Xilinx University Program
Virtex-II Pro Development
System
Hardware Reference Manual
UG069 (v1.0) March 8, 2005
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XUP Virtex-II Pro Development System
UG069 (v1.0) March 8, 2005
The following table shows the revision history for this document.
VersionRevision
03/08/051.0Initial Xilinx release. (DRAFT)
XUP Virtex-II Pro Development Systemwww.xilinx.comUG069 (v1.0) March 8, 2005
UG069 (v1.0) March 8, 2005www.xilinx.comXUP Virtex-II Pro Development System
Appendix A: Configuring the FPGA from the Embedded USB
Configuration Port
Appendix B: Programming the Platform FLASH PROM User Area
Appendix C: Restoring the Golden FPGA Configuration
Appendix D: Using the Golden FPGA Configuration for System Self-
Test
Appendix E: User Constraint Files (UCF)
Appendix F: Links to the Component Data Sheets
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Chapter 1
XUP Virtex-II Pro Development System
Features
•Virtex™-II Pro FPGA with PowerPC™ 405 cores
•Up to 2 GB of Double Data Rate (DDR) SDRAM
•System ACE™ controller and Type II CompactFlash™ connector for FPGA
configuration and data storage
•Embedded Platform Cable USB configuration port
•High-speed SelectMAP FPGA configuration from Platform Flash In-System
Programmable Configuration PROM
•Support for “Golden” and “User” FPGA configuration bitstreams
•On-board 10/100 Ethernet PHY device
•Silicon Serial Number for unique board identification
•RS-232 DB9 serial port
•Two PS-2 serial ports
•Four LEDs connected to Virtex-II Pro I/O pins
•Four switches connected to Virtex-II Pro I/O pins
•Five push buttons connected to Virtex-II Pro I/O pins
•Six expansion connectors joined to 80 Virtex-II Pro I/O pins with over-voltage
protection
•High-speed expansion connector joined to 40 Virtex-II Pro I/O pins that can be used
differentially or single ended
•AC-97 audio CODEC with audio amplifier and speaker/headphone output and line
level output
•Microphone and line level audio input
•On-board XSGA output, up to 1200 x 1600 at 70 Hz refresh
•Three Serial ATA ports, two Host ports and one Target port
•Off-board expansion MGT link, with user-supplied clock
•100 MHz system clock, 75 MHz SATA clock
•Provision for user-supplied clock
•On-board power supplies
•Power-on reset circuitry
•PowerPC 405 reset circuitry
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General Description
The XUP Virtex-II Pro Development System provides an advanced hardware platform that
consists of a high performance Virtex-II Pro Platform FPGA surrounded by a
comprehensive collection of peripheral components that can be used to create a complex
system and to demonstrate the capability of the Virtex-II Pro Platform FPGA.
Block Diagram
Figure 1-1 shows a block diagram of the XUP Virtex-II Pro Development System.
Chapter 1: XUP Virtex-II Pro Development System
External Power
Internal Power Supplies
4.5-5.5V
CPU Debug Port
100 MHz System Clock
75 MHz SATA Clock
User Clocks (2)
Platform Flash Configurations (2)
Compact Flash Configurations (8)
USB2 High Speed Configuration
3.3V
2.5V
1.5V
Figure 1-1:XUP Virtex-II Pro Development System Block Diagram
Board Components
Virtex-II Pro
FPGA
AC97 Audio CODEC & Stereo Amp
XSGA Video Output
User LEDs (4)
User Switches (4)
User Push-button Switches (5)
10/100 Ethernet PHY
RS-232 & PS/2 Ports (2)
Serial ATA Por ts (3)
Multi-Gigabit Transceiver Port
2 GB DDR SDRAM DIMM Module
5V Tolerant Expansion Headers
High Speed Expansion Port
UG069_01_012105
This section contains a concise overview of several important components on the XUP
Virtex-II Pro Development System (see Figure 1-2). The most recent documentation for the
system can be obtained from the XUP Virtex-II Pro Development System support website
at: http://www.xilinx.com/univ/xup2vp.html
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General Description
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Figure 1-2: XUP Virtex-II Pro Development System Board Photo
Virtex-II Pro FPGA
U1 is a Virtex-II Pro FPGA device packaged in a flip-chip-fine-pitch FF896 BGA package.
Two different capacity FPGAs can be used on the XUP Virtex-II Pro Development System
with no change in functionality. Ta bl e 1-1 lists the Virtex-II Pro device features.
Table 1-1:XC2VP20 and XC2VP30 Device Features
FeaturesXC2VP20XC2VP30
Slices928013969
Array Size56 x 4680 x 46
Distributed RAM290 Kb428 Kb
Multiplier Blocks88136
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Chapter 1: XUP Virtex-II Pro Development System
Table 1-1:XC2VP20 and XC2VP30 Device Features (Continued)
FeaturesXC2VP20XC2VP30
Block RAMs1584 Kb2448 Kb
DCMs88
PowerPC RISC Cores22
Multi-Gigabit Transceivers88
Figure 1-3 identifies the I/O banks that are used to connect the various peripheral devices
to the FPGA.
AC97 Audio SXGA port
10/100 Ethernet
1
0
2
7
OVER VOLTAGE CLAMPS
EXPANSION CONNECTORS
LEDs & SWITCHES
PS/2 KBD & MOUSE
PUSH BUTTONS
RS-232
System ACE port
Figure 1-3: I/O Bank Connections to Peripheral Devices
Power Supplies and FPGA Configuration
The XUP Virtex-II Pro Development System is powered from a 5V regulated power supply.
On-board switching power supplies generate 3.3V, 2.5V, and 1.5V for the FPGA, and
peripheral components and linear regulators power the MGTs.
The board has provisioning for current measurement for all of the FPGA digital power
supplies, as well as application of external power if the capacity of the on-board switching
power supplies is exceeded.
3
6
45
256M x 64/72 DDR SDRAM DIMM MODULE
3.3V IO
2.5V IO
UG069_03_012105
The XUP Virtex-II Pro Development System provides several methods for the
configuration of the Virtex-II Pro FPGA. The configuration data can originate from the
internal Platform Flash PROM (two potential configurations), the internal CompactFlash
storage media (eight potential configurations), and external configurations delivered from
the embedded Platform Cable USB or parallel port interface.
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General Description
Multi-Gigabit Transceivers
System RAM
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Four of the eight Multi-Gigabit Transceivers (MGTs) that are present in the Virtex-II Pro
FPGA are brought out to connectors and can be utilized by the user. Three of the
bidirectional MGT channels are terminated at Serial Advanced Technology Attachment
(SATA) connectors and the fourth channel terminates at user-supplied Sub-Miniature A
(SMA) connectors. The MGT transceivers are equipped with a 75 MHz clock source that is
independent for the system clock to support standard SATA communication. An
additional MGT clock source is available through a differential user-supplied (SMA)
connector pair. Two of the ports with SATA connectors are configured as Host ports and
the third SATA port is configured as a Target port to allow for simple board-to-board
networking.
The XUP Virtex-II Pro Development System has provision for the installation of usersupplied JEDEC-standard 184-pin dual in-line Double Data Rate Synchronous Dynamic
RAM memory module. The board supports buffered and unbuffered memory modules
with a capacity of 2 GB or less in either 64-bit or 72-bit organizations. The 72-bit
organization should be used if ECC error detection and correction is required.
System ACE Compact Flash Controller
The System Advanced Configuration Environment (System ACE™) Controller manages
FPGA configuration data. The controller provides an intelligent interface between an
FPGA target chain and various supported configuration sources. The controller has several
ports: the Compact Flash port, the Configuration JTAG port, the Microprocessor (MPU)
port and the Test JTAG port. The XUP Virtex-II Pro Development System supports a single
System ACE Controller. The Configuration JTAG ports connect to the FPGA and front
expansion connectors. The Test JTAG port connects to the JTAG port header and USB2
interface CPLD, and the MPU ports connect directly to the FPGA.
Fast Ethernet Interface
The XUP Virtex-II Pro Development System provides an IEEE-compliant Fast Ethernet
transceiver that supports both 100BASE-TX and 10BASE-T applications. It supports full
duplex operation at 10 Mb/s and 100 Mb/s, with auto-negotiation and parallel detection.
The PHY provides a Media Independent Interface (MII) for attachment to the 10/100
Media Access Controller (MAC) implemented in the FPGA. Each board is equipped with a
Silicon Serial Number that uniquely identifies each board with a 48-bit serial number. This
serial number is retrieved using “1-Wire” protocol. This serial number can be used as the
system MAC address.
Serial Ports
The XUP Virtex-II Pro Development System provides three serial ports: a single RS-232
port and two PS/2 ports. The RS-232 port is configured as a DCE with hardware
handshake using a standard DB-9 serial connector. This connector is typically used for
communications with a host computer using a standard 9-pin serial cable connected to a
COM port. The two PS/2 ports could be used to attach a keyboard and mouse to the XUP
Virtex-II Pro Development System. All of the serial ports are equipped with level-shifting
circuits, because the Virtex-II Pro FPGAs cannot interface directly to the voltage levels
required by RS-232 or PS/2.
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Chapter 1: XUP Virtex-II Pro Development System
User LEDs, Switches, and Push Buttons
A total of four LEDs are provided for user-defined purposes. When the FPGA drives a
logic 0, the corresponding LED turns on. A single four-position DIP switch and five push
buttons are provided for user input. If the DIP switch is up, closed, or on, or the push button
is pressed, a logic 0 is seen by the FPGA, otherwise a logic 1 is indicated.
Expansion Connectors
A total of 80 Virtex-II Pro I/O pins are brought out to four user-supplied 60-pin headers
and two 40-pin right angle connectors for user-defined use. The 60-pin headers are
designed to accept ribbon-cable connectors, with every second signal a ground for signal
integrity. Some of these signals are shared with the front-mounted right-angle connectors.
The front-mounted connectors support Digilent expansion modules. In addition, a highspeed connector is provided to support Digilent high-speed expansion modules. This
connector provides 40 single-ended or differential I/O signals in addition to three clocks.
Consult the Digilent website at www.diglentinc.com
compatible with the XUP Virtex-II Pro Development System.
XSGA Output
The XUP Virtex-II Pro Development System includes a video DAC and 15-pin highdensity D-sub connector to support XSGA output. The video DAC can operate with a pixel
clock of up to 180 MHz. This allows for a VESA-compatible output of 1280 x 1024 at 75 Hz
refresh and a maximum resolution of 1600 x 1200 at 70 Hz refresh.
for a list of expansion boards that are
AC97 Audio CODEC
An audio CODEC and stereo power amplifier are included on the XUP Virtex-II Pro
Development System to provide a high-quality audio path and provide all of the analog
functionality in a PC audio system. It features a full-duplex stereo ADC and DAC, with an
analog mixer, combining the line-level inputs, microphone input, and PCM data.
CPU Trace and Debug Port
The FPGA is equipped with a CPU debugging interface and a 16-pin header. This
connector can be used in conjunction with third party tools, the Xilinx Parallel Cable IV, or
the Xilinx Platform Cable USB to debug software as it runs on either PowerPC 405
processor core.
ChipScope Pro™ can also be used to perform real-time debug and verification of the FPGA
design. ChipScope Pro inserts logic analyzer, bus analyzer, and Virtual I/O low-profile
software cores into the FPGA design. These cores allow the designer to view all the internal
signals and nodes within the FPGA including the Processor Local Bus (PLB) or On-Chip
Peripheral Bus (OPB) supporting the PowerPC 405 cores. Signals are captured and brought
out through the embedded Platform Cable USB programming interface for analysis using
the ChipScope Pro Logic Analyzer tool.
USB 2 Programming Interface
The XUP Virtex-II Pro Development System includes an embedded USB 2.0
microcontroller capable of communications with either high-speed (480 Mb/s) or fullspeed (12 Mb/s) USB hosts. This interface is used for programming or configuring the
Virtex-II Pro FPGA in Boundary-Scan (IEEE 1149.1/IEEE 1532) mode. Target clock speeds
are selectable from 750 kHz to 24 MHz. The USB 2.0 microcontroller attaches to a desktop
or laptop PC with an off-the-shelf high-speed A-B USB cable.
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Using the System
Configuring the Power Supplies
The XUP Virtex-II Pro Development System supports the independent creation of the
power supplies for the core voltage of 1.5V (FPGA_VINT), 2.5V general-purpose power,
I/O and/or VCCAUX supplies (VCC2V5), and 3.3V I/O and general-purpose power
(VCC3V3). These voltages are created by synchronous buck-switching regulators derived
from the 4.5V-5.5V power input provided at the center-positive barrel-jack power input
(J26) or the terminal block pair (J34-J35). Each of these supplies can be disabled through the
insertion of jumpers (JP2, JP4, and JP6), and the external application of power from the
terminal blocks (J28-J33). If external power is supplied, the associated internal power
supply must be disabled (through the insertion of JP6, JP2, or JP4) and the associated onboard power delivery jumpers (JP5, JP1, or JP3) must be removed. The power consumption
from each of the on-board power supplies can be monitored through the removal of JP5,
JP1, or JP3 and the insertion of a current monitor. If any of the power supplies are outside
the recommended tolerance, internally or externally provided, the system enters a RESET
state indicated by the illumination of the RESET_PS_ERROR LED (D6) and the assertion of
the RESET_Z signal. A typical switching power supply is shown in Figure 2-1.
Chapter 2
ug069_04_021505
Figure 2-1:Typical Switching Power Supply
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VCC3V3
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Chapter 2: Using the System
Because of the analog nature of the MGTs, the power for those elements are created by low
noise, low dropout linear regulators. Figure 2-2 shows the power supply for the MGTs.
U20
FIXED 2.5V LDO
TA B
TA B
4
3
+
6
4
3
6
C428
330UF 6.3V
C433
+
330UF 6.3V
C430
0.1UF
C434
0.1UF
VCC_MGT
C427
1000PF
VTT_MGT
C432
1000PF
UG069_05_010605
C431
+
33OUF 6.3V
C429
+
33OUF 6.3V
FERRITE BEAD
2961666671
L32
2
INOUT
1
SHDNGND
5
SENSE
LT1963AEQ-25
U21
FIXED 2.5V LDO
2
INOUT
1
SHDNGND
5
SENSE
LT1963AEQ-25
GND_MGT
Configuring the FPGA
At power up, or when the RESET_RELOAD push button (SW1) is pressed for longer than
2 seconds, the FPGA begins to configure. The two configuration methods supported, JTAG
and master SelectMAP, are determined by the CONFIG SOURCE switch, the most
significant switch (left side) of SW9.
If the CONFIG SOURCE switch is closed, on, or up, a high-speed SelectMap byte-wide
configuration from the on-board Platform Flash configuration PROM (U3) is selected as
the configuration source. This is identified to the user through the illumination of the
PROM CONFIG LED (D19).
The Platform Flash configuration PROM supports two different FPGA configurations
(versions) selected by the position of the PROM VERSION switch, the least significant
switch (right side) of SW9.
If the PROM VERSION switch is closed, on, or up, the GOLDEN configuration from the onboard Platform Flash configuration PROM is selected as the configuration data. This is
identified to the user through the illumination of the GOLDEN CONFIG LED (D14). This
configuration can be a board test utility provided by Xilinx, or another safe default
configuration. It is important to note that the PROM VERSION switch is only sampled on
board powerup and after a complete system reset. This means that if this switch is changed
after board powerup, the RESET_RELOAD pushbutton (SW1) must be pressed for more
than 2 seconds for the new state of the switch to be recognized.
Figure 2-2:MGT Power
If the PROM VERSION switch is open, off, or down, a User configuration from the on-board
Platform Flash configuration PROM is selected as the configuration data. This
configuration must be programmed into the Platform Flash PROM from the JTAG
Platform Cable USB interface or the USB interface following the instructions in Appendix
B, “Programming the Platform FLASH PROM User Area.”
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Configuring the FPGA
The Platform Flash is normally disabled after the FPGA is finished configuring and has
asserted the DONE signal. If additional data is made available to the FPGA after the
completion of configuration, jumper JP9 must be moved from the NORMAL to the
EXTENDED position to permanently enable the PROM and allow the FPGA to clock out
the additional data using the FPGA_PROM_CLOCK signal. The process of loading
additional non-configuration data into the FPGA is outlined in application note:
XAPP694:
Reading User Data from Configuration PROMs.
If the CONFIG SOURCE switch is open, off, or down, a lower speed JTAG-based
configuration from Compact Flash or external JTAG source is selected as the configuration
source. This is identified to the user through the illumination of the JTAG CONFIG LED
(D20).
The JTAG-based configuration can originate from several sources: the Compact Flash card,
a PC4 cable connection through J27, and a USB to PC connection through J8 the embedded
Platform Cable USB interface.
If a JTAG-based configuration is selected, the default source is from the Compact Flash
port (J7). The System ACE controller checks the associated Compact Flash socket and
storage device for the existence of configuration data. If configuration data exists on the
storage device, the storage device becomes the source for the configuration data. The file
structure on the Compact Flash storage device supports up to eight different configuration
data files, selected by the triple CF CONFIG SELECT DIP switch (SW8). During JTAG
configuration, the SYSTEMACE STATUS LED (D12) flashes until the configuration process
is completed, and the FPGA asserts the FPGA_DONE signal and illuminates the DONE
LED (D4). At any time, the RESET_RELOAD pushbutton (SW1) can be used to load any of
the eight different configuration data files by pressing the switch for more than 2 seconds.
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If a JTAG-based configuration is selected and a valid configuration file is not found on the
Compact Flash card by the System ACE controller (U2), the SYSTEMACE ERROR LED
(D11) flashes, and the System ACE controller connects to an external JTAG port for FPGA
configuration.
The default external source for FPGA configuration is the high-speed embedded Platform
Cable USB configuration port (J8) and is enabled when the System ACE controller does not
find configuration data on the storage device. Detailed instructions on using the highspeed Platform Cable USB interface can be found in Appendix A, “Configuring the FPGA
from the Embedded USB Configuration Port.”
If a USB-equipped host PC is not available as a configuration source, then a Parallel Cable
4 (PC4) interface can be used instead by connecting a PC4 cable to J27.
It should be noted that if SelectMap byte-wide configuration from the on-board Platform
Flash configuration PROM is enabled, the FPGA Start-Up Clock should be set to CCLK in
the Startup Options section of the Process Options for the generation of the programming
file, otherwise JTAG Clock should be selected.
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Chapter 2: Using the System
Figure 2-3 illustrates the configuration data path.
USB2
Microcontroller
& CPLD
GOLDEN
VERSION SELECT
USER
JTAG Port
JTAG Port
PLATFORM
FLASH
SMAP Port
Test JTAG PortConfig JTAG Port
SystemACE
Controller
PROM
CONFIG SOURCE
JTAG
CF Card/
MicroDrive
SMAP Port
Micro Port
CF CONFIG SELECT
FPGA
Micro PortJTAG Port
UG069_06_122704
Figure 2-3:Configuration Data Path
Four status LEDs show the configuration state of the XUP Virtex-II Pro Development
System at all times. The user can see the configuration source, configuration version, and
tell when the configuration has completed from the status LEDs shown in Tab le 2- 1.
Table 2-1: System Configuration Status LEDs
LED Status
System Status
D19 (Green)
PROM Config
D20 (Green)
CF Config
D14 (Amber)
GOLDEN Config
D4 (Red)
Done
SelectMAP USER LOADINGONOFFOFFOFF
SelectMAP USER COMPLETEDONOFFOFFON
SelectMAP GOLDEN LOADINGONOFFONOFF
SelectMAP GOLDEN
ONOFFONON
COMPLETED
JTAG COMPACT FLASH
OFFONOFFOFF
LOADING
JTAG COMPACT FLASH
OFFONOFFON
COMPLETED
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Clock Generation and Distribution
Table 2-1: System Configuration Status LEDs (Continued)
LED Status
System Status
D19 (Green)
PROM Config
D20 (Green)
CF Config
D14 (Amber)
GOLDEN Config
D4 (Red)
Done
JTAG USB or PC4 LOADINGOFFONOFFOFF
JTAG USB or PC4 COMPLETEDOFFONOFFON
Clock Generation and Distribution
The XUP Virtex-II Pro Development System supports six clock sources:
•A 100 MHz system clock (Y2),
•A 75 MHz clock (U10) for the MGTs operating the Serial Advanced Technology
•A 32 MHz clock (Y4) for the System ACE interfaces, and
•A clock from the Digilent high-speed expansion module.
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The 75 MHz SATA clock is obtained from a high stability (20 ppm) 3.3V LVDSL differential
output oscillator, and the external MGT clock is obtained from two user-supplied SMA
connectors. The remaining three oscillators are all 3.3V single-ended LVTTL sources. Each
of the oscillators is equipped with a power supply filter to reduce the noise on the clock
outputs.
Tab le 2 -2 identifies the various clock connections for the FPGA.
Table 2-2:Clock Connections
SignalFPGA PinI/O Type
SYSTEM_CLOCKAJ15LVCMOS25
ALTERNATE_CLOCKAH16LVCMOS25
HS_CLKIN (from high speed
B16LVCMOS25
expansion port)
MGT_CLK_PF16LVDS_25
MGT_CLK_NG16LVDS_25
EXTERNAL_CLOCK_PG15LVDS_25
EXTERNAL_CLOCK_NF15LVDS_25
FPGA_SYSTEMACE_CLOCKAH15LVCMOS25
For the user to take advantage of the external differential clock inputs, two SMA
connectors must be installed at J23 and J24. These SMA connectors can be purchased from
Digi-Key® under the part number A24691-ND. Figure 2-4 identifies the location of the
external differential clock inputs.
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Chapter 2: Using the System
Figure 2-4: External Differential Clock Inputs
The alternate clock input is obtained from a user-supplied 3.3V oscillator. The footprint on
the printed circuit board supports either a full size (21mm x 13mm) or half size (13mm x
13mm) through-hole oscillator. Figure 2-5 identifies the location of the alternate clock
input oscillator.
Figure 2-5: Alternate Clock Input Oscillator
Using the DIMM Module DDR SDRAM
The XUP Virtex-II Pro Development System is equipped with a 184-pin Dual In-line
Memory Module (DIMM) socket that provides access up to 2 GB of Double Data Rate
SDRAM. The DDR SDRAM is an enhancement to the traditional Synchronous DRAM. It
supports data transfer on both edges of each clock cycle, effectively doubling the data
throughput of the memory device.
The DDR SDRAM operates with a differential clock: CLK and CLK_Z (the transition of
CLK going high and CLK_Z going low is considered the positive edge of the CLK)
commands (address and control signals) are registered at every positive edge of the CLK.
Input data is registered on both edges of the data strobe (DQS), and output data is
referenced to both edges of DQS, as well as both edges of CLK.
A bidirectional data strobe is transmitted by the DDR SDRAM during Reads and by the
FPGA DDR SDRAM memory controller during Writes. DQS is edge-aligned with the data
for Reads and center-aligned with the data for Writes.
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Using the DIMM Module DDR SDRAM
Read and Write accesses to the DDR SDRAM are burst oriented: accesses start at a selected
location and continue for a programmed number of locations in a programmed sequence.
Accesses begin with the registration of an Active command, which is followed by a Read or
Write command. The address bits registered coincident with the Read or Write command
are used to select the bank and starting column location for the burst address.
DDR SDRAM provides for 2, 4, 8, or full-page programmable Read or Write burst lengths.
The allowable burst lengths depend on the specific DDR SDRAM used on the DIMM
module. This information can be obtained from the serial presence detect (SPD) EEPROM.
An auto-precharge function can be enabled to provide a self-timed precharge that is
initiated at the end of the burst sequence. As with standard SDRAMs, the pipelined
multibank architecture of DDR SDRAMs allows for concurrent operation, thereby,
providing high effective bandwidth by hiding row precharge and activation time.
The modules incorporate a serial presence detect (SPD) function implemented using a
2048-bit EEPROM. The first 128 bytes of the EEPROM are programmed by the module
manufacturer to identify the module type and various SDRAM timing parameters. The
remaining 128 bytes of EEPROM are available for use as non-volatile memory. The
EEPROM is accessed using a standard I
clock) and SDRAM_SDA (serial data) signals.
Data on the SDRAM_SDA signal can change only when the clock signal SDRAM_SCL is
low. Changes in the SDRAM_SDA data signal when SDRAM_SCL is high; this indicates a
start or stop bit condition as shown in Figure 2-6. A high-to-low transition of
SDRAM_SDA when SDRAM_SCL is high indicates a start bit condition, the start of all
commands. A low-to-high transition of SDRAM_SDA when SDRAM_ SCL is high
indicates a stop bit condition, terminating the command placing the SPD device into a low
power mode.
2
C bus protocol using the SDRAM_SCL (serial
R
SDRAM_SCL
SDRAM_SDA
START BITSTOP BIT
UG069_07_082604
Figure 2-6:Definition of Start and Stop Conditions
All commands commence with a start bit, followed by eight data bits. The transmitting
device, either the bus master or slave, releases the bus after transmitting eight bits. During
the ninth clock cycle, the receiver pulses the SDA data signal low to acknowledge that it
received the eight bits of data as shown in Figure 2-7.
XUP Virtex-II Pro Development Systemwww.xilinx.com25
UG069 (v1.0) March 8, 2005
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SCL FROM
MASTER
SDA OUTPUT FROM
TRANSMITTER
SDA OUTPUT FROM
RECEIVER
Chapter 2: Using the System
1289
START BITACKNOWLEDGE
UG069_08_021405
Figure 2-7: Acknowledge Response from Receiver
The SPD device always responds with an acknowledge after recognition of a start
condition and its slave address (100). If a read command was issued, the SPD device
transmits eight bits of data, releases the SDRAM_SDA data line, and monitors the
SDRAM_SDA data line for an acknowledge. If an acknowledge is detected and no stop bit is
generated by the master, the SPD device continues to transmit data. If no acknowledge is
detected, the SPD device terminates further data transmission and waits for the stop bit
condition to return to low power mode.
MASTER
(FPGA)
SDRAM_SDA
SLAVE
(SPD EEPROM)
MASTER
(FPGA)
SDRAM_SDA
SPD device read and write operations are shown in Figure 2-8 and Figure 2-9.
SLAVE ADDRESS
READDATA nDATA n+1
START
001100011
A2A1A0
R/W
ACK
ACK
Figure 2-8: EEPROM Sequential Read
SLAVE ADDRESS
WRITEWORD ADDRESSDATA
START
001100011
A2
A1A0R/W
ACK
STOP
UG069_09_021405
STOP
SLAVE
(SPD EEPROM)
ACK
ACK
ACK
UG069_10_021405
Figure 2-9:EEPROM Write
26www.xilinx.comXUP Virtex-II Pro Development System
UG069 (v1.0) March 8, 2005
Using the DIMM Module DDR SDRAM
The ability to read the SPD EEPROM is important because the module specific timing
parameters are included in the EEPROM data and are required by the DDR SDRAM
controller to provide the highest memory throughput. The definitions of the SPD data
bytes are outlined in Tab le 2 -3.
Table 2-3:SPD EEPROM Contents
ByteDescription
0Number of used bytes in SPD EEPROM
1Total number of bytes on SPD EEPROM
2Memory type (DDR SDRAM = 07h)
3Number of row addresses
4Number of column addresses
5Number of ranks (01h)
6-7Module data width
8Module interface voltage (SSTL 2.5V = 04h)
R
9SDRAM cycle time (tck) (CAS LATENCY = 2.5)
10SDRAM access time (tac) (CAS LATENCY = 2.5)
11Module configuration type
12Refresh rate
13Primary SDRAM component width
14Error checking SDRAM component width
15Minimum clock delay from
Back-to-Back Random Column Addresses
16Supported burst lengths
17Number of banks on SDRAM component
18CAS latencies supported
19CS latency
20WE latency
21SDRAM module attributes
22SDRAM attributes
23SDRAM cycle time (tck) (CAS LATENCY =2)
24SDRAM access time (tac) (CAS LATENCY =2)
25SDRAM cycle time (tck) (CAS LATENCY =1)
26SDRAM access time (tac) (CAS LATENCY =1)
27Minimum ROW PRECHARGE time (trp)
28Minimum ROW ACTIVE to ROW ACTIVE (trrd)
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Chapter 2: Using the System
Table 2-3:SPD EEPROM Contents (Continued)
ByteDescription
29Minimum RAS# to CAS# delay (trcd)
30Minimum RAS# pulse width (tras)
31Module rank density
32Command and address setup time (tas, tcms)
33Command and address hold time (tah, tcmh)
34Data setup time (tds)
35Data hold time (tdh)
36-40Reserved
41Minimum ACTIVE/AUTO REFRESH time
42Minimum AUTO REFRESH to ACTIVE/AUTO REFRESH
command period
43Max cycle time
44Max DQS-DQ skew
45Max READ HOLD time
46Reserved
47DIMM height
48-61Reserved
62SPD revision
63CHECKSUM for bytes 0-62
64-71Manufacturer's JEDEC ID code
72Manufacturing location
73-90Module part number (ASCII)
91-92Module revision code
93Year of manufacture (BCD)
94Week of manufacturer (BCD)
95-98Module serial number
99-127Reserved
128-255User defined contents
The DIMM module is supplied with three differential clocks. These three clock signals are
matched in length to each other and the DDR SDRAM feedback signals to allow for fully
synchronous operation across all banks of memory. The DDR SDRAM clocks are driven by
Double Data Rate (DDR) output registers, connected to a Digital Clock Manager (DCM)
with an optional external feedback connection. The DDR SDRAM controller logic is
described in DS425
28www.xilinx.comXUP Virtex-II Pro Development System
, PLB Double Data Rate (DDR) Synchronous DRAM (SDRAM) Controller.
UG069 (v1.0) March 8, 2005
Using the DIMM Module DDR SDRAM
The Xilinx PLB DDR SDRAM controller is a soft IP core designed for Xilinx FPGAs that
support different CAS latencies and memory data widths set by design parameters.
The DDR SDRAM controller logic instantiates DDR input and output registers on the
address, data, and control signals, so the clock to output delays match the clock output
delay. The DDR SDRAM clocking structure as shown in Figure 2-10 is a simplified version
of the clocking structure mentioned in DS425
R
.
ug069_23_021505
Figure 2-10: Clock Generation for the DDR SDRAM
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Chapter 2: Using the System
Xilinx has qualified several different types of PC2100 memory modules for use in the XUP
Virtex-II Pro Development System. These modules cover various densities, organizations,
and features. The qualified memory modules are identified in Ta bl e 2-4 .
For an updated list of supported modules, consult the XUP Virtex-II Pro Development
System support Web site at:
http://www.xilinx.com/univ/xupv2p.html
The data bus width, number of ranks, address range, clock latency, and output type are all
parameters that are used by the DDR memory controller design to create the correct
memory controller for the user application.
Table 2-4:Qualified SDRAM Memory Modules
Crucial® Technology
Part Number
Memory
Organization
Number of
Ranks
Unbuffered or
Registered
CAS
Latency
CT6472Z265.18T*512 MB 64M X 72DualUnbuffered2.5
CT6464Z265.16T*512 MB 64M X 64DualUnbuffered2.5
CT6472Z265.9T*512 MB 64M X 72SingleUnbuffered2.5
CT6464Z265.8T*512 MB 64M X 64SingleUnbuffered2.5
CT1664Z265.4T*128 MB 16M X 64SingleUnbuffered2.5
Notes:
The * in the Crucial part number represents the revision number of the module, which is not
required to order the module.
These memory modules are designed for a maximum clock frequency of at least 133 MHz
and have a CAS latency of 2.5 (18.8 ns). The PLB Double Data Rate Synchronous DRAM
Controller supports CAS latencies of two or three clock cycles.
If the memory system is to operate at 100 MHz, then set the CAS latency parameter in the
controller design to 2 (20 ns). If full speed (133MHz) memory operation is required, then
set the CAS latency parameter in the controller design to 3 (22.6 ns).
Tab le 2 -5 provides the details on the FPGA to DDR SDRAM DIMM module connections.
Table 2-5:DDR SDRAM Connections
SignalDirection
DIMM
Module Pin
FPGA
Pin
I/O Type
SDRAM_DQ[0]I/O2C27SSTL2-II
SDRAM_DQ[1]I/O4D28SSTL2-II
SDRAM_DQ[2]I/O6D29SSTL2-II
SDRAM_DQ[3]I/O8D30SSTL2-II
SDRAM_DQ[4]I/O94H25SSTL2-II
SDRAM_DQ[5]I/O95H26SSTL2-II
SDRAM_DQ[6]I/O98E27SSTL2-II
SDRAM_DQ[7]I/O99E28SSTL2-II
SDRAM_DQS[0]I/O5E30SSTL2-II
SDRAM_DM[0]097U26SSTL2-II
30www.xilinx.comXUP Virtex-II Pro Development System
UG069 (v1.0) March 8, 2005
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