The Digilent FX12 board (the FX12) is an
integrated circuit development platform for
Xilinx’s Virtex-4 FX12 FPGA. The FX12 is
based on Xilinx’s newest programmable
architecture and contains a PowerPC core,
dual Ethernet MACs, 32 XtremeDSP slices,
80Kbytes of block RAM, advanced clock
management, and flexible I/O’s. The FX12
also features external memories, a flexible
time base, power supplies, an Ethernet PHY,
ports, and other I/O devices.
The FX12 provides an ideal platform for
investigating a new generation of highly
integrated designs made possible by Xilinx’s
Virtex-4 family.
Features include:
• a Virtex-4 FX12 FPGA
• JTAG programming port that can
accommodate all Digilent and Xilinx
programming cables
• XCF08S Xilinx Platform Flash ROM to
store FPGA configurations
• Marvell 88E1111 “Alaska” Gigabit PHY
• 24-bit Analog Devices high-speed Video
DAC
• 64 Mbytes of ISSI DDR SDRAM
• 16 Mbytes of Micron Flash ROM
• high-current Linear Technology
switching power supplies
• Linear Technology FastDAACS
connector for driving high-speed analog
peripherals
• user-settable Integrated Circuit System
frequency synthesizer (up to 350MHz)
• on board serial port, LCD display,
buttons, switches, and LEDs
• high-speed-capable expansion
connector
Doc: 502-108 page 1 of 18
Copyright Digilent, Inc. All rights reserved. Other product and company names mentioned may be trademarks of their respective owners.
FX12 Block Diagram
®
FX12 Reference Manual
Digilent
www.digilentinc.com
Functional Description
The FX12 showcases the many advanced features of Xilinx’s Virtex-4 FPGA, especially its ability to
serve as the single device at the core of an embedded system. The FX12 includes a host of advanced
features, including an embedded PowerPC core, a hard-IP MAC, XtremeDSP slices that include fast
hardware multipliers, advanced clock management, Smart RAM, and other features, bringing new
capabilities to highly-integrated embedded platforms. The FX12 board enhances the abilities of the
FPGA by adding peripheral devices such as 64Mbytes of DDR memory, 16Mbytes of Flash ROM, and
an Ethernet port, making it well suited to support a variety of embedded system designs.
The FX12 is supported by world-class design tools, including ISE, Chipscope-Pro, Embedded
developers Kit (EDK), and System Generator.
JTAG Ports and Device Configuration
The FX12 can be programmed from a PC or directly from an on-board Flash ROM at power-on. PC
programming requires a programming cable such as Digilent’s JTAG3 or JTAG-USB cable, or Xilinx’s
PC4 or Platform USB cable. Programming files for the Virtex-4 and XCF08 Platform Flash ROM can
be created using Xilinx’s ISE or EDK software, or a variety of other third-party tools. Please refer to
the appropriate CAD tool reference materials for information on creating programming files.
Mode select
JTAG3
header
PC4
header
XCF08
Platform
Flash
jumper
JTAG
Virtex-4
FPGA
Slave
Serial
Bypass
buffer
Hirose FX2 connector
PROG
DONE
LD14
Vdd
PROG (reset)
pushbutton
Mode Select
Jumpers
JTAG3
Connector
PC4
Connector
A .bit file may be programmed into the FPGA from a PC by
setting the mode jumpers to “JTAG” mode, attaching a
programming cable to the PC and to one of the two
programming headers (JTAG3 or PC4), and running Digilent’s
Adept software or Xilinx’s iMPACT programming tool (Adept is a
free download from the Digilent website and iMPACT is a free
download from the Xilinx website). The configuration software
will automatically identify all devices in the scan chain, and allow
Mode Select Jumper Settings
the FPGA and ROM to either be bypassed individually, or
programmed individually with any available .bit or .mcs file. Note that both the FPGA and Platform
Flash ROM will always appear in the scan chain. If a JTAG-aware peripheral board is attached to the
Hirose FX2 expansion connector, it will appear in the scan chain between the FPGA and Platform
Flash.
Copyright Digilent, Inc. Page 2/18 Doc: 502-046
FX12 Reference Manual
Digilent
www.digilentinc.com
After the Platform Flash ROM has been loaded with a configuration file, the FPGA can load that file at
power-on if the mode select jumpers are set in the Platform Flash position.
An FPGA system-reset button labeled PROG has been provided to allow a user-initiated FPGA reset.
Pressing the PROG button will clear all configuration memory and cause the FPGA to await the next
programming cycle. An LED on the DONE signal will illuminate at the end of a successful
configuration.
Power Supplies
Power is delivered to the FX12 board via a 2.1mm,
center-positive power connector that can be driven
from any suitable 4VDC-5.5VDC source (like a
2.1mm centerpositive power jack
3.3V switching supply
for FPGA I/O and
peripherals (LTC3416)
2.5V switching supply
for DDR (LTC3416)
wall-plug supply). Power is routed from the
connector to four switching regulators and single
LDO that produce all required supply voltages.
Input power is also routed directly to the character
LCD and high-speed expansion connector (pins
A49 and A50) for use by peripheral circuits.
Current Consumption
Total board current is dependant on FPGA
configuration, synthesizer clock frequency, and
external connections. In test configurations using
the PPC core to run DDR and Flash memory tests,
with roughly 10% of the FPGA routed and a
100MHz input clock, approximately 650mA of
supply current is drawn from the main power
supply. Required current will increase if larger
circuits are configured in the FPGA, if clock
frequency is increased, and if peripheral boards are
attached.
1.8V LDO for
Platform Flash
ROM (LTC1844)
FX12 Power Supplies
1.25V switching supply for
DDR termination (LTC3413)
1.2V switching supply for
FPGA core (LTC3418)
Power Distribution
The FX12 uses an eight-layer PCB, with the stack-up shown in the
table. The Vdd planes are split into several localized islands to
accommodate the various component’s supply voltage requirements.
Bulk ceramic bypass capacitors are placed strategically around the
board, and every component Vdd pin has one, two, or three local
bypass caps in the .001 to .047uF range. The power supply routing
and bypass capacitors result in a very clean low-noise power supply.
FX12 Stack-Up
Layer Usage Copper
1 Signal 1 oz.
2 GND .5 oz.
3 Signal .5 oz.
4 Vdd .5 oz.
5 Vdd .5 oz.
6 Signal .5 oz.
7 GND .5 oz.
8 Signal 1 oz.
Supply Details
Copyright Digilent, Inc. Page 3/18 Doc: 502-046
FX12 Reference Manual
Regulator
Part
Number
Supply
Max
Current
• Hirose expansion connector
• Xilinx FPGA I/O banks 2, 4, 6, 7,
and 8
3.3V 4A LTC3416
• Micron Flash memory
• RS-232 level shifter
• Analog Devices Video DAC
• ICS frequency synthesizer
• Xilinx Platform Flash
• Xilinx FPGA I/O banks 1, 3, 5, 7,
2.5V 4A LTC3416
and 8
• ISSI DDR DRAM’s
• Marvell 88E1111 Ethernet PHY
1.8V 150mA LTC1844
1.25V 2A LTC3413
1.2V 8A LTC3418
• Xilinx Platform Flash
• DDR termination networks
• Xilinx FPGA core
• Marvell PHY core
Oscillator
The FX12 includes a 350MHz, crystal-toLVCMOS frequency synthesizer from
Integrated Circuit Systems Inc (PN
ICS8402). The synthesizer gets its primary
frequency input from a 25MHz crystal, and
then multiplies that input up to the desired
output frequency. The output frequency is
selected by the DIP switches at SW1,
according to the table in Appendix A. The
clock output from the synthesizer is
delivered to the FPGA on the GCLK0 input
at pin Y5.
A secondary input is also available to drive
a different base frequency into the
synthesizer. The socket labeled “test_clk”
can accommodate any 12-40MHz LVCMOS
oscillator in a half-DIP package. This
secondary source will drive the synthesizer
if the XTAL_SEL signal is driven high from
the FPGA. The oscillator circuit is shown in
the accompanying figure. Please see the
ICS8402 data sheet for further information.
Digilent
www.digilentinc.com
Devices Powered Notes
Uses oversized 3.3uH
inductor for stability at
low current.
Uses oversized 3.3uH
inductor for stability at
low current.
Uses oversized 1.5uH
inductor for stability at
low current.
SMA Clock
Inputs to FPGA
Frequency Select
Switches
SMA Clock
Output
Secondary
Clock Input
Frequency
Synthesizer
Clock Source
Select Jumper
Primary Crystal
(25MHz)
FX12 Oscillator Circuit
Copyright Digilent, Inc. Page 4/18 Doc: 502-046
FX12 Reference Manual
Digilent
www.digilentinc.com
Frequency
Select
Switches
M0
M1
IC15
XTAL_SEL
Q1
M2
M3
M4
N0
ICS8402
Frequency
Synthesizer
N1
VCO_SEL
Q0
OE1
OE2
M5
TEST_CLK
M6
M7
M8
NP_LOAD
XTAL1
XTAL2
MR
FX12 Frequency Synthesizer Diagram
R18 (GCLK0)
R18
Virtex-4
FPGA
SMA
Connector
Test
Clock
Socket
25MHz
Crystal
DDR
The 64Mbyte DDR memory array consists of two 32Mbyte (16M x 16) ISSI IS43R16160A-6T devices
connected as a 16M x 32 array. Individual byte selects for both memories are brought to the FPGA so
byte, word, and long-word read/writes are possible. A differential clock is routed from the FPGA to the
memories, and a length-matched clock return is routed back to the FPGA to allow for timing
optimization. All data signals are delay and impedance matched (with 48-ohm trace impedance), and
all DDR signals are actively terminated through 47-ohm resistors to a 1.25V supply for optimal bus
performance.
UCF File
Signals routed to the DDR SDRAM should use the SSTL2_I standard as shown in the example .ucf
file entry below. All VREF pins on Bank 5 (used by the DDR signal connections) should have “prohibit”
constraints in the .ucf file to prohibit software from assigning these pins to other functions.
NET “DDR_D0” LOC = “P20” | IOSTANDARD = SSTL2_I ;
CONFIGPROHIBIT = C17;