Digianswer A S BTDVK100 Users Manual
Bluetooth Development Kit
User’s Guide
94001480000
Rev. 2.0, 2002-05-29
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consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can
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Technical Information Center: 1–800–521–6274
HOME PAGE: http://www.motorola.com/semiconductors/
© Copyright Motorola, Inc., 2002
Contents
Chapter 1
Introduction
1.1 About This Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Additional Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1.3 Downloads and Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.4 Unpacking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.5 System Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.6 Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
Chapter 2
Product Overview
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.2 Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.4 ICs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.5 Software Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.5.1 Bluetooth HCI Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.5.2 Configuration Manager. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.5.3 DemoBench . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
Chapter 3
Setup
3.1 Setting Up Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.2 Running UART. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
3.3 Running USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9
Chapter 4
Hardware
4.1 Signal and Connection Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11
4.2 Environmental. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.3 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.4 Electrical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12
4.4.1 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.2 Reset Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.3 Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13
4.4.4 Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.4.5 UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.4.6 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
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4.4.7 CODEC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.4.8 Antenna. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
4.5 Reference Designs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-14
Chapter 5
Limitations
5.1 USB Limitations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
Chapter 6
Regulatory
6.1 Regulatory Statements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.1.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.1.2 European Union (EU) and EFTA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.1.3 France . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.1.4 Nederland . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17
6.1.5 United States of America and Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
6.1.6 Canada Compliance (Industry Canada) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
6.1.7 Singapore . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18
6.1.8 Brazil. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
6.1.9 Japan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
6.1.10 Taiwan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19
6.2 Obtaining Type Approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
6.2.1 Requirements for Bluetooth Qualification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
6.2.2 Requirements for regulatory type approvals: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20
Appendix A
Board Diagram
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Chapter 1
Introduction
NOTE:
Users are not permitted to make changes or modify the device in any way.
With the Development Kit for the Bluetooth Platform Solution from Motorola, the company is launching a
unique demonstration and development tool for its platform.
The Development Kit contains all of the hardware, software, and documentation needed to evaluate the
functionality of the ICs making up Motorola’s Bluetooth platform solution chipset:
• MC71000 Bluetooth Baseband Controller IC
• MC13180 Bluetooth Low Power Wireless Data Transceiver IC
• MC13181 Wireless Power Management IC
Also, you can develop software and hardware solutions around the platform chipset. The Development Kit
makes it possible to easily and quickly set up and start demonstrating a Class 2 Bluetooth solution, and it
provides an efficient layout for the baseband and RF on an FR4 PCB substrate.
The primary applications of the Development Kit are:
• Evaluation of the platform chipset and its features
• Porting of a user Bluetooth stack to the Motorola Bluetooth hardware
• Prototyping of a Bluetooth-enabled host device
• Reference design for quick layout of a Bluetooth solution based on the MC71000 and MC13180
chipset
The Development Kit is Bluetooth 1.1 qualified and type approved in a great number of countries. See the
section “Regulatory”.
For detailed information on the ICs making up the platform chipset, please see the technical brief
accompanying each of the ICs: MC71000, MC13180, and MC13181. These technical briefs are all
included on the CD.
1.1 About This Guide
This user’s guide will help you get started with the Bluetooth Development Kit. The guide covers a large
number of aspects of using the Development Kit, including:
• Overview of the Development Kit and accompanying documentation
• Instructions on setting up the hardware and software
• Descriptions of the various elements that make up the Development Kit
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Introduction
The following is an overview of the various sections of this user’s guide and a brief description of each
section:
• Chapter 1, “Introduction” contains an overview of the user’s guide and additional documents
available from the CD. The introduction is also where to find information on support, unpacking,
system requirements, and a list of the acronyms used in this guide.
• Chapter 2, “Product Overview” provides an overview of the Development Kit where the various
elements of the product are described briefly.
• Chapter 3, “Setup” explains how to set up the hardware and software to get the Development Kit
running.
• Chapter 4, “Hardware” describes the various aspects of the Development Kit hardware
• Chapter 5, “Limitations” describes the limitations of the current Development Kit version.
Currently this chapter deals with HCI Limitations only.
• Chapter 6, “Regulatory” contains regulatory statements, a list of the countries where the
Development Kit will be type approved, and information on what is needed to obtain type approvals
for new products.
• Appendix A, “Board Diagram“, contains a diagram of the Development Kit board.
1.2 Additional Documents
In addition to this user’s guide, the documentation for the Development Kit includes the following
documents. These are all accessible from the document overview on the CD.
• User’s Guides for various elements of the Development Kit:
— Bluetooth HCI Terminal Guide
— Configuration Manager User’s Guide
— DemoBench User’s Guide
— Bluetooth Platform Solution Embedded System User’s Guide
— Bluetooth Headset Guide
• Reference designs: Bluetooth Platform Solution Reference Designs including descriptions and
schematics
• A platform document providing a system overview of the Bluetooth Platform Solution from
Motorola
• Technical briefs for the various Bluetooth platform elements:
— MRFIC2408 External Power Amplifier IC
— MC13180 Bluetooth Low Power Wireless Data Transceiver IC
— MC13181 Wireless Power Management IC
— MC71000 Bluetooth Baseband Controller IC
— Bluetooth Development Kit
• Application notes for the following:
— Using the Bluetooth Audio Signal Processor (BTASP) for High-Quality Audio Performance
— Motorola’s Bluetooth Solution to Interference Rejection and Coexistence with 802.11
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Downloads and Support
— Enhancing ISM Band Performance Using Adaptive Frequency Hopping
• Product Errata
• Data sheets and information for components on the Development Kit:
— CODEC
—USB
— UART Level Converter
— EEPROMs
— Crystals
• Bluetooth Core Specification v1.1
1.3 Downloads and Support
For Development Kit software and documentation downloads, go to the following website:
http://www.btpo.net
In addition, you may find useful information on the following websites: http://www.motorola.com and
http://www.motorola.com/semiconductor/bluetooth
For support on your Development Kit, contact your local FAE.
1.4 Unpacking
The Bluetooth Development Kit sales package contains the following items:
• Development kit boards (2)
• Power supplies (2)
• RS232 cables (2)
• USB cables (2)
• Antennas (2)
• Headsets (2)
• Installation CD including software tools and documentation (1)
1.5 System Requirements
To install and use the Bluetooth Development Kit, you will need the following:
• A PC equipped with Windows® 98/98 SE/Me/2000
• At least a 600 MHz processor (or higher)
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Introduction
1.6 Acronyms and Abbreviations
Throughout this guide, the following acronyms and abbreviations are used:
EEPROM Electrically Erasable/Programmable Read Only Memory
Rx Receive(r)
SEEPROM Serial Electrically Erasable/Programmable Read Only Memory
SPI Serial Peripheral Interface
The SPI Bus made by Motorola handles all serial communication with a number of
different RF front ends and SEEPROMs.
SSI Synchronous Serial Interface
Tx Transmit(ter)
UART Universal Asynchronous Receiver Transmitter
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Chapter 2
Product Overview
This section contains a brief overview of the Development Kit. More detailed information on the various
elements of the Development Kit is included in later sections and in the separate user’s guides included on
the CD.
2.1 Block Diagram
The following figure shows the Development Kit block diagram:
Figure 2-1. Block Diagram
USB
RS232
UART
Modular Jack
DC
Power
Input
USB
RS232
Level
Shifter
CODEC
MC13181
MC71000 MC13180
EEPROM
7 Status
LEDs
Reset Switch
2.2 Interfaces
The development kit features RS232, UART, and USB interfaces:
Antenna
Diversity
Switch
Class ½
Antenna Jumper
Antenna
Connector
F Antenna
• RS232 interface: Programmable baud rate from 1200 to 921 Kbit.
• UART interface: 5-pin header with RxD, CTS, RTS, and GND, 3.3 V signaling, programmable
baud rate from 1200 to 921 Kbit, HCI UART transport layer.
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Product Overview
NOTE:
The UART and RS232 interfaces cannot operate simultaneously.
• USB interface: Full speed (12 Mbit/s) USB node device, HCI USB transport layer, 3.3 V operation,
self-powered, National USBN9604 USB controller.
The following list shows the USB limitations:
— USB interface is for evaluation purposes and only included for ease of use.
— Supports OpenUSBDI-compatible USB controllers. USB v1.1.
— Does not support Open HCI.
— Production release of the MC71000 will not support USB.
• Audio connections, with audio routed either to the CODEC or through the transport layer
2.3 Applications
The Development Kit supports the Headset application. A separate Headset User’s Guide is TBD.
2.4 ICs
The Development Kit is supplied with the following Bluetooth ICs from Motorola:
• MC71000 Bluetooth Baseband Controller IC
• MC13180 Bluetooth Low Power Wireless Data Transceiver IC
• MC13181 Wireless Power Management IC
Future Development Kit releases will contain the MRFIC2408 External Power Amplifier IC.
2.5 Software Tools
The Bluetooth Development Kit is accompanied by the following software tools:
• Bluetooth HCI Terminal
• Configuration manager
• DemoBench
The following sections describe briefly each of the software tools. A separate user’s guide for each tool is
included on the Development Kit CD.
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