Digital Equipment Corporation
Maynard, Massachusetts
March 1996
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This document was prepared using VAX DOCUMENT Version 2.1.
Contents
About This Manual...........................................vii
1 Introduction to the EB164
1.1System Components and Features........................1–1
4–4Flash ROM Image Selection ..........................4–11
5–1Power Supply dc Current Requirements ................5–1
5–2Board Component List . . . ...........................5–4
v
This manual describes Digital Semiconductor’s 21164 Alpha microprocessor
motherboard (EB164), a module for computing systems based on the 21164
Alpha microprocessor and the Digital Semiconductor 21171 chipset.
Audience
This manual is intended for users of the EB164 to assist them in installing the
EB164 and populating it with memory modules and peripheral cards.
Scope
This manual describes the features, configuration, and installation of the
EB164. This manual does not include specific bus specifications (for example,
PCI or ISA buses). Additional information is available in the appropriate
vendor and IEEE specifications. See Appendix B for information about how to
obtain additional technical support and how to order additional documentation.
Content
This manual contains the following chapters and appendixes:
•Chapter 1, Introduction to the EB164, is an overview of the EB164,
About This Manual
including its components, uses, and features.
•Chapter 2, System Configuration and Connectors, describes the user
environment configuration; board connectors and functions; jumper
functions; and identifies jumper and connector locations.
•Chapter 3, Starting and Using the EB164, lists additional hardware and
software requirements, provides information on how to configure the
hardware and software, and describes the motherboard startup procedures.
•Chapter 4, Functional Description, describes some of the functional
elements of the EB164, such as flash ROM contents, interrupt assignments,
and power distribution.
vii
•Chapter 5, EB164 Requirements, Power, and Parameters, describes the
EB164 power and environmental requirements, and identifies major board
components.
•Appendix A, Supporting Vendor Products, lists suggested vendor sources
for supporting components, such as, power supply, SIMMs, enclosure, and
so forth.
•Appendix B, Technical Support and Ordering Information, describes how to
obtain Digital Semiconductor information and technical support, and how
to order Digital Semiconductor products and associated literature.
Document Conventions
This section provides the conventions used in this document.
Caution: Cautions indicate potential damage to equipment or data.
Note: Notes provide additional information.
Numbering: All numbers are decimal or hexadecimal unless otherwise
indicated. In case of ambiguity, a subscript indicates the radix of nondecimal
numbers. For example, 19 is a decimal number, but 1916and 19A are
hexadecimal numbers.
Extents: Extents are specified by a single number, or a pair of numbers in
angle brackets (< > ) separated by a colon ( :) and are inclusive. For example,
bits <7:3> specify an extent including bits 7, 6, 5, 4, and 3. Multiple bit fields
are shown as extents.
Register Figures: Register figures have bit and field position numbering
starting at the right (low-order) and increasing to the left (high-order).
Signal Names: Signal names in text are printed in boldface lowercase type.
For example, ‘‘ . . . bits data<127:0> are delivered to the Bcache SIMM
connectors . . . ’’
viii
Introduction to the EB164
This chapter provides an overview of the EB164 motherboard and describes
the EB164, its components, features, and uses.
1.1 System Components and Features
The EB164 is implemented in industry-standard parts and uses a Digital
Semiconductor 21164 Alpha microprocessor (21164) running at 266, 300, or 333
MHz. The functional components are shown in Figure 1–1 and are introduced
in the following subsections.
1.1.1 Digital Semiconductor 21171 Core Logic Chipset
The 21164 is supported by the Digital Semiconductor 21171 (21171) chipset.
The 21171 consists of the following two application-specific integrated circuit
(ASIC) types:
•One copy of the 21171-CA control, I/O interface, and address chip (CIA)
provides the interface between the 21164, main memory (addressing and
control), and the peripheral component interconnect (PCI) bus. It also
provides the data switch companion chips with control information to direct
the data flow.
1
•Four copies of the 21171-BA data switch chip (DSW) provide the memory
interface data path and route PCI data through the CIA chip.
The chipset includes the majority of functions required to develop a highperformance PC or workstation, requiring minimum discrete logic on the
module. It provides flexible and generic functions to allow its use in a wide
range of systems.
2 IDE Devices
Diskette
Parallel Port
2 Serial Ports
MK−2306−01A
1.1.2 Memory Subsystem
The dynamic random-access memory (DRAM) provides 32MB to 512MB with
a 256-bit data bus. The memory is contained in one bank of eight commodity
single inline memory modules (SIMMs). Single- or double-sided SIMMs may
be used. Each SIMM is 36 bits wide, with 32 data bits and 4 check bits,
with 70 ns or less access. Table 1–1 lists the SIMM sizes supported and the
corresponding main memory size for 256-bit arrays.
Table 1–1 Main Memory Sizes
SIMM SizeEight SIMMs (256-Bit Array)
1M23632MB
2M23664MB
4M236128MB
8M
2
36256MB
16M236512MB
All eight SIMM connectors (J3 through J10) must be populated. See Figure 2–3
and Table 2–2.
1.1 System Components and Features
1.1.3 L3 Bcache Subsystem Overview
The board-level external L3 backup cache (Bcache) subsystem supports
multiple cache sizes and access times. Cache sizes supported are 2MB with
Alpha cache SIMMs populated with 128K28 SRAMs, and 4MB and 8MB with
SIMMs populated with 512K28 SRAMs. Speeds of 6 ns to 15 ns can be used.
The EB164 has a 2MB 10-ns Bcache SIMM. See Appendix A for order
information.
1.1.4 PCI Interface Overview
The EB164 PCI interface is the main I/O bus for the majority of functions
(SCSI interface, graphics accelerator, and so on). The PCI interface provides a
selectable PCI speed between 25 MHz and 33 MHz (based on the 21164 clock
divisor). An onboard PCI-to-ISA bridge is provided through an Intel 82378ZB
Saturn I/O (SIO) chip.
The PCI bus has three dedicated PCI expansion slots (one 64-bit and two
32-bit) and one shared 64-bit PCI/ISA slot.
Introduction to the EB164 1–3
1.1 System Components and Features
1.1.5 ISA Interface Overview
The ISA bus has two dedicated slots and a third shared ISA/PCI slot. It
provides the following system support functions:
•Mouse and keyboard controller functions—provided by an Intel 8242 chip.
•An IDE interface, a diskette controller, two universal asynchronous
receiver–transmitters (UARTs) with full modem control, and a bidirectional
parallel port—provided by a National 87312 combination chip.
•A time-of-year (TOY) function—provided by a Dallas Semiconductor
DS1287 chip.
•Operating system support—provided by a 1MB flash ROM that contains
firmware and debug monitor code.
Users can develop code on a host system, and load software into the EB164
through a serial line, diskette, or Ethernet board. In addition, sectors of
the flash ROM can be programmed for application-specific purposes.
1.1.6 Miscellaneous Logic
The EB164 contains the following miscellaneous components:
•Clocks
A 26.66-MHz oscillator and phase-locked loop (PLL) clock generator provide
a clock source to the 21164 microprocessor and system.
A 14.3-MHz crystal and frequency generator provide a clock source for ISA
devices.
•Serial ROM
A Xilinx XC17128 serial ROM (SROM) contains initial code that is loaded
into the 21164 instruction cache (Icache) on power-up. A serial line
interface is also provided to allow direct connection to a terminal line for
debugging purposes.
•Programmable array logic (PAL) devices for the following functions:
One PAL for utility bus (Ubus) decoding
One PAL for interrupts
Two PAL devices for memory row address strobe (RAS) bank generation
and buffering
1–4 Introduction to the EB164
1.1.7 Software Support
Software support code, consisting of a debug monitor and Windows NT ARC
firmware is contained in a 1MB flash ROM. The monitor provides functions
that allow you to:
•Download files through serial and Ethernet ports and diskette.
•Load data from a ROM through the debug monitor.
•Examine and deposit the EB164 system registers, a few 21164 internal
processor registers (IPRs), and I/O mapped registers.
•Examine and modify DRAM and I/O mapped memory.
•Disassemble CPU instructions in memory.
•Transfer control to programs in memory.
•Perform native debugging operations, including breakpoints and single
stepping.
•Perform full source-level debugging operations by using DECladebug
software running on a host communicating through an Ethernet
connection.
1.1 System Components and Features
•Perform a memory image dump.
1.1.8 Component Layout
Figure 1–2 shows the EB164 board component layout and dimensions.
Introduction to the EB164 1–5
1.1 System Components and Features
Figure 1–2 Board Component Layout
1
33.15 cm
(13.05 in)
1
30.73 cm
(12.10 in)
11
13
12
7
8
1
34
5
6
9
2
10
14
1
16
19
18
17
20
21
1
15
1.2 EB164 Summary
The features of the EB164 are listed and described in Table 1–2.
1–6 Introduction to the EB164
MK−2306−32
Table 1–2 EB164 Features Summary
CharacteristicDescription
Operating Systems
1.2 EB164 Summary
Supported operating
systems
Microsoft Windows NT. For information on Digital UNIX
operating system support, see your local distributor or your
Digital sales representative.
System Characteristics
CPU and clock speedDigital Semiconductor 21164 Alpha microprocessor at 266,
300, or 333 MHz
CPU upgradableZIF socket for 21164 upgrade
Instruction issueUp to 4 instructions issued per clock cycle
Word size64 bits
Address size40-bit physical address, 43-bit virtual address
Floating-point formatVAX (F and G) and IEEE (S and T) data types
Memory (DRAM)
1
Minimum DRAM 32MB plus ECC
Maximum DRAM 512MB plus ECC
Memory (ROM)1MB flash ROM
External L2 cacheConfigurable for 2MB, 4MB, 8MB (128-bit data)
Memory bus width256 bits plus ECC
Performance metricsThe EB164 performance is listed here:
21164BcacheSPECint92SPECfp92
266 MHZ2MB, 10ns300.6417.4
300 MHZ2MB, 10ns335
(estimated)
460
(estimated)
333 MHZ2MB, 10ns365.2518
Graphics
Graphics optionsRefer to the Microsoft Hardware Compatibility List for
1
Minimum DRAM recommended: 32MB for Windows NT and Digital UNIX.
Windows NT to determine which graphics cards are
supported. See Section B.4 for information on how to obtain
the listing.
(continued on next page)
Introduction to the EB164 1–7
1.2 EB164 Summary
Table 1–2 (Cont.) EB164 Features Summary
CharacteristicDescription
Input/Output
Input device interfacesPS/2 style keyboard and mouse
SerialTwo RS423-compatible (9-position) serial communications
ParallelOne parallel (Centronics compatible) communications port
Bus optionsTotal of 6 option slots
PCI busSupports two 64-bit PCI options slots at 5V and two 32-bit
ISA busSupports three 16-bit ISA option slots
IDEOne IDE interface supporting up to 2 drives
DisketteOne 82077-compatible diskette controller supporting up to 2
Environmental Characteristics (Operating)
Operating temperature10°C to 40°C (50°F to 104°F)
Maximum rate of (dry
bulb) temperature
change
Relative humidity
Maximum wet bulb
Minimum dew point
EMC complianceCompliance certification is the responsibility of the system
Shock and vibrationPassing of shock and vibration tests is dependent on the
ports
PCI option slots at 5V
drives with 1.44MB and 2.88MB formats
6
11°C/hour
10%–90% noncondensing
32°C (90°F)
2°C (36°F)
integrator. The EB164 was tested in industry-representative
enclosures to prove feasibility of emissions compliance.
method used to mount the system board, the design of the
enclosure, and how the enclosure is supported. Testing is
the responsibility of the system integrator.
2°C/hour (20°F/hour64°F/hour)
Physical Characteristics
Form factorStandard, full-size PC AT board
Width/depth30.73 cm (12.10 in)233.15 cm (13.05 in)
1–8 Introduction to the EB164
System Configuration and Connectors
The EB164 uses jumpers to implement configuration parameters such
as variations in backup cache (Bcache) size, access timing, and speed, as
well as boot parameters. These jumpers must be configured for the user’s
environment. Onboard connectors are provided for the I/O interfaces, single
inline memory modules (SIMMs), and serial and parallel peripheral ports.
After the module is configured, power can be applied, and the debug monitor
can be run. The debug monitor and its commands are described in the AlphaMicroprocessors Evaluation Board Debug Monitor User’s Guide. Appendix B
provides information about other software design tools.
2.1 Configuration Jumpers
Figure 2–1 identifies the location of the software and hardware configuration
jumpers, and Table 2–1 provides descriptions. Figure 2–2 provides a detailed
view of the configuration jumpers and their function.
These jumpers allow the Bcache to emulate the sizes specified
in the following table. These jumpers are changed in conjunction
with the appropriate index jumpers J17, J16, and J15.