DIGITAL-LOGIC MICROSPACE MSEBX800, MICROSPACE MSEBX900 User Manual

Detailed USER MANUAL FOR:

EBX

smartModule800/900

MSEBX800/900

Nordstrasse 11/F CH - 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage:

http://www.digitallogic.com

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

For internal use only:

File: MSEBX800-900_Detailed_V1.0.doc Path: R:\HANDBUCH\MSEBX\MSEBX800\MSEBX800-900_Detailed_V1.0.doc

This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG.

The software described herein, together with this document, are furnished under a license agreement and may be used or copied only in accordance with the terms of that agreement.

About this Manual and How to Use It

This manual is written for the original equipment manufacturer (OEM) who plans to build computer systems based on the single board MICROSPACE-PC. It is for integrators and programmers of systems based on the MICROSPACE-Computer family. This manual provides instructions for installing and configuring the board, and describes the system and setup requirements. This document contains information on hardware requirements, interconnections, and details of how to program the system. Please check the Product CD for further information and manuals.

REVISION HISTORY:

Product Version

Document Version

Date/Initials: Modification:

Remarks, News, Attention:

V0.3 V1.0 05.2008 WAS Initial Version

Attention!

1. All information in this manual, and the product, are subject to change without prior notice.

2. Read this manual prior to installation of the product.

3. Read the security information carefully prior to installation of the product.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

Table of Contents

1. PREFACE .....................................................................................................................................................5

1.1. Trademarks ..................................................................................................................................... 5

1.2. Disclaimer ....................................................................................................................................... 5

1.3. Environmental Protection Statement ........................................................................................... 5

1.4. Who should use this Product ....................................................................................................... 5

1.5. Recycling Information.................................................................................................................... 6

1.6. Technical Support .......................................................................................................................... 6

1.7. Limited Two Year Warranty ........................................................................................................... 6

1.8. Explanation of Symbols................................................................................................................. 7

1.9. Applicable Documents and Standards ........................................................................................ 8

1.10. For Your Safety............................................................................................................................... 9

1.11. RoHS Commitment......................................................................................................................... 9

1.11.1. RoHS Compatible Product Design ........................................................................................ 10

1.11.2. RoHS Compliant Production Process ................................................................................... 10

1.11.3. WEEE Application.................................................................................................................. 10

1.12. Swiss Quality ................................................................................................................................ 11

1.13. The Swiss Association for Quality and Management Systems............................................... 11

2. OVERVIEW .................................................................................................................................................12

2.1. Standard Features........................................................................................................................ 12

2.2. Unique Features ........................................................................................................................... 12

2.3. Standards ...................................................................................................................................... 12

2.4. Block Diagrams ............................................................................................................................ 13

2.4.1. MSEBX800 ............................................................................................................................ 13

2.4.2. SM800 ................................................................................................................................... 14

2.5. MSEBX800/900 Specifications .................................................................................................... 15

2.6. Examples of Ordering Codes ...................................................................................................... 18

2.7. Dimensions & Diagrams .............................................................................................................. 19

2.8. Incompatibilities to a Standard PC/AT ....................................................................................... 22

2.9. MSEBX800/900 Related Application Notes ................................................................................ 22

2.10. High Frequency Radiation (to meet EN55022/EN61000) .......................................................... 22

2.11. Thermoscan .................................................................................................................................. 23

2.12. RTC Battery Lifetime.................................................................................................................... 23

3. PREPARATION............................................................................................................................................24

3.1. Important Information .................................................................................................................. 24

3.2. Mounting the smartModule ......................................................................................................... 25

3.3. RAM Assembly/Disassembly ...................................................................................................... 26

3.4. Power & Reset Buttons................................................................................................................ 28

4. BUS SIGNALS ............................................................................................................................................29

4.1. PC104 Bus..................................................................................................................................... 29

4.2. Addressing PCI Devices on the MSEBX800:............................................................................. 31

5. DETAILED SYSTEM DESCRIPTION................................................................................................................32

5.1. Boot Time ...................................................................................................................................... 32

5.2. Interfaces ...................................................................................................................................... 33

5.2.1. PS/2 Keyboard (AT Compatible) and PS/2 Mouse .............................................................. 33

5.2.2. Line Printer Port LPT1 ........................................................................................................... 33

5.2.3. Serial Ports COM1 - COM2 ................................................................................................... 33

5.2.4. Floppy Disk Interface ............................................................................................................. 34

5.3. Controllers .................................................................................................................................... 35

5.3.1. Interrupt Controllers ............................................................................................................... 35

5.3.2. Timers and Counters ............................................................................................................. 35

5.3.3. Core BIOS Download ............................................................................................................ 35

5.4. BIOS Recovery ............................................................................................................................. 36

6. DESCRIPTION AND LOCATION OF THE CONNECTORS ....................................................................................37

6.1. Connector Plan............................................................................................................................. 38

6.2. Connector Descriptions............................................................................................................... 39

7. JUMPER LOCATIONS ON THE BOARD...........................................................................................................50

7.1. The 2pin Jumpers......................................................................................................................... 50

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

7.2. The 3pin Jumpers......................................................................................................................... 50

7.3. Jumpers on the MSEBX800......................................................................................................... 51

8. INDEX ........................................................................................................................................................52

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

1. PREFACE

The information contained in this manual has been carefully checked and is believed to be accurate; it is subject to change without notice. Product advances mean that some specifications may have changed. DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may appear in this manual. Furthermore, DIGITAL-LOGIC AG does not accept any liability arising from the use or application of any circuit or product described herein.

1.1. Trademarks

DIGITAL-LOGIC, DIGITAL-LOGIC-Logo, MICROSPACE, and smartModule are registered trademarks owned worldwide by DIGITAL-LOGIC AG, Luterbach (Switzerland). In addition, this document may include names, company logos, and registered trademarks which are, therefore, proprietary to their respective owners.

1.2. Disclaimer

DIGITAL-LOGIC AG makes no representations or warranties with respect to the contents of this manual, and specifically disclaims any implied warranty of merchantability or fitness, for any particular purpose. DIGITALLOGIC AG shall, under no circumstances, be liable for incidental or consequential damages or related expenses resulting from the use of this product, even if it has been notified of the possibility of such damage.

1.3. Environmental Protection Statement

This product has been manufactured to satisfy environmental protection requirements wherever possible. Many of the components used (structural parts, printed circuit boards, connectors, batteries, etc.) are capable of being recycled. Final disposal of this product after its service life must be accomplished in accordance with applicable country, state, or local laws or regulations.

1.4. Who should use this Product

 Electrical engineers with know-how in PC-technology.

 Because of the complexity and the variability of PC-technology, we cannot guarantee that the product

will work in any particular situation or set-up. Our technical support will try to help you find a solution.

 Pay attention to electrostatic discharges; use a CMOS protected workplace.

 Power supply must be OFF when working on the board or connecting any cables or devices.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

1.5. Recycling Information

All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances Directive). The product is soldered with a lead free process.

1.6. Technical Support

1. Contact your local DIGITAL-LOGIC Technical Support, in your country.

2. Use the Internet Support Request form at http://support.digitallogic.ch/  embedded products  New Support Request

Support requests are only accepted with detailed information about the product (i.e., BIOS-, Boardversion)!

1.7. Limited Two Year Warranty

DIGITAL-LOGIC AG guarantees the hardware and software products it manufactures and produces to be free from defects in materials and workmanship for two years following the date of shipment from DIGITALLOGIC AG, Switzerland. This warranty is limited to the original purchaser of the product and is not transferable.

During the two year warranty period, DIGITAL-LOGIC AG will repair or replace, at its discretion, any defective product or part at no additional charge, provided that the product is returned, shipping prepaid, to DIGITAL-LOGIC AG. All replaced parts and products become property of DIGITAL-LOGIC AG.

Before returning any product for repair, direct customers of DIGITAL-LOGIC AG, Switzerland

are required to register a RMA (Return Material Authorization) number in the Support Center at

http://support.digitallogic.ch/

All other customers must contact their local distributors for returning defective materials.

This limited warranty does not extend to any product which has been damaged as a result of accident, misuse, abuse (such as use of incorrect input voltages, wrong cabling, wrong polarity, improper or insufficient ventilation, failure to follow the operating instructions that are provided by DIGITAL-LOGIC AG or other contingencies beyond the control of DIGITAL-LOGIC AG), wrong connection, wrong information or as a result of service or modification by anyone other than DIGITAL-LOGIC AG. Nor if the user has insufficient knowledge of these technologies or has not consulted the product manuals or the technical support of DIGITAL-LOGIC AG and therefore the product has been damaged.

Empty batteries (external and onboard), as well as all other battery failures, are not covered by this manufacturer’s limited warranty.

Except, as directly set forth above, no other warranties are expressed or implied, including, but not limited to, any implied warranty of merchantability and fitness for a particular purpose, and DIGITAL-LOGIC AG expressly disclaims all warranties not stated herein. Under no circumstances will DIGITAL-LOGIC AG be liable to the purchaser or any user for any damage, including any incidental or consequential damage, expenses, lost profits, lost savings, or other damages arising out of the use or inability to use the product.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

1.8. Explanation of Symbols

CE Conformity

This symbol indicates that the product described in this manual is in compliance with all applied CE standards.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment.

Caution, Electric Shock!

This symbol and title warn of hazards due to electrical shocks (> 32V) when touching products or parts of them. Failure to observe the precautions indicated and/or prescribed by the law may endanger your life/health and/or result in damage to your equipment

Warning, ESD Sensitive Device!

This symbol and title inform that electronic boards and their components are sensitive to Electro Static Discharge (ESD). In order to ensure product integrity at all times, care must always be taken while handling and examining this product.

Attention!

This symbol and title emphasize points which, if not fully understood and taken into consideration by the reader, may endanger your health and/or result in damage to your equipment.

Note...

This symbol and title emphasize aspects the user should read through carefully for his, or her, own advantage.

Warning, Heat Sensitive Device!

This symbol indicates a heat sensitive component.

Safety Instructions

This symbol shows safety instructions for the operator to follow.

This symbol warns of general hazards from mechanical, electrical, and/or chemical failure. This may endanger your life/health and/or result in damage to your equipment.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

1.9. Applicable Documents and Standards

The following publications are used in conjunction with this manual. When any of the referenced specifications are superseded by an approved revision, that revision shall apply. All documents may be obtained from their respective organizations.

 Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright

 ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS)

Interface Circuits, January 1, 2001. http://www.ansi.org/

 ANSI INCITS 361-2002: AT Attachment with Packet Interface - 6 (ATA/ATAPI-6), November 1, 2002.

http://www.ansi.org/

 ANSI INCITS 376-2003: American National Standard for Information Technology – Serial Attached

SCSI (SAS), October 30, 2003. http://www.ansi.org/

reserved. http://www.intel.com/labs/media/audio/

 Display Data Channel Command Interface (DDC/CI) Standard (formerly DDC2Bi) Version 1, August

http://www.vesa.org/summary/sumddcci.htm

http://www.expresscard.org/

 IEEE 802.3-2002, IEEE Standard for Information technology, Telecommunications and information

exchange between systems–Local and metropolitan area networks–Specific requirements – Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access Method and Physical Layer Specifications. http://www.ieee.org

 IEEE 802.3ae (Amendment to IEEE 802.3-2002), Part 3: Carrier Sense Multiple Access with Collision

Detection (CSMA/CD) Access Method and Physical Layer Specifications, Amendment: Media Access Control (MAC) Parameters, Physical Layers, and Management Parameters for 10 GB/s Operation.

http://www.ieee.org

 PICMG® Policies and Procedures for Specification Development, Revision 2.0, September 14, 2004,

PCI Industrial Computer Manufacturers Group (PICMG®), 401 Edgewater Place, Suite 500, Wakefield, MA 01880, USA, Tel: 781.224.1100, Fax: 781.224.1239. http://www.picmg.org/

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

 Smart Battery Data Specification Revision 1.1, December 11, 1998. www.sbs-forum.org

1998, 2000 Duracell, Inc., Energizer Power Systems, Inc., Fujitsu, Ltd., Intel Corporation, Linear Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, PowerSmart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved.

http://www.smbus.org/

http://www.usb.org/

1.10. For Your Safety

Your new DIGITAL-LOGIC product was developed and tested carefully to provide all features necessary to ensure its compliance with electrical safety requirements. It was also designed for a long, fault-free life. However, this life expectancy can be drastically reduced by improper treatment during unpacking and installation. Therefore, in the interest of your own safety and for the correct operation of your new DIGITAL-LOGIC product, please comply with the following guidelines.

Attention!

All work on this device must only be carried out by sufficiently skilled personnel.

Caution, Electric Shock!

Before installing your new DIGITAL-LOGIC product, always ensure that your mains power is switched off. This applies also to the installation of piggybacks or peripherals. Serious electrical shock hazards can exist during all installation, repair and maintenance operations with this product. Therefore, always unplug the power cable and any other cables which provide external voltage before performing work.

Warning, ESD Sensitive Device!

Electronic boards and their components are sensitive to static electricity. In order to ensure product integrity at all times, be careful during all handling and examinations of this product.

1.11. RoHS Commitment

DIGITAL-LOGIC AG is committed to develop and produce environmentally friendly products according to the Restriction of Hazardous Substances (RoHS) Directive (2002/95/EC) and the Waste Electrical and Electronic Equipment (WEEE) Directive (2002/96/EC) established by the European Union. The RoHS directive was adopted in February 2003 by the European Union and came into effect on July 1, 2006. It is not a law but a directive, which restricts the use of six hazardous materials in the manufacturing of various types of electronic and electrical equipment. It is closely linked with the Waste Electrical and Electronic Equipment Directive (WEEE) 2002/96/EC, which has set targets for collection, recycling and recovery of electrical goods and is part of a legislative initiative to solve the problem of huge amounts of toxic e-waste.

Each European Union member state is adopting its own enforcement and implementation policies using the directive as a guide. Therefore, there could be as many different versions of the law as there are states in the EU. Additionally, non-EU countries like China, Japan, or states in the U.S. such as California may have their own regulations for green products, which are similar, but not identical, to the RoHS directive.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances:

 Lead

 Mercury

 Cadmium

 Chromium VI

 PBB and PBDE

The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. This means that the limits do not apply to the weight of the finished product, or even to a component but to any single substance that could (theoretically) be separated mechanically.

1.11.1. RoHS Compatible Product Design

All DIGITAL-LOGIC standard products comply with RoHS legislation.

Since July 1, 2006, there has been a strict adherence to the use of RoHS compliant electronic and mechanical components during the design-in phase of all DIGITAL-LOGIC standard products.

1.11.2. RoHS Compliant Production Process

DIGITAL-LOGIC selects external suppliers that are capable of producing RoHS compliant devices. These capabilities are verified by:

1. A confirmation from the supplier indicating that their production processes and resulting devices are RoHS compliant.

2. If there is any doubt of the RoHS compliancy, the concentration of the previously mentioned substances in a produced device will be measured. These measurements are carried out by an accredited laboratory.

1.11.3. WEEE Application

The WEEE directive is closely related to the RoHS directive and applies to the following devices:

 Large and small household appliances  IT equipment  Telecommunications equipment (although infrastructure equipment is exempt in some countries)  Consumer equipment  Lighting equipment – including light bulbs  Electronic and electrical tools  Toys, leisure and sports equipment  Automatic dispensers

It does not apply to fixed industrial plants and tools. The compliance is the responsibility of the company that brings the product to market, as defined in the directive. Components and sub-assemblies are not subject to product compliance. In other words, since DIGITAL-LOGIC does not deliver ready-made products to end users the WEEE directive is not applicable for DIGITAL-LOGIC. Users are nevertheless encouraged to properly recycle all electronic products that have reached the end of their life cycle.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

1.12. Swiss Quality

 100% Made in Switzerland

 DIGITAL-LOGIC is a member of "Swiss-Label"

 This product was not manufactured by employees earning

piecework wages

 This product was manufactured in humane work conditions

 All employees who worked on this product are paid

customary Swiss market wages and are insured

 ISO 9000:2001 (quality management system)

1.13. The Swiss Association for Quality and Management Systems

The Swiss Association for Quality and Management Systems (SQS) provides certification and assessment services for all types of industries and services. SQS certificates are accepted worldwide thanks to accreditation by the Swiss Accreditation Service (SAS), active membership in the International Certification Network, IQNet, and co-operation contracts/agreements with accredited partners.

www.sqs.ch

The SQS Certificate ISO 9001:2000 has been issued to DIGITAL-LOGIC AG, the entire company, in the field of development, manufacturing and sales of embedded computer boards, embedded computer modules and computer systems. The certification is valid for three years at which time an audit is performed for recertification.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2. OVERVIEW

2.1. Standard Features

The MICROSPACE EBX is a miniaturized modular device incorporating the major elements of a PC/AT compatible computer. It includes standard PC/AT compatible elements, such as:

 Powerful GEODE LX800/900 with 500/600MHz  DDRAM 128-1024MByte SODIMM 200pin  Real-time clock with CMOS-RAM and 10-year battery buffer  LPT1 parallel port  COM1-, COM2- RS232 serial port 16C550 comp.  Speaker interface  PS/2-keyboard and mouse interface  Floppy disk interface  AT-IDE hard disk interface  VGA video interface, LCD, LVDS  6-channel sound interface AC97-V2.3  100/10-Base-T LAN  PC/104 (ISA) BUS optional  4 Ports USB V2.0  PC/104plus (PCI) BUS optional

2.2. Unique Features

The MICROSPACE MSEBX800 includes all standard PC/AT functions plus unique DIGITAL-LOGIC AG enhancements, such as:

 Single 8V to 30V supply  Watchdog  EEPROM for setup and configuration  2

LAN Port 100Base-T

 PATA ports optional  UL approved parts  Console redirection

2.3. Standards

The MICROSPACE product meet all standards for personal computer architecture.

Standard Contact to the organisation Remarks

PC/104BUS www.pc104.org USB www.usb.org PCI www.pcisig.com SMB www.smbus.org WfM www.intel.com/labs/manage/wfm Wired for management baseline AC97 www.developer.intel.com/ial/scalableplatforms/

audio

LPC www.developer.intel.com/design/chipsets/

industry/lpc.htm ATA/ATAPI-6 www.t13.org ACPI www.acpi.info Power management

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.4. Block Diagrams

2.4.1. MSEBX800

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.4.2. SM800

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.5. MSEBX800/900 Specifications

CPU Specification

CPU SM800 AMD GEODE LX800/900 located in the smartModule800/900 CPU Core Supply 1.25V very low powered 1st Level Cache 32k data and 32k code 2nd Level Cache 128kByte Performance SM800PCX SM900PCX

P2 Equivalent Performance: 500MHz

600MHz Clock SM800PCX SM900PCX

The CPU Clock is defined with the ordered SM800/900-xxx

500MHz

600MHz

Chipset Specification

Northbridge AMD LX800/900 Southbridge AMD CS5536 LAN 2x 10/100Mbit Intel 82551ER (LAN A), Intel 82551ER (LAN B) Audio Stereo In and Stereo Line-Out Codec AD1985 up to 96kHz sampling rate, 16bit (Analog Devices) Firewire IEEE1394 Not on board Video 16MByte Video-DDRAM

Memory Specification

SODIMM SODIMM200pin DDR PC2700 333MHz 256-1024MByte Flash-BIOS 8MByte Flash Setup EEPROM 2kByte for CMOS-backup in battery-less applications Flash-Video BIOS Combined in the core BIOS Video RAM 16MByte to 64MByte DDRAM

Video Controller Specification

Controller AMD graphics integrated in the LX800/900 chipset Video Memory 16MB Channel 1 CRT VGA up to 2048x1600 pixels Channel 2 LVDS, TV-Out, CRT Bootup-Resolution 640x480 / 800x600 / 1024x768 2D-Graphics Integrated accelerator 3D-Graphics None Direct-X Version PnP Integrated

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

External Interfaces Specification

Video Interfaces CRT1, DVO USB V1.1/2.0 4 Ports LPT IEEE1293 Printer COM1 RS232 COM2 RS232 COM3 COM4 Keyboard PS/2 Mouse PS/2 Floppy 26pin FCC Interface for TEAC Mini-Floppy Parallel-Hard disk 2.5” 2 x 44pin RM2.0mm ATAIDE-cable Parallel-Hard disk 3.5” 2 x 40pin RM2.5mm PATA-IDE cable Speaker 0.1Watt Speaker ISA-Bus PC/104 PCI-Bus PC/104plus PCI-Riser-Bus PCI-Slot

Power Supply Specification

Input voltage Nominal 8V-30V, maximum Ripple=200mVpp Input inrush current t.b.d. Protection EMI filtered Spec. None

3.3Volt Power Output Not available

Power Consumption Specification

With 256MByte Typical (10W) at 500MHz

Typical (11W) at 600MHz Standby Typical 0.5 Amp. Power off (if VCC 12V) Typical 7.3mA Power off (if VCC 19V) Typical 8.6mA Power off (if VCC 24V) Typical 9.6mA

Physical Characteristics Specification PC/104plus

Dimensions Length: 203mm

Depth: 146mm Height: 33mm

Weight 300gr

Operating Environment Specification

Relative Humidity 5 - 90% non-condensing

IEC68-2-30 at -20° to +50°C operating Vibration operating IEC68-2-6 10-50Hz, 0.075mm and 55-500Hz, 1.0G Vibration non-operating IEC68-2-6 10-50Hz, 0.15mm and 55-500Hz, 2.0G Shock operating IEC68-2-27 10G, 11ms ½ sine Shock non-operating IEC68-2-27 50G, 11ms, ½ sine Altitude IEC68-2-13 4571meter operating Temperature operating IEC68-2-1,2,14: MSEBX800 Standard -20°C to +60°C Extended Temp. option MIL-810-501/502 see separate table below Temperature storage IEC68-2-1,2,14-65°C to +125°C 

 The backup battery is limited on -40°C to +80°C

operating and storage temperature!

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

Operating Temperature Specification:

MIL-810-501 MIL-810-502

Extended temperature range: SM800PCX (500MHz)

-40°C to +70°C

Security

e1 Not planned UL Not planned ETS 301 Not planned CE/SEV Yes Safety AR385-16

If all signals are externally filtered and assembled into an enclosed metallic case!

EMI / EMC Tests Specification

EMC emission EN61000-6-2:2001 Conducted disturbance EN55022 Class B Radiated disturbance EN55022 Class B EMC immunity EN61000-6-2 Electrostatic discharge (ESD) EN61000-4-2

Voltage = 4kV contact / 8kV air, Criteria A

Radiated RF-Field EN61000-4-3

Level = 10V/m, Criteria A

Electrical fast transients (Burst) EN61000-4-4

Grade 2: DC-Power lines = 1000V (5/50ns) Grade 2: AC-Power lines = 2000V (5/50ns) Grade 2: Signal lines = 500V (5/50ns) Criteria B

Surge EN61000-4-5

Grade 2: DC-Power lines = 1kV, (1.2/50us) Grade 2: AC-Power lines = 2kV, (1.2/50us) Criteria B

Conducted disturbances EN61000-4-6

Voltage = 10V coupled by case, Criteria A

All information is subject to change without notice.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.6. Examples of Ordering Codes

The MSEBX800 system is combined from:

Baseboard MSEBX800 smartModule 800/900-xxx (must be ordered separately) Memory: SODIMM200-DDRAM (must be ordered separately)

Article Part No. Description

MSEBX800 811060

EBX board without SM800/900-xxx, 0MB RAM, no PC/104-Plus connector

SM800PCX 805212 LX800 SM900PCX 805242 LX900

Accessories Part No. Description

MSFloppy 891001 3.5” Micro-Floppy drive (26Pin) MSFDCK 802600 Micro-Floppy cable (26Pin) MSEBX800-DK 811210 Aluminium housing with 20GB HDD, FDD, CD-R, PSU

Options Part No. Description

Option L+ 807006 PC/104- Plus, connector long (without option CF) DDRAM256M 890670 DDR-SODIMM Module 256MB DDRAM512M 890671 DDR-SODIMM Module 512MB DDRAM1G 890672 DDR-SODIMM Module 1GB

These are only examples; for current ordering codes, please see the current price list.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.7. Dimensions & Diagrams

MSEBX800

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.8. Incompatibilities to a Standard PC/AT

None.

2.9. MSEBX800/900 Related Application Notes

# Description

80 High frequency Radiation (to meet EN55022)



Application Notes are availble at http://www.digitallogic.com  support, or on any Application CD from

DIGITAL-LOGIC.

2.10. High Frequency Radiation (to meet EN55022/EN61000)

All peripheral interfaces are filtered to meet the EMI/EMC standards EN55022.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

2.11. Thermoscan

Product Part Number Serial Number Version

MSEBX800 811202 45320210010 0.2 SM800PCX 805164 45316410032 2.1 SODIMM DDR 1GB 870672 - Software Windows XP SP2 running desktop

Top view, passive cooled:

t [min] fCPU [MHz] I [A] P [W]

60 500 0.5 9.5

2.12. RTC Battery Lifetime

Battery Specifications Lowest Temp.

-40°C

Nominal Temp.

+20°C

Highest Temp.

+85°C

Manufacturer pbq Type ER10280 Capacity versus Temp. 8uA 850mAh 910mAh 850mAh Voltage versus Temp. 8uA 3.5V 3.6V Ca. 3.6V Nominal Values 3.6V / 450mAh / -40°C...~+85°C

Information is taken from the data sheet of the pbq ER10280.

Product Temperature

°C

Battery Voltage V VCC (+12V)

switched ON

µA

VCC (+12V)

switched off

µA

MSEBX800

+25°C 3.6 15 18

-40°C 3.5 15 14

Battery Current

+85°C 3.8 15 30 +25°C >10 years >10 years

-40°C >10 years >10 years

Battery Lifetime

+85°C >10 years Ca. 6 years

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

3. PREPARATION

3.1. Important Information

Warning, ESD Sensitive Device!

Place the embedded computer board on an isolated, ESD-protected surface. Also ensure that all equipment, tools and people are fully protected against ESD.

Attention!

The smartModule must be firmly attached to the board with screws. Do not attempt to power-up the system without taking this step or the system may not work and you risk damaging the equipment! See Section 3.2 for assembly instructions.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

3.2. Mounting the smartModule

Line up the holes in the smartModule on the MSEBX board (top side). Then on the reverse side, attach the smartModule using 4 Phillips head screws (circled in red, within the red frame marking the approximate location of the smartModule). The screws are delivered with the smartModule but if lost may be ordered: Part Nr. 502528, description: M2x 5 galvanized machine screw.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

3.3. RAM Assembly/Disassembly

To install or change the RAM, follow these steps:

1. Unmount the smartModule by removing the 4 screws marked in red (see the photo from the previous page).

2. To change the RAM:

a. Using your thumbnails, gently push the clips holding the RAM module in place toward the

outside (Photo 1, marked "A").

Photo 1

b. There will be a slight "click" and the RAM will flip up at an angle (Photo 2).

Photo 2

c. Remove the original RAM.

d. With the new RAM, carefully place the side with the connectors into the slot. There is only one

correct way to place the RAM in the slot due to a notch between the connectors which matches up to a tab in the slot. Do not force the RAM into the slot, it should fit very easily.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

e. Slowly push the RAM down until the clips "click" into place (Photo 3).

Photo 3

3. To install a RAM:

a. Carefully place the side of the RAM with the connectors into the slot. There is only one correct

way to place the RAM in the slot due to a notch between the connectors which matches up to a tab in the slot. Do not force the RAM into the slot, it should fit very easily.

b. Slowly push the RAM down until the clips "click" into place (Photo 3).

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

3.4. Power & Reset Buttons

Power Button: Push the Power Button for 2 seconds to start up the system.

Reset Button: Should the system hang, press the Reset Button.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

4. BUS SIGNALS

4.1. PC104 Bus

Note...

The ISA-Bus may have some minor incompatibilities, see Chapter 6.

AEN, output

Address Enable: used to degate the microprocessor and other devices from the I/O channel to allow DMA transfers to take place. low = CPU Cycle, high = DMA Cycle

BALE, output

Address Latch Enable: provided by the bus controller and used on the system board to latch valid addresses and memory decodes from the microprocessor. This signal is used so that devices on the bus can latch LA17-23. The SA0-19 address lines latch internally according to this signal. BALE is forced high during DMA cycles.

/DACK[0-3, 5-7], output

DMA Acknowledge: 0 to 3 and 5 to 7 are used to acknowledge DMA requests (DRQ0 through DRQ7). They are active low. This signal indicates that the DMA operation can begin.

DRQ[0-3, 5-7], input

DMA Requests: 0 through 3 and 5 through 7 are asynchronous channel requests used by peripheral devices and the I/O channel microprocessors to gain DMA service (or control of the system). A request is generated by bringing a DRQ line to an active level. A DRQ line must be held high until the corresponding DMA Request Acknowledge (DACK/) line goes active. DRQ0 through DRQ3 will perform 8bit DMA transfers; DRQ5-7 are used for 16 accesses.

/IOCHCK, input

IOCHCK/: provides the system board with parity (error) information about memory or devices on the I/O channel. low = parity error, high = normal operation

IOCHRDY, input

I/O Channel Ready: pulled low (not ready) by a memory or I/O device to lengthen I/O or memory cycles. Any slow device using this line should drive it low immediately upon detecting its valid address and a Read or Write command. Machine cycles are extended by an integral number of one clock cycle (67 nanoseconds). This signal should be held in the range of 125-15600nS. low = wait, high =

normal operation

/IOCS16, input

I/O 16 Bit Chip Select: signals the system board that the present data transfer is a 16bit, 1 wait-state, I/O cycle. It is derived from an address decode. /IOCS16 is active low and should be driven with an open collector (300 Ohm pull-up) or tri-state driver capable of sinking 20mA. The signal is driven based only on SA15-SAO (not /IOR or /IOW) when AEN is not asserted. In the 8bit I/O transfer, the default transfers a 4 wait-state cycle.

/IOR, input/output

I/O Read: instructs an I/O device to drive its data onto the data bus. It may be driven by the system microprocessor or DMA controller, or by a microprocessor or DMA controller resident on the I/O channel. This signal is active low.

/IOW, input/output

I/O Write: instructs an I/O device to read the data on the data bus. It may be driven by any microprocessor or DMA controller in the system. This signal is active low.

IRQ [3-7, 9-12, 14, 15], input

These signals are used to tell the microprocessor that an I/O device needs attention. An interrupt request is generated when an IRQ line is raised from low to high. The line must be held high until the microprocessor acknowledges the interrupt request.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

/Master, input

This signal is used with a DRQ line to gain control of the system. A processor or DMA controller on the I/O channel may issue a DRQ to a DMA channel in cascade mode and receive a /DACK.

/MEMCS16, input

MEMCS16 Chip Select: signals the system board if the present data transfer is a 1 wait-state, 16bit, memory cycle. It must be derived from the decode of LA17 through LA23. /MEMCS16 should be driven with an open collector (300 Ohm pull-up) or tri-state driver capable of sinking 20mA.

/MEMR, input/output

These signals instruct the memory devices to drive data onto the data bus. /MEMR is active on all memory read cycles. /MEMR may be driven by any microprocessor or DMA controller in the system. When a microprocessor on the I/0 channel wishes to drive /MEMR, it must have the address lines valid on the bus for one system clock period before driving /MEMR active. These signals are active

low.

/MEMW, input/output

These signals instruct the memory devices to store the data present on the data bus. /MEMW is active in all memory read cycles. /MEMW may be driven by any microprocessor or DMA controller in the system. When a microprocessor on the I/O channel wishes to drive /MEMW, it must have the address lines valid on the bus for one system clock period before driving /MEMW active. Both signals are

active low.

OSC, output

Oscillator (OSC): a high-speed clock with a 70 nanosecond period (14.31818 MHz). This signal is not synchronous with the system clock. It has a 50% duty cycle. OSC starts 100µs after reset is inactive.

RESETDRV, output

Reset Drive: used to reset or initiate system logic at power-up time or during a low line-voltage outage. This signal is active high. When the signal is active all adapters should turn off or tri-state all drivers connected to the I/O channel. This signal is driven by the permanent Master.

/REFRESH, input/output

These signals are used to indicate a refresh cycle and can be driven by a microprocessor on the I/O channel. These signals are active low.

SA0-SA19, LA17 - LA23 input/output

Address bits 0 through 19 are used to address memory and I/0 devices within the system. These 20 address lines allow access of up to 1MByte of memory. SAO through SA19 are gated on the system bus when BALE is high and are latched on the falling edge of BALE. LA17 to LA23 are not latched and addresses the full 16MByte range. These signals are generated by the microprocessors or DMA controllers. They may also be driven by other microprocessor or DMA controllers that reside on the I/0 channel. The SA17-SA23 are always LA17-LA23 address timings for use with the MSCS16 signal. This is advanced AT96 design. The timing is selectable with jumpers LAxx or SAxx.

/SBHE, input/output

Bus High Enable (system): indicates a transfer of data on the upper byte of the data bus, XD8 through XD15. Sixteen-bit devices use /SBHE to condition data-bus buffers tied to XD8 through XD15.

SD[0-15], input/output

These signals provide bus bits 0 through 15 for the microprocessor, memory, and I/O devices. D0 is the least significant bit and D15 is the most significant bit. All 8bit devices on the I/O channel should use D0 through D7 for communications to the microprocessor. The 16bit devices will use D0 through D15. To support 8bit devices, the data on D8 through D15 will be gated to D0 through D7 during 8bit transfers to these devices; 16bit microprocessor transfers to 8bit devices will be converted to two 8bit transfers.

/SMEMR, input/output

These signals instruct the memory devices to drive data onto the data bus for the first MByte. /SMEMR is active on all memory read cycles. /SMEMR may be driven by any microprocessor or DMA controller in the system. When a microprocessor on the I/0 channel wishes to drive /SMEMR, it must have the address lines valid on the bus for one system clock period before driving /SMEMR active. The signal is active low.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

/SMEMW, input/output

These signals instruct the memory devices to store the data present on the data bus for the first MByte. /SMEMW is active in all memory read cycles. /SMEMW may be driven by any microprocessor or DMA controller in the system. When a microprocessor on the I/O channel wishes to drive /SMEMW, it must have the address lines valid on the bus for one system clock period before driving /SMEMW active. Both signals are active low.

SYSCLK, output

This is an 8MHz system clock. It is a synchronous microprocessor cycle clock with a cycle time of 167 nanoseconds. The clock has a 66% duty cycle. This signal should only be used for synchronization.

TC, output

Terminal Count: provides a pulse when the terminal count for any DMA channel is reached. The TC completes a DMA-Transfer. This signal is expected by the onboard floppy disk controller. Do not use this signal because it is internally connected to the floppy controller.

/0WS, input

The Zero Wait State (/0WS) signal tells the microprocessor that it can complete the present bus cycle without inserting any additional wait cycles. In order to run a memory cycle to a 16bit device without wait cycles, /0WS is derived from an address decode gated with a Read or Write command. In order to run a memory cycle to an 8bit device with a minimum of one-wait states, /0WS should be driven active one system clock after the Read or Write command is active, gated with the address decode for the device. Memory Read and Write commands to an 8bit device are active on the falling edge of the system clock. /0WS is active low and should be driven with an open collector or tri-state driver capable of sinking 20mA.

12V, +/- 5%

This signal is used only for the flat panel supply.

GROUND = 0V

This is used for the entire system.

VCC, +5V +/- 0.25V

This is used to supply other PC/104 peripheral cards. Maximum current is 2Amp.

For further information about PC/104 and PC/104plus, please refer to the PC/104 Specification Manual which is available on the internet: http://www.digitallogic.com (manuals).

4.2. Addressing PCI Devices on the MSEBX800:

PCI Slot Assignment

The following definitions for the peripherals correspond with the BIOS:

Device IDSEL PIRQ REQ# GNT# Comments

SLOT 1 AD20 A, B, C, D 3 3 SLOT 2 AD21 B, C, D, A 4 4 SLOT 3 AD22 C, D, A, B 5 5 SLOT 4 AD23 D, A, B, C 6 6 LAN Controller AD29 A 7 7 ISA-Bridge AD24 -- 8 8 CS5536 AD25 --- 2 2 For VGA, IDE and USB Arbiter 0 --- --- 0 0 Arbiter 1 --- --- 1 1

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

5. DETAILED SYSTEM DESCRIPTION

5.1. Boot Time

System Boot Times

Definitions/Boot-Medium Quick

Boot*

Normal

Boot

MSEBX800-500MHz with RTC-Backup Battery Memory 256MB shared 8MB for Video

time [s]

From Floppy disk Boot from Setup-Disk1 MS-DOS v6.22 to "Starting MS-DOS"-Prompt. 10 26 Boot from Setup-Disk1 MS-DOS v6.22 to "Welcome Setup Screen"-Prompt. 30 45 Boot from "(Sys a:)-Disk“ to "A:/>“-Prompt. 18 33

From Hard disk-Toshiba MK2110MAF Boot from Hard disk to "Starting MS-DOS"-Prompt. 10 26 Boot from Hard disk to "Win2000: Windows-Login"-Prompt. 80 95

From CompactFlash SanDisk SDCFB-64-101-00 64MB Boot from CF to "Starting MS-DOS"-Prompt. 10 26 Boot from CF to "C:\>"-Prompt. 13 29

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

5.2. Interfaces

5.2.1. PS/2 Keyboard (AT Compatible) and PS/2 Mouse

X31 Keyboard

Pin Signal Pin Signal

1 KB_Data 2 3 GND 5 +5Volt / 100mA 6 KB_Clk 8 -

X32 Mouse

Pin Signal Pin Signal

1 MB_Data 2 3 GND 5 +5Volt / 100mA 6 MB_Clk 8 -

5.2.2. Line Printer Port LPT1

A standard bi-directional LPT port is integrated into the MICROSPACE PC.

Further information about these signals is available in numerous publications, including the IBM technical reference manuals for the PC and AT computers and from other reference documents.

The current is: IOH = 12mA IOL = 24mA

The SMC 37C672 may be programmed via software commands.

In the new BIOS version, this selection may be controlled with the BIOS setup screen.

5.2.3. Serial Ports COM1 - COM2

The serial channels are fully compatible with 16C550 UARTS.

X30B / X39 Serial Port Connectors COM1, COM2

Pin Signal Name Function in/out DB25 Pin DB9 Pin

1 CD Data Carrier Detect in 8 1 2 RXD Data Receive Data in 6 6 3 TXD Transmit Data out 3 2 4 DTR Data Terminal Ready out 4 7 5 GND System Ground - 2 3 6 DSR Data Set Ready In 5 8 7 RTS Request to Send out 20 4 8 CTS Clear to Send in 22 9 9 RI Ring Indicator in 7 5

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

5.2.4. Floppy Disk Interface

Supported Floppy Formats

Capacity Drive size Tracks Data rate DOS version

1.2 MB 5-1/4" 80 500 KHz 3.0 - 6.22 720 K 3-1/2" 80 250 KHz 3.2 - 6.22

1.44 M 3-1/2" 80 500 KHz 3.3 - 6.22

Floppy Interface Configuration

The desired configuration of floppy drives (number and type) must be properly initialized in the board's CMOS – configuration memory. This is generally done by using DEL or F2 at bootup time.

Floppy Interface Connector

The table shows the pin-out and signal definitions of the board's floppy disk interface connector. It is identical in pin-out to the floppy connector of a standard AT. Note that, as in a standard PC or AT, both floppy drives are jumpered to the same drive select: as the 'second' drive. The drives are uniquely selected as a result of a swapping of a group of seven wires (conductors 10-16) that must be in the cable between the two drives. The seven-wire swap goes between the computer board and drive 'A'; the wires to drive 'B' are unswapped (or swapped a second time). The 26pin high density (1mm pitch FCC) connector has only one drive and motor select. The onboard jumper defines the drive A: or B:. Default is always A:.

Floppy Disk Interface Technology

Only CMOS drives are supported. This means the termination resistors are 1 KOhm and 5 1/4“-drives are not recommended (TTL interface).

The 26pin connector: FFC/FPC 0.3mm thick 1.0mm (0.039") pitch (MOLEX 52030 Series)

Floppy Disk Interface Connector

FD26: Pin Signal Name Function in/out

1 VCC +5Volt 2 IDX Index Pulse in 3 VCC +5Volt 4 DS2 Drive Select 2 out 5 VCC +5Volt

6 DCHG Disk Change in 10 MO2 Motor On 2 out 12 DIRC Direction Select out 14 STEP Step out 16 WD Write Data out 17 GND Signal grounds 18 WE Write Enable out 19 GND Signal grounds 20 TRKO Track 0 in 21 GND Signal grounds 22 WP Write Protect in 23 GND Signal grounds 24 RDD Read Data in 25 GND Signal grounds 26 HS Head Select out

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

5.3. Controllers

5.3.1. Interrupt Controllers

An 8259A compatible interrupt controller, within the chipset, provides seven prioritized interrupt levels. Of these, several are normally associated with the board's onboard device interfaces and controllers, and several are available on the AT expansion bus.

Interrupt Sources Used Onboard

IRQ0 ROM-BIOS clock tick function, from timer 0 Yes IRQ1 Keyboard controller output buffer full Yes IRQ2 Used for cascade 2. 8259 Yes IRQ3 COM2 serial port Yes IRQ4 COM1 serial port Yes IRQ5 LPT2 parallel printer (if present) No  IRQ6 Floppy controller Yes IRQ7 LPT1 parallel printer Yes IRQ8 Battery backed clock Yes IRQ9 Free for user No  IRQ10 Free for user No  IRQ11 Free for user No  IRQ12 PS/2 mouse Yes IRQ13 Math. coprocessor Yes IRQ14 Hard disk IDE / SCSI Yes IRQ15 Free for user No 

 It may depend on the LAN configuration.

 IRQ 15 = if option CF is not assembled, then free for user.

5.3.2. Timers and Counters

5.3.2.1. Programmable Timers

An 8253 compatible timer/counter device is also included in the board's ASIC device. This device is utilized in precisely the same manner as in a standard AT implementation. Each channel of the 8253 is driven by a

1.190MHz clock, derived from a 14.318MHz oscillator, which can be internally divided in order to provide a variety of frequencies.

Timer 2 can also be used as a general purpose timer if the speaker function is not required.

Timer Assignment

Timer Function

0 ROM-BIOS clock tick (18.2Hz) 1 DRAM refresh request timing (15µs) 2 Speaker tone generation time base

5.3.2.2. Watchdog

The watchdog timer detects a system crash and performs a hardware reset. After power up, the watchdog is always disabled as the BIOS does not send strobes to the watchdog. In case the user wants to take advantage of the watchdog, the application must produce a strobe at least every 800ms. If no strobe occurs within the 800ms, the watchdog resets the system.

5.3.3. Core BIOS Download

See the separate driver/software/BIOS manual, GEODE_LX800-900.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

5.4. BIOS Recovery

In case the BIOS needs to be recovered:

1. Set Jumper J9.

2. Start the MSEBX800/900.

3. Open the BIOS.

4. Remove Jumper J9.

5. Load the default BIOS settings.

6. Save the settings.

7. Restart the MSEBX800/900.

Jumper J9

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

6. DESCRIPTION AND LOCATION OF THE CONNECTORS

Connector Structure Pin Remarks

Power Input 2 Power Jack

ATX Power Connector 20

X11

LVDS 2x 10 RM2.54

X14

Video IN 2 SMA

X15

LCD 2x 25 RM2.54

X20

MIC IN - Phone Jack

X22

Line Out Front - Phone Jack

X27

SPDIF OUT - SPDIF

X30A

LPT 25 D-Sub25

X30B

COM 1 9 D-Sub 9

X30C

VGA 15 HDsub 15

X31

Keyboard - PS/2

X32

Mouse - PS/2

X33A

LAN A (LAN interface of SM800PCX) 8 RJ45

X33B

USB 0 4 -

X33C

USB 1 4 -

X34A

LAN B (82551ER – SM800DK) 8 RJ45

X34B

USB 2 4 -

X34C

USB 3 4 -

X36

ISA POD CPLD 2x 5 RM2.54

X39

COM 2 9 D-Sub 9

X51

JTAG 2x 5 RM2.54

X52

AVR Programming 2x 3 RM2.54

X53

Utility / Extension 2x 10 RM2.54

X60

HDD 2.5” 2x 22 RM2.54

X62

HDD 3.5” 2x 20 RM2.54

X70

Floppy 26 FCC

X100

PC/104 PC/104 PC/104

X101

PC/104+ PC/104+ PC/104+

X120

Mini PCI Mini PCI Mini PCI

X130

PCI Slot (standard PCI slot) - PCI

Special Connectors LS1

Buzzer - -

Onboard Switches SW1

Main Switch / Power Button (Pwrbtn)

SW2

Reset Switch

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

6.1. Connector Plan

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

6.2. Connector Descriptions

X1 Power Input

Pin Signal Pin Signal

1 8-30V DC-Input 2 Ground

X2 ATX Connector

Pin Signal Pin Signal

1 +3.3V 2 +3.3V 3 GND 4 +5V 5 GND 6 +5V 7 GND 8 PWR-OK

9 +5VSB 10 +12V 11 +3.3V 12 -12V 13 GND 14 PS-ON# 15 GND 16 GND 17 GND 18 -5V 19 +5V 20 +5V

X11 LVDS

Pin Signal Pin Signal

1 LVDS_A0- 2 LVDS_A0+

3 GND 4 GND

5 LVDS_A1- 6 LVDS_A1+

7 LCD BKL (dep. J5) 8 LCD BKL (dep. J5)

9 LVDS_A2- 10 LVDS_A2+ 11 LCD VDD (dep 3) 12 LCD VDD (dep 3) 13 LVDS_A3- 14 LVDS_A3+ 15

19 LVDS_Clock- 20 LVDS_Clock+

The LVDS interface works only if the J6 Jumper is not installed.

X14 Video Input Channel

Pin Signal Name Function in/out

1 Video Signal CVBS In

2 Ground

The Video IN interface works only if the J6 Jumper is installed.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X15 LCD Connector

Pin Signal Pin Signal

1 DE_SPLIT 2 VSYNC

3 BLK 4 HSYNC

5 VCCLCD_SB 6 Ground

8 SHFCLK

9 VDD 10 D0 11 D1 12 D2 13 D3 14 D4 15 D5 16 D6 17 D7 18 D8 19 D9 20 D10 21 D11 22 D12 23 D13 24 D14 25 D15 26 Ground 27 D16 28 D17 29 D18 30 D19 31 D20 32

33 D21 34 D22 35 D23 36

44 Ground

49 VCC 50

The LCD interface works only if the J6 Jumper is not installed.

X20 Microphone Input Audio Connector

Pin Signal Pin Signal

2 Sense 3 Audio Ground 4 Channel R 5 Channel L 6

X22 Front (Stereo Output) Audio Connector

Pin Signal Pin Signal

2 Sense 3 Audio Ground 4 Channel R 5 Channel L 6

X27 SPDif Connector

Pin Signal Pin Signal

1 Digital Audio Data Out 2 GND

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X30A Printer Port (Centronics, EMI-Filtered)

D-SUB Connector: Signal

Pin 1 Strobe Pin 2 Data 0 Pin 3 Data 1 Pin 4 Data 2 Pin 5 Data 3 Pin 6 Data 4 Pin 7 Data 5 Pin 8 Data 6 Pin 9 Data 7 Pin 10 Acknowledge Pin 11 Busy Pin 12 paper end Pin 13 select Pin 14 autofeed Pin 15 error Pin 16 init printer Pin 17 shift in (SI) Pins 18-25 GND

X30B Serial Port COM1 RS232 (EMI-Filtered)

D-SUB connector: Signal

Pin 1 DCD Pin 2 RXD Pin 3 TXD Pin 4 DTR Pin 5 GND Pin 6 DSR Pin 7 RTS Pin 8 CTS Pin 9 RI

X30C VGA

Pin Signal

1 Red 2 Green 3 Blue 13 H-Synch 14 V-Synch 5, 6, 7, 8, 10 GND 4, 9, 11, 12, 15

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X31 PS/2Keyboard (AT Compatible)

Pin Signal Pin Signal

1 KB_Data 2 3 GND 5 +5Volt / 100mA 6 KB_Clk 8 -

X32 PS/2Mouse

Pin Signal Pin Signal

1 MB_Data 2 3 GND 5 +5Volt / 100mA 6 MB_Clk 8 -

X33A Ethernet LAN

RJ-45 Pin Signal RJ-45 Pin Signal

1 TX+ 2 TX3 RX+ 4 GND 5 GND 6 RX7 GND 8 GND

X33B / X33C USB 0/1

Pin Signal Pin Signal

1 VCC 5 VCC 2 USB-Px- 6 USB-Px3 USB-Px+ 7 USB-Px+ 4 GND 8 GND

X34A Ethernet LAN

RJ-45 Pin Signal RJ-45 Pin Signal

1 TX+ 2 TX3 RX+ 4 GND 5 GND 6 RX7 GND 8 GND

X34B / X34C USB 2/3

Pin Signal Pin Signal

1 VCC 5 VCC 2 USB-Px- 6 USB-Px3 USB-Px+ 7 USB-Px+ 4 GND 8 GND

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

RJ45 Connector 10BaseT (IEEE 802.3i), 100BaseTX (IEEE 802.3u):

MDI-Pin EIA/TIA 568A colors

(wire/line)

Pin Twisted

Pair

TX+ White / Green 1 3

TX- Green 2 3

RX+ White / Orange 3 2

GND .. 4 1

GND .. 5 1

RX- Orange 6 2

GND .. 7 4

GND .. 8 4

Cabling: Do not exceed 100m (328 feet); minimum quality of CAT5, preferably S/FTP or STP CAT6. Be careful to have a well balanced shield/ground concept.

X36 CPLD

Pin Signal Pin Signal

1 CPLD TCK 2 GND 3 CPLD TDO 4 VCC5SB 5 CPLD TMS 6

7 SYS RST# 8

9 CPLD TDI 10 GND

Only for internal use.

X39 Serial Port

D-SUB connector: Signal

Pin 1 DCD Pin 2 RXD Pin 3 TXD Pin 4 DTR Pin 5 GND Pin 6 DSR Pin 7 RTS Pin 8 CTS Pin 9 RI

X51 JTAG

Pin Signal Pin Signal

1 TCK 6

2 GND 7 RESET_IN (RST) 3 TDO 8

4 VCCSUS 9 TDI 5 TMS 10 GND

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X52 AVR

Pin Signal Pin Signal

1 AVR VCC 2 GND 3 AVR SCL 4 AVR RST 5 AVR MISO 6 AVR MOSI

Only for internal use

X53 Utility

Pin Signal Pin Signal

1 SUSC 2 VCCBat TP 3 PS ON ATX 4 VCC5SB TP 5 System Reset 6 VCC3 TP 7 PWRBTN 8 VCC TP 9 GPIO 30 10 VCC12 TP

11 GPIO 31 12 GND 13 GPIO 34 14 GND 15 SMB SDA 16

17 SMB SCL 18

X60 2.5" Hard Disk

Pin Signal Pin Signal

1 Reset (active low) 2

3 D7 4 D8 5 D6 6 D9 7 D5 8 D10 9 D4 10 D11 11 D3 12 D12 13 D2 14 D13 15 D1 16 D14 17 D0 18 D15 19 GND 20

(keypin) NC

21 DRQ 22 GND 23 IOW(active low) 24 GND 25 IOR(active low) 26 GND 27 IOCHRDY 28

ALE / Master-Slave NC

29 DACK 30 GND 31 IRQ14 (pri) IRQ15 (sec) 32 IOCS16 (active low) 33 ADR1 34 DIAG 35 ADR0 36 ADR2 37 CS0 (active low) 38 CS1 (active low) 39 LED (active low) 40 GND 41 VCC Logic 42 VCC Motor 43 GND 44

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X62 3.5" Hard Disk

Pin Signal Pin Signal

1 Reset (active low) 2 GND 3 D7 4 D8 5 D6 6 D9 7 D5 8 D10 9 D4 10 D11

11 D3 12 D12 13 D2 14 D13 15 D1 16 D14 17 D0 18 D15 19 GND 20

(keypin) NC

21 DRQ 22 GND 23 IOW(active low) 24 GND 25 IOR(active low) 26 GND 27 IOCHRDY 28

ALE / Master-Slave NC

29 DACK 30 GND 31 IRQ14 (pri) IRQ15 (sec) 32 IOCS16 (active low) 33 ADR1 34 DIAG 35 ADR0 36 ADR2 37 CS0 (active low) 38 CS1 (active low) 39 LED (active low) 40 GND

X70 Floppy Disk

FD26:

Pin Signal Name

Function

in/out

1 VCC +5Volt 2 IDX Index Pulse in 3 VCC +5Volt 4 DS2 Drive Select * out 5 VCC +5Volt

6 DCHG Disk Change in 10 M02 Motor on * out 12 DIRC Direction Select out 14 STEP Step out 16 WD Write Data out 17 GND Signal grounds 18 WE Write Enable out 19 GND Signal grounds 20 TRKO Track 0 in 21 GND Signal grounds 22 WP Write Protect in 23 GND Signal grounds 24 RDD Read Data in 25 GND Signal grounds 26 HS Head Select out

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X100 PC/104 Connector (ISA)

Pin A: B: C: D:

0 Ground Ground 1 IOCHCK Ground SBHE MEMCS16 2 SD7 RESET LA23 IOCS16 3 SD6 +5V LA22 IRQ10 4 SD5 IRQ9 LA21 IRQ11 5 SD4

LA20 IRQ12 6 SD3 DRQ2 LA19 IRQ15 7 SD2

(-12V) NC

LA18 IRQ14 8 SD1 0WS LA17 DACK0 9 SD0 +12V MEMR DRQ0

10 IOCHRDY

Ground NC

MEMW DACK5

11 AEN SMEMW SD8 DRQ5 12 SA19 SMEMR SD9 DACK6 13 SA18 SIOW SD10 DRQ6 14 SA17 SIOR SD11 DACK7 15 SA16 DACK3 SD12 DRQ7 16 SA15 DRQ3 SD13 +5 Volt 17 SA14 DACK1 SD14 MASTER 18 SA13 DRQ1 SD15 Ground 19 SA12 REF Ground Ground 20 SA11 SYSCLK 21 SA10 IRQ7 22 SA9 IRQ6 23 SA8 IRQ5 24 SA7 IRQ4 25 SA6 IRQ3 26 SA5 DACK2 27 SA4 TC 28 SA3 ALE 29 SA2 +5 Volt 30 SA1 OSC 31 SA0 Ground 32 Ground Ground

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X101 PC/104+ Connector (PCI)

Pin A: B: C: D:

1 GND/5.0V KEY2 Reserved +5 AD00 2 VI/O AD02 AD01 +5V 3 AD05 GND AD04 AD03 4 C/BE0* AD07 GND AD06 5 GND AD09 AD08 GND 6 AD11 VI/O AD10 M66EN 7 AD14 AD13 GND AD12 8 +3.3V C/BE1* AD15 +3.3V

9 SERR* GND SB0* PAR 10 GND PERR* +3.3V SDONE 11 STOP* +3.3V LOCK* GND 12 +3.3V TRDY* GND DEVSEL* 13 FRAME* GND IRDY* +3.3V 14 GND AD16 +3.3V C/BE2* 15 AD18 +3.3V AD17 GND 16 AD21 AD20 GND AD19 17 +3.3V AD23 AD22 +3.3V 18 IDSEL0 GND IDSEL1 IDSEL2 19 AD24 C/BE3* VI/O IDSEL3 20 GND AD26 AD25 GND 21 AD29 +5V AD28 AD27 22 +5V AD30 GND AD31 23 REQ0* GND REQ1* VI/O 24 GND REQ2* +5V GNT0* 25 GNT1* VI/O GNT2* GND 26 +5V CLK0 GND CLK1 27 CLK2 +5V CLK3 GND 28 GND INTD* +5V RST* 29 +12V INTA* INTB* INTC* 30 -12V Reserved Reserved GND/3.3V KEY2

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X120 MiniPCI Interface

Pin Signal Pin Signal Pin Signal Pin Signal

1 TIP 2 RING 63 3.3V 64 FRAME#

3 8PMJ-3 4 8PMJ-1 65 CLKRUN# 66 TRDY#

5 8PMJ-6 6 8PMJ-2 67 SERR# 68 STOP#

7 8PMJ-7 8 8PMJ-4 69 GROUND 70 3.3V

9 8PMJ-8 10 8PMJ-5 71 PERR# 72 DEVSEL# 11 LED1_GRNP 12 LED2_YELP 73 C/BE[1]# 74 GROUND 13 LED1_GRNN 14 LED2_YELN 75 AD[14] 76 AD[15] 15 CHSGND 16 RESERVED 77 GROUND 78 AD[13] 17 INTB# 18 5V 79 AD[12] 80 AD[11] 19 3.3V 20 INTA# 81 AD[10] 82 GROUND 21 RESERVED 22 RESERVED 83 GROUND 84 AD[09] 23 GROUND 24 3.3VAUX 85 AD[08] 86 C/BE[0]# 25 CLK 26 RST# 87 AD[07] 88 3.3V 27 GROUND 28 3.3V 89 3.3V 90 AD[06] 29 REQ# 30 GNT# 91 AD[05] 92 AD[04] 31 3.3V 32 GROUND 93 RESERVED 94 AD[02] 33 AD[31] 34 PME# 95 AD[03] 96 AD[00] 35 AD[29] 36 RESERVED 97 5V 98 RESERVED_WIP5 37 GROUND 38 AD[30] 99 AD[01] 100 RESERVED_WIP5 39 AD[27] 40 3.3V 101 GROUND 102 GROUND 41 AD[25] 42 AD[28] 103 AC_SYNC 104 M66EN 43 RESERVED 44 AD[26] 105 AC_SDATA_IN 106 AC_SDATA_OUT 45 C/BE[3]# 46 AD[24] 107 AC_BIT_CLK 108 AC_CODEC_ID0# 47 AD[23] 48 IDSEL 109 AC_CODEC_ID1# 110 AC_RESET# 49 GROUND 50 GROUND 111 MOD_AUDIO_MON 112 RESERVED 51 AD[21] 52 AD[22] 113 AUDIO_GND 114 GROUND 53 AD[19] 54 AD[20] 115 SYS_AUDIO_OUT 116 SYS_AUDIO_IN 55 GROUND 56 PAR 117 SYS_AUDIO_OUT GND 118 SYS_AUDIO_IN GND 57 AD[17] 58 AD[18] 119 AUDIO_GND 120 AUDIO_GND 59 C/BE[2]# 60 AD[16] 121 RESERVED 122 MPCIACT# 61 IRDY# 62 GROUND 123 VCC5VA 124 3.3VAUX

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

X130 PCI Slot (Standard PCI Slot)

Pin Name PCI Pin Description Pin Name PCI Pin Description

A1 TRST Test Logic Reset B1 -12V -12 VDC A2 +12V +12 VDC B2 TCK Test Clock A3 TMS Test Mde Select B3 GND Ground A4 TDI Test Data Input B4 TDO Test Data Output A5 +5V +5 VDC B5 +5V +5 VDC A6 INTA Interrupt A B6 +5V +5 VDC A7 INTC Interrupt C B7 INTB Interrupt B A8 +5V +5 VDC B8 INTD Interrupt D

A9 ----- Reserved B9 PRSNT1 Present A10 +5V Power (+5 V or +3.3 V) B10 ----- Reserved A11 ----- Reserved B11 PRSNT2 Present A12 GND03

Ground or Keyway for 3.3/Universal PWB

B12 GND

Ground or Keyway for 3.3/Universal PWB

A13 GND05

Ground or Keyway for 3.3/Universal PWB

B13 GND

Ground or Open (Key) for 3.3/Universal PWB

A14 3.3Vaux ----- B14 RES Reserved A15 RESET Reset B15 GND Ground A16 +5V Power (+5 V or +3.3 V) B16 CLK Clock A17 GNT Grant PCI use B17 GND Ground A18 GND08 Ground B18 REQ Request A19 PME# Power Managment Event B19 +5V Power (+5 V or +3.3 V) A20 AD30 Address/Data 30 B20 AD31 Address/Data 31 A21 +3.3V01 +3.3 VDC B21 AD29 Address/Data 29 A22 AD28 Address/Data 28 B22 GND Ground A23 AD26 Address/Data 26 B23 AD27 Address/Data 27 A24 GND10 Ground B24 AD25 Address/Data 25 A25 AD24 Address/Data 24 B25 +3.3V +3.3VDC A26 IDSEL Initialization Device Select B26 C/BE3 Command, Byte Enable 3 A27 +3.3V03 +3.3 VDC B27 AD23 Address/Data 23 A28 AD22 Address/Data 22 B28 GND Ground A29 AD20 Address/Data 20 B29 AD21 Address/Data 21 A30 GND12 Ground B30 AD19 Address/Data 19 A31 AD18 Address/Data 18 B31 +3.3V +3.3 VDC A32 AD16 Address/Data 16 B32 AD17 Address/Data 17 A33 +3.3V05 +3.3 VDC B33 C/BE2 Command, Byte Enable 2 A34 FRAME Address or Data phase B34 GND13 Ground A35 GND14 Ground B35 IRDY# Initiator Ready A36 TRDY# Target Ready B36 +3.3V06 +3.3 VDC A37 GND15 Ground B37 DEVSEL Device Select A38 STOP Stop Transfer Cycle B38 GND16 Ground A39 +3.3V07 +3.3 VDC B39 LOCK# Lock bus A40 ----- Reserved B40 PERR# Parity Error A41 ----- Reserved B41 +3.3V08 +3.3 VDC A42 GND17 Ground B42 SERR# System Error A43 PAR Parity B43 +3.3V09 +3.3 VDC A44 AD15 Address/Data 15 B44 C/BE1 Command, Byte Enable 1 A45 +3.3V10 +3.3 VDC B45 AD14 Address/Data 14 A46 AD13 Address/Data 13 B46 GND18 Ground A47 AD11 Address/Data 11 B47 AD12 Address/Data 12 A48 GND19 Ground B48 AD10 Address/Data 10 A49 AD9 Address/Data 9 B49 GND20 Ground A50 Keyway Open or Ground for 3.3V PWB B50 Keyway Open or Ground for 3.3V PWB A51 Keyway Open or Ground for 3.3V PWB B51 Keyway Open or Ground for 3.3V PWB A52 C/BE0 Command, Byte Enable 0 B52 AD8 Address/Data 8 A53 +3.3V11 +3.3 VDC B53 AD7 Address/Data 7 A54 AD6 Address/Data 6 B54 +3.3V12 +3.3 VDC A55 AD4 Address/Data 4 B55 AD5 Address/Data 5 A56 GND21 Ground B56 AD3 Address/Data 3 A57 AD2 Address/Data 2 B57 GND22 Ground A58 AD0 Address/Data 0 B58 AD1 Address/Data 1 A59 +5V Power (+5 V or +3.3 V) B59 VCC08 Power (+5 V or +3.3 V) A60 REQ64 Request 64 bit B60 ACK64 Acknowledge 64 bit A61 VCC11 +5 VDC B61 VCC10 +5 VDC A62 VCC13 +5 VDC B62 VCC12 +5 VDC

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

7. JUMPER LOCATIONS ON THE BOARD

The following tables show the location of the jumper blocks on the MSEBX800/900 board. The numbers shown in these tables are silk screened on the board so that the pins can be easily located. This chapter refers to the individual pins for these jumpers.

Be careful: some jumpers are soldering bridges; you will need a miniature soldering station with a vacuum pump.

Settings written in bold are defaults!

7.1. The 2pin Jumpers

Jumper Structure Open Closed

1 - 2

LAN B (SM800DK LAN) isolate

Enable LAN B

Disable LAN B

Select Video Out- or Input Enable LCD/LVDS

Enable Video-In

Disable write protection of local FWH (FirmWareHub)

FWH read only

FHW read / write

Boot FWH from SM800PCX or from the MSEBX800-Board

Boot SM800PCX FWH

Boot local FWH

7.2. The 3pin Jumpers

Jumper Structure Open Closed

1 - 2

Closed

2 - 3

PCI X130 slot in JTAG chain

JTAG w/

JTAG w/o

LCD VDD voltage

+3.3V

+5V

LVDS transmitter LVDS on LVDS auto on LVDS off

LCD Backlight voltage +5V

+12V 1)

RTC enable / disable

Enable RTC batt

Disable RTC batt 2)

1.) The 12V are only available if an ATX-Supply is connected.

2.) It's possible to connect an external RTC back-up battery to pin 2-3 of J7.

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

7.3. Jumpers on the MSEBX800

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

8. INDEX

Addressing PCI Devices............................................. 31

BIOS Recovery .......................................................... 36

Block Diagrams .......................................................... 13

Boot Time................................................................... 32

Bus Signals ................................................................ 29

Connector Descriptions.............................................. 39

Connector Plan .......................................................... 38

Connectors................................................................. 37

2.5" Hard Disk ....................................................... 44

3.5" Hard Disk ....................................................... 45

ATX ....................................................................... 39

Ethernet LAN......................................................... 42

Floppy Disk............................................................ 45

JTAG ..................................................................... 43

Keyboard PS/2 ...................................................... 42

LCD ....................................................................... 40

LVDS ..................................................................... 39

Microphone............................................................ 40

MiniPCI Interface................................................... 48

Mouse PS/2........................................................... 42

PC/104 .................................................................. 46

PC/104+ Slot ......................................................... 47

PCI Slot ................................................................. 49

Power Input ........................................................... 39

Printer Port ............................................................ 41

RJ45...................................................................... 43

Serial Port........................................................ 41, 43

SPDif ..................................................................... 40

Stereo Output ........................................................ 40

USB....................................................................... 42

Utility...................................................................... 44

VGA....................................................................... 41

Video Input Channel.............................................. 39

Controllers.................................................................. 35

Core BIOS Download................................................. 35

Dimensions & Diagrams............................................. 19

Disclaimer .................................................................... 5

Environmental Protection Statement............................ 5

Features, Standard .................................................... 12

Features, Unique........................................................ 12

Floppy Disk ................................................................ 34

Floppy Disk Interface Connector ................................ 34

High Frequency Radiation .......................................... 22

Important Information ................................................. 24

Interfaces.................................................................... 33

ISO 9001:2000 ........................................................... 11

Jumper Locations ....................................................... 50

Jumpers...................................................................... 51

2pin........................................................................ 50

3pin........................................................................ 50

Keyboard .................................................................... 33

LPT1........................................................................... 33

Manual, How to Use It .................................................. 2

Mouse......................................................................... 33

Ordering Codes .......................................................... 18

PC104 Bus ................................................................. 29

PCI Slot Assignment................................................... 31

Power & Reset Buttons .............................................. 28

Preparation................................................................. 24

Printer......................................................................... 33

Programmable Timers ................................................ 35

RAM Assembly/Disassembly...................................... 26

Recycling Information................................................... 6

Related Application Notes .......................................... 22

RoHS Commitment....................................................... 9

RTC Battery Lifetime .................................................. 23

Safety Precautions ....................................................... 9

Security ...................................................................... 17

Serial Ports................................................................. 33

smartModule

DIGITAL-LOGIC AG MSEBX800/900 Detailed Manual V1.0

Mounting................................................................ 25

Specifications ............................................................. 15

SQS............................................................................ 11

Standards..................................................................... 8

Swiss Association for Quality and Management

Systems................................................................. 11

Swiss Quality.............................................................. 11

Symbols ....................................................................... 7

Technical Support ........................................................ 6

Thermoscan ............................................................... 23

Timers and Counters.................................................. 35

Trademarks .................................................................. 5

Warranty....................................................................... 6

Watchdog ................................................................... 35

DIGITAL-LOGIC MICROSPACE MSEBX800, MICROSPACE MSEBX900 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual