Digital Equipment Digital Semiconductor 21164 Alpha Microprocessor User Manual

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DigitalSemiconductor21164 AlphaMicroprocessorMotherboard

User’sManual

Order Number: EC–QLJLC–TE

Revision/Update Information: This document supersedes the

Alpha 21164 Microprocessor Motherboard User’s Manual (EC–QLJLB–TE).

Digital Equipment Corporation Maynard, Massachusetts

March 1996

Possession, use, or copying of the software described in this publication is authorized only pursuant to a valid written license from Digital or an authorized sublicensor.

While Digital believes the information included in this publication is correct as of the date of publication, it is subject to change without notice.

Digital Equipment Corporation makes no representations that the use of its products in the manner described in this publication will not infringe on existing or future patent rights, nor do the descriptions contained in this publication imply the granting of licenses to make, use, or sell equipment or software in accordance with the description.

Printed in U.S.A. Alpha AXP, AlphaGeneration, DEC, DECchip, DECladebug, Digital, Digital Semiconductor,

OpenVMS, VAX, VAX DOCUMENT, VMS, the AlphaGeneration design mark, and the DIGITAL logo are trademarks of Digital Equipment Corporation.

Digital Semiconductor is a Digital Equipment Corporation business. Digital UNIX Version 3.2 for Alpha is a UNIX 93 branded product.

Centronics is a trademark of Genicom Corporation. CompuServe is a registered trademark of CompuServe, Inc. FaxBACK is a registered trademark and Intel and UPI are trademarks of Intel Corporation. GRAFOIL is a registered trademark of Union Carbide Corporation. IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc. MACH is a trademark of Advanced Micro Devices, Inc. Micron is a registered trademark of Micron Corporation. Microsoft is a registered trademark and NT and Windows NT are trademarks of Microsoft Corporation. Motorola is a registered trademark of Motorola, Inc. National is a registered trademark of National Semiconductor Corporation. PS/2 is a registered trademark of International Business Machines Corporation. SPEC is a trademark of Standard Performance Evaluation Corporation. TriQuint is a registered trademark of TriQuint Semiconductor, Inc. UNIX is a registered trademark in the United States and other countries, licensed exclusively through X/Open Company Ltd. Xilinx is a trademark of Xilinx, Incorporated.

All other trademarks and registered trademarks are the property of their respective owners.

This document was prepared using VAX DOCUMENT Version 2.1.

Contents

About This Manual........................................... vii

1 Introduction to the EB164

1.1 System Components and Features........................ 1–1

1.1.1 Digital Semiconductor 21171 Core Logic Chipset .......... 1–1

1.1.2 Memory Subsystem ................................ 1–3

1.1.3 L3 Bcache Subsystem Overview ....................... 1–3

1.1.4 PCI Interface Overview . . ........................... 1–3

1.1.5 ISA Interface Overview . . ........................... 1–4

1.1.6 Miscellaneous Logic ................................ 1–4

1.1.7 Software Support .................................. 1–5

1.1.8 Component Layout ................................. 1–5

1.2 EB164 Summary . . ................................... 1–6

2 System Conﬁguration and Connectors

2.1 Conﬁguration Jumpers ................................. 2–1

2.2 EB164 Connectors . ................................... 2–8

3 Starting and Using the EB164

3.1 Hardware Requirements ............................... 3–1

3.2 Software Requirements ................................ 3–2

3.3 Hardware Conﬁguration ............................... 3–2

3.4 Software Conﬁguration ................................ 3–8

3.4.1 Starting Windows NT ARC Firmware .................. 3–9

3.4.2 Going to the Debug Monitor from Windows NT ARC

Firmware ........................................ 3–9

3.4.3 Returning to Windows NT ARC Firmware from the Debug

Monitor ......................................... 3–10

iii

4 Functional Description

4.1 PCI Interrupts and Arbitration . . ........................ 4–1

4.1.1 Interrupts ....................................... 4–1

4.1.2 Arbitration ....................................... 4–5

4.2 ISA Bus Devices...................................... 4–5

4.3 dc Power Distribution . ................................ 4–5

4.4 PCI Devices . ........................................ 4–7

4.5 Flash ROM. . ........................................ 4–8

4.5.1 Special ROM Header ............................... 4–8

4.5.2 Flash ROM Structure............................... 4–11

4.5.3 Flash ROM Access . ................................ 4–13

5 EB164 Requirements, Power, and Parameters

5.1 Power Requirements . . ................................ 5–1

5.2 Environmental Requirements . . . ........................ 5–2

5.3 Physical Board Parameters ............................. 5–2

A Supporting Vendor Products

A.1 Products Included .................................... A–1

A.2 Products Not Included . ................................ A–2

B Technical Support and Ordering Information

B.1 Obtaining Technical Support ............................ B–1

B.2 Ordering Digital Semiconductor Products . . ................ B–1

B.3 Ordering Digital Semiconductor Literature . ................ B–2

B.4 Ordering Third-Party Literature . ........................ B–3

Index

Figures

1–1 EB164 Functional Block Diagram ..................... 1–2

1–2 Board Component Layout . . . ........................ 1–6

2–1 EB164 Jumper Locations ............................ 2–2

2–2 Conﬁguration Jumpers .............................. 2–3

2–3 EB164 Connector Locations . . ........................ 2–8

2–4 Detail of Header Connector J2 ........................ 2–9

3–1 Fan/Heat Sink Assembly . ........................... 3–4

3–2 EB164 Power Connectors . ........................... 3–7

4–1 Interrupt Logic . ................................... 4–2

4–2 Interrupt and Interrupt Mask Registers ................ 4–5

4–3 dc Power Distribution . . . ........................... 4–6

4–4 Special Header Content . . ........................... 4–8

5–1 Board Component Layout ........................... 5–3

Tables

1–1 Main Memory Sizes ................................ 1–3

1–2 EB164 Features Summary ........................... 1–7

2–1 Conﬁguration Jumper Position Descriptions . . . .......... 2–4

2–2 EB164 Connector Descriptions ........................ 2–10

4–1 EB164 System Interrupts ........................... 4–3

4–2 PCI-to-ISA SIO Bridge Interrupts . . ................... 4–4

4–3 Special Header Entry Descriptions . ................... 4–9

4–4 Flash ROM Image Selection .......................... 4–11

5–1 Power Supply dc Current Requirements ................ 5–1

5–2 Board Component List . . . ........................... 5–4

This manual describes Digital Semiconductor’s 21164 Alpha microprocessor motherboard (EB164), a module for computing systems based on the 21164 Alpha microprocessor and the Digital Semiconductor 21171 chipset.

Audience

This manual is intended for users of the EB164 to assist them in installing the EB164 and populating it with memory modules and peripheral cards.

Scope

This manual describes the features, conﬁguration, and installation of the EB164. This manual does not include speciﬁc bus speciﬁcations (for example, PCI or ISA buses). Additional information is available in the appropriate vendor and IEEE speciﬁcations. See Appendix B for information about how to obtain additional technical support and how to order additional documentation.

Content

This manual contains the following chapters and appendixes:

• Chapter 1, Introduction to the EB164, is an overview of the EB164,

About This Manual

including its components, uses, and features.

• Chapter 2, System Conﬁguration and Connectors, describes the user environment conﬁguration; board connectors and functions; jumper functions; and identiﬁes jumper and connector locations.

• Chapter 3, Starting and Using the EB164, lists additional hardware and software requirements, provides information on how to conﬁgure the hardware and software, and describes the motherboard startup procedures.

• Chapter 4, Functional Description, describes some of the functional elements of the EB164, such as ﬂash ROM contents, interrupt assignments, and power distribution.

vii

• Chapter 5, EB164 Requirements, Power, and Parameters, describes the EB164 power and environmental requirements, and identiﬁes major board components.

• Appendix A, Supporting Vendor Products, lists suggested vendor sources for supporting components, such as, power supply, SIMMs, enclosure, and so forth.

• Appendix B, Technical Support and Ordering Information, describes how to obtain Digital Semiconductor information and technical support, and how to order Digital Semiconductor products and associated literature.

Document Conventions

This section provides the conventions used in this document.

Caution: Cautions indicate potential damage to equipment or data. Note: Notes provide additional information. Numbering: All numbers are decimal or hexadecimal unless otherwise

indicated. In case of ambiguity, a subscript indicates the radix of nondecimal numbers. For example, 19 is a decimal number, but 1916and 19A are hexadecimal numbers.

Extents: Extents are speciﬁed by a single number, or a pair of numbers in angle brackets (< > ) separated by a colon ( :) and are inclusive. For example, bits <7:3> specify an extent including bits 7, 6, 5, 4, and 3. Multiple bit ﬁelds are shown as extents.

Register Figures: Register ﬁgures have bit and ﬁeld position numbering starting at the right (low-order) and increasing to the left (high-order).

Signal Names: Signal names in text are printed in boldface lowercase type. For example, ‘‘ . . . bits data<127:0> are delivered to the Bcache SIMM connectors . . . ’’

viii

Introduction to the EB164

This chapter provides an overview of the EB164 motherboard and describes the EB164, its components, features, and uses.

1.1 System Components and Features

The EB164 is implemented in industry-standard parts and uses a Digital Semiconductor 21164 Alpha microprocessor (21164) running at 266, 300, or 333 MHz. The functional components are shown in Figure 1–1 and are introduced in the following subsections.

1.1.1 Digital Semiconductor 21171 Core Logic Chipset

The 21164 is supported by the Digital Semiconductor 21171 (21171) chipset. The 21171 consists of the following two application-speciﬁc integrated circuit (ASIC) types:

• One copy of the 21171-CA control, I/O interface, and address chip (CIA)

provides the interface between the 21164, main memory (addressing and control), and the peripheral component interconnect (PCI) bus. It also provides the data switch companion chips with control information to direct the data ﬂow.

• Four copies of the 21171-BA data switch chip (DSW) provide the memory

interface data path and route PCI data through the CIA chip.

The chipset includes the majority of functions required to develop a highperformance PC or workstation, requiring minimum discrete logic on the module. It provides ﬂexible and generic functions to allow its use in a wide range of systems.

Introduction to the EB164 1–1

1.1 System Components and Features

Figure 1–1 EB164 Functional Block Diagram

Digital Semiconductor

21164 Alpha

Microprocessor

Support

− Oscillator

− Serial ROM

Index Control

Bcache Tag

Data

Check

Address

Commands

128

Bcache SIMM Sockets (X2)

Digital Semiconductor

21171 Core Logic Chipset

Digital Semiconductor

Control

Digital Semiconductor

Control, I/O Interface,

and Address

21171−BA

Data Switch

(X4)

21171−CA

PCI−to−ISA

Bridge

Data

Flash ROM Time−of−Year Keyboard/Mouse

256

Data

DRAM SIMM Sockets (X8)

Address/Control

3 Dedicated PCI Slots 2 Dedicated ISA Slots 1 Shared PCI/ISA Slot

1–2 Introduction to the EB164

Combination

Controller

2 IDE Devices Diskette Parallel Port 2 Serial Ports

MK−2306−01A

1.1.2 Memory Subsystem

The dynamic random-access memory (DRAM) provides 32MB to 512MB with a 256-bit data bus. The memory is contained in one bank of eight commodity single inline memory modules (SIMMs). Single- or double-sided SIMMs may be used. Each SIMM is 36 bits wide, with 32 data bits and 4 check bits, with 70 ns or less access. Table 1–1 lists the SIMM sizes supported and the corresponding main memory size for 256-bit arrays.

Table 1–1 Main Memory Sizes

SIMM Size Eight SIMMs (256-Bit Array)

1M236 32MB 2M236 64MB 4M236 128MB 8M

36 256MB

16M236 512MB

All eight SIMM connectors (J3 through J10) must be populated. See Figure 2–3 and Table 2–2.

1.1 System Components and Features

1.1.3 L3 Bcache Subsystem Overview

The board-level external L3 backup cache (Bcache) subsystem supports multiple cache sizes and access times. Cache sizes supported are 2MB with Alpha cache SIMMs populated with 128K28 SRAMs, and 4MB and 8MB with SIMMs populated with 512K28 SRAMs. Speeds of 6 ns to 15 ns can be used.

The EB164 has a 2MB 10-ns Bcache SIMM. See Appendix A for order information.

1.1.4 PCI Interface Overview

The EB164 PCI interface is the main I/O bus for the majority of functions (SCSI interface, graphics accelerator, and so on). The PCI interface provides a selectable PCI speed between 25 MHz and 33 MHz (based on the 21164 clock divisor). An onboard PCI-to-ISA bridge is provided through an Intel 82378ZB Saturn I/O (SIO) chip.

The PCI bus has three dedicated PCI expansion slots (one 64-bit and two 32-bit) and one shared 64-bit PCI/ISA slot.

Introduction to the EB164 1–3

1.1 System Components and Features

1.1.5 ISA Interface Overview

The ISA bus has two dedicated slots and a third shared ISA/PCI slot. It provides the following system support functions:

• Mouse and keyboard controller functions—provided by an Intel 8242 chip.

• An IDE interface, a diskette controller, two universal asynchronous receiver–transmitters (UARTs) with full modem control, and a bidirectional parallel port—provided by a National 87312 combination chip.

• A time-of-year (TOY) function—provided by a Dallas Semiconductor DS1287 chip.

• Operating system support—provided by a 1MB ﬂash ROM that contains ﬁrmware and debug monitor code.

Users can develop code on a host system, and load software into the EB164 through a serial line, diskette, or Ethernet board. In addition, sectors of the ﬂash ROM can be programmed for application-speciﬁc purposes.

1.1.6 Miscellaneous Logic

The EB164 contains the following miscellaneous components:

• Clocks A 26.66-MHz oscillator and phase-locked loop (PLL) clock generator provide

a clock source to the 21164 microprocessor and system. A 14.3-MHz crystal and frequency generator provide a clock source for ISA

devices.

• Serial ROM A Xilinx XC17128 serial ROM (SROM) contains initial code that is loaded

into the 21164 instruction cache (Icache) on power-up. A serial line interface is also provided to allow direct connection to a terminal line for debugging purposes.

• Programmable array logic (PAL) devices for the following functions:

One PAL for utility bus (Ubus) decoding One PAL for interrupts Two PAL devices for memory row address strobe (RAS) bank generation

and buffering

1–4 Introduction to the EB164

1.1.7 Software Support

Software support code, consisting of a debug monitor and Windows NT ARC ﬁrmware is contained in a 1MB ﬂash ROM. The monitor provides functions that allow you to:

• Download ﬁles through serial and Ethernet ports and diskette.

• Load data from a ROM through the debug monitor.

• Examine and deposit the EB164 system registers, a few 21164 internal

processor registers (IPRs), and I/O mapped registers.

• Examine and modify DRAM and I/O mapped memory.

• Disassemble CPU instructions in memory.

• Transfer control to programs in memory.

• Perform native debugging operations, including breakpoints and single

stepping.

• Perform full source-level debugging operations by using DECladebug

software running on a host communicating through an Ethernet connection.

1.1 System Components and Features

• Perform a memory image dump.

1.1.8 Component Layout

Figure 1–2 shows the EB164 board component layout and dimensions.

Introduction to the EB164 1–5

1.1 System Components and Features

Figure 1–2 Board Component Layout

33.15 cm (13.05 in)

30.73 cm (12.10 in)

1.2 EB164 Summary

The features of the EB164 are listed and described in Table 1–2.

1–6 Introduction to the EB164

MK−2306−32

Table 1–2 EB164 Features Summary

Characteristic Description Operating Systems

1.2 EB164 Summary

Supported operating systems

Microsoft Windows NT. For information on Digital UNIX operating system support, see your local distributor or your Digital sales representative.

System Characteristics

CPU and clock speed Digital Semiconductor 21164 Alpha microprocessor at 266,

300, or 333 MHz CPU upgradable ZIF socket for 21164 upgrade Instruction issue Up to 4 instructions issued per clock cycle Word size 64 bits Address size 40-bit physical address, 43-bit virtual address Floating-point format VAX (F and G) and IEEE (S and T) data types Memory (DRAM)

Minimum DRAM 32MB plus ECC

Maximum DRAM 512MB plus ECC Memory (ROM) 1MB ﬂash ROM External L2 cache Conﬁgurable for 2MB, 4MB, 8MB (128-bit data) Memory bus width 256 bits plus ECC Performance metrics The EB164 performance is listed here:

21164 Bcache SPECint92 SPECfp92

266 MHZ 2MB, 10ns 300.6 417.4

300 MHZ 2MB, 10ns 335

(estimated)

460

(estimated)

333 MHZ 2MB, 10ns 365.2 518

Graphics

Graphics options Refer to the Microsoft Hardware Compatibility List for

Minimum DRAM recommended: 32MB for Windows NT and Digital UNIX.

Windows NT to determine which graphics cards are

supported. See Section B.4 for information on how to obtain

the listing.

(continued on next page)

Introduction to the EB164 1–7

1.2 EB164 Summary

Table 1–2 (Cont.) EB164 Features Summary

Characteristic Description Input/Output

Input device interfaces PS/2 style keyboard and mouse Serial Two RS423-compatible (9-position) serial communications

Parallel One parallel (Centronics compatible) communications port Bus options Total of 6 option slots PCI bus Supports two 64-bit PCI options slots at 5V and two 32-bit

ISA bus Supports three 16-bit ISA option slots IDE One IDE interface supporting up to 2 drives Diskette One 82077-compatible diskette controller supporting up to 2

Environmental Characteristics (Operating)

Operating temperature 10°C to 40°C (50°F to 104°F) Maximum rate of (dry

bulb) temperature change

Relative humidity Maximum wet bulb Minimum dew point

EMC compliance Compliance certiﬁcation is the responsibility of the system

Shock and vibration Passing of shock and vibration tests is dependent on the

ports

PCI option slots at 5V

drives with 1.44MB and 2.88MB formats

11°C/hour

10%–90% noncondensing 32°C (90°F) 2°C (36°F)

integrator. The EB164 was tested in industry-representative enclosures to prove feasibility of emissions compliance.

method used to mount the system board, the design of the enclosure, and how the enclosure is supported. Testing is the responsibility of the system integrator.

2°C/hour (20°F/hour64°F/hour)

Physical Characteristics

Form factor Standard, full-size PC AT board Width/depth 30.73 cm (12.10 in)233.15 cm (13.05 in)

1–8 Introduction to the EB164

System Conﬁguration and Connectors

The EB164 uses jumpers to implement conﬁguration parameters such as variations in backup cache (Bcache) size, access timing, and speed, as well as boot parameters. These jumpers must be conﬁgured for the user’s environment. Onboard connectors are provided for the I/O interfaces, single inline memory modules (SIMMs), and serial and parallel peripheral ports.

After the module is conﬁgured, power can be applied, and the debug monitor can be run. The debug monitor and its commands are described in the Alpha Microprocessors Evaluation Board Debug Monitor User’s Guide. Appendix B provides information about other software design tools.

2.1 Conﬁguration Jumpers

Figure 2–1 identiﬁes the location of the software and hardware conﬁguration jumpers, and Table 2–1 provides descriptions. Figure 2–2 provides a detailed view of the conﬁguration jumpers and their function.

System Conﬁguration and Connectors 2–1

2.1 Conﬁguration Jumpers

Figure 2–1 EB164 Jumper Locations

J17

J16

J15

2–2 System Conﬁguration and Connectors

J14

MK−2306−30

Figure 2–2 Conﬁguration Jumpers

CONF4 CONF5

CONF6 CONF7 CONF8 CONF9 CONF10 CONF11 CONF12 CONF13 CONF14 CONF15

irq3 irq2 irq1 irq0 Reserved BC_SIZE<2> BC_SIZE<1> BC_SIZE<0> BC_SPEED<2> BC_SPEED<1> BC_SPEED<0> Mini−Debugger BOOT_OPTION Reserved BC_RD_FAST Reserved Reserved Reserved Reserved Reserved

2.1 Conﬁguration Jumpers

J17

J16

J15

J14

index22

2 3

index21

2 3

index20

2 3

Flash ROM Write Protect/

Write Enable

MK−2306−04

System Conﬁguration and Connectors 2–3

2.1 Conﬁguration Jumpers

Table 2–1 Conﬁguration Jumper Position Descriptions

Feature Jack/Jumper—Pins and Description

System clock divisor

J1—1/2, —3/4, —5/6, —7/8

J1—1/2 (irq3)

In In Out Out 3 In Out In In 4 In Out In Out 5 In Out Out In 6 In Out Out Out 7 Out In In In 8

Out In In Out 9

Out In Out In 10

Out In Out Out 11 Out Out In In 12 Out Out In Out 13 Out Out Out In 14 Out Out Out Out 15

J1—3/4 (irq2)

Divisor 8 is used for 266 MHz.

Divisor 9 is used for 300 MHz.

Divisor 10 is used for 333 MHz.

J1—5/6 (irq1)

J1—7/8 (irq0) Ratio

2–4 System Conﬁguration and Connectors

(continued on next page)

2.1 Conﬁguration Jumpers

Table 2–1 (Cont.) Conﬁguration Jumper Position Descriptions

Feature Jack/Jumper—Pins and Description

BC_SIZE<2:0> J1—11/12 (CONF4), —13/14 (CONF5), —15/16 (CONF6)

These jumpers allow the Bcache to emulate the sizes speciﬁed in the following table. These jumpers are changed in conjunction with the appropriate index jumpers J17, J16, and J15.

Bcache size– index address bits <22:20>

CONF4 Pins 11/12

CONF5 Pins 13/14

CONF6

Pins 15/16 Bcache

In In In Reserved In In Out Reserved In Out In Reserved In Out Out 2MB (default) Out In In 4MB Out In Out 8MB Out Out In Reserved Out Out Out Reserved

J17, J16, J15

Jumper

2MB (default) 4MB

8MB

J17 (index22) 2 to 3 2 to 3 1 to 2 J16 (index21) 2 to 3 1 to 2 1 to 2 J15 (index20) 1 to 2 1 to 2 1 to 2

SIMMs populated with 128K28 or 512K28 SRAMs

SIMMs populated with 512K28 SRAMs

(continued on next page)

System Conﬁguration and Connectors 2–5

2.1 Conﬁguration Jumpers

Table 2–1 (Cont.) Conﬁguration Jumper Position Descriptions

Feature Jack/Jumper—Pins and Description

BC_SPEED<2:0> J1—17/18 (CONF7), —19/20 (CONF8), —21/22 (CONF9)

These jumpers select the Bcache timing parameters used to compute the BC_CONFIG register value. Select the jumper conﬁguration that matches the access time for the SRAMs being used.

CONF7 Pins 17/18

In In In Reserved In In Out 6-ns SRAM timing In Out In 8-ns SRAM timing In Out Out 10-ns SRAM timing (default) Out In In 12-ns SRAM timing Out In Out 15-ns SRAM timing Out Out In Reserved Out Out Out Reserved

Mini-Debugger J1—23/24 (CONF10)

The Alpha SROM Mini-Debugger is provided in the SROM. This jumper (In) causes the SROM initialization to trap to the MiniDebugger (connector J13) after all initialization is complete, but before starting the execution of the system ﬂash ROM code. The default position for this jumper is out.

CONF8 Pins 19/20

CONF9 Pins 21/22 Bcache Speed

(continued on next page)

2–6 System Conﬁguration and Connectors

2.1 Conﬁguration Jumpers

Table 2–1 (Cont.) Conﬁguration Jumper Position Descriptions

Feature Jack/Jumper—Pins and Description

BOOT_OPTION J1—25/26 (CONF11)

This jumper selects the image to be loaded into memory from the system ﬂash ROM. With the jumper out (bit = 1), the ﬁrst image (debug monitor) is loaded. With the jumper in (bit = 0), alternate images can be loaded depending upon the value stored in TOY RAM location 0x3F. The default position for this jumper is in.

For system ﬂash ROMs that contain a single image, the header is optional. If the header does not exist, the entire 1MB system ﬂash ROM is loaded and executed at physical address zero.

For more information on the system ROM header and boot images, refer to Section 4.5.1.

BC_RD_FAST J1—29/30 (CONF13)

This jumper forces a Bcache read speed setting of 1 cycle faster than nominal.

BC_RD_FAST Bcache Speed

Flash ROM writeprotect/writeenable jumper

In Make read speed 1 cycle faster Out Nominal read speed (default)

J14

Jumper Pins Function

1 to 2 Flash ROM write-protect 2 to 3 Flash ROM write-enable (default)

System Conﬁguration and Connectors 2–7

2.2 EB164 Connectors

Figure 2–3 shows the EB164 connectors and Table 2–2 describes them. Figure 2–4 provides a detail of header connector J2.

Figure 2–3 EB164 Connector Locations

J29

J33

J31

J34

J32

J25

J24

J23

J22

J30

J18

J28 J27

J26

J13

J12

J11

J10

J21

J20

J19

2–8 System Conﬁguration and Connectors

MK−2306−31

Figure 2–4 Detail of Header Connector J2

2.2 EB164 Connectors

IDE Drive Active Indicator

Speaker

Fan 1

Fan 2

Fan 3

Ground Pins: 5, 8, 9, 12, 13, 16,

18, 22, and 25

+12−V Pins: 3, 7, and 11

System Halt Button

System Reset Button

Keyboard Lock Switch

Power On Indicator

MK−2306−27A

System Conﬁguration and Connectors 2–9

2.2 EB164 Connectors

Table 2–2 EB164 Connector Descriptions

Connector Pins Description

J10 72 DRAM 0 SIMM J9 72 DRAM 1 SIMM J8 72 DRAM 2 SIMM J7 72 DRAM 3 SIMM J6 72 DRAM 4 SIMM J5 72 DRAM 5 SIMM J4 72 DRAM 6 SIMM J3 72 DRAM 7 SIMM

J11 60 Bcache 0 SIMM J12 60 Bcache 1 SIMM

Main Memory/Bcache SIMMs

Note: To ﬁll a 256-bit data path, all SIMM connectors J3

through J10 must be populated.

Note: Both Bcache SIMM connectors must be populated.

PCI Connectors

J22 184 PCI64 connector 0 J23 184 PCI64 connector 1 J24 124 PCI32 connector 2 J25 124 PCI32 connector 3

ISA Connectors

J19 98 ISA connector slot 0 J20 98 ISA connector slot 1 J21 98 ISA connector slot 2

Keyboard Connector

J32 6 Keyboard connector

2–10 System Conﬁguration and Connectors

(continued on next page)

2.2 EB164 Connectors

Table 2–2 (Cont.) EB164 Connector Descriptions

Connector Pins Description

Mouse Connector

J34 6 Mouse connector

National 87312 Combination Chip Connectors

J33 26 Parallel port connector

Connects to an external 25-pin connector.

J27 10 Serial communication port 1 connector

Note: This connector can be used as a terminal port for the

debug monitor. J26 10 Serial communication port 2 connector J31 34 Diskette drive connector J28 40 IDE drive connector

SROM Data/Clock

J13 6 SROM data/clock serial port input connector

Note: This connector can be used as a terminal port for the

Mini-Debugger.

J2 26 Header connector J2 is a straight double-row header with

J2—3/5, —7/9, —11/13

J2—15/17 2 IDE drive active indicator pins

2 each Up to three 12-V cooling fans may be connected to these

standard 0.025-in pins on 0.10-in centers. Connections to

it may be made by means of individual 2- or 4-pin female

plugs. Figure 2–4 provides a detail of header connector J2.

System Enclosure Fans

pins.

IDE Drive Active Indicator

(continued on next page)

System Conﬁguration and Connectors 2–11

2.2 EB164 Connectors

Table 2–2 (Cont.) EB164 Connector Descriptions

Connector Pins Description

J2—19/21/23/25 — Speaker connector pins

J2—26 1 Power on indicator pin

J2—8/10 2 System halt button pins

J2–12/14 2 System reset button pins

J2–18/20 2 Keyboard lock switch pins

Speaker

Power On Indicator

Connect LED from this pin to ground.

System Halt Button

System Reset Button

Keyboard Lock Switch

2–12 System Conﬁguration and Connectors

(continued on next page)

Table 2–2 (Cont.) EB164 Connector Descriptions

Connector Pins Description

Power Connectors

J18 12 Board power connector

Pin Voltage/Signal

1 +3.3 V

2 +3.3 V

3 +3.3 V

4 Ground

5 Ground

6 Ground

7 Ground

8 Ground

9 Ground

10 +3.3 V

11 +3.3 V

12 +3.3 V

2.2 EB164 Connectors

(continued on next page)

System Conﬁguration and Connectors 2–13

2.2 EB164 Connectors

Table 2–2 (Cont.) EB164 Connector Descriptions

Connector Pins Description

J29 12 Board power connector

Pin Voltage/Signal

1 p_dcok 2 Vdd (+5 V) 3 +12 V 4 –12 V 5 Ground 6 Ground 7 Ground 8 Ground 9–5V 10 Vdd (+5 V) 11 Vdd (+5 V) 12 Vdd (+5 V)

Note: Power for the EB164 is provided by a user-supplied power supply. Digital does not provide this power supply. (Refer to Chapter 5 for more information.)

J30 3 CPU fan power and sensor

Caution: Fan sensor required.

The fan must have a built-in sensor that drives a signal if the airﬂow stops. The sensor must be connected to pin J30—2. The fan supplied with the EB164 includes an airﬂow sensor.

2–14 System Conﬁguration and Connectors

Starting and Using the EB164

This chapter lists hardware, software, and accessories that users must obtain to completely furnish a functioning computer system. The chapter then describes how to conﬁgure the hardware and software. Finally, the chapter describes how to start and use the EB164.

3.1 Hardware Requirements

Before turning on the power to your EB164, you must provide the following components in addition to those supplied in the kit. The components needed depend upon the intended use of the EB164 board.

• A 21164 Alpha microprocessor (266-, 300-, or 333-MHz speed).

• If a 300-MHz or 333-MHz microprocessor is used, the oscillator must be

changed. Refer to Appendix A for part numbers and sources. The board ships with parts to complement a 266-MHz microprocessor.

• Eight 72-pin, 36-bit, 5-V, DRAM SIMM memory modules (connectors

J3 through J10). SIMMs must consist of identical devices. Digital recommends that all SIMMs be purchased from the same vendor.

• Two Alpha L3 cache SRAM SIMMs (connectors J11 and J12). Part

numbers for 2MB cache sizes are listed in Appendix A.

• An industry-standard PC power supply that includes a 3.3-V dc output,

rated at a minimum of 339 W (refer to Appendix A).

• A PS/2 compatible 101-key keyboard.

• A PS/2 compatible mouse.

• A supported PCI or ISA bus graphics card, cables, and a compatible

monitor.

• A supported PCI or ISA bus SCSI controller and cables.

• A SCSI CD–ROM drive.

• An IDE or SCSI hard drive.

Starting and Using the EB164 3–1

3.1 Hardware Requirements

• A 3.5-in diskette drive and cable.

• A 9-pin serial line cable.

• A terminal or a serial line connection to a host system with appropriate cables.

Refer to the Alpha Microprocessors Evaluation Board Windows NT 3.51 Installation Guide provided in the EB164 Windows NT 3.51 Installation Kit and the Hardware Compatibility List for Windows NT to determine which SCSI controllers and graphics cards are supported.

For more information about hardware requirements and for the location of board connectors and jumpers, see Chapter 2.

3.2 Software Requirements

The following software media is required to install and run the Windows NT operating system:

• A Windows NT 3.51 CD–ROM

• An EB164 Windows NT 3.51 installation diskette

3.3 Hardware Conﬁguration

Once you have acquired the necessary hardware, it must be assembled into a system. This section lists the necessary steps. The system does not have to be assembled in the order presented. However, if you are installing the motherboard into an enclosure, Digital recommends that you install the microprocessor and heat sink ﬁrst.

Caution: Static-Sensitive Component

Due to the sensitive nature of electronic components to static electricity, Digital strongly advises that anyone handling the 21164 Alpha microprocessor wear a properly grounded antistatic wrist strap. Use of antistatic mats, ESD approved workstation, or exercising other good ESD practices is recommended.

3–2 Starting and Using the EB164

3.3 Hardware Conﬁguration

1. Install the 21164 Alpha microprocessor in ZIF socket U42.

a. Observe antistatic precautions. b. Lift the ZIF socket actuator handle to a full 90° angle. c. Make sure that all the pins on the 21164 are straight. d. The ZIF socket and 21164 are keyed to allow for proper installation.

Align the 21164, with its missing AD01 pin, with the corresponding plugged AD01 position on the ZIF socket. Gently lower into position.

e. Close the ZIF socket actuator handle to its locked position.

2. If you are installing a 266-MHz microprocessor, you do not need to change

any other components or associated jumper settings. If you are installing a 300-MHz or 333-MHz microprocessor, you must

also reconﬁgure the clock divisor jumpers on header J1 as described in Table 2–1. You must also change the oscillator. Refer to Appendix A for part numbers and sources.

3. Install the heat sink and heat sink fan as directed in the following steps.

Heat sinks and accompanying fans are available from Digital in kit form, or from recommended vendors as kits or component piece parts.

A TS30 manual nut/torque driver with the following attachments is required to afﬁx the heat sink and fan to a 21164:

• 1/4-in hex bit

• 7/16-in socket with 1/4-in hex drive

• #2 Phillips screwdriver bit

Install the heat sink only after the 21164 has been assembled to the board ZIF socket.

Note

Starting and Using the EB164 3–3

3.3 Hardware Conﬁguration

Refer to Figure 3–1 for heat sink and fan assembly details.

Figure 3–1 Fan/Heat Sink Assembly

Screw, 6-32 x 0.875 in Qty 4

Guard, Fan

Fan

Clip, Heat Sink/Chip/Fan

Nut, Hex, 1/4-20, 2011-T3 Aluminum, 0.438 in Across Flats, Qty 2 Torque to 20 +/- 2 in-lbs

Heat Sink, with Fan Mounting Holes

a. Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used

to improve the thermal conductivity between the chip package and the heat sink by replacing micro air pockets with a less insulative material. Perform the following steps to position the GRAFOIL pad:

1) Perform a visual inspection of the package slug to ensure that it is free of contamination.

3–4 Starting and Using the EB164

Thermal Pad

21164 Alpha Microprocessor

LJ04412A.AI5

3.3 Hardware Conﬁguration

2) Wearing clean gloves, pick up the GRAFOIL pad. Do not do this

with bare hands because skin oils can be transferred to the pad.

3) Place the GRAFOIL pad on the gold-plated slug surface and align

it with the threaded studs.

b. Attach the microprocessor heat sink. The heat sink material is clear

anodized, hot-water-sealed, 6061-T6 aluminum. The nut material is 2011-T3 aluminum (this grade is critical). Perform the following steps to attach the heat sink:

1) Observe antistatic precautions.

2) Align the heat sink holes with the threaded studs on the ceramic

package.

3) Handle the heat sink by the edges and lower it on to the chip

package, taking care not to damage the stud threads.

4) Set a calibrated torque driver to 20 in-lb,62 in-lb, (2.3 N m,

0.2 N m.) The torque driver should have a mounted 7/16-in

socket.

5) Insert a nut into the 7/16-in socket, place on one of the studs, and

tighten to the speciﬁed torque. Repeat for second nut.

6) If the sink/chip/fan clip is used, install it properly by positioning

it over the assembly and hooking its ends around the ZIF socket retainers.

c. Perform the following steps to attach the heat sink fan assembly:

1) Place the fan assembly on top of the heat sink, aligning the fan

mounting holes with the corresponding threaded heat sink holes. Align the fan so that the fan power/sensor wires exit the fan closest to connector J30 (see Figure 2–3). Fan airﬂow must be directed into the heat sink (fan label facing down toward the heat sink).

2) Place the fan guard on top of the fan. Orient the guard so that the

corner mounting areas lay ﬂush against the heat sink.

3) Secure the fan and fan guard to the heat sink with four

6–3220.875-in screws.

4) Plug the fan power/sensor cable into connector J30 (see

Figure 2–3).

Starting and Using the EB164 3–5

3.3 Hardware Conﬁguration

4. Install the two L3 cache SRAM SIMMs into sockets J11 and J12. Refer to Table 2–2 for socket locations.

5. Install eight system memory DRAM SIMMs. Refer to Table 2–2 for socket locations.

a. Observe antistatic precautions. Handle SIMMs at the edges only to

prevent damage.

b. SIMMs must be installed in groups of eight consisting of identical

devices. c. Hold the SIMM at an angle with the notch facing the key in the socket. d. Firmly push the module into the connector and stand the module

upright. e. Make sure that the SIMM snaps into the metal locking clips on both

ends.

6. If you intend to mount the motherboard in a system enclosure, do so now. Install the power supply into the enclosure ﬁrst, then the motherboard. Appendix A lists a suggested enclosure and a suggested power supply. The enclosure you use should be able to accept a standard, full-size PC AT board.

7. Connect the power supply to the EB164 board, as shown in Figure 3–2, with standard power to J29, and with 3.3-V dc power to J18.

8. If you are using an enclosure, mount the 3.5-in diskette drive, hard drive, and CD–ROM drive. Refer to the manufacturer’s instructions for installing these devices.

9. Connect the supplied 3.5-inch diskette drive. The 34-pin diskette drive cable goes from connector J31 on your EB164 to the diskette drive. The drive should be connected at the very end of the cable closest to the twist in the cable. Attach a power connector to the drive. Again, make sure to insert the connector in the proper orientation so that pin 1 on the cable matches pin 1 on the board header (as indicated on the module).

10. Install the SCSI controller in a free PCI or ISA connector and attach the CD–ROM drive. If you will be using a SCSI hard drive, install the hard drive now. Refer to the manufacturer’s instructions for installing these devices. Verify that a unique SCSI ID is assigned to each device you attach to the SCSI bus.

3–6 Starting and Using the EB164

Figure 3–2 EB164 Power Connectors

EB164 Board

J29

21164

Microprocessor

3.3 Hardware Conﬁguration

J29 Pin Voltage/Signal

p_dcok

Vdd

2 (+5 V) 3 +12 V 4 −12 V 5 Ground 6 Ground 7 Ground 8 Ground 9 −5 V

Vdd

10 (+5 V)

Vdd

11 (+5 V)

Vdd

12 (+5 V)

J18

J18 Pin Voltage/Signal

1 +3.3 V

2 +3.3 V 3 +3.3 V 4 Ground 5 Ground 6 Ground 7 Ground 8 Ground 9 Ground 10 +3.3 V 11 +3.3 V 12 +3.3 V

MK−2306−28

Starting and Using the EB164 3–7

3.3 Hardware Conﬁguration

11. If you will be using an IDE hard drive, attach your IDE cable to connector J28 in the proper orientation and install your hard drive. The disk should be conﬁgured as the primary device on the IDE bus. Refer to the manufacturer’s instructions for setting up the hard drive.

12. If you plan to use your EB164 on a network, install the Ethernet controller board (DE435) in one of the PCI connectors as outlined in the DE435 documentation.

13. Install the graphics card into either a PCI or ISA connector, depending on the card you are using. Connect the graphics card to a compatible monitor following the graphics card manufacturer’s instructions.

14. Connect the keyboard cable to connector J32.

15. Connect the mouse cable to connector J34.

16. Connect the 9-pin serial port adapter cable, provided in the kit, to the COM1 connector at J27. Insert the connector in the proper orientation, so that pin 1 on the cable matches pin 1 on the board header (as indicated on the module).

17. Connect your terminal to the COM1 port, using a cable arrangement appropriate to your terminal. Set the terminal to 9600 baud, 8 data bits, 1 stop bit, no parity.

18. Connect miscellaneous items such as, enclosure fans, reset button, speaker, power indicator, hard drive active indicator (if using an IDE drive), keyboard lock switch, and so forth.

3.4 Software Conﬁguration

Two ﬁrmware programs have been loaded into the EB164 1MB ﬂash ROM. They are the debug monitor and the Windows NT ARC ﬁrmware. The debug monitor is a serial line monitor program used to perform software and hardware debug functions. The Windows NT ARC ﬁrmware is used to load and boot Windows NT. The EB164 system has been conﬁgured to start the Windows NT ARC ﬁrmware by default.

The serial ROM ﬁrmware uses a value stored in the nonvolatile RAM of the real-time clock to determine which ﬁrmware image to load. Once the Windows NT ARC ﬁrmware is running, you can switch to the debug monitor ﬁrmware.

3–8 Starting and Using the EB164

3.4 Software Conﬁguration

3.4.1 Starting Windows NT ARC Firmware

Start the Windows NT ARC ﬁrmware using the following procedure.

1. Verify that the jumper from J14-2 to J14-3 is inserted, allowing the ﬂash

ROM to be written. If the Windows NT ARC ﬁrmware is unable to write to ﬂash ROM, it prints the

2. Verify that the jumper at J1–25/26 is installed (see CONF11 on the

module). The presence of the jumper at J1–25/26 forces the serial ROM ﬁrmware to load the alternate image selected by the value in the nonvolatile TOY RAM. The absence of this jumper overrides the value stored in the TOY RAM and causes the ﬁrst image, the debug monitor, to be loaded.

3. Turn on the power to the EB164. After the power-up diagnostics are run,

the ARC console boot menu appears on the graphics display. If the ARC console boot menu does not appear, check the output of COM1

for error messages and review your hardware conﬁguration. You are ready for software installation. Refer to the Alpha Microprocessors

Evaluation Board Windows NT 3.51 Installation Guide for instructions.

device error

message and stops.

3.4.2 Going to the Debug Monitor from Windows NT ARC Firmware

You may use either of these two methods to access the debug monitor from the Windows NT ARC ﬁrmware.

A. Use the ARC ﬁrmware menus to choose the debug monitor.

1. At the Boot menu, choose Supplementary menu....

2. At the Supplementary menu, choose Setup the system....

3. At the Setup the system menu, choose Machine speciﬁc setup....

4. At the Machine speciﬁc setup menu, choose Debug Monitor.

5. Turn off the power to the EB164, then turn the power back on.

B. Turn off the power to the EB164, remove the jumper from J1-25/26

(CONF11 on the module), then turn on the power to the EB164.

Starting and Using the EB164 3–9

3.4 Software Conﬁguration

3.4.3 Returning to Windows NT ARC Firmware from the Debug Monitor

The following methods may be used to return to the Windows NT ARC ﬁrmware from the debug monitor.

A. If you used item A in section Section 3.4.2 to enter the debug monitor, then

use this procedure to return to Windows NT ARC ﬁrmware. The ﬁrmware contained in the serial ROM on your EB164 determines which ﬁrmware image is loaded from the ﬂash ROM at power-up. The serial ROM ﬁrmware uses a value stored in the nonvolatile RAM of the real-time clock to determine which ﬁrmware image to load. At this point, you want the serial ROM to load the Windows NT ARC ﬁrmware.

1. Use the following debug monitor commands to select Windows NT ARC

ﬁrmware, by writing the value 1 to the TOY RAM. and to verify the selection:

EB164> bootopt nt O/S type selected: "The Windows NT Operating System"

....Firmware type: "Windows NT Firmware"

EB164> bootopt Predefined bootoptions are...

"0" "Alpha Evaluation Board Debug Monitor" "DBM" "1" "The Windows NT Operating System" "NT" "2" "OpenVMS" "VMS" "3" "Digital UNIX" "UNIX"

O/S type selected: "The Windows NT Operating System"

....Firmware type: "Windows NT Firmware"

EB164>

The EB164 does not support the OpenVMS operating system.

2. Turn off power to the EB164. Verify the presence of a jumper at

J1–25/26 (see CONF11 on the module).

3. Turn on the power to the EB164. After the power-up diagnostics are

run, the ARC console boot menu appears on the graphics display.

3–10 Starting and Using the EB164

Note

3.4 Software Conﬁguration

B. If you used item B in section Section 3.4.2 to enter the debug monitor, then

use this procedure to return to Windows NT ARC ﬁrmware.

1. Turn off the power to the EB164, insert the jumper from J1-25/26 (CONF11 on the module).

2. Turn on the power to the EB164. After the power-up diagnostics are run, the ARC console boot menu appears on the graphics display. If the ARC console boot menu does not appear, check the output of COM1 for error messages and review your hardware conﬁguration.

Starting and Using the EB164 3–11

Functional Description

This chapter describes the functional operation of the EB164. The description introduces the Digital Semiconductor 21171 ASIC support chipset and describes its implementation with the 21164 microprocessor, its supporting memory, and I/O devices. Figure 1–1 shows the EB164 major functional components.

Information, such as bus timing and protocol, found in other data sheets and reference documentation is not duplicated. See Appendix B for a list of supporting documents and order numbers.

Note

For detailed descriptions of bus transactions, chipset logic, and operation, refer to the Alpha 21164 Microprocessor Hardware Reference

Manual and the DECchip 21171 Core Logic Chipset Technical Reference Manual.

For details of the PCI interface, refer to the PCI System Design Guide.

4.1 PCI Interrupts and Arbitration

The following sections describe the EB164 interrupt and arbitration (arbiter) logic.

4.1.1 Interrupts

PCI-, ISA-, and CIA-generated interrupts are each described. Figure 4–1 shows the interrupt logic.

Functional Description 4–1

4.1 PCI Interrupts and Arbitration

Figure 4–1 Interrupt Logic

21164

jmp_irq3*

jmp_irq2*

jmp_irq1*

cpu_irq3

cpu_irq2

jmp_irq0*

jmp_pwr_fail*

jmp_mch_hlt**

error_nmi

eb164.5

cia_error

sio_nmi

Control,

pwr_fail_irq

mch_hlt_irq

cpu_irq0

cpu_irq1

MUX

rtc_irq_h

Pull−Down

and Address

I/O Interface,

sys_mch_chk_irq

eb164.5

Pull−Down

pci_isa_irq

cia_int

Pull−Down

eb164.8

cpu_reset_l

Bridge

PCI−to−ISA

eb164.2

*From J1 jumpers

**From Halt switch

MK−2306−22

eb164.25

sio_int

PCI Bus

System

Interrupt

PLD

pci_isa_irq

irq_reset_l

Decodes

sense_dis

ISA Bus

eb164.20−.22

PCI

Slots

pci_int _l

4–2 Functional Description

Ubus<7:0>

eb164.30

Combination

Keyboard

drq<7:5, 3:0>

ISA

Slots

eb164.27eb164.32

Controller

and Mouse

<7:3><12, 1>

irq<15:3 ,1>

eb164.26

4.1 PCI Interrupts and Arbitration

The PCI-to-ISA SIO bridge chip provides the functionality of two 8259 interrupt control devices. These ISA-compatible interrupt controllers are cascaded such that 14 external and two internal interrupts are available. The PCI interrupt acknowledge command should be used to read the interrupt request vector from the SIO.

However, the EB164 has more interrupt signals than the 14 external interrupts the SIO can handle. Therefore, all the ISA interrupts are sent to the SIO except for the two CIA interrupts, the time-of-year (TOY) interrupt, and the 16 PCI interrupts. They are sent to an external interrupt PAL. This PAL takes these interrupts, as well as an OR of the nonexistent memory (NMI) and error signals from the SIO, and generates cpu_irq<3:0>. During reset, cpu_irq<3:0> convey the system clocking ratios and delays, which are set by jumpers on J1.

Table 4–1 lists each system interrupt, its ﬁxed interrupt priority level (IPL), and its EB164 implementation. Table 4–2 lists each SIO interrupt and its EB164 implementation.

Table 4–1 EB164 System Interrupts

21164 Interrupt IPL

Suggested Usage EB164 Usage

cpu_irq<0> 20 Corrected system

cpu_irq<1> 21 — PCI and ISA interrupts cpu_irq<2> 22 Interprocessor and

cpu_irq<3> 23 — Reserved pwr_fail_irq 30 Powerfail interrupt Reserved sys_mch_chk_irq 31 System machine

mch_hlt_irq — Halt Reserved

IPL = interrupt priority level (ﬁxed)

error

timer interrupts

check interrupt

Corrected ECC error and sparse space reserved encodings detected by CIA

Time-of-year clock interrupt

SIO NMI and CIA errors

Functional Description 4–3

4.1 PCI Interrupts and Arbitration

Table 4–2 PCI-to-ISA SIO Bridge Interrupts

Priority Label Controller Internal/External Interrupt Source

1 IRQ0 1 Internal Internal timer 1 2 IRQ1 1 External Keyboard 3–10 IRQ2 1 Internal Interrupt from controller 2 3 IRQ8# 4 IRQ9 2 External ISA bus pin B04 5 IRQ10 2 External ISA bus pin D03 6 IRQ11 2 External ISA bus pin D04 7 IRQ12 2 External Mouse 8 IRQ13 2 External Reserved 9 IRQ14 2 External IDE 10 IRQ15 2 External ISA bus pin D06 11 IRQ3 1 External 87312 combination controller 12 IRQ4 1 External 87312 combination controller 13 IRQ5 1 External 87312 combination controller 14 IRQ6 1 External 87312 combination controller 15 IRQ7 1 External 87312 combination controller

2 External Reserved

The # symbol indicates an active low signal.

Interrupt PLDs Function

The MACH210A PLD is an 8-bit I/O slave on the ISA bus at hex addresses 804, 805, and 806. This is accomplished by a decode of the three ISA address bits sa<2:0> and the three ecas_addr<2:0> bits.

Each interrupt can be individually masked by setting the appropriate bit in the mask register. An interrupt is disabled by writing a 1 to the desired position in the mask register. An interrupt is enabled by writing a 0. For example, bit <7> set in interrupt mask register 1 indicates that the INTB2 interrupt is disabled. There are three mask registers located at ISA addresses 804, 805, and 806.

An I/O read transaction at ISA addresses 804, 805, and 806 returns the state of the 17 PCI interrupts rather than the state of the masked interrupts. On read transactions, a 1 means that the interrupt source shown in Figure 4–2 has asserted its interrupt. The mask register can be updated by writing addresses 804, 805, or 806. The mask register is write-only.

4–4 Functional Description

Figure 4–2 Interrupt and Interrupt Mask Registers

Interrupt and Interrupt Mask Register 1 (ISA Address 804h)

76543210

Interrupt and Interrupt Mask Register 2 (ISA Address 805h)

76543210

Interrupt and Interrupt Mask Register 3 (ISA Address 806h)

76543210

RAZ = Read-as-Zero, Read-Only

Notes:

Interrupt Mask Register Is Write-Only

4.1.2 Arbitration

Arbitration logic is implemented in the Intel 82378ZB Saturn I/O (SIO) chip. The arbitration scheme is ﬂexible and software programmable. Refer to the Intel 82420/82430 PCIset ISA and EISA Bridges document for more information about programmable arbitration.

4.1 PCI Interrupts and Arbitration

inta0inta1inta2inta3intb0intb1intb2 sio

intb3intc0intc1intc2intc3intd0intd1intd2

RAZRAZRAZRAZRAZRAZRAZ intd3

LJ-04211.AI

4.2 ISA Bus Devices

Two dedicated ISA expansion slots are provided in addition to the combination ISA/PCI slot. System support features such as serial lines, parallel port, integrated device electronics (IDE), and diskette controller are embedded on the module by means of an 87312 combination controller chip. Also shown is the utility bus (Ubus) with its system support devices.

4.3 dc Power Distribution

The EB164 derives its system power from a user-supplied PC power supply. The power supply must provide +12 V dc and –12 V dc, –5 V dc, +3 V dc, and Vdd (+5 V dc). The dc power is supplied through power connectors J18 and J29. (See Figure 4–3.) Power is distributed to the board logic through dedicated power planes within the 6-layer board structure.

Functional Description 4–5

4.3 dc Power Distribution

Figure 4–3 dc Power Distribution

Fans (J1)Flash ROM

Integrated

Circuits/Clocks

+5 V Pull−Ups

Spkr

eb164.22eb164.26

P/J30

Fan

21164

Pull−Downs

eb164.2

MK−2306−25

+3 V Pull−Ups

ISA Conn. PCI32 Conn.

Vdd

+12 V

23456

J29

−12 V

−5 V

718

4–6 Functional Description

+3 V

GND (Vss)

J18

293104115126

Power

Connectors

eb164.40

101112

As shown in Figure 4–3, the +12 V dc, –12 V dc, and –5 V dc are supplied to ISA connectors J19, J20, and J21. The +12 V dc and –12 V dc are supplied to ISA connectors and PCI32 connectors J24 and J25. The +12 V dc is also supplied to the CPU fan connector J30, auxiliary fan connector pins on header J2, and to the ﬂash ROM write-enable conector J14. Vdd is supplied to ISA connectors, PCI32 connectors and most of the board’s integrated circuits. The +3 V dc is supplied to the 21164 microprocessor.

4.4 PCI Devices

The EB164 uses the PCI bus as the main I/O bus for the majority of peripheral functions. The board implements the ISA bus as an expansion bus for system support functions and relatively slow peripheral devices.

The PCI bus supports multiplexed, burst mode, read and write transfers. It supports synchronous operation of between 25 MHz and 33 MHz. It also supports either a 32-bit or 64-bit data path with 32-bit device support in the 64-bit conﬁguration. Depending upon the conﬁguration and operating frequencies, the PCI bus supports anywhere between 100MB/s (25-MHz, 32-bit) to 264MB/s (33-MHz, 64-bit) peak throughput. The PCI provides parity on address and data cycles. Three physical address spaces are supported:

4.3 dc Power Distribution

1. 32-bit memory space

2. 32-bit I/O space

3. 256-byte-per-agent conﬁguration space The bridge from the 21164 system bus to the 64-bit PCI bus is provided by the

CIA chip. It generates the required 32-bit PCI address for 21164 I/O accesses directed to the PCI. It also accepts 64-bit double address cycles and 32-bit single address cycles. However, the 64-bit address support is subject to some constraints.

Functional Description 4–7

4.5 Flash ROM

The ﬂash ROM, sometimes called the system ROM, is a 1MB, nonvolatile, writable ROM. After the serial ROM (SROM) code initializes the EB164 system, the ﬂash ROM code prepares the system for booting. The ﬂash ROM headers, structure, and access methods are described here.

4.5.1 Special ROM Header

The MAKEROM tool is used to place a special header on ROM image ﬁles. The SROM allows the system (ﬂash) ROM to contain several different ROM images, each with its own header. The header informs the SROM where to load the image, and whether or not it has been compressed with the MAKEROM tool. The header is optional for system ROMs containing a single image. If the header does not exist, the complete 1MB system ﬂash ROM is loaded and executed starting at physical address zero. Figure 4–4 shows the header content.

Figure 4–4 Special Header Content

31 0

Validation Pattern 5A5AC3C3 Inverse Validation Pattern A5A53C3C Header Size (Bytes) Image Checksum Image Size (Memory Footprint) Decompression Flag Destination Address Lower Longword Destination Address Upper Longword Reserved<31:16> Flash ROM Image Size Optional Firmware ID<31:0> Optional Firmware ID<63:32> Header Checksum (excluding this field)

0x00 0x04 0x08 0x0C 0x10 0x14 0x18 0x1C

Header Rev<7:0>Firmware ID<15:8>

0x20 0x24 0x28 0x2C 0x30

4–8 Functional Description

MK−2306−19

Table 4–3 describes each entry in the special header.

Table 4–3 Special Header Entry Descriptions

Entry Description

4.5 Flash ROM

Validation and inverse validation pattern

Header size (bytes) This longword provides the size of the header block, which

Image checksum This longword is used to verify the integrity of the ROM. Image size The image size is used by the SROM code to determine how

Decompression ﬂag The decompression ﬂag informs the SROM code whether

Destination address This quadword contains the destination address for the

Firmware ID The ﬁrmware ID is a byte that speciﬁes the ﬁrmware type.

This quadword contains a special signature pattern used to validate that the special ROM header has been located. The pattern is 5A5AC3C3A5A53C3C.

varies among versions of the header speciﬁcation. When the header is located, SROM code determines where

the image begins based on the header size. Additional data added to the header is ignored by older SROM code.

A header size of 32 bytes implies version 0 of the header speciﬁcations.

much of the system ﬂash ROM should be loaded.

the MAKEROM tool was used to compress the ROM image with a repeating byte algorithm. The SROM code contains routines that execute the decompression algorithm. Other compression and decompression schemes, which work independently from this scheme, may be employed.

image. The SROM code loads the image at this address and begins execution.

This information facilitates image boot options necessary to boot different operating systems.

Firmware Name

Debug monitor 0 Alpha evaluation board

Windows NT 1 Windows NT ARC ﬁrmware Alpha SRM 2 Alpha System Reference

Firmware Type Firmware Description

debug monitor

Manual console

(continued on next page)

Functional Description 4–9

4.5 Flash ROM

Table 4–3 (Cont.) Special Header Entry Descriptions

Entry Description

Header revision The revision of the header speciﬁcation used in this header.

Flash ROM image size The ﬂash ROM image size reﬂects the size of the image as

Optional ﬁrmware ID This optional ﬁeld can be used to provide additional

Header checksum The checksum of the header. This is used to validate the

This is necessary to provide for changes to the header speciﬁcation. Version 0 headers are identiﬁed by the size of the header (32 bytes).

it is contained in the ﬂash ROM.

ﬁrmware information such as ﬁrmware revision or a character descriptive string of up to 8 characters.

presence of a header beyond the validation provided by the validation pattern.

4–10 Functional Description

4.5.2 Flash ROM Structure

During the power-up and initialization sequence, the EB164 always loads the ﬁrst image if BOOT_OPTION=1 (jumper J1—25/26 not installed). Then the ﬁrst image (the debug monitor) will be booted.

If jumper J1—25/26 (BOOT_OPTION) is installed (see Figure 2–2), the EB164 reads the value at location 0x3F of the TOY RAM. The EB164 uses the value found there to determine which image will be selected (see Table 4–4). The selected image is loaded and executed.

Table 4–4 Flash ROM Image Selection

TOY RAM

Value

0x00 0 Evaluation board debug monitor ﬁrmware 0x01 1 Windows NT ARC ﬁrmware 0x02 2 Alpha SRM ﬁrmware (OpenVMS) 0x03 2 Alpha SRM ﬁrmware (Digital UNIX) 0x8n NA

Firmware ID2Image Description

4.5 Flash ROM

SROM code loads the nth image from ﬂash ROM. If n=0, the SROM code loads the entire ﬂash ROM contents. If n=1, 2, . . . , the SROM code loads the ﬁrst image, second image, and so on.

Operating system type. Found at TOY RAM address 0x3F.

Found in image header.

Note: SRM ﬁrmware is not included in the EB164 kit.

The ﬂash ROM contains only one of these images.

Not applicable.

If an image is speciﬁed and is not found, the EB164 loads the ﬁrst image found in the ﬂash ROM with a valid header. If no valid header is found, the entire 1MB ﬂash image is loaded at address 0x00000000.

The following sequence of steps describes how to change the value stored in TOY RAM location 0x3F by using either the basic debug monitor commands or the debug monitor

bootopt

command.

Functional Description 4–11

4.5 Flash ROM

Changing TOY RAM Location 0x3F—Debug Monitor

Use the debug monitor In the example shown here, the

bootopt

command to change the value in location 3F.

bootopt

command is used to change the value

bootopt

in location 3F from 0 to 1:

EB164> bootopt

Predefined bootoptions are...

"0" "Alpha Evaluation Board Debug Monitor" "DBM" "1" "The Windows NT Operating System" "NT" "2" "OpenVMS" "VMS" "3" "Digital UNIX" "UNIX"

O/S type selected: "Alpha Evaluation Board Debug Monitor"

....Firmware type: "DBM Firmware"

EB164> bootopt nt

O/S type selected: "The Windows NT Operating System"

....Firmware type: "Windows NT Firmware"

EB164> bootopt

Predefined bootoptions are...

"0" "Alpha Evaluation Board Debug Monitor" "DBM" "1" "The Windows NT Operating System" "NT" "2" "OpenVMS" "VMS" "3" "Digital UNIX" "UNIX"

O/S type selected: "The Windows NT Operating System"

....Firmware type: "Windows NT Firmware"

EB164>

Command

Use the debug monitor

bootopt

which image is selected.

Use the debug monitor from 0 to 1.

Use the debug monitor has changed from 0 to 1.

4–12 Functional Description

command to see the image choices and note

bootopt nt

bootopt

command to verify that the selected image

command to change the selected image

4.5.3 Flash ROM Access

The ﬂash ROM can be viewed as two banks of 512KB each. At power-up the lower 512KB bank is accessed using the address range 86.FFF8.0000 to

86.FFFF.FFFF. Setting address bit 19 (ﬂash_adr19) allows you to access the higher 512KB

of ﬂash ROM. Write a 1 to the register at address 0x800 to set address bit 19. Manually deposit a 1 to address 0x800 or enter the following command from the debug monitor:

> wb 800 1

The address range for the higher bank is 86.FFF8.0000 to 86.FFFF.FFFF, the same as for the lower bank. Access is now to the higher bank and will continue until the EB164 is reset, ora0iswritten to the register at address 0x800.

The write-enable jumper must be installed at J14—2/3 (see Figure 2–1 and Figure 2–2). This enables writing to the ﬂash ROM.

4.5 Flash ROM

Note

Functional Description 4–13

EB164 Requirements, Power, and

This chapter describes the EB164 environmental requirements, power, and physical board parameters.

5.1 Power Requirements

The EB164 derives its main dc power from a user-supplied power supply. The board has a total power dissipation of 116 W, excluding any plug-in PCI and ISA devices. Table 5–1 lists the power requirement for each dc supply voltage.

The power supply must supply a dcok signal to the system reset logic.

Table 5–1 Power Supply dc Current Requirements

Voltage Current

+3.3 V dc 16.0 A +5 V dc 10.0 A –5 V dc 0 A +12 V dc 1.0 A –12 V dc 100.0 mA

Parameters

Values indicated are for a fully populated EB164 system module excluding plug-in PCI and ISA

devices, with a CPU clock speed of 266 MHz.

The 21164 cooling fan must have a built-in sensor that will drive a signal if the airﬂow stops. The sensor is connected to EB164 board connector J30. When the signal is generated, it resets the system.

Caution: Fan Sensor Required

EB164 Requirements, Power, and Parameters 5–1

5.2 Environmental Requirements

The 21164 microprocessor is cooled by a small fan blowing directly into the chip’s heat sink. The EB164 motherboard is designed to run efﬁciently using only this fan. Additional fans may be necessary depending upon cabinetry and I/O board requirements.

The EB164 is speciﬁed to run within the following environment:

Parameter Speciﬁcation

Operating temperature 10°C to 40°C (50°F to 104°F) Storage temperature –55°C to 125°C (–67°F to 257°F) Relative humidity 10% to 90% with maximum wet bulb temperature 28°C

Rate of (dry bulb) temperature change

(82°F) and minimum dew point 2°C (36°F)

11°C/hour

2°C/hour (20°F/hour64°F/hour)

5.3 Physical Board Parameters

The EB164 board consists of a 6-layer printed-wiring board (PWB) with components mounted to side 1 only. The board is populated with integrated circuit packages together with supporting active and passive components. The EB164 is a standard, full-size PC AT board with the following dimensions:

• Width: 30.73 cm (12.10 in ±0.0005 in)

• Length: 33.15 cm (13.05 in ±0.0005 in)

• Height: 6.0 cm (2.375 in) The board can be used in certain desktop and deskside systems that have

adequate clearance for the 21164 heat sink and fan. All ISA and PCI expansion slots are usable in standard desktop or deskside enclosures.

Figure 5–1 shows the board and component outlines, and identiﬁes the major components. Table 5–2 lists the components. Refer to Chapter 2 for jumper and connector functions and locations.

5–2 EB164 Requirements, Power, and Parameters

Figure 5–1 Board Component Layout

33.15 cm (13.05 in)

5.3 Physical Board Parameters

30.73 cm (12.10 in)

MK−2306−32

EB164 Requirements, Power, and Parameters 5–3

5.3 Physical Board Parameters

Table 5–2 Board Component List

Locator Number

1 U42 Digital Semiconductor 21164 Alpha microprocessor 2 U41 21171-CA control, I/O interface, and address (CIA) chip 3 U32 21171-BA data switch (DSW0) chip 4 U15 21171-BA data switch (DSW2) chip 5 U10 21171-BA data switch (DSW1) chip 6 U2 21171-BA data switch (DSW3) chip 7 U50 TriQuint TQ2061 phase-locked loop (PLL) clock chip 8 U49 26.66-MHz clock oscillator 9 U31 Main memory row address strobe (RAS) PAL 10 U30 Main memory row address strobe (RAS) PAL 11 U58 National 87312 combination chip 12 U57 ISA clock frequency generator chip 13 X2 14.318-MHz clock oscillator 14 U33 Motorola 88PL117 phase-locked loop (PLL) system clock chip 15 U17 Intel 82378ZB PCI-to-ISA SIO bridge chip 16 U12 Xilinx serial ROM (initialization code) chip 17 U11 MACH210A interrupt request and PCI arbiter PAL 18 U13 Ubus decoder PAL 19 U14 Flash ROM chip 20 U7 Intel 8242 mouse and keyboard controller chip 21 U6 Dallas Semiconductor DS1287 time-of-year (TOY) clock chip

Component Number Component Description

5–4 EB164 Requirements, Power, and Parameters

Supporting Vendor Products

To obtain components and accessories that are not included with your EB164 motherboard, Digital Equipment Corporation suggests the following vendors. In doing so, Digital does not warrant these components or guarantee that they will function in all conﬁgurations.

A.1 Products Included

The following products are included in the EB164 motherboard kit.

• Alpha microprocessor clock solution. Components available from: TriQuint Semiconductor

2300 Owen Street Santa Clara CA 95054 Phone: 408–982–0900 ext 142 FAX: 408–982–0222

NEL Frequency (crystal oscillator source)

CPU Frequency Oscillator Frequency

21164-266 26.66 MHz (included) TQ2061 (included) 21164-300 30.0 MHz (not supplied) TQ2061 (included) 21164-333 33.33 MHz (not supplied) TQ2061 (included)

• Heat sink and fan solution. Components included: heat sink, GRAFOIL pad, 2 hex nuts, heat sink clips, 60-mm fan, fan guard, and 4 screws. Components available from:

United Machine and Tool Design River Road Fremont NH 03044 Phone 603–642–5040 FAX 603–642–5819

TriQuint PLL Part Number

Supporting Vendor Products A–1

A.1 Products Included

• Bcache (Level 3) cache SIMMs

Cache Size

2MB @10 ns 128K280 2 Digital PN, 21A04-M1

SIMM Conﬁguration Qty Vendor/Part Number

A.2 Products Not Included

The following products are not included in the EB164 motherboard kit.

• DRAM system memory—70 ns DRAM SIMMs (5 V, 72 pin) 1M236, 2M236, 4M236, 8M236, 16M236.

The DRAM SIMMs must be n236 SIMMs.

• Power supply—+3.3 V, +5 V, –5 V, +12 V, –12 V, available from: Emacs Electronics USA, Inc.

1410 Gail Borden Place C-4 El Paso TX 79935 Phone: 915–599–2688 Part number: AP2-5300F (300 W)

Autec Power Systems 69 Moreland Rd Simi Valley, CA 93065 Phone: 805–522–0888 Part number: PCB-3330-1010-D (339 W)

Note

• Enclosure Axxion part number TL17 (modiﬁed for Digital applications).

A–2 Supporting Vendor Products

Technical Support and Ordering

B.1 Obtaining Technical Support

If you need technical support or help deciding which literature best meets your needs, call the Digital Semiconductor Information Line:

Information

United States and Canada Outside North America

1–800–332–2717 +1–508–628–4760

B.2 Ordering Digital Semiconductor Products

To order the EB164, contact your local distributor. The following table lists some of the semiconductor products available from

Digital. To obtain a Digital Semiconductor Product Catalog, contact the Digital Semiconductor Information Line.

Product Order Number

Digital Semiconductor 21164 Alpha Microprocessor Motherboard (EB164) 266-MHz Kit (Supports the Windows NT operating system.)

Digital Semiconductor 21164 333-MHz Alpha Microprocessor 21164–333 Digital Semiconductor 21164 300-MHz Alpha Microprocessor 21164–300 Digital Semiconductor 21164 266-MHz Alpha Microprocessor 21164–266 Digital Semiconductor 21164 266-MHz Alpha Microprocessor for

Windows NT

21A04-A0

21164–P1

Technical Support and Ordering Information B–1

B.3 Ordering Digital Semiconductor Literature

The following table lists some of the available Digital Semiconductor literature. For a complete list, contact the Digital Semiconductor Information Line.

Title Order Number

Alpha AXP Architecture Reference Manual Alpha AXP Architecture Handbook EC–QD2KA–TE Alpha 21164 Microprocessor Data Sheet EC–QAEPC–TE Alpha 21164 Microprocessor Hardware Reference Manual EC–QAEQC–TE Alpha 21164 Microprocessor Product Brief EC–QAENB–TE Alpha 21164 Microprocessor Evaluation Board Read Me

First Alpha 21164 Microprocessor Evaluation Board Product

Brief Digital Semiconductor 21164 Alpha Microprocessor

Evaluation Board User’s Guide DECchip 21171 Core Logic Chipset Product Brief EC–QC3EB–TE DECchip 21171 Core Logic Chipset Technical Reference

Manual Answers to Common Questions about PALcode for Alpha

AXP Systems PALcode for Alpha Microprocessors System Design Guide EC–QFGLB–TE Alpha Microprocessors Evaluation Board Windows NT

3.51 Installation Guide

SPICE Models for Alpha Microprocessors and Peripheral Chips: An Application Note

Alpha Microprocessors SROM Mini-Debugger User’s Guide

Alpha Microprocessors Evaluation Board Debug Monitor User’s Guide

Alpha Microprocessors Evaluation Board Software Design Tools User’s Guide

EY–T132E–DP

EC–QD2VB–TE

EC–QCZZD–TE

EC–QD2UD–TE

EC–QE18B–TE

EC–N0647–72

EC–QLUAD–TE

EC–QA4XC–TE

EC–QHUXA–TE

EC–QHUVC–TE

EC–QHUWA–TE

To purchase the Alpha AXP Architecture Reference Manual, call 1–800–DIGITAL from the U.S. or

Canada, contact your local Digital ofﬁce, or call Digital Press at 1–800–366–2665.

B–2 Technical Support and Ordering Information

B.4 Ordering Third-Party Literature

You can order the following third-party literature directly from the vendor:

Title Vendor

B.4 Ordering Third-Party Literature

PCI System Design Guide PCI Special Interest Group

PCI Local Bus Speciﬁcation, Rev 2.1 PCI Special Interest Group

82420/82430 PCIset ISA and EISA Bridges (includes 82378IB/ZB SIO) PN 290483

UPI-41AH/42AH Universal Peripheral Interface 8-Bit Slave Microcontroller PN 210393

Flash Memory PN 210830

PC87311/PC87312 (SuperI/O II/III) Floppy Disk Controller with Dual UARTs, Parallel Port, and IDE Interface PN 11362

Hardware Compatability List Contact Microsoft’s Customer Service

1–800–433–5177 (U.S.) 1–503–797–4207 (International) 1–503–234–6762 (FAX)

(See previous entry.) Intel Corporation

Literature Sales P.O. Box 7641 Mt. Prospect, IL 60056 USA 1–800–628–8686 FaxBACK® Service 1–800–628–2283 BBS 1–916–356–3600

Intel Corporation (See previous entry.)

National Semiconductor Corporation 2900 Semiconductor Drive P.O. Box 58090 Santa Clara, CA 95052 USA 1–800–272–9959

representatives at 1–800–426–9400, or access CompuServe Information Systems in Library 1 of the WINNT forum (GO WINNT) or Library 17 of the MSWIN32 forum (GO MSWIN32).

Technical Support and Ordering Information B–3

Index

Airﬂow requirements, 5–2 Alpha

documentation, B–2 Arbitration scheme, 4–5 Associated literature, B–2

Backup cache

See Bcache Bcache

Digital part number, A–2

index jumpers, 2–5

SIMM connectors, 2–10

size jumpers, 2–4

speed jumpers, 2–5

subsystem, 1–3 BC_RD_FAST jumper, 2–7 Block diagram, 1–1

interrupt logic, 4–1

power distribution, 4–5 Board

conﬁguration, 2–1

connectors, 2–8

jumpers, 2–1 Boot option jumper, 2–6

Bridge

See SIO chip

Cache

See Bcache 21171 chipset, 1–1 Chipset support, 1–1 Clock divisor jumper, 2–4 COM1 connector, 2–11 COM2 connector, 2–11

Components

See System components Conﬁguration, 2–1 to 2–14

hardware, 3–2

software, 3–8 Conﬁguration jumpers, 2–1 Connectors, 2–8

Bcache SIMM, 2–10

CPU fan power, 2–14

CPU fan sensor, 2–14

debug monitor interface, 2–11

diskette, 2–11

DRAM SIMM, 2–10

IDE drive, 2–11

ISA bus, 2–10

keyboard, 2–10

Mini-Debugger, 2–11

mouse, 2–11

parallel port, 2–11

PCI bus, 2–10

power, 2–13, 2–14

serial interface ports, 2–11

speaker, 2–12

SROM port, 2–11

system enclosure fan power, 2–11

Index–1

Conventions, viii Cooling fan, CPU

power connectors, 2–14 sensor connector, 2–14

Current

dc ampere requirements, 5–1

dc power distribution, 4–5

See also Power requirements dc power requirements, 5–1 Debug and monitor ROM

system support, 1–5 Debug monitor, 3–8

interface connector, 2–11 Digital Semiconductor 21171 chipset, 1–1 Diskette drive, 1–8

connector, 2–11

controller, 1–4

hardware requirement, 3–2

installation, 3–6 Documentation, B–2 DRAM

SIMM connectors, 2–10 Dynamic RAM

See DRAM

Flash ROM, 1–5

developing code, 1–4 loading code, 1–4 write-enable jumper, 2–7 write-protect jumper, 2–7

Floppy drive

See Diskette drive

Functional description, 4–1 to 4–13

dc power distribution, 4–5 to 4–7 interrupts, 4–1 to 4–4 ISA bus devices, 4–5 PCI devices, 4–7

GRAFOIL pad, 3–4

Halt button, 2–12 Hard drive connector, 2–11 Hardware requirements, 3–1 to 3–2 Heat sink, 3–3, 3–4, 3–5 Heat sink fan, 3–3, 3–4, 3–5

CPU environment, 5–2 power connectors, 2–14 sensor, 5–1 sensor connector, 2–14

Environmental requirements, 5–2

Fan, CPU

See Heat sink fan Fan, heat sink

See Heat sink fan Fan, system enclosure

See System enclosure fan Features

See System features

Index–2

IDE, 4–5

drive active pins, 2–11 drive cable, 3–8 drive connector, 2–11 interface, 1–4, 1–8

Industry Standard Architecture

See ISA

Integrated device electronics

See IDE Interrupt mask registers, 4–4 Interrupts, 4–1 ISA

arbitration, 4–5

bus connectors, 2–10

ISA (cont’d)

devices, 4–5 interface overview, 1–4

Jumpers, 2–1

Bcache index, 2–5 Bcache size, 2–4 Bcache speed, 2–5 BC_RD_FAST, 2–7 boot option, 2–6 Flash ROM write-protect/write-enable,

2–7 Mini-Debugger, 2–6 system clock divisor, 2–4 system conﬁguration, 2–1

Keyboard

connector, 2–10 lock switch, 2–12

L3 cache

See Bcache

Level 3 cache

See Bcache

Literature, B–2, B–3

Memory

SIMM connectors, 2–10

Memory subsystem, 1–3

Digital Equipment Digital Semiconductor 21164 Alpha Microprocessor User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual