DIGITAL-LOGIC MSM800SEV/SEL, MSM800BEV, MSM800XEV/XEL Technical User's Manual

TAILED TECHNICAL USER MANUAL FOR:

C/104 plus

MSM800SEV/SEL MSM800BEV MSM800XEV/XEL

Nordstrasse 11/F CH - 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

For internal use only:

File: MSM800SEV-SEL_Detailed_V1.7.doc

Path: R:\HANDBUCH\MSM\cpu_boards\MSM800\MSM800SEV-SEL_Detailed_V1.7.doc

This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.

The software described herein, together with this document, are furnished under a license agreement and may be used or copied only in accordance with the terms of that agreement.

About this Manual and How to Use It

This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board, and describes the system and setup requirements. This document contains information on hardware requirements, interconnections, and details of how to program the system. Please check the Product CD for further information and manuals.

REVISION HISTORY:

Document Version

Date/Initials: Modification:

Remarks, News, Attention:

V0.1 02.2006 KUF Initial Version V0.2/V0.3 03.2006 DAR Preliminary Version 1 / Preliminary Version 2 V0.4 06.2006 DAR Preliminary Version 3 V1.0 07.2006 DAR Final Release V1.0A 07.2006 DAR LCD connector / Flat Panel description V1.0B 08.2006 DAR Minor corrections, BIOS update V1.1 10.2006 DAR System I/O Map / Index structure, Board Version 2.1 V1.1A 11.2006 DAR BIOS V1.12, misc drawings V1.1B 12.2006 DAR Front Picture, BIOS V1.13 V1.2 02.2007 DAR BIOS V1.14, other board versions added (not complete) V1.2A 03.2007 DAR Power Mgt / BIOS Setup pictures

erial Port Remote Control V1.3 04.2007 KUF General Doc Revision/Preface additions V1.4 05.2007 WAS/DAR

KUF

Revision History format change / Filename & Path moved Previous product versions chapter added

“Ext. battery connect & onboard battery removed” warning added V1.5 06.2007 DAR/WAS Jumper7 Section 7.1 added w/Note for BIOS boot up Section 4.7.3 V1.6 07.2007 WAS VGA monitor signals updated / XEV&XEL thermoscans added V1.6A 08.2007 DAR MSM800XEV/XEL BIOS History added V1.6B 12.2007 SEP/WAS ACPI S3 (Suspend to RAM) not available; available PCI slots (3 vs 4);

umpers clarified; 1.12 & 1.13 added / Chapter 10

V1.6C 02.2008 DAR Chapter 10 / Heat sink options updated per Solution Guide 2008 / BIOS

1.24 added V1.6D 03.2008 DAR Mechanical Drawings V1.6E 09.2008 DAR Chapter 2.6 V1.6F 10.2008 DAR ??

V1.7 08.2009 MEG/WAS Jumpers J6 & J7 "Remarks" / LANCON info / Power conn. pin diagram

ttention!

1. All information in this manual, and the product, are subject to change without prior notice.

2. Read this manual prior to installation of the product.

3. Read the security information carefully prior to installation of the product.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

able of Contents

. PREFACE........................................................................................................................ 5

1.1. Trademarks ..................................................................................................................................... 5

1.2. Disclaimer ....................................................................................................................................... 5

1.3. Environmental Protection Statement ........................................................................................... 5

1.4. Who should use this Product ....................................................................................................... 5

1.5. Recycling Information.................................................................................................................... 6

1.6. Technical Support .......................................................................................................................... 6

1.7. Limited Two Year Warranty ........................................................................................................... 6

1.8. Explanation of Symbols................................................................................................................. 7

1.9. Applicable Documents and Standards ........................................................................................ 8

1.10. For Your Safety............................................................................................................................... 9

1.11. RoHS Commitment......................................................................................................................... 9

1.11.1. RoHS Compatible Product Design ........................................................................................ 10

1.11.2. RoHS Compliant Production Process ................................................................................... 10

1.11.3. WEEE Application.................................................................................................................. 10

1.12. Swiss Quality ................................................................................................................................ 11

1.13. The Swiss Association for Quality and Management Systems............................................... 11

2. OVERVIEW....................................................................................................................12

2.1. Standard Features........................................................................................................................ 12

2.2. Unique Features MSM800SEV/SEL ............................................................................................ 12

2.3. Unique Features MSM800BEV/BEL ............................................................................................ 12

2.4. Unique Features MSM800XEV/XEL ............................................................................................ 12

2.5. Block Diagrams ............................................................................................................................ 13

2.5.1. MSM800SEV ......................................................................................................................... 13

2.5.2. MSM800BEV ......................................................................................................................... 14

2.5.3. MSM800XEV ......................................................................................................................... 15

2.6. MSM800 SEV/SEL, BEV/BEL, XEV/XEL Specifications ............................................................ 16

2.7. Examples of Ordering Codes ...................................................................................................... 19

2.8. Dimensions and Diagrams .......................................................................................................... 20

2.8.1. MSM800SEV/SEL/BEV/XEV/XEL ......................................................................................... 20

2.8.2. MSM800LVDSCON ............................................................................................................... 32

2.8.3. MSM800DVICON .................................................................................................................. 33

2.8.4. MSM800CON ........................................................................................................................ 34

2.9. MSM800SEV/SEL Incompatibilities to a Standard PC/AT ........................................................ 35

2.9.1. PC104 BUS / ISA BUS .......................................................................................................... 35

2.9.2. ISA-Incompatibility with ISA-PCCARD-Controller ................................................................. 36

2.9.3. ISA-Incompatibility with 16bit I/O Transfer with FPGA-Decoder ........................................... 36

2.9.4. ISA-Incompatibility with 16bit Memory Transfer with FPGA-Decoder................................... 36

2.10. Related Application Notes........................................................................................................... 36

2.11. Thermoscan .................................................................................................................................. 37

2.12. High Frequency Radiation (to meet EN55022) .......................................................................... 39

2.12.1. For Peripheral Cables:........................................................................................................... 39

2.12.2. For Stack-Through Applications: ........................................................................................... 39

2.12.3. Power Supply:........................................................................................................................ 39

2.13. Battery Lifetime ............................................................................................................................ 40

2.13.1. External Battery Assembly: ................................................................................................... 40

3. BUS SIGNALS ...............................................................................................................41

3.1. PC104 Bus..................................................................................................................................... 41

3.2. PC104+ Bus................................................................................................................................... 43

3.3. Expansion Bus ............................................................................................................................. 45

3.4. Addressing PCI Devices .............................................................................................................. 45

3.4.1. MSM800SEV/SEL V2.1 ......................................................................................................... 45

3.4.2. MSM800BEV/XEV/XEL V1.x ................................................................................................. 45

4. BIOS HISTORY .............................................................................................................46

5. DETAILED SYSTEM DESCRIPTION ................................................................................... 47

5.1. Power Requirements.................................................................................................................... 47

5.2. Boot Time ...................................................................................................................................... 47

5.3. CPU, Boards and RAMs............................................................................................................... 48

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

.3.1. CPUs of this MICROSPACE Product .................................................................................... 48

5.3.2. Numeric Coprocessor ............................................................................................................ 48

5.3.3. DDRAM Memory on MSM800SEV/SEL/BEV/BEL................................................................ 48

5.3.4. DDRAM Memory on MSM800XEV/XEL ................................................................................ 48

5.4. Interfaces ...................................................................................................................................... 48

5.4.1. AT Compatible Keyboard & PS/2 Mouse X31....................................................................... 48

5.4.2. Line Printer Port LPT1 ........................................................................................................... 49

5.4.3. Serial Ports COM1-COM2 ..................................................................................................... 49

5.4.4. Floppy Disk Interface ............................................................................................................. 49

5.4.5. Speaker Interface .................................................................................................................. 50

5.5. Controllers .................................................................................................................................... 51

5.5.1. Interrupt Controllers ............................................................................................................... 51

5.6. Timers and Counters ................................................................................................................... 51

5.6.1. Programmable Timers ........................................................................................................... 51

5.6.2. RTC (Real Time Clock) ......................................................................................................... 52

5.6.3. Watchdog............................................................................................................................... 52

5.7. BIOS............................................................................................................................................... 53

5.7.1. Core BIOS download ............................................................................................................. 53

5.7.2. ROM-BIOS Sockets............................................................................................................... 54

5.7.3. BIOS CMOS Setup ................................................................................................................ 54

5.8. CMOS RAM Map ........................................................................................................................... 54

5.9. EEPROM saved CMOS Setup...................................................................................................... 60

5.9.1. EEPROM Memory for Setup ................................................................................................. 61

5.10. Memory & I/O Map ........................................................................................................................ 61

5.10.1. System Memory Map............................................................................................................. 61

5.10.2. System I/O Map ..................................................................................................................... 62

6. VGA/LCD ...................................................................................................................66

6.1. VGA/LCD Controller of the Geode LX800 .................................................................................. 66

6.2. Graphic Modes ............................................................................................................................. 66

6.3. DVICON Resolution...................................................................................................................... 66

6.4. Flat Panel Functional Description .............................................................................................. 67

7. DESCRIPTION OF THE CONNECTORS................................................................................68

7.1. Top Side of the MSM800SEV/SEL V2.1/V2.2.............................................................................. 69

7.2. Bottom Side of the MSM800SEV V2.1/V2.2................................................................................ 70

7.3. Top Side of the MSM800BEV V1.1 .............................................................................................. 71

7.4. Top Side of the MSM800XEV/XEL V1.0 ...................................................................................... 72

8. JUMPER LOCATIONS ON THE BOARD .............................................................................. 83

8.1. The Jumpers on the MSM800SEV/SEL ...................................................................................... 83

8.2. The Jumpers on the MSM800BEV/XEV/XEL .............................................................................. 83

9. CABLE INTERFACES ...................................................................................................... 88

9.1. The Hard Disk Cable 44pin .......................................................................................................... 88

9.2. The COM 1/2 Serial Cable ............................................................................................................ 89

9.3. The Printer Cable.......................................................................................................................... 90

9.4. The Micro-Floppy Cable............................................................................................................... 91

9.5. The LAN Cable (RJ45).................................................................................................................. 92

10. THERMAL SPECIFICATIONS......................................................................................... 93

11. ASSEMBLY VIEWS .....................................................................................................95

11.1. MSM800SEV/SEL V2.1/V2.2 ......................................................................................................... 95

11.2. MSM800BEV V1.1 ......................................................................................................................... 97

11.3. MSM800XEV/XEL V1.0 ................................................................................................................. 99

12. PREVIOUS PRODUCT VERSIONS................................................................................101

12.1. Board Dimensions – Versions 1.0 / 1.1 / 1.2 ............................................................................ 101

12.2. Assembly Views ......................................................................................................................... 102

12.2.1. MSM800SEV/SEL V1.1 ....................................................................................................... 102

12.2.2. MSM800 V1.2 ...................................................................................................................... 106

12.3. Connectors and Jumpers of Previous Product Versions ...................................................... 110

12.3.1. Description of the Connectors for V1.0 /V1.1 /V1.2............................................................. 110

13. INDEX ..................................................................................................................... 119

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

. PREFACE

The information contained in this manual has been carefully checked and is believed to be accurate; it is subject to change without notice. Product advances mean that some specifications may have changed. DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or application of any circuit or product described herein.

1.1. Trademarks

DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include names, company logos, and registered trademarks which are, therefore, proprietary to their respective owners.

1.2. Disclaimer

DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITALLOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.

1.3. Environmental Protection Statement

This product has been manufactured to satisfy environmental protection requirements wherever possible. Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or local laws or regulations.

1.4. Who should use this Product

 Electrical engineers with know-how in PC-technology.

 Because of the complexity and the variability of PC-technology, we cannot guarantee that the product

will work in any particular situation or set-up. Our technical support will try to help you find a solution.

 Pay attention to electrostatic discharges; use a CMOS protected workplace.

 Power supply must be OFF when working on the board or connecting any cables or devices.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

1.5.

Recycling Information

l components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances

Directive). The product is soldered with a lead free process.

1.6. Technical Support

1. Contact your local DIGITAL-LOGIC Technical Support, in your country.

2. Use the Internet Support Request form at http://support.digitallogic.ch/



embedded products  New

Support Request

Support requests are only accepted with detailed information about the product (i.e., BIOS-, Boardversion)!

1.7. Limited Two Year Warranty

DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be free from defects in materials and workmanship for two years following the date of shipment from DIGITALLOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transferable.

During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.

Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland

are required to register a RMA (Return Material Authorization) number in the Support Center at

http://support.digitallogic.ch/

All other customers must contact their local distributors for returning defective materials.

his limited warranty does not extend to any product which has been damaged as a result of accident, misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC AG and therefore the product has been damaged.

Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufacturer’s limited warranty.

Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to, any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable to the purchaser or any user for any damage, including any incidental or consequential damage, expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

1.8. Explanation of Symbols

E Conformity

This symbol indicates that the product described in this manual is in compliance with all applied CE standards.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 32V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment

Warning, ESD Sensitive Device!

This symbol and title inform that electronic boards and their components are sensitive to Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must always be taken while handling and examining this product.

Attention!

This symbol and title emphasize points which, if not fully understood and taken into consideration by the reader, may endanger your health and/or result in damage to your equipment.

Note...

This symbol and title emphasize aspects the user should read through carefully for his, or her, own advantage.

Warning, Heat Sensitive Device!

This symbol indicates a heat sensitive component.

Safety Instructions

This symbol shows safety instructions for the operator to follow.

This symbol warns of general hazards from mechanical, electrical, and/or chemical failure. This may endanger your life/health and/or result in damage to your equipment.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

1.9.

Applicable Documents and Standards

The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.

 Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright



ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001. http://www.ansi.org/



ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.

http://www.ansi.org/



ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached SCSI (SAS), October 30, 2003. http://www.ansi.org/



http://www.vesa.org/summary/sumddcci.htm



http://www.expresscard.org/



IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications. http://www.ieee.org



IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.

http://www.ieee.org



PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004, PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/



Serial ATA: High Speed Serialized AT Attachment Revision 1.0a January 7, 2003 Copyright © 20002003, APT Technologies, Inc, Dell Computer Corporation, Intel Corporation, Maxtor Corporation, Seagate Technology LLC. All rights reserved. http://www.sata-io.org/

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7



Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org



System Management Bus (SMBus) Specification Version 2.0, August 3, 2000 Copyright © 1994, 1995, 1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.

http://www.smbus.org/



Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corporation, NEC Corporation, Koninklijke Philips Electronics N.V. All rights reserved.

http://www.usb.org/

1.10.

For Your Safety

Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the interest of your own safety and for the correct operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.

Attention!

All work on this device must only be carried out by sufficiently skilled personnel.

Caution, Electric Shock!

Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is switched off. This applies also to the installation of piggybacks or peripherals. Serious electrical shock hazards can exist during all installation, repair and maintenance operations with this product. Therefore, always unplug the power cable and any other cables which provide external voltage before performing work.

Warning, ESD Sensitive Device!

Electronic boards and their components are sensitive to static electricity. In order to ensure product integrity at all times, be careful during all handling and examinations of this product.

1.11. RoHS Commitment

DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a directive, which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.

Each European Union member state is adopting its own enforcement and implementation policies using the directive as a guide. Therefore, there could be as many different versions of the law as there are states in the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their own regulations for green products, which are similar, but not identical, to the RoHS directive.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

oHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:

 Lead

 Mercury

 Cadmium

 Chromium VI

 PBB and PBDE

The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply to the weight of the finished product, or even to a component but to any single substance that could (theoretically) be separated mechanically.

1.11.1. RoHS Compatible Product Design

ll DIGITAL-LOGIC standard products comply with RoHS legislation.

Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.

1.11.2. RoHS Compliant Production Process

IGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These capabilities are verified by:

1. A confirmation from the supplier indicating that their production processes and resulting devices are RoHS compliant.

2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned substances in a produced device will be measured. These measurements are carried out by an accredited laboratory.

1.11.3. WEEE Application

he WEEE directive is closely related to the RoHS directive and applies to the following devices:

 Large and small household appliances  IT equipment  Telecommunications equipment (although infrastructure equipment is exempt in some countries)  Consumer equipment  Lighting equipment – including light bulbs  Electronic and electrical tools  Toys, leisure and sports equipment  Automatic dispensers

It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to properly recycle all electronic products that have reached the end of their life cycle.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

1.12. Swiss Quality



100% Made in Switzerland

 DIGITAL-LOGIC is a member of "Swiss-Label"

 This product was not manufactured by employees earning piecework wages

 This product was manufactured in humane work conditions

 All employees who worked on this product are paid customary Swiss market wages and are insured

 ISO 9000:2001 (quality management system)

1.13. The Swiss Association for Quality and Management Systems

The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment services for all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification Network, IQNet, and co-operation contracts/agreements with accredited partners.

www.sqs.ch

he SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field of development, manufacturing and sales of embedded computer boards, embedded computer modules and computer systems. The certification is valid for three years at which time an audit is performed for recertification.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

. OVERVIEW

2.1. Standard Features

The MICROSPACE PC/104 is a miniaturized modular device incorporating the major elements of a PC/AT compatible computer. It includes standard PC/AT compatible elements, such as:

 Powerful Geode LX-800 500MHz  BIOS ROM  Timers, DMA  Real-time clock with CMOS-RAM and battery buffer (external/onboard)  LPT1 parallel port  COM1-, COM2-RS2332 serial port  Speaker interface  AT-keyboard interface or PS/2-keyboard interface  Floppy disk interface  AT-IDE hard disk interface  VGA/LCD video interface  PC/104 ISA Bus  PC104+ PCI Bus (option)  PS/2 mouse interface  4 Channel USB 2.0  Optional: Onboard CF socket Type II  Single 5V supply  EEPROM for setup and configuration  UL approved parts  Watchdog

2.2. Unique Features MSM800SEV/SEL

The MSM800SEV/SEL includes all standard PC/AT functions plus unique enhancements, such as:

 LAN Ethernet, INTEL 82551ER (or on request [optional] 82551QM)  LPC to ISA Bridge  SODIMM DDR-Memory holder (128-1024MByte)

2.3. Unique Features MSM800BEV/BEL

The MSM800BEV includes all standard PC/AT functions plus unique enhancements, such as:

 LAN Ethernet, INTEL 82551ER (or on request [optional] 82551QM)  PCI to ISA Bridge for full ISA support. Needs one PCI load/resource.  SODIMM DDR-Memory holder (128-1024MByte)

2.4. Unique Features MSM800XEV/XEL

The MSM800XEV includes all standard PC/AT functions plus unique enhancements, such as:

 LAN Ethernet, INTEL 82551ER (or on request [optional] 82551QM)  PCI to ISA Bridge for full ISA support. Needs one PCI load/resource.  Soldered 256MByte onboard DDR-RAM

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

2.5.

Block Diagrams

2.5.1. MSM800SEV

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

5.2. MSM800BEV

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

5.3. MSM800XEV

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

2.6.

MSM800 SEV/SEL, BEV/BEL, XEV/XEL Specifications

CPU

CPU G

eode LX800

CPU Core Supply 1

.8V very low powered

Mode R

eal/Protected

Compatibility 8

086 – P5

Word Size 3

2bits Secondary Cache – Physical Addressing 32 lines Virtual Addressing 1

6GBytes Clock Rates 5

00MHz Socket Standard S

oldered BGA

Chipset

Northbridge A

MD LX800

Southbridge A

MD 5536

LAN 1

0/100MBit Intel 82C551ER Audio A

C97 – V2.3 Firewire IEEE1394 Not onboard Video 1

6MByte Video-DDRAM

Power Management

Available since V2.0 The LX800 supports ACPI and APM Version 1.2.

he following ACPI Sleep States are supported:

- S1 (Sleep with CPU content)

- S4 (Hibernation - LED* is blinking) with transition to S5

- S5-G2 (Power Off - LED* is blinking. The device can be switched on by the Main Button (or if available with WOL)

- S5-G3 (Power Off - Mechanically)

* = if available

DMA

8237A comp. 4

channel 8bits

3 channel 16bits

Interrupts

8259 comp. 8

+ 7 levels

C compatible

Timers

8254 comp. 3

programmable counter/timers

Memory

MSM800SEV/SEL/BEV M

SM800SEV/SEL

SODIMM200pin DDR PC2700 333MHz 128-1024Mbyte Soldered onboard 256Mbyte DDR-RAM

Video

Controller M

SM800SEV

BUS 3

2bit high speed 33MHz PCI Bus

Enhanced BIOS V

GA/LCD BIOS Memory 2

-254MByte shared RAM

CRT-Monitor V

GA, SVGA up to 1920x1440 Flat panel T

FT 3.3V 18/24bit up to 1600x1200 Controller modes CRT only; flat panel only; or simultaneous CRT and flat panel Video input no Drivers W

IN2000, XP

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

Mass Storage

FD: F

loppy disk interface, for max. 1 floppy with 26pin connector HD: E

-IDE interface, AT-type, for max. 2 hard disks, 44pin connector, for 1.3, 1.8

and 2.5" hard disks with 44 pins IDE

Standard AT Interfaces

Serial

Name FIFO IRQs Addr. Standard Option

COM1 C

OM2

yes yes

IRQ4 IRQ3

3F8 2F8

RS232C RS232C

(

Baud rates: 50-115 KBaud programmable)

Parallel L

PT1 printer interface mode: SPP(output), EPP (bidir.) (Centronics)

Keyboard A

T or PS/2 –keyboard Mouse P

S/2 Speaker 0

.1 W output drive

RTC I

ntegrated into the chipset, RTC with CMOS-RAM 256Byte

Backup current

5 µA Non-chargeable Battery M

SM800SEV/BEV/XEV

MSM800SEL/BEL/XEL

3.6V Lithium 400mAh internally or externally connected External 3.6V Lithium battery needed

BUS

PC/104plus I

EEE-996 standard ISA bus, buffered MSM800SEV/SEL: 8bit and limited 16bit support MSM800BEV/BEL/XEV/XEL: full 16bit ISA support

Clock 8

MHz defined by the Geode

USB

USB 2

Transfer rate 4

00MBps, 12.5MBps/1.5MBps

Channels 4

Peripheral Extension

ISA W

ith PC/104 BUS MSM800SEV/SEL: with ISA 16bit DMA limitation MSM800BEV/BEL/XEV/XEL: no ISA limitation

PCI

ith PC/104plus BUS MSM800SEV/SEL: 3 slots – max. 3 master devices MSM800BEV/BEL/XEV/XEL: 2 slots – max. 2 master devices

Power Supply

Working

Volts ± 5%

Power Rise Time U

nspecified

Power consumption MSM800SEV V2.1 with HD, MS/KB (PS/2), CRT Monitor

indows XP Desktop: type 7.5-10W

Standby power consumption MSM800SEV/SEL/BEV:

indows Standby: 2.5W (without MS/KB wake-up function) Windows Standby: 4.5W (with PS/2 wake-up function)

Physical Characteristics

Dimensions L

ength: 91mm Depth: 96mm Height: 25mm

Weight 1

70gr

PCB Thickness 1.6mm / 0.0625 inches nominal PCB Layer Multilayer

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

Operating Environment

Relative humidity 5

-90% non-condensing

Vibration 5

to 2000Hz, 0.1G

Shock 1

Temperature

SM800SEV/SEL

perating standard version:

Without heat sink: 0°C to +60°C With small heat sink 807041: -25°C to +70°C

Operating extended version:

Not possible

MSM800BEV O

perating standard version:

Without heat sink: 0°C to +60°C With small heat sink 807041: -25°C to +70°C

Operating extended version:

With large heat sink 807042 + E48: -40°C to +85°C With thermojunction + E48: -40°C to +85°C

MSM800XEV/XEL O

perating standard version:

Without heat sink: 0°C to +60°C With small heat sink 807041: -25°C to +70°C

Operating extended version:

With large heat sink 807042 + E47: -40°C to +70°C With thermojunction + E48: -40°C to +85°C

EMI / EMC (IEC1131-2 refer MIL 461/462)

ESD Electro Static Discharge I

EC 801-2, EN55101-2, VDE 0843/0847 Part 2 Metallic protection needed Separate ground layer included 15 kV single peak

REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9. (not tested) EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4

50V - 4kV, 50 ohms, Ts=5ns

Grade 2: 1kV Supply, 500 I/O, 5kHz

SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5

upply: 2kV, 6 pulse/minute I/O: 500V, 2 pulse/minute FD, CRT: none

High-frequency Radiation E

N55022

Compatibility

MSM800SEV/BEV/XEV/SEL/BEL/XEL Mechanically compatible to our MSMx86 Boards and to all

ther PC/104 boards

ll information is subject to change without notice.

DIGITAL-LOGIC AG

MSM800SEV/SEL/BEV/XEV/XEL Detailed Manual V1.7

2.7.

Examples of Ordering Codes

Part / Option Part Nr. Description

MSM800SEL 802105 Low cost version without: RTC-battery MSM800SEV 802100 Standard version with: LPC-Bridge MSM800BEV 802110 Standard version with: full ISA-16bit support and PCI-ISA-Bridge MSM800XEL 802125 Low cost soldered RAM version without:

RTC-battery or PCI-ISA-Bridge

MSM800XEV 802120 Standard soldered RAM version with:

ull ISA-16bit support and PCI-ISA-Bridge

Option -L+ 8

07006

PC/104-Plus with long connector

Option -P+ 8

07005

PC/104-Plus with short connector

Option -CF 8

07007 CompactFlash socket (without Option -L) MSM800-CKCON 803035 MSM800 PC/104-cable kit MSFLOPPY 8

91001 3.5” Micro-floppy drive (26pin) MSFDCK 8

02600 Micro-floppy cable (26pin) MSM800-LANCON 803046 LAN cable with PCB connector MSM800-DVICON 803042 DVI-D interface MSM800-LVDSCON 803044 LVDS interface MSM800DK 8

02118 Development kit

hese are only examples; for current ordering codes, please see the current price list.