Page 1
)
p
θ
(BR)
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• High Surge Capability
• High Current Capability and Low Forward Voltage Drop
• For Use in Low Voltage, High Frequency Inverters, Free
Wheeling, and Polarity Protection Application
• Lead, Halogen and Antimony Free, RoHS Compliant (Note 1)
• "Green" Device (Note 4)
Maximum Ratings @T
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage @ I
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current @ TL = 90°CI
Repetitive Peak Forward Current
1ms, δ ≤ 0.5
t
≤
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
= 25°C unless otherwise specified
A
= 1.0mA
R
Mechanical Data
• Case: SOD-123
• Plastic Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Polarity: Cathode Band
• Leads: Matte Tin Finish annealed over Alloy 42 leadframe (Lead
Free Plating) Solderable per MIL-STD-202, Method 208
• Marking Information: See Page 3
• Ordering Information: See Page 3
• Weight: 0.01 grams (approximate)
Top View
V
RRM
V
RWM
V
R
V
R(RMS
O
I
FRM
I
FSM
1N5819HW
40 V
28 V
1.0 A
1.5 A
25 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 2)
Typical Thermal Resistance Junction to Ambient (Note 2)
Operating and Storage Temperature Range
P
R
T
J, TSTG
D
JA
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 3)
Forward Voltage
Reverse Leakage Current (Note 3)
Total Capacitance
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
2. Device mounted on FR-4 PC Board, 2"x2", 2 oz. Copper, single sided, Cathode pad dimensions 0.75"x1.0", Anode pad dimensions 0.25"x 1.0".
3. Short duration pulse test used to minimize self-heating effect.
4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
V
V
F
I
R
C
T
40
R
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯ ⎯
⎯
⎯
⎯
⎯
⎯
10
1
15
1.5
50 60 pF
Fire Retardants.
2O3
1N5819HW
Document number: DS30217 Rev. 15 - 2
1 of 4
www.diodes.com
450 mW
-65 to +125
0.320
0.450
0.750
1.0
10
50
2
75
3
222
V
V
mA
mA
μA
mA
μA
mA
IR = 1.0mA
= 0.1A
I
F
I
= 1.0A
F
= 3.0A
I
F
= 40V, TA = 25°C
V
R
V
= 40V, TA = 100°C
R
= 4V, TA = 25°C
V
R
V
= 4V, TA = 100°C
R
= 6V, TA = 25°C
V
R
V
= 6V, TA = 100°C
R
°C/W
°C
VR = 4V, f = 1.0MHz
February 2010
© Diodes Incorporated
Page 2
NSTAN
TANEO
U
F
O
RWAR
C
U
R
REN
T
C
, TOT
CAPACITANC
pF)
T
RAT
T T
PER
T
U
R
C
P
F
O
R
R
U
R
G
C
U
R
R
N
T
1N5819HW
10
10,000
(A)
1
D
1,000
100
0.1
10
S
0.01
1
0.001
0.1
F
I, I
0.0001
1,000
0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
0.40.2
0.6
0.8
Fig. 1 Typical Forward C haracteristics
1.0
.01
0
51015
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
20
25 30
Fig. 2 Typical Reverse Characteristics
1.0
35
40
0.8
E (
0.6
100
AL
T
10
0
Fig. 3 T otal Capacitance vs. Reverse Voltage
150
)
10
V , DC REVERSE VOLTAGE (V)
R
20 30
40
E (º
125
0.4
0.2
F(AV)
I , AVERAGE FORWARD CURRENT (A)
Single Puls e Half-Wave
60 Hz Resistive or Inductive Load
0
10 40 60 80 100 120
T , AMBIENT TEMPERATURE (ºC)
A
Fig. 4 Forward Current Derating Curve
25
(A)
E
20
140
A
EM
100
E
15
D S
75
WA
10
ED AMBIEN
, DE
A
50
25
1
V , DC REVERSE VOLTAGE (V)
R
10
Fig. 5 Operating Temperature Derating
20
30
40
50
5
EAK
8.3ms Single Half Sine-Wave
FSM
I,
0
110100
NUMBER OF CYCLES AT 60 Hz
Fig. 6 Maxi m um Non-Re petitive P eak Forwa rd Surge Cur r ent
1N5819HW
Document number: DS30217 Rev. 15 - 2
2 of 4
www.diodes.com
February 2010
© Diodes Incorporated
Page 3
1N5819HW
Ordering Information (Note 5)
Part Number Case Packaging
1N5819HW-7-F SOD-123 3000/Tape & Reel
Notes: 5. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
Date Code Key
Year 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012
Code N P R S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
SL
YM
SL = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
Package Outline Dimensions
C
H
B
M
Suggested Pad Layout
X
Y
SOD-123
A
K
L
C
G
Z
Dim Min Max
A 0.55 Typ
B 1.40 1.70
C 3.55 3.85
H 2.55 2.85
J 0.00 0.10
K 1.00 1.35
L 0.25 0.40
M 0.10 0.15
α
All Dimensions in mm
Dimensions Value (in mm)
Z 4.9
G 2.5
X 0.7
Y 1.2
C 3.7
0 8°
1N5819HW
Document number: DS30217 Rev. 15 - 2
3 of 4
www.diodes.com
February 2010
© Diodes Incorporated
Page 4
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
1N5819HW
1N5819HW
Document number: DS30217 Rev. 15 - 2
4 of 4
www.diodes.com
February 2010
© Diodes Incorporated
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