TECHNICAL USER MANUAL FOR:
smartCore Express
SMA200
Nordstrasse 11/F
CH - 4542 Luterbach
Tel.: ++41 (0)32 681 58 00
Fax: ++41 (0)32 681 58 01
Email: support@digitallogic.com
Homepage:
http://www.digitallogic.com
DIGITAL-LOGIC AG SMA200 Manual V1.0
2
For internal use only:
File: SMA200_TechManual_V1.0.doc
Path: R:\HANDBUCH\smart\SMA200\SMA200_TechManual_V1.0.doc
COPYRIGHT 2008 BY DIGITAL-LOGIC AG
This publication is protected by copyright and all rights are reserved. No part of this document may be
reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic,
mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.
The software described herein, together with this document, are furnished under a license agreement and
may be used or copied only in accordance with the terms of that agreement.
About this Manual and How to Use It
This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems
based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the
MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board,
and describes the system and setup requirements. This document contains information on hardware
requirements, interconnections, and details of how to program the system. Please check the Product CD for
further information and manuals.
REVISION HISTORY:
Document
Version
Date/Initials: Modification:
Remarks, News, Attention:
V0.1 07.2008 KUF Initial Version
V1.0 09.2008 WAS Details fine-tuned / Standard format w/Eng. applied
Attention!
1. All information in this manual, and the product, are subject to change without prior notice.
2. Read this manual prior to installation of the product.
3. Read the security information carefully prior to installation of the product.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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Table of Contents
1. PREFACE .....................................................................................................................................................4
1.1. Trademarks ..................................................................................................................................... 4
1.2. Disclaimer ....................................................................................................................................... 4
1.3. Environmental Protection Statement ........................................................................................... 4
1.4. Who should use this Product ....................................................................................................... 4
1.5. Recycling Information.................................................................................................................... 5
1.6. Technical Support .......................................................................................................................... 5
1.7. Limited Two Year Warranty ........................................................................................................... 5
1.8. Explanation of Symbols................................................................................................................. 6
1.9. Applicable Documents and Standards ........................................................................................ 7
1.10. For Your Safety............................................................................................................................... 8
1.11. RoHS Commitment......................................................................................................................... 8
1.11.1. RoHS Compatible Product Design .......................................................................................... 9
1.11.2. RoHS Compliant Production Process ..................................................................................... 9
1.11.3. WEEE Application.................................................................................................................... 9
1.12. Swiss Quality ................................................................................................................................ 10
1.13. The Swiss Association for Quality and Management Systems............................................... 10
2. OVERVIEW .................................................................................................................................................11
2.1. Standard Features........................................................................................................................ 11
2.2. Technical Specifications ............................................................................................................. 12
2.3. Examples of Ordering Codes ...................................................................................................... 14
3. DIMENSIONS & DIAGRAMS..........................................................................................................................15
3.1. Block Diagram .............................................................................................................................. 15
Design IN with the smartModule.............................................................................................................. 16
3.2. Dimensions of the smartCoreExpress Module ......................................................................... 16
3.3. Connector Placement & Pin Definition on the Carrier Board .................................................. 17
3.4. Photo of the Top Side of the PCB............................................................................................... 18
3.5. Dimensions of the Carrier Board Connector............................................................................. 19
3.6. Component Heights between Module and Carrier Board ........................................................ 19
4. COM-EXPRESS CONNECTOR DESCRIPTION ................................................................................................20
4.1. Signal Terminology Descriptions ............................................................................................... 20
4.2. smartCoreExpress Connector Pinout ........................................................................................ 21
5. SIGNAL DESCRIPTIONS OF THE SMARTCOREEXPRESS .................................................................................23
5.1. Wire Design for Typical Impedances ......................................................................................... 23
5.2. Matching of the Differential Pairs ............................................................................................... 23
5.3. Placing an AC Coupling Capacitor on each PCIe-TX ............................................................... 24
5.4. smartCoreExpress Signal Groups.............................................................................................. 25
5.4.1. PCI-Express........................................................................................................................... 25
5.4.2. SDVO..................................................................................................................................... 26
5.4.3. LVDS ..................................................................................................................................... 27
5.4.4. USB ....................................................................................................................................... 28
5.4.5. Parallel ATA........................................................................................................................... 29
5.4.6. LPC BUS ............................................................................................................................... 30
5.4.7. SMBus ................................................................................................................................... 31
5.4.8. HDA Audio Interface .............................................................................................................. 32
5.4.9. SD / SDIO Interface ............................................................................................................... 33
5.4.10. SPI BUS................................................................................................................................. 34
5.4.11. SATA Interface (Option) ........................................................................................................ 35
5.4.12. GLAN ..................................................................................................................................... 36
5.4.13. CAN / Serial ........................................................................................................................... 37
5.4.14. PM ......................................................................................................................................... 38
5.4.15. Supply.................................................................................................................................... 39
6. SMARTCORE-EXPRESS CONNECTOR SPECIFICATIONS .................................................................................40
7. SMARTCORE-EXPRESS VERSUS COMEXPRESS...........................................................................................41
8. INDEX ........................................................................................................................................................42
DIGITAL-LOGIC AG SMA200 Manual V1.0
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1. PREFACE
The information contained in this manual has been carefully checked and is believed to be accurate; it is
subject to change without notice. Product advances mean that some specifications may have changed.
DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may
appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or
application of any circuit or product described herein.
1.1. Trademarks
DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks
owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include
names, company logos, and registered trademarks which are, therefore, proprietary to their respective
owners.
1.2. Disclaimer
DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and
specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITALLOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related
expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.
1.3. Environmental Protection Statement
This product has been manufactured to satisfy environmental protection requirements wherever possible.
Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are
capable of being recycled. Final disposal of this product after its service life must be accomplished in
accordance with applicable country, state, or local laws or regulations.
1.4. Who should use this Product
Electrical engineers with know-how in PC-technology.
Because of the complexity and the variability of PC-technology, we cannot guarantee that the product
will work in any particular situation or set-up. Our technical support will try to help you find a solution.
Pay attention to electrostatic discharges; use a CMOS protected workplace.
Power supply must be OFF when working on the board or connecting any cables or devices.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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1.5. Recycling Information
All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances
Directive). The product is soldered with a lead free process.
1.6. Technical Support
1. Contact your local DIGITAL-LOGIC Technical Support, in your country.
2. Use the Internet Support Request form at http://support.digitallogic.ch/ embedded products New
Support Request
Support requests are only accepted with detailed information about the product (i.e., BIOS-, Boardversion)!
1.7. Limited Two Year Warranty
DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be
free from defects in materials and workmanship for two years following the date of shipment from DIGITALLOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not
transferable.
During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any
defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to
DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.
Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland
are required to register a RMA (Return Material Authorization) number in the Support Center at
http://support.digitallogic.ch/
All other customers must contact their local distributors for returning defective materials.
This limited warranty does not extend to any product which has been damaged as a result of accident,
misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or
insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or
other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as
a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient
knowledge of these technologies or has not consulted the product manuals or the technical support of
DIGITAL-LOGIC AG and therefore the product has been damaged.
Empty batteries (external and onboard), as well as all other battery failures, are not covered by this
manufacturer’s limited warranty.
Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to,
any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG
expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be
liable to the purchaser or any user for any damage, including any incidental or consequential damage,
expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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1.8. Explanation of Symbols
CE Conformity
This symbol indicates that the product described in this manual is in compliance with all
applied CE standards.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 60V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment.
Caution, Electric Shock!
This symbol and title warn of hazards due to electrical shocks (> 32V) when touching
products or parts of them. Failure to observe the precautions indicated and/or prescribed by
the law may endanger your life/health and/or result in damage to your equipment
Warning, ESD Sensitive Device!
This symbol and title inform that electronic boards and their components are sensitive to
Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must
always be taken while handling and examining this product.
Attention!
This symbol and title emphasize points which, if not fully understood and taken into
consideration by the reader, may endanger your health and/or result in damage to your
equipment.
Note...
This symbol and title emphasize aspects the user should read through carefully for his, or
her, own advantage.
Warning, Heat Sensitive Device!
This symbol indicates a heat sensitive component.
Safety Instructions
This symbol shows safety instructions for the operator to follow.
This symbol warns of general hazards from mechanical, electrical, and/or
chemical failure. This may endanger your life/health and/or result in damage
to your equipment.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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1.9. Applicable Documents and Standards
The following publications are used in conjunction with this manual. When any of the referenced
specifications are superseded by an approved revision, that revision shall apply. All documents may be
obtained from their respective organizations.
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright
© 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix
Technologies Ltd., Toshiba Corporation. All rights reserved. http://www.acpi.info/
ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS)
Interface Circuits, January 1, 2001. http://www.ansi.org/
ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.
http://www.ansi.org/
ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached
SCSI (SAS), October 30, 2003. http://www.ansi.org/
Audio Codec ’97 Revision 2.3 Revision 1.0, April 2002 Copyright © 2002 Intel Corporation. All rights
reserved. http://www.intel.com/labs/media/audio/
Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August
14, 1998 Copyright © 1998 Video Electronics Standards Association. All rights reserved.
http://www.vesa.org/summary/sumddcci.htm
ExpressCard Standard Release 1.0, December 2003 Copyright © 2003 PCMCIA. All rights reserved.
http://www.expresscard.org/
IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information
exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3:
Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical
Layer Specifications. http://www.ieee.org
IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision
Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access
Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.
http://www.ieee.org
Intel Low Pin Count (LPC) Interface Specification Revision 1.1, August 2002 Copyright © 2002 Intel
Corporation. All rights reserved. http://developer.intel.com/design/chipsets/industry/lpc.htm
PCI Express Base Specification Revision 1.1, March 28, 2005, Copyright © 2002-2005 PCI Special
Interest Group. All rights reserved. http://www.pcisig.com/
PCI Express Card Electromechanical Specification Revision 1.1, March 28, 2005, Copyright © 2002-
2005 PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI Local Bus Specification Revision 2.3, March 29, 2002 Copyright © 1992, 1993, 1995, 1998, 2002
PCI Special Interest Group. All rights reserved. http://www.pcisig.com/
PCI-104 Specification, Version V1.0, November 2003. All rights reserved. http://www.pc104.org
PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,
PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500,
Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/
Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 2000-
2003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation,
Seagate Technology LLC. All rights reserved. http://www.sata-io.org/
DIGITAL-LOGIC AG SMA200 Manual V1.0
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Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org
System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995,
1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.
http://www.smbus.org/
Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer
Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft
Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved.
http://www.usb.org/
1.10. For Your Safety
Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features
necessary to ensure its compliance with electrical safety requirements. It was also designed for a
long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment
during unpacking and installation. Therefore, in the interest of your own safety and for the correct
operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.
Attention!
All work on this device must only be carried out by sufficiently skilled personnel.
Caution, Electric Shock!
Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is
switched off. This applies also to the installation of piggybacks or peripherals. Serious
electrical shock hazards can exist during all installation, repair and maintenance operations
with this product. Therefore, always unplug the power cable and any other cables which
provide external voltage before performing work.
Warning, ESD Sensitive Device!
Electronic boards and their components are sensitive to static electricity. In order to ensure
product integrity at all times, be careful during all handling and examinations of this product.
1.11. RoHS Commitment
DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the
Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic
Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was
adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a
directive, which restricts the use of six hazardous materials in the manufacturing of various types of
electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment
Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods
and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.
Each European Union member state is adopting its own enforcement and implementation policies using the
directive as a guide. Therefore, there could be as many different versions of the law as there are states in
the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have
their own regulations for green products, which are similar, but not identical, to the RoHS directive.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:
Lead
Mercury
Cadmium
Chromium VI
PBB and PBDE
The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for
Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not
apply to the weight of the finished product, or even to a component but to any single substance that could
(theoretically) be separated mechanically.
1.11.1. RoHS Compatible Product Design
All DIGITAL-LOGIC standard products comply with RoHS legislation.
Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and
mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.
1.11.2. RoHS Compliant Production Process
DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These
capabilities are verified by:
1. A confirmation from the supplier indicating that their production processes and resulting devices are
RoHS compliant.
2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned
substances in a produced device will be measured. These measurements are carried out by an
accredited laboratory.
1.11.3. WEEE Application
The WEEE directive is closely related to the RoHS directive and applies to the following devices:
Large and small household appliances
IT equipment
Telecommunications equipment (although infrastructure equipment is exempt in some countries)
Consumer equipment
Lighting equipment – including light bulbs
Electronic and electrical tools
Toys, leisure and sports equipment
Automatic dispensers
It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that
brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to
product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end
users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to
properly recycle all electronic products that have reached the end of their life cycle.
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1.12. Swiss Quality
100% Made in Switzerland
DIGITAL-LOGIC is a member of "Swiss-Label"
This product was not manufactured by employees earning piecework wages
This product was manufactured in humane work conditions
All employees who worked on this product are paid customary Swiss market wages and are insured
ISO 9000:2001 (quality management system)
1.13. The Swiss Association for Quality and Management
Systems
The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment
services for all types of industries and services. SQS certificates are accepted worldwide thanks to
accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification
Network, IQNet, and co-operation contracts/agreements with accredited partners.
www.sqs.ch
The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field
of development, manufacturing and sales of embedded computer boards, embedded computer modules and
computer systems. The certification is valid for three years at which time an audit is performed for
recertification.
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2. OVERVIEW
2.1. Standard Features
The smartCoreExpress is an electrical and mechanical definition for a COM or Computer on Module
(miniaturized PC system), based on Intel's ATOM chip unit incorporating the major elements of a PC
compatible computer.
Powerful though low consumption ATOM CPU
Soldered DDR2 RAM 512k up to 2GByte
Single 220pin connectors (Tyco) for the smartCoreExpress BUS
5x x1 PCI-Express lanes
8x USB V2.0
1x PATA or (4x SATA plus 1x GE-LAN)
1x SDVO interface
1x LVDS 24bit interface
1x AC97 HAD interface
1x LPC BUS
1x SPI BUS
1x SM BUS
1x Generic Serial BUS (ex. CAN)
4x GPIO (programmable global in/out)
Maximum Thermal Design Power up to 40W
Reserved pins for: 1x Ethernet interface 1GE
Single 5Volt supply
Legacy signals for SuperIO
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2.2. Technical Specifications
CPU Specification
CoreDuo / Celeron M Intel Atom 510 1.10GHz with 0.5MB L2-cache
Intel Atom 530 1.60GHz with 0.5MB L2-cache
Clock 1.1 or 1.6GHz
1st Level Cache 2x 32kByte
2nd Level Cache 0.54 MByte (on die)
Technology 40nm
VCCCore @ 1.6GHz 1.050V
VCCCore @ 1.1GHz 0.844V
VCCCore @ deep sleep 0.748V
CPU BUS CMOS
AGTL+ Termination Not needed
FSB 533MHz quad-pumped synchronous BUS
Mathematics Coprocessor
Available on the Atom CPU
Intel US15W Graphics Memory Controller Hub
Memory Controller Specification
Supports
Socket DDR2 soldered memory
Technologies DDR2-667
Capacity 512MByte up to 2GByte
Voltage 1.8V
Termination 0.9V
Width 64bit
ECC-Support No
Intel US15W Graphics Memory Controller Hub
Graphic Controller
Specification
Max. Video Memory 128MByte with Intel GMA
Graphic Core Frequency 250MHz
SDVO Port 2 channels (multiplexed with the PEG signals)
1x 200 Mpixel/sec
Support for up to 1x DVI, 1x VGA and 1x LVDS
Dotclock = 165MHz
Compliant with DVI Spec.1.5
Flat Panel Interface 2 channel LVDS interface
1x 18, 2x 18, 1x 24, 2x 24bpp TFT
Dotclock = up to 2x 112 MHz
Resolutions 640 x 480 up to 1600 x 1200 (UXGA)
Automatic panel detection via VESA EDID 1.3
LVDS 24bit 200Mpixel/sec
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Intel US15W Specification
PCIe BUS 2x x1 Lane
EIDE BUS 1x Ultra P-ATA 100
SATA BUS USB V2.0 8 channel USB
APIC INTEL I/O APIC
SMB V2.0 SMBus controller
FWH FirmWare Hub for BIOS devices
LPC Serialized BUS (no ISA) used for external SuperI/O
Sound AC97 2.3 HDA Interface with 192kHz sampling rate and 8 channels
IRQ Controller 8259 compatible
Timers 8254 compatible
Power Management Integrated
Reset & Power Management Specification
Controller Atmel
Power Modes S5, S3
ACPI V3.0
BUS Specification
LPC 8bit 33MHz
PCIexpress 2x x1 lane
Power Supply Specification
DC Input 5.0V, max. 200mV ripple
Inrush Current
5.0V up to 2Amp for 100µs
Standby Power 0.1W
Onboard Voltages VCC Core, 1.05V, 1.8V, 0.9V, CoreVCC, 1.5V
Power Consumption 4W
Use inductors in series to reduce the maximum inrush current!
Physical Characteristics Specification
Dimensions Length: 65 mm +/- 0.1mm
Depth: 58 mm +/- 0.1mm
Height: 11 mm +/- 0.2mm (with 5mm bus connectors)
14 mm +/- 0.2mm (with 8mm bus connectors)
The connector height is selected by the connector on the carrier board.
Weight 70 gr / 8 ounces
PCB Thickness 1.6 mm / 0.0625 inches nominal
PCB Layer Multilayer
DIGITAL-LOGIC AG SMA200 Manual V1.0
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Operating Environment Specification
Relative Humidity 5-90% non-condensing
Vibration 5 to 2000 Hz
Shock 10 G
Operating Temperature Standard: t.b.d. (depends on the CPU and the cooling concept)
Extended Range: t.b.d.
Maximum Copper Temperature 90°C
Storage Temperature -55°C to +85°C
EMI / EMC (IEC1131-2 refer MIL 461/462) Specification
ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate Ground Layer included
15 kV single peak
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
Not tested
EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 Ohm, Ts = 5ns
Grade 2: 1KV Supply, 500 I/O, 5Khz
SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5
Supply: 2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: None
High-Frequency Radiation EN55022
All information is subject to change without notice.
2.3. Examples of Ordering Codes
Product Name Part Number Description
SMA200-11G-xxGB
incl. 0.5GB RAM
incl. 1.0GB RAM
incl. 2.0GB RAM
805800
805801
805802
ATOM Z510, 1.1GHz
SMA200-16G-xxGB
incl. 0.5GB RAM
incl. 1.0GB RAM
incl. 2.0GB RAM
805810
805811
805812
ATOM Z530, 1.6GHz
SMA204-16G-xxGB
incl. 0.5GB RAM
incl. 1.0GB RAM
incl. 2.0GB RAM
805820
805821
805822
ATOM Z530, 1.6GHz, 4GB PATA SSD
Options/Accessories
SMX-CON5 807139 5mm COM Express connector
SMX-CON8 807138 8mm COM Express connector
SMA200DK 805850 SMA200 Development Kit
These are only examples; for current ordering codes, please see the current price list.
DIGITAL-LOGIC AG SMA200 Manual V1.0
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3. DIMENSIONS & DIAGRAMS
3.1. Block Diagram
Temp
.
Sensor
Intel Atom
Processor
CPU
(power supply)
Power
Management
Microcontroller
FSB
1 GB DDR2
RAM
Firmware Hub
(BIOS)
System Controller Hub
US15W
Module Connector (220 pin)
FSB
SMB
LVDS, Backlight, DDC
SVDO / GMBus (I2C)
PAT
8x USB
2x PCIe
SD/SDIO/MMC
HD Audio / AC link
LPC BUS
SPI BUS
Option
SSD 4GB
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Design IN with the smartModule
Attention!
When using an active/passive heatsink that is not from DLAG, be very careful!
The maximum depth the screws can go into the product is 3mm or the module will be
destroyed!
3.2. Dimensions of the smartCoreExpress Module
58.0
3.25
58.5mm
A1
B1
3.25
3.25
3.65mm
View of the bottom side of the
smartCoreExpress module.
All dimensions with +/-0.1mm tolerance
if not otherwise specified.
Units = millimeter.
Pin 1
50.2
44.0
d=1.6
d=1.0
65.0mm
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3.3. Connector Placement & Pin Definition on the Carrier
Board
View of the Top Side (mounting side) of the smartCoreExpress PCB:
d=2.2/D=4.5
3.6mm
A1 A2 A3 ...
B1
A110
B110
0.5
0.3
1.8
1.6
0.4
d=1.0
d=1.6
58.5mm
57.7mm
1.6
d=2.2/D=4.5
44.0mm
50.2mm
3.25
3.25
smartCoreExpress
PCB pad design
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3.4. Photo of the Top Side of the PCB
Pin 1
65mm
58mm
DIGITAL-LOGIC AG SMA200 Manual V1.0
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3.5. Dimensions of the Carrier Board Connector
SMX-CON8:
Standard Height: 5.0mm (Available alternative: 8.0mm)
DLAG Part Nr: 807138
AMP/Tyco: 8-6318491-6
(Components placed below the smartModule should total a maximum of 2.0mm.)
3.6. Component Heights between Module and Carrier Board
Parts mounted on the back side of the module (in the space between the bottom surface of the module PCB
and the carrier board) should have a maximum height of 8.0mm.
5.0mm
6.0mm
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4. COM-EXPRESS CONNECTOR DESCRIPTION
4.1. Signal Terminology Descriptions
Signal Description
PU Internally implemented pull up resistor
PD Internally implemented pull down resistor
I/O 3.3V Bi-directional signal 3.3V tolerant
I/O 5V Bi-directional signal 5V tolerant
I 3V Input 3.3V tolerant
I 5V Input 5V tolerant
I/O 3.3VSB Input 3.3V tolerant, active in standby state
O 3V Output 3.3V signal level
O 5V Output 5V signal level
P Power input/output
D Differential signal pair
DDC Display data channel
PCIE In compliance with PCI Express Base Specification, Revision 1.0a
SATA In compliance with Serial ATA Specification, Revision 1.0a
LVDS Low voltage differential signal: 350mV nominal; 450mV maximum differential signal
LAN 100/10Mbit/s LAN signals coming from the PHY
TPM Trusted platform module
GE-LAN 1GB LAN signals
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4.2. smartCoreExpress Connector Pinout
BUS on the smartCoreExpress – Connectors A / B: Pins 1-55
Pin Signal BUS Type Remarks Pin Signal BUS Type Remarks
A1 GND B1 GND
A2 PCIe_TX0_N PCIe Dif AC B2 PCIe_RX0_N PCIe Dif AC
A3 PCIe_TX0_P PCIe Dif AC B3 PCIe_RX0_P PCIe Dif AC
A4 PCIe_CLK0_N PCIe Dif AC B4 PCIe_CLK1_N PCIe Dif AC
A5 PCIe_CLK0_P PCIe Dif AC B5 PCIe_CLK1_P PCIe Dif AC
A6 GND B6 GND
A7 PCIe_TX1_N PCIe Dif AC B7 PCIe_RX1_N PCIe Dif AC
A8 PCIe_TX1_P PCIe Dif AC B8 PCIe_RX1_P PCIe Dif AC
A9 PCIe_TX2_N PCIe Dif AC B9 PCIe_RX2_N PCIe Dif AC
A10 PCIe_TX2_P PCIe Dif AC B10 PCIe_RX2_P PCIe Dif AC
A11 GND B11 GND
A12 PCIe_CLK2_N PCIe Dif AC B12 PCIe_CLK3_N PCIe Dif AC
A13 PCIe_CLK2_P PCIe Dif AC B13 PCIe_CLK3_P PCIe Dif AC
A14 PCIe_TX3_N PCIe Dif AC B14 PCIe_RX3_N PCIe Dif AC
A15 PCIe_TX3_P PCIe Dif AC B15 PCIe_RX3_P PCIe Dif AC
A16 GND B16 GND
A17 PCIe_REQ0# PCIe 3.3v-O Clk request B17 PCIe_REQ1# PCIe 3.3v-O Clock request
A18 PCIe_REQ2# PCIe 3.3v-O Clk request B18 PCIe_REQ3# PCIe 3.3v-O Clock request
A19 SDVO_CLK_N SDVO Dif AC B19 SDVO_INT_N SDVO Dif AC
A20 SDVO_CLK_P SDVO Dif AC B20 SDVO_INT_P SDVO Dif AC
A21 GND B21 GND
A22 SDVO_GREEN_N SDVO Dif AC B22 SDVO_BLUE_N SDVO Dif AC
A23 SDVO_GREEN_P SDVO Dif AC B23 SDVO_BLUE_P SDVO Dif AC
A24 SDVO_TVCLK_N SDVO Dif AC B24 SDVO_STALL_N SDVO Dif AC
A25 SDVO_TVCLK_P SDVO Dif AC B25 SDVO_STALL_P SDVO Dif AC
A26 GND B26 GND
A27 SDVO_RED_N SDVO Dif AC B27 SDVO_DDC_CLK SDVO 3.3V Bidir.
A28 SDVO_RED_P SDVO Dif AC B28 SDVO_DDC_DAT SDVO 3.3V Bidir.
A29 LVDS_D0_P LVDS Dif LV B29 LVDS_D1_P LVDS Dif LV
A30 LVDS_D0_N LVDS Dif LV B30 LVDS_D1_N LVDS Dif LV
A31 GND B31 GND
A32 LVDS_D2_P LVDS Dif LV B32 LVDS_CLK_P LVDS Dif LV
A33 LVDS_D2_N LVDS Dif LV B33 LVDS_CLK_N LVDS Dif LV
A34 LVDS_D3_P LVDS Dif LV B34 LVDS_BKL_CTR LVDS 3.3v
A35 LVDS_D3_N LVDS Dif LV B35 LVDS_BKL_EN LVDS 3.3v
A36 GND B36 LVDS_DETECT# LVDS 3.3V
A37 LVDS_DDC_DAT LVDS 3.3v B37 LVDS_VDD_EN LVDS 3.3V
A38 LVDS_DDC_CLK LVDS 3.3v B38 USB_C_DEV USB 3.3V
A39 USB_0_P USB Dif LV B39 USB_1_P USB Dif LV
A40 USB_0_N USB Dif LV B40 USB_1_N USB Dif LV
A41 GND B41 GND
A42 USB_2_P USB Dif LV B42 USB_3_P USB Dif LV
A43 USB_2_N USB Dif LV B43 USB_3_N USB Dif LV
A44 USB_4_P USB Dif LV B44 USB_5_P USB Dif LV
A45 USB_4_N USB Dif LV B45 USB_5_N USB Dif LV
A46 GND B46 GND
A47 USB_6_P USB Dif LV B47 USB_7_P USB Dif LV
A48 USB_6_N USB Dif LV B48 USB_7_N USB Dif LV
A49 USB_OC01# USB 3.3v B49 USB_OC23# USB 3.3v
A50 USB_OC45# USB 3.3v B50 USB_OC67# USB 3.3v
A51 GND B51 GND
A52 GE_CLK GE-LAN
B52 GE_RTS GE-LAN
A53 GE_TX0 GE-LAN
B53 GE_RX0 GE-LAN
A54 GE_TX1 GE-LAN
B54 GE_RX1 GE-LAN
A55 GE_TX2 GE-LAN
B55 GE_RX2 GE-LAN
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BUS on the smartCoreExpress – Connectors A / B: Pins 56-110
Pin Signal BUS Type
Remarks
Pin Signal BUS Type
Remarks
A56 SMB_CLK SMB 3.3V bidir B56 SPI_MISO SPI 3.3V Bidir.
A57 SMB_DAT SMB 3.3V bidir B57 SPI_MOSI SPI 3.3V Bidir
A58 SMB_ALERT# SMB 3.3V bidir B58 SPI-CS# SPI 3.3Vo
A59 SATA_LED# SAT 3.3Vo B59 SPI_CLK SPI 3.3Vo
A60 GND B60 GND
A61 IDE_D3 / SATA_Tx0P HD 5 /DI B61 IDE_CS3 / SATA_Tx0P HD 5 /DI
A62 IDE_A0 / SATA_Tx0N HD 5 /Di B62 IDE_DAK / SATA_Tx0N HD 5 /Di
A63 IDE_A2 / SATA_Rx0P HD 5 /Di B63 IDE_D4 / SATA_Rx0P HD 5 /Di
A64 IDE_D8 / SATA_Rx0N HD 5 /Di B64 IDE_D2 / SATA_Rx0N HD 5 /Di
A65 IDERQ / GND HD 5 / B65 IDEIORDY / GND HD 5 /
A66 IDE_A1 / SATA_Tx2P HD 5 /Di B66 IDE_D10 / SATA_Tx2P HD 5 /Di
A67 IDE_D13 / SATA_Tx2N HD 5 /Di B67 IDE_D6 / SATA_Tx2N HD 5 /Di
A68 IDE_D1 / SATA_Rx2P HD 5 /Di B68 IDE_D12 / SATA_Rx2P HD 5 /Di
A69 IDE_IRQ / SATA_Rx2N HD 5 /Di B69 IDE_D9 / SATA_Rx2N HD 5 /Di
A70 GND B70 GND
A71 IDE_D11 / PCIE_TX4_N HD 5 /Di B71 IDE_D15 / PCIE_RX4_N HD 5 /Di
A72 IDE_D5 / PCIE_TX4_N HD 5 /Di B72 IDE_D0 / PCIE_RX4_N HD 5 /Di
A73 IDE_RD# / PCIE_REQ4 HD 5 / 3 B73 IDE_D7 HD 5
A74 IDE_D14/ PCIE_CK4_N HD 5 /Di B74 IDE_WR#/ CAN_TX HD 5 /Di
A75 IDE_CS1/ PCIE_CK4_N HD 5 /Di B75 IDE_DET / CAN_RX HD 5 /Di
A76 LPC_AD3 LPC 3.3V B76 LPC_CLK0 LPC 3.3Vo 33MHz
A77 LPC_AD1 LPC 3.3V B77 LPC_CLK1 LPC 3.3Vo 33MHz
A78 LPC_AD0 LPC 3.3V B78 LPC_SERIRQ LPC 3.3V
A79 LPC_FRAME# LPC 3.3V B79 LPC_AD2 LPC 3.3V
A80 GND B80 GND
A81 SD_WP SDIO 3.3V B81 SD_DATA7 SDIO 3.3V
A82 SD_CD# SDIO 3.3V B82 SD_PWR* SDIO 3.3V
A83 SD_CLK SDIO 3.3V B83 SD_DATA2 SDIO 3.3V
A84 SD_DATA1 SDIO 3.3V B84 SD_LED SDIO 3.3V
A85 SD_DATA3 SDIO 3.3V B85 SD_DATA4 SDIO 3.3V
A86 SD_DATA5 SDIO 3.3V B86 SD_DATA0 SDIO 3.3V
A87 SD_DATA6 SDIO 3.3V B87 SD_CMD SDIO 3.3V
A88 LVDS_CTLB_DAT LVDS 3.3Vo B88 BIOS_Recovery / WDO SYS 3.3Vo
A89 LVDS_CTLB_CLK LVDS 3.3Vo B89 Speaker Output SYS 3.3Vo
A90 GND B90 GND
A91 AC97_DOCK_EN# HDA 3.3Vi B91 AC97_BITCLK HDA 3.3Vo
A92 AC97_SDATAIN1 HDA 3.3V B92 AC97_DOCK_RST# HDA 3.3Vo
A93 AC97_SDATAOUT HDA 3.3V B93 AC97_SDATAIN0 HDA 3.3V
A94 AC97_RST# HDA 3.3Vo B94 AC97_SYNC HDA 3.3V
A95 IDE_PCSEL HD 5V B95 A20M# SYS 5V
A96 GPIO0 SYS 3.3V B96 Powergood SYS 5Vi
A97 GPIO1 SYS 3.3V B97 PSON# SYS 3.3Vi
A98 GPIO2 SYS 3.3V B98 PWRBTN# SYS 3.3Vi
A99 GPIO3 SYS 3.3V B99 SUS_S3#_Output SYS 3.3Vo
A100 GND B100 GND
A101 Reset_Output# SYS 3.3Vo B101 SUS_S4&5#_Output SYS 3.3Vo
A102 Reset_Input# SYS 3.3Vi B102 BIOS_Disable# SYS 3.3Vi
A103 WAKE_Input# SYS 3.3Vi B103 Battery Supply 3.0-3.6V SYS 3Vin
A104 +5Volt Supply Input PWR 5Vi B104 +5Volt_Always Input PWR 5Vi
A105 +5Volt Supply Input PWR 5Vi B105 +5Volt Supply Input PWR 5Vi
A106 +5Volt Supply Input PWR 5Vi B106 +5Volt Supply Input PWR 5Vi
A107 +5Volt Supply Input PWR 5Vi B107 +5Volt Supply Input PWR 5Vi
A108 +5Volt Supply Input PWR 5Vi B108 +5Volt Supply Input PWR 5Vi
A109 +5Volt Supply Input PWR 5Vi B109 +5Volt Supply Input PWR 5Vi
A110 GND B110 GND
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5. SIGNAL DESCRIPTIONS OF THE SMARTCOREEXPRESS
5.1. Wire Design for Typical Impedances
5.2. Matching of the Differential Pairs
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5.3. Placing an AC Coupling Capacitor on each PCIe-TX
In the smartCoreExpress module, all PCI-TX pairs already include the series AC capacitors.
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5.4. smartCoreExpress Signal Groups
5.4.1. PCI-Express
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
PCIe_Tx [0-4] +/- PCIe Dif
Out
Transmitter 2.5Gbit
Connected to an Rx pin pair
of the device.
100nF Series
Cap.
- 200 100 0.2
PCIe_Rx [0..4] +/-
PCIe Dif
In
Receiver 2.5Gbit
Connected to a Tx pin pair
of the device. The Tx output
of the device needs an AC
coupling capacitor.
- Series
Cap.
100nF
As 0402
200 100 0.2
PCIe_CLK[0..4] +/-
PCIe Dif
Out
Reference clock (100MHz)
Connected to a Refclock pin
pair of the device.
- - 200 100 0.2
PCIe_REQ#[0..4] PCIe 3.3V
In
A low signal at this input will
enable the PCI-Clk-Output
of the corresponding PCIExpress lane.
PU
integrated in
the CK540
- 200 Static
-
If the signals are not used:
All these PCI-Express signals may be left open.
Remarks:
Pair to Pair spacing: 35mil = 0.9mm
BUS to BUS spacing: 20mil = 0.5mm
The AC coupling capacitors must be placed near the device for the Tx signals only. The maximum
number of vias per signal is less than 4.
EMV/EMI filters:
Are not needed.
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5.4.2. SDVO
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
SDVO_CTRLCLK SDVO
DDC signal PU 4.7k to
3.3V
55
SDVO_CTRLDAT SDVO
DDC signal PU 4.7K to
3.3V
55
SDVO_CLK +/- SDVO Dif
Out
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_INIT +/- SDVO Dif
In
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_STALL +/- SDVO Dif
In
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_TVCLKIN +/-
SDVO Dif
In
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_Red +/- SDVO Dif
Out
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_Green +/- SDVO Dif
Out
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
SDVO_Blue +/- SDVO Dif
Out
Needs a series 100nF
capacitor to connect to an
SDVO converter chip
- - 100 100 0.5
If the signals are not used:
All these SDVO signals may be left open.
Remarks:
For the DDC signals, a voltage translator to 3.3V or 5V is needed.
Pair to Pair spacing: 35mil = 0.9mm
Pair to Pair matching: better than 25mm
BUS to BUS spacing: 20mil = 0.5mm
The AC coupling capacitors (100nF / 0402) must be placed near the device for the Tx signals only.
The maximum number of vias per signal is less than 4.
Supported devices:
SiliConImage SIL1362 / SIL1364 (DVI)
Chrontel CH7021 (SDTV / HDTV / CRT)
EMV/EMI filters:
Chokes are needed.
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5.4.3. LVDS
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length in
mm
LVDS_DDCCLK LVDS 3.3V DDC signal PU 10k to
3.3V
- 150 55
LVDS_DDCDAT LVDS 3.3V DDC signal PU 10k to
3.3V
- 150 55
LVDS_DATA[0..3] +/-
LVDS Dif
Out
LVDS data signal
Connected directly to the
display.
- - 150 100 0.5
LVDS_CLK +/- LVDS Dif
Out
LVDS clock signal
Connected directly
to the
display.
- - 150 100 0.5
LVDS_VDDEN LVDS 3.3V
Out
LVDS control signal
To switch on/off the VDD
of the LVDS display.
100k pull
down
- 150 55
LVDS_BKLCTL LVDS 3.3V
Out
Connected to the LVDS
display’s PWM-based
backlight inverter
module. No multi-bus
master mode is
supported.
- 150 55
LVDS_BKLEN LVDS 3.3V
Out
Connected to the LVDS
display’s backlight
inverter module switch.
100k pull
down
- 150 55
LVDS_CTLA_CLK LVDS 3.3V
I/O
Connected to the LVDS
display’s PWM-based
backlight inverter
module. No multi bus
master mode supported.
PU 4.7k to
3.3V
- 150 55
LVDS_CTLB_DATA
LVDS 3.3V
I/O
Connected to the LVDS
display’s PWM-based
backlight inverter
module.
PU 4.7k to
3.3V
- 150 55
If the signals are not used:
All these LVDS signals may be left open.
Remarks:
For the DDC signals, a voltage translator to 3.3V or 5V is needed.
Pair to Pair spacing: 35mil = 0.9mm
Pair to Pair matching: better than 25mm
Bus to Bus spacing: 20mil = 0.5mm
Maximum via count: 0 2.
EMV/EMI filters:
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5.4.4. USB
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
USB_[0..7] +/- USB Dif Differential USB data signal
pair
- - 300 100 0.2
USB_OC[0..7]# USB 3.3V
In
USB overcurrent signal PU 10k to
3.3V
- 300 55
If the signals are not used:
All these USB signals may be left open.
Remarks:
EMV/EMI-filters:
Use a choke and clamping diode on each signal pair.
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5.4.5. Parallel ATA
Signal BUS Type Description
On Module
Terminatio
n
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
PATA_D[15..0] CMOS 5V
I/O
IDE data signals Series 33 - 100 55 -
PATA_A[0..2] CMOS 5V
Out
IDE address signal.
Connect directly to the PATA
device.
- - 100 55
PATA_IOR#] CMOS 5V
Out
IDE control signal.
Connect directly to the
PATA-device.
- - 100 55
PATA_IOW#] CMOS 5V
Out
IDE control signal.
Connect directly to the
PATA-device.
- - 100 55
PATA_DACK#] CMOS 5V
Out
IDE control signal.
Connect directly to the
PATA-device.
- - 100 55
PATA_CS[3,1] CMOS 5V
Out
IDE control signal.
Connect directly to the
PATA-device.
- - 100 55
PATA_REQ CMOS 3/5V
In
IDE control signal.
Connect directly to the
PATA-device.
- - 100 55
PATA_IORDY CMOS 3V
In
IDE control signal.
Connect directly to the
PATA-device.
PU 4.7k to
3.3V
- 100 55
PATA_IRQ CMOS 3V
In
IDE control signal.
Connect directly to the
PATA-device.
PU 10k to
3.3V
- 100 55
PATA_PCSEL CMOS 3V
In
GND = SSD works as master
HIGH = SSD works as slave
PD 4.7k to
GND
100 55
If the signals are not used:
All this PATA signals may be left open.
Remarks:
EMV/EMI filters:
Are not needed.
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5.4.6. LPC BUS
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
LPC_FRAME# CMOS 3.3V
Out
Connect to the LPC device - - 100 55 -
LPC_AD[3..0] CMOS 3.3V
I/O
Connect to the LPC device - - 100 55 -
LPC_SERIRQ CMOS 3.3V
I/O
Connect to the LPC device PU 10k to
3.3V
- 100 55 -
LPC_CLKOUT[0..1]
CMOS 3.3V
Out
Connect to the Firmware
hub or the SuperIO
Series 33
Ohm
- 100 55 -
If the signals are not used:
Leave the pins open.
Remarks:
Use 33 Ohm series termination in each LPC-CLKx-signal.
The LPC_CLKOUTx may drive only 2 loads.
EMV/EMI filters:
Are not needed.
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5.4.7. SMBus
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
SMB_ALERT# CMOS 3.3V
In
Connect to the SMB device PU 10k to
3.3V
- 200 55 -
SMB_DATA CMOS 3.3V
I/O
Connect to the SMB device
open drain
PU 4.7k to
3.3V
- 200 55 -
SMB_CLOCK CMOS 3.3V
I/O
Connect to the SMB device
open drain
PU 4.7k to
3.3V
- 200 55 -
If the signals are not used:
The pins can stay open.
Remarks:
The SMB_ALERT# may be used to initiate an SMB event over APIC or an SMI.
Maximum BUS capacitance is 200pF. For higher BUS loads, the SMB repeater PCA9515 from Philips
is recommended. Each new SMB segment must be terminated with 2x 4.7k.
EMV/EMI filters:
Are not needed.
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5.4.8. HDA Audio Interface
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
HDA_DOCKEN# CMOS 3.3V
Out
HAD dock enable.
This signal controls the
external HD audio
docking isolation logic.
When de-asserted, the
switch is in isolate
mode.
- - 200 55 -
HAD_RST# CMOS 3.3V
Out
Reset signals for the
external codecs.
Series 33 - 200 55 -
HAD_SYNC CMOS 3.3V
Out
Sample rate at 48kHz to
the codecs.
Series 33 200 55 -
HAD_BITCLK CMOS 3.3V
Out
24MHz signal for the
external codec.
Series 33 200 55 -
HAD_SDATAin [1..0]
CMOS 3.3V
In
Data input from the
external codecs.
- Series
33 Ohm
200 55 -
HAD_SDATAout CMOS 3.3V
Out
Data output from the
ext. PC.
Series 33
HAD_DOCKRST# CMOS 3.3V Reset signal for the
codecs.
- - 200 55 -
If the signals are not used:
Remarks:
The 33 Ohm series termination should be placed directly next to the codecs.
Supported Codecs:
EMV/EMI filters:
Are not needed.
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5.4.9. SD / SDIO Interface
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
SD0_CD# CMOS 3.3V
Out
Connect to an SDIO
device or card.
PU 10k to
3.3V
- 100 55 -
SD0_CLK CMOS 3.3V
Out
Connects to the pin of
the SD/SDIO device or
card.
Series 47
Ohm
Series
49 Ohm
100 55
SD0_CMD# CMOS 3.3V
I/O
Connects to the pin of
the SD/SDIO device or
card.
PU 10k to
3.3V
Series 47
100 55
SD_Data [3..0] CMOS 3.3V Connects to the pin of
the SD/SDIO device or
card.
Series
49 Ohm
100 55
SD0_LED CMOS 3.3V
Out
Optional.
SD0_PWR# CMOS Out Connect to the power
pin on the SD/SDIO
device or card, voltage
translation might be
required.
SD0_WP CMOS In Connects to the pin of
the SD/SDIO device or
card.
PU 10k
to 3.3V
If the signals are not used:
Remarks:
EMV/EMI filters:
Are not needed.
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5.4.10. SPI BUS
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
SPI_MISO CMOS 3.3V
In
Connect to the SPI
device.
- 150 55 -
SPI_MOSI CMOS 3.3V
Out
Connect to the SPI
device.
150 55 -
SPI_CLK CMOS 3.3V
Out
Connect to the SPI
device.
f = 17.86 and 31.25MHz
Series 33 Ohm 150 55 -
SPI_CS# CMOS 3.3V
Out
Connect to the SPI
device.
150 55 -
If the signals are not used:
Remarks:
EMV/EMI filters:
Are not needed.
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5.4.11. SATA Interface (Option)
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
SATA_Tx[0..3] SATA Dif SATA transmitter pair Series 10nF 100 100 SATA_Rx[0..3] SATA Dif SATA receiver pair Series 10nF 100 100 -
If the signals are not used:
Unused SATA interfaces may be open.
Remarks:
The 10nF capacitors 0402 need to be placed directly at the SATA connector.
Maximum via count is 2 per signal.
BUS to BUS spacing is min. 20mil = 0.5mm
Pair to Pair spacing is min. 35mil = 0.9mm
The SATA_LED# output show the SATA (all ports) activity. The LED must be connected to +3.3V with
a series resistor of 330 Ohm to the “SATA_LED#” signal.
EMV/EMI filters:
Are not needed.
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5.4.12. GLAN
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length in
mm
GLAN_TX +/- GLAN Dif GLAN TX pair for 1GE - 100nF 250 95 0.5
GLAN_RX +/- GLAN Dif GLAN RX pair for 1GE - 100nF 250 95 0.5
GLAN-CLK +/- GLAN Dif GLAN reference clock
pair
- 33 Ohm 250 50 -
LCI_TXD[2..0] LCI 3.3V
Out
3x TX signal for
10/100MB
- - 250 50 -
LCI_RXD[2..0] LCI 3.3V
In
3x RX signal for
10/100MB
- - 250 50 -
LCI_RST LCI 3.3V
Out
LAN reset/synch - - 250 50 -
If the signals are not used:
Unused GLAN /LCI interfaces may be open.
Remarks:
The 10nF capacitors 0402 need to be placed directly at the SATA connector.
Maximum via count is 2 per signal.
BUS to BUS spacing is min. 20mil = 0.5mm
Pair to Pair spacing is min. 35mil = 0.9mm
EMV/EMI filters:
Are not needed.
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5.4.13. CAN / Serial
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length
in mm
CAN_TX CMOS 3.3V
Out
Serial output. Res. - - - -
CAN_RX CMOS 3.3V
In
Serial input. Res. - - - -
If the signals are not used:
Unused interfaces may be open.
Remarks:
EMV/EMI filters:
Are not needed.
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5.4.14. PM
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length in
mm
WAKE# CMOS 3.3V
In
To wakeup the system,
this input must be pulled
to GND.
PU 1k0k
3.3V
- - - -
WD_OUT CMOS 3.3V
Out
Indicates a watchdog
timeout event with a high
level. Cleared with a
reset and at power-on.
- - - - -
SUS_S3# CMOS 3.3V
Out
Low = system is in
suspend state S3/S4/S5
(ACPI).
- - - - -
SUS_S4&5# CMOS 3.3V
Out
Low = system is in
suspend state S4/S5
(ACPI).
- - - - -
GPIO[3..0] CMOS 3.3V
I/O
General purpose I/O pin. - - - - -
RST_IN# CMOS 3.3V
In
To reset the system, this
input must be pulled to
GND.
PU 10k to
3.3V
- - - -
RST_OUT# CMOS 3.3V
Out
Goes low during the reset
phase and stays at high
in the running phase.
- - - - -
Power-Good CMOS 3.3V
In
High = feedback from the
external power supplies,
that the voltages are in
the valid ranges.
PU 10k to
3.3V
- - - -
PS_ON CMOS 3.3V
Out
High = power supply on
the baseboard is
switched on.
- - - - -
PWRBTN# CMOS 3.3V
In
To activate this signal,
the PWR_BTN# must be
pulled to GND.
PU 1k to
3.3V
BIOS_Disable# CMOS 3.3V
In
Low = onmodule BIOs is
disabled, an external
BIOS may be connected
over LPC.
PU 1k to
3.3V
- - - -
A20M# CMOS 3.3V
In
Connect to the SuperIO's
KBC to switch between
real and protected mode.
PU 100k to
5.0V
- - - -
Speaker CMOS 3.3V
Out
Speaker
If the signals are not used:
Leave the signal open.
Remarks:
EMV/EMI filters:
Are not needed.
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5.4.15. Supply
Signal BUS Type Description
On Module
Termination
Ext. Termination
Needed
Max.
Length
in mm
Ohm
Matched
Length in
mm
+5Volt PWR In 5V power supply input.
Switched with the
sus4signal
- - - - -
+5V Always PWR In 5V Always available.
VCCRTC PWR In RTC supply 3.0-3.6Volt.
Connect to a lithium
battery, using a 1k series
resistor.
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6. SMARTCORE-EXPRESS CONNECTOR SPECIFICATIONS
The connector type is equal to the COMexpress connector. This is a 220pin, surface-mounted connector
with 0.5mm pitch.
Parameter Condition Specification
Contact Copper alloy Material
Housing Thermoplast molded compound LCP
Current 0.5 Amp
Voltage 50 VAC
Termination Resistance
55mΩ max. ∆R = 20mΩ max.
Electrical
Insulation Resistance
500MΩ
Mating Cycles 30
Connector Mating Force 0.9N per contact
Connector Un-mating Force 0.1N per contact
Pitch 0.5mm
Number of pins 220
Mechanical
Temperature rating -40°C to 85°C
The manufacturer of the connector is:
Source on smartCore Part Name Part Number
Carrier Board Connector
TYCO / AMP H = 8mm Alternative
H = 5mm Standard
8-6318491-6
3-1827253-6
smartCoreExpress Module Connector
TYCO / AMP Mating connector 8-1318490-6
The stack height may be defined on the carrier board as either 5 or 8mm using the two different connector
types available.
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7. SMARTCORE-EXPRESS VERSUS COMEXPRESS
The smartCoreExpress supports small footprints and especially mobile applications. It is powered by the
modern Intel Atom CPU technology.
To select the correct module, this chapter compares the different PCIe-based module concepts. All concepts
allow minimum (required) and maximum (optional) features.
The following table summarizes the features of all PCIe COMs.
Examples: 2 / 6 = 2 required, 6 optional from each module
1 / 1 (PCIe) = 1 required, no more optional, 1x PCI lane needed.
Depending on the concept, reduces the number of free PCIe lanes.
Features
SmartCore
Express
ETXexpress
COMexpress
Type 2
Basic form
factor
MicroETXexpress
COMexpress
Type 2
Small form factor
NanoETXexpress
COMexpress
Type 1
Q-Seven
Size [mm]
58 x 65
3770mm2
h = 5 + 6mm
95 x 125
11875mm2
h = 8 + 13mm
95 x 95
9025mm2
h = 5 + 13mm
51 x 80
4080mm2
h = 5 + 13mm
70 x 70
4900mm2
h = 12mm
Supply Input
5V
typ. 5W
12V
typ. 10-30W
12V
typ. 10W
5V-14V
typ. 8W
5V
typ. 10W
PCI Express Lanes
2 / 6 4 / 6 2 / 6 (1-5 avail.) 1 / 6 2 / 4
(2 available)
PCI 32bit
– 1 / 1 1 / 1 (needs PCIe) – –
USB 2.0 Ports
8 / 8 8 / 8 4 / 8 4 / 8 8 / 8
USB Client Port
0 / 1 – – 0 / 1 –
LAN Port
0 / 1 1 / 1 1 / 1 (needs PCIe) 1 / 1 1 / 1 (PCIe)
HD Audio AC97
1 / 1 1 / 1 0 / 1 0 / 1 1 / 1
PATA
0 / 1 1 / 1 1 / 1 0 / 0 –
SATA
0 / 4 2 / 4 2 / 4 (needs PCIe) 0 / 4 2 / 2 (PCIe)
Analog VGA
– 1 / 1 0 / 1, not avail. 0 / 1 –
LVDS Ports
0 / 1 1 / 1 0 / 1 0 / 1 2 / 2
SDVO
1 / 1 0 / 1 1 / 1 – 1 / 1
PEG x16
– 1 / 1 1 / 1, not avail. – –
TV Output
– 1 / 1 1 / 1, not avail. 0 / 1 –
LPC, SMB
1 / 1 1 / 1 1 / 1 1 / 1 1 / 1
SDIO/MMC Port
0 / 1 – shared with GP shared with GP –
Express Card
Support
0 / 1 1 / 2 1 / 2, not avail. 1 / 2 –
CAN-Bus
0 / 1 – – – –
Connector
220pin 2x 220pin 2x 220pin 1x 220pin 230pin
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8. INDEX
A
AC Coupling Capacitor............................................... 24
B
Block Diagram............................................................ 15
BUS............................................................................ 13
C
COM-Express Connector Description ........................ 20
COM-Express Connector Pinout ................................ 21
COMexpress Connector Specifications................ 40, 41
Connector Placement................................................. 17
Coprocessor......................................................... 12, 13
D
Design IN ................................................................... 16
Dimensions
Carrier Board Connector ....................................... 19
Component Heights............................................... 19
smartCoreExpress Module .................................... 16
Dimensions & Diagrams............................................. 15
Disclaimer .................................................................... 4
E
EMI / EMC.................................................................. 14
Environmental Protection Statement............................ 4
F
Features, Standard .................................................... 11
I
ISO 9001:2000 ........................................................... 10
M
Manual, How to Use It.................................................. 2
Matching of the Differential Pairs ............................... 23
O
Ordering Codes.......................................................... 14
P
Photo of the Top Side of the PCB .............................. 18
Pin Definition .............................................................. 17
Power Management ................................................... 13
Power Supply ............................................................. 13
R
Recycling Information................................................... 5
RoHS Commitment....................................................... 8
S
Safety Precautions ....................................................... 8
Signal Descriptions..................................................... 23
Signal Groups............................................................. 25
CAN / Serial........................................................... 37
GLAN..................................................................... 36
HAD Audio............................................................. 32
LPC BUS ............................................................... 30
LVDS ..................................................................... 27
Parallel ATA........................................................... 29
PCI-Express .......................................................... 25
PM ......................................................................... 38
SATA ..................................................................... 35
SD / SDIO.............................................................. 33
SDVO .................................................................... 26
SMBus ................................................................... 31
SPI BUS ................................................................ 34
Supply.................................................................... 39
USB ....................................................................... 28
Signal Terminology Descriptions ................................ 20
SQS............................................................................ 10
Standards ..................................................................... 7
Swiss Association for Quality and Management
Systems................................................................. 10
Swiss Quality.............................................................. 10
Symbols........................................................................ 6
T
Technical Specifications ............................................. 12
Technical Support ........................................................ 5
Trademarks .................................................................. 4
W
Warranty....................................................................... 5
Watchdog ................................................................... 13
Wire Design................................................................ 23
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