Digi XBee-PRO 900HP User Manual
XBee®-PRO 900HP/XSC RF Modules
S3 and S3B
User Guide
Revision history—90002173
Revision Date Description
S October
2016
T May 2018 Added note on range estimation. Changed ICto ISED.
U July 2018 Added the 0x00, 0x80 and 0x89 frames for the 900HP.
V June
2019
W January
2020
Replaced the Programmable bootloader section with the Programmable
XBee SDK section. Updated the indoor range spec. Corrected the SPand ST
parameter default values.
Added FCC publication 996369 related information.
Added IFETEL certifications.
Trademarks and copyright
Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United
States and other countries worldwide. All other trademarks mentioned in this document are the
property of their respective owners.
© 2020 Digi International Inc. All rights reserved.
Disclaimers
Information in this document is subject to change without notice and does not represent a
commitment on the part of Digi International. Digi provides this document “as is,” without warranty of
any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or
merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.
Warranty
To view product warranty information, go to the following website:
www.digi.com/howtobuy/terms
Customer support
Gather support information: Before contacting Digi technical support for help, gather the following
information:
Product name and model
Product serial number (s)
Firmware version
Operating system/browser (if applicable)
Logs (from time of reported issue)
XBee®-PRO 900HP/XSC RF Modules
2
Trace (if possible)
Description of issue
Steps to reproduce
Contact Digi technical support: Digi offers multiple technical support plans and service packages.
Contact us at +1 952.912.3444 or visit us at www.digi.com/support.
Feedback
To provide feedback on this document, email your comments to
Include the document title and part number (XBee®-PRO 900HP/XSC RF Modules, 90002173 W) in the
subject line of your email.
techcomm@digi.com
XBee®-PRO 900HP/XSC RF Modules
3
Contents
About the XBee-PRO 900HP RF Module
User guide structure 14
Technical specifications
Performance specifications 17
Power requirements 17
General specifications 18
Networking specifications 18
Regulatory conformity summary 18
Serial communication specifications 19
UART pin assignments 19
SPI pin assignments 19
GPIO specifications 19
Secondary processor specifications 20
Hardware
Mechanical drawings 23
Pin signals 24
Design notes 26
Power supply design 26
Board layout 26
Antenna performance 26
Recommended pin connections 27
Module operation for the programmable variant 28
Programmable XBee SDK 30
Configure the XBee-PRO 900HP RF Module
Software libraries 32
Configure the device using XCTU 32
Over-the-air firmware updates 32
Distribute the new application 32
Verify the new application 33
Install the application 33
XBee Multi Programmer 34
XBee®-PRO 900HP/XSC RF Modules
4
Operation
Basic operational design 36
Serial interface 36
UART data flow 36
Serial data 37
Configuration considerations 37
Select the serial port 37
Force UART operation 38
Select the SPI port 38
Serial port selection 39
Serial receive buffer 39
Serial transmit buffer 39
UART flow control 39
CTS flow control 39
RTS flow control 39
SPI operation
SPI communications 42
SPI implementation 42
SPI signals 43
Full duplex operation 44
Low power operation 44
SPI and API mode 45
SPI parameters 45
Modes
Serial modes 47
Transparent operating mode 47
API operating mode 47
Comparing Transparent and API modes 47
Modes of operation 49
Idle mode 49
Transmit mode 49
Receive mode 49
Command mode 49
Sleep mode 52
Sleep modes
About sleep modes 54
Asynchronous modes 54
Synchronous modes 54
Normal mode 54
Asynchronous pin sleep mode 55
Asynchronous cyclic sleep mode 55
Asynchronous cyclic sleep with pin wake up mode 55
Synchronous sleep support mode 55
Synchronous cyclic sleep mode 56
The sleep timer 56
Indirect messaging and polling 56
XBee®-PRO 900HP/XSC RF Modules
5
Indirect messaging 56
Polling 57
Sleeping routers 57
Sleep coordinator sleep modes in the DigiMesh network 57
Synchronization messages 58
Become a sleep coordinator 60
Select sleep parameters 62
Start a sleeping synchronous network 62
Add a new node to an existing network 63
Change sleep parameters 64
Rejoin nodes that lose sync 64
Diagnostics 65
Query sleep cycle 65
Sleep status 66
Missed sync messages command 66
Sleep status API messages 66
Networking methods
The MAC and PHY layers 68
64-bit addresses 68
Make a unicast transmission 69
Make a broadcast transmission 69
Delivery methods 69
Point to Point / Point to Multipoint (P2MP) 69
Repeater/directed broadcast 70
DigiMesh networking 71
AT commands
Special commands 77
AC (Apply Changes) 77
FR (Force Reset) 77
RE (Restore Defaults) 77
WR (Write) 77
MAC/PHY commands 78
AF (Available Frequencies) 78
CM (Channel Mask) 78
MF (Minimum Frequency Count) 79
HP (Preamble ID) 79
ID (Network ID) 80
MT(Broadcast Multi-Transmits) 80
PL (TX Power Level) 80
RR (Unicast Mac Retries) 81
ED (Energy Detect) 81
Diagnostic commands 81
BC (Bytes Transmitted) 81
DB (Last Packet RSSI) 81
ER (Received Error Count) 82
GD (Good Packets Received) 82
EA (MAC ACK Failure Count) 82
TR (Transmission Failure Count) 83
UA (MAC Unicast Transmission Count) 83
%H (MAC Unicast One Hop Time) 83
XBee®-PRO 900HP/XSC RF Modules
6
%8 (MAC Broadcast One Hop Time) 83
Network commands 84
CE (Node Messaging Options) 84
BH (Broadcast Hops) 84
NH (Network Hops) 84
NN (Network Delay Slots) 85
MR (Mesh Unicast Retries) 85
RN (Delay Slots) 85
Addressing commands 86
SH (Serial Number High) 86
SL (Serial Number Low) 86
DH (Destination Address High) 86
DL (Destination Address Low) 86
TO (Transmit Options) 87
NI (Node Identifier) 87
NT (Node Discover Time) 88
NO (Node Discovery Options) 88
CI (Cluster ID) 89
DE (Destination Endpoint) 89
SE (Source Endpoint) 89
Addressing discovery/configuration commands 89
AG (Aggregator Support) 89
DN (Discover Node) 90
ND (Network Discover) 90
FN (Find Neighbors) 91
Security commands 92
EE (Security Enable) 92
KY (AES Encryption Key) 92
Serial interfacing commands 92
BD (Baud Rate) 92
NB (Parity) 93
SB (Stop Bits) 93
RO (Packetization Timeout) 94
FT (Flow Control Threshold) 94
AP (API Mode) 94
AO (API Options) 95
I/O settings commands 95
CB (Commissioning Pushbutton) 95
D0 (DIO0/AD0) 95
D1 (DIO1/AD1) 96
D2 (DIO2/AD2) 96
D3 (DIO3/AD3) 97
D4 (DIO4) 97
D5 (DIO5/ASSOCIATED_INDICATOR) 98
D6 (DIO6/RTS) 98
D7 (DIO7/CTS) 99
D8 (DIO8/SLEEP_REQUEST) 99
D9 (DIO9/ON_SLEEP) 100
P0 (DIO10/RSSI/PWM0 Configuration) 100
P1 (DIO11/PWM1 Configuration) 101
P2 (DIO12 Configuration) 101
P3 (DIO13/DOUT) 102
P4 (DIO14/DIN) 102
PD (Pull Up/Down Direction) 102
PR (Pull-up/Down Resistor Enable) 102
XBee®-PRO 900HP/XSC RF Modules
7
M0 (PWM0 Duty Cycle) 103
M1 (PWM1 Duty Cycle) 103
LT (Associate LED Blink Time) 104
RP (RSSI PWM Timer) 104
I/O sampling commands 104
AV (Analog Voltage Reference) 104
IC (DIO Change Detection) 105
IF (Sleep Sample Rate) 105
IR (I/O Sample Rate) 106
IS (Force Sample) 106
TP (Board Temperature) 106
%V (Voltage Supply Monitoring) 107
Sleep commands 107
SM (Sleep Mode) 107
SO (Sleep Options) 107
SN (Number of Sleep Periods) 108
SP (Sleep Period) 108
ST (Wake Time) 109
WH (Wake Host Delay) 109
Diagnostic - sleep status/timing commands 109
SS (Sleep Status) 109
OS (Operating Sleep Time) 110
OW (Operating Wake Time) 110
MS (Missed Sync Messages) 111
SQ (Missed Sleep Sync Count) 111
Command mode options 111
CC (Command Character) 111
CN (Exit Command Mode) 111
CT (Command Mode Timeout) 112
GT (Guard Times) 112
Firmware commands 112
VL (Version Long) 112
VR (Firmware Version) 112
HV (Hardware Version) 112
HS (Hardware Series) 113
DD (Device Type Identifier) 113
NP (Maximum Packet Payload Bytes) 113
CK (Configuration CRC) 113
Operate in API mode
API mode overview 116
API frame format 116
API operation (AP parameter = 1) 116
API operation-with escaped characters (AP parameter = 2) 116
Data bytes that need to be escaped: 117
Length 117
Frame data 117
API serial exchanges 119
AT commands 119
Transmit and Receive RF data 120
Remote AT commands 120
Device Registration 121
Calculate and verify checksums 121
Example 121
XBee®-PRO 900HP/XSC RF Modules
8
Frame descriptions
64-bit Transmit Request - 0x00 124
Description 124
Format 124
Examples 125
Local AT Command Request - 0x08 125
Description 125
Format 126
Examples 126
Queue Local AT Command Request - 0x09 128
Description 128
Examples 128
Transmit Request - 0x10 130
Description 130
Transmit options bit field 131
Examples 131
Explicit Addressing Command Request - 0x11 133
Description 133
64-bit addressing 133
Reserved endpoints 133
Reserved cluster IDs 133
Reserved profile IDs 133
Transmit options bit field 135
Examples 135
Remote AT Command Request - 0x17 137
Description 137
Format 137
Examples 138
64-bit Receive Packet - 0x80 140
Description 140
Format 140
Examples 141
Local AT Command Response - 0x88 142
Description 142
Examples 143
Transmit Status - 0x89 144
Description 144
Delivery status codes 145
Examples 145
Modem Status - 0x8A 147
Description 147
Modem status codes 148
Examples 148
Extended Transmit Status - 0x8B 150
Description 150
Route Information - 0x8D 152
Description 152
Format 152
Examples 153
Aggregate Addressing Update- 0x8E 154
Description 154
Examples 154
Receive Packet - 0x90 156
Description 156
XBee®-PRO 900HP/XSC RF Modules
9
Examples 157
Explicit Receive Indicator - 0x91 158
Description 158
Examples 159
I/O Sample Indicator- 0x92 160
Description 160
Examples 161
Node Identification Indicator - 0x95 163
Description 163
Examples 165
Remote AT Command Response- 0x97 166
Description 166
Examples 167
Advanced application features
Remote configuration commands 170
Send a remote command 170
Apply changes on remote devices 170
Remote command responses 170
Network commissioning and diagnostics 170
Configure devices 170
Network link establishment and maintenance 171
Place devices 172
Device discovery 172
Link reliability 173
Commissioning pushbutton and associate LED 175
I/O line monitoring 178
I/O samples 178
Queried sampling 178
Periodic I/O sampling 181
Detect digital I/O changes 181
General Purpose Flash Memory
General Purpose Flash Memory 183
Access General Purpose Flash Memory 183
General Purpose Flash Memory commands 184
PLATFORM_INFO_REQUEST (0x00) 184
PLATFORM_INFO (0x80) 184
ERASE (0x01) 185
ERASE_RESPONSE (0x81) 185
WRITE (0x02) and ERASE_THEN_WRITE (0x03) 186
WRITE _RESPONSE (0x82) and ERASE_THEN_WRITE_RESPONSE (0x83) 187
READ (0x04) 187
READ_RESPONSE (0x84) 188
FIRMWARE_VERIFY (0x05) and FIRMWARE_VERIFY_AND_INSTALL(0x06) 188
FIRMWARE_VERIFY_RESPONSE (0x85) 189
FIRMWARE_VERIFY _AND_INSTALL_RESPONSE (0x86) 189
Work with flash memory 190
XBee®-PRO 900HP/XSC RF Modules
10
XSC firmware
XBee-PRO XSC RF Module overview 192
Pin signals 192
Electrical characteristics 193
Timing specifications 194
XBee-PRO XSC specifications
Performance specifications 198
Power requirements 198
Networking specifications 199
General specifications 199
Antenna options 199
Regulatory conformity summary 200
XBee-PRO XSC RF Module operation
Serial communications 202
UART-interfaced data flow 202
Serial data 202
Flow control 202
Data In (DIN) buffer and flow control 203
Data Out (DO) buffer and flow control 204
Operating modes 204
Idle mode 204
Transmit mode 205
Receive mode 205
Sleep mode 205
Command mode 208
Configuration and commands
Programming examples 213
Connect the device to a PC 213
Send binary commands 213
Example 213
Special commands 214
FR (Force Reset) 214
PL (TX Power Level) 214
Command mode options 214
AT (Guard Time After) 215
BT (Guard Time Before) 215
CC (Command Sequence Character) 215
CD (DO3 Configuration) 216
CN (Exit Command Mode) 216
CT (Command Mode Timeout) 217
E0 (Echo Off) 217
E1 (Echo On) 217
PC (Power-up to Transparent operating mode) 218
Networking and security commands 218
AM (Auto-set MY) 218
MD (RF Mode) 219
XBee®-PRO 900HP/XSC RF Modules
11
MY (Source Address) 219
Network commands 220
DT (Destination Address) 220
HP (Preamble ID) 220
HT (Time before Wake-up Initializer) 221
ID (Network ID) 221
MK (Address Mask) 221
RN (Delay Slots) 222
RR (Unicast Mac Retries) 222
SY (Time Before Initialization) 223
TT (Streaming Limit) 224
Serial interfacing commands 224
BD (Interface Data Rate) 224
CS (DO2 Configuration) 225
FL (Software Flow Control) 226
FT (Flow Control Threshold) 227
NB (Parity) 227
PK (Maximum RF Packet Size) 227
RB (Packetization Threshold) 228
RO (Packetization Timeout) 228
RT (DI2 Configuration) 229
Diagnostic commands 229
ER (Receive Count Error) 229
GD (Receive Good Count) 230
RE (Restore Defaults) 230
RP (RSSI PWM Timer) 231
RZ (DI Buffer Size) 231
RS (RSSI) 232
SH (Serial Number High) 232
SL (Serial Number Low) 232
TR (Transmission Failure Count) 233
VR (Firmware Version - Short) 233
Sleep commands 234
FH (Force Wakeup Initializer) 234
HT (Time before Wake-up Initializer) 234
LH (Wakeup Initializer Timer) 235
PW (Pin Wakeup) 235
SM (Sleep Mode) 236
ST (Wake Time) 236
Network configurations
Network topologies 239
Point-to-point networks 239
Point-to-multipoint networks 239
Peer to peer networks 240
Addressing 241
Address recognition 242
Basic communications 242
Streaming mode (default) 242
Repeater mode 243
Acknowledged mode 247
XBee®-PRO 900HP/XSC RF Modules
12
S3B hardware certifications
Agency certifications - United States 251
United States (FCC) 251
OEM labeling requirements 251
XBee-PRO 900HP and XBee-PRO XSC 251
FCC notices 251
Limited modular approval 252
Fixed base station and mobile applications 252
Portable applications and SAR testing 253
RF exposure statement 253
FCC-approved antennas (900 MHz) 254
Antennas approved for use with the XBee-PRO 900HP RF Module 254
FCC publication 996369 related information 260
ISED (Innovation, Science and Economic Development Canada) 262
Labeling requirements 262
Contains IC: 1846A-XB900HP 262
Transmitters for detachable antennas 262
Detachable antenna 262
Brazil ANATEL 263
Mexico IFETEL 264
OEM labeling requirements 264
IDA (Singapore) certification 264
Labeling 264
Frequency band 265
Antenna gain 265
Legacy S3B hardware certifications
Agency certifications - United States 267
United States (FCC) 267
OEM labeling requirements 267
XBee PRO S3 267
XBee PRO S3B 267
FCC notices 268
Limited modular approval 268
Fixed base station and mobile applications 269
Portable applications and SAR testing 269
RF exposure statement 269
ISED (Innovation, Science and Economic Development Canada) 270
Labeling requirements 270
Contains IC: 1846A-XB900HP 270
Contains IC: 1846A-XBEEXSC or Contains IC: 1846A-XBPS3B 270
Antenna options: 900 MHz antenna listings 271
Transmitters with detachable antennas 276
Detachable antenna 277
Brazil ANATEL 278
XBee®-PRO 900HP/XSC RF Modules
13
About the XBee-PRO 900HP RF Module
The XBee-PRO 900HP RF Modules consist of firmware loaded onto XBee-PRO S3B hardware. These
embedded RF devices provide wireless connectivity to end-point devices in mesh networks.
You can build networks up to 128 nodes using the XBee devices. For larger networks of up to 1,000 or
more nodes, we offer RF optimization services to assist with proper network configuration.
For more information network configuration, contact Digi Technical Support.
Note The XBee-PRO 900HP RF Module is not backward compatible with the legacy XBee-PRO 900
(Part Number: XBP09-DP…) or XBee-PRO DigiMesh 900 (Part Number: XBP09-DM…) RF modules.
The XBee-PRO S3B hardware consists of:
n One Energy Micro EFM
n One Analog Devices ADF7023 radio transceiver
n One RF power amplifier
n One NXP MC9S08QE32
User guide structure
This user guide contains documentation for two RF protocols: XStream Compatible (XSC) and 900HP.
The XSC firmware is provided for customers who need compatibility with existing networks that need
to be 9XStream compatible. Customers who do not require this compatibility should not use the XSC
firmware, but rather the newer 900HP firmware.
The XSC firmware section at the back of this user guide contains documentation for the XSC firmware
only. All other firmware documentation in the user guide is applicable to the 900HP firmware only. For
more information about XSC firmware see the XSC firmware section.
The XBee-PRO 900HP RF Module is not backward compatible with the legacy XBee-PRO 900 (Part
Number: XBP09-DP…) or XBee-PRO DigiMesh 900 (Part Number: XBP09-DM…) RF Modules.
The following table describes how to use this user guide based on the Digi part number for the
module:
®
32G230F128 microcontroller
®
microcontroller, only in the programmable version of the XBee
XBee®-PRO 900HP/XSC RF Modules
14
About the XBee-PRO 900HP RF Module User guide structure
PreDigi Part
Numbers FCC ID
Hardware
Platform
installed
Firmware
Firmware
Available
Regulatory
Information
XBP09-XC… MCQ-
XBEEXSC
XBP9B-XC*T-001
(revision G and earlier)
MCQ-
XBPS3B
XBP9B-XC*T-002
(revision G and earlier)
XBP9B-XC*T-021
(revision F and earlier)
XBP9B-XC*T-022
(revision F and earlier)
XBP9B-XC*T-001
(revision H and later)
MCQ-
XB900HP
XBP9B-XC*T-002
(revision H and later)
XBP9B-XC*T-021
(revision G and later)
XBP9B-XC*T-022
(revision G and later)
all other part numbers
beginning XBP9B-XC...
XBP9B-D… MCQ-
XB900HP
1
S3
XSC XSC Legacy S3B
hardware
certifications
S3B XSC XSC Legacy S3B
hardware
certifications
S3B XSC XSC /
900HP
S3B 900HP XSC /
900HP
1
The S3 hardware variant is a legacy design that is obsolete. New and old designs should use the S3B hardware
variant.
XBee®-PRO 900HP/XSC RF Modules
15
Technical specifications
Performance specifications 17
Power requirements 17
General specifications 18
Networking specifications 18
Regulatory conformity summary 18
Serial communication specifications 19
GPIO specifications 19
Secondary processor specifications 20
XBee®-PRO 900HP/XSC RF Modules
16
Technical specifications Performance specifications
Performance specifications
This table describes the performance specifications for the devices.
Note Range figure estimates are based on free-air terrain with limited sources of interference. Actual
range will vary based on transmitting power, orientation of transmitter and receiver, height of
transmitting antenna, height of receiving antenna, weather conditions, interference sources in the
area, and terrain between receiver and transmitter, including indoor and outdoor structures such as
walls, trees, buildings, hills, and mountains.
Specification
Ideal RF line-of-sight
range
Transmit power output 24 dBm (250 mW) (software selectable)
RF data rate (high) 200 kb/s
RF data rate (low) 10 kb/s
Serial UART interface Complementary metal–oxide–semiconductor (CMOS) Serial universal
Serial interface data
rate (software
selectable)
Receiver sensitivity
(typical)
Power requirements
The following table describes the power requirements for the XBee-PRO 900HP RF Module.
Value
10 kb/s: up to 9 miles (15.5 km)
200 kb/s: up to 4 miles (6.5 km)
(with 2.1 dB dipole antennas)
asynchronous receiver/transmitter (UART), baud rate stability of <1%
9600-230400 baud
-101 dBm, high data rate
-110 dBm, low data rate
Specification Value
Supply voltage 2.1 to 3.6 VDC
Transmit current PL = 4: 215 mA typical, (290 mA max)
Idle/receive current 29 mA typical at 3.3 V (35 mA max)
Sleep current 2.5 µA (typical)
1
Supply voltages of less than 3.0 V may reduce performance. Output power and receiver sensitivity may
degrade.
XBee®-PRO 900HP/XSC RF Modules
1
PL = 3: 160 mA typical
PL = 2: 120 mA typical
PL = 1: 95 mA typical
PL = 0: 60 mA typical
17
Technical specifications General specifications
General specifications
The following table describes the general specifications for the devices.
Specification Value
Operating frequency band
Dimensions 3.29 cm x 2.44 cm x 0.546 cm (1.297" x 0.962" x 0.215)
Weight 5 to 8 grams, depending on the antenna option
Operating temperature -40 ºC to 85 º C (industrial)
Antenna options Integrated wire, U. FL RF connector, reverse-polarity SMA
Digital I/O Fifteen (15) I/O lines,
1
902 to 928 MHz (software selectable channels)
Dimensions do not include connector/antenna or pin lengths
connector
Analog-to-digital converter
(ADC)
Four (4)10-bit analog inputs
Networking specifications
The following table provides the networking specifications for the device.
Specification Value
Supported network topologies Mesh, point-to-point, point-to-multipoint, peer-to-peer
Number of channels, user selectable
channels
Addressing options Personal Area Network identifier (PAN ID), Preamble ID, and
Encryption 128 bit Advanced Encryption Standard (AES)
64 channels available
64-bit addresses
Regulatory conformity summary
This table describes the agency approvals for the devices.
Country Approval
United States (FCC Part 15.247) MCQ-XB900HP
Innovation, Science and Economic Development Canada
(ISED)
1
Supply voltages of less than 3.0 V may reduce performance. Output power and receiver sensitivity may
degrade.
XBee®-PRO 900HP/XSC RF Modules
1846A-XB900HP
18
Technical specifications Serial communication specifications
Country Approval
Australia RCM
Brazil ANATEL 3727-12-1209
Singapore License No. DA105737 (XB900HP only)
Mexico IFETEL (XB900HP listed in Mexico
IFETEL)
RoHS2 Compliant
Serial communication specifications
The XBee-PRO 900HP RF Module supports both Universal Asynchronous Receiver / Transmitter
(UART) and Serial Peripheral Interface (SPI)serial connections.
UART pin assignments
UART pins Device pin number
DOUT 2
DIN / CONFIG 3
CTS / DIO7 12
RTS / DIO6 16
SPI pin assignments
SPI pins Device pin number
SPI_SCLK / DIO18 18
SPI_SSEL / DIO17 17
SPI_MOSI / DIO16 11
SPI_MISO / DIO15 4
SPI_ATTN / DIO1 19
GPIO specifications
XBee devices have 15 General Purpose Input/Output (GPIO) ports available. The precise list depends
on the device configuration as some devices use the GPIO pins for purposes such as serial
communication. The following table shows the electrical specifications for the GPIO pins.
XBee®-PRO 900HP/XSC RF Modules
19
Technical specifications Secondary processor specifications
GPIO electrical specification Value
Voltage - supply 2.1 - 3.6 V (3.0 V or higher required for optimal performance)
Low Schmitt switching threshold 0.3 x V
High Schmitt switching threshold 0.7 x V
DD
DD
Input pull-up resistor value 40 kΩ
Input pull-down resistor value 40 kΩ
Output voltage for logic 0 0.05 x V
Output voltage for logic 1 0.95 x V
DD
DD
Output source current 2 mA
Output sink current 2 mA
Total output current (for GPIO pins) 48 mA
Note For information about Mexico IFETEL, see Mexico IFETEL. Only the XBee-PRO 900HP devices
listed are approved by IFETEL.
Secondary processor specifications
If the device has the programmable secondary processor, add the values from the following tables to
the specifications listed in the Power requirements specifications. For more information about
transmit, receive, and sleep currents, see Power requirements.
For example, if the secondary processor runs at 20 MHz and the primary processor is in receive mode,
then the new current value is:
I
= Ir2+ Irx= 14 mA + 9 mA = 23 mA
total
where Ir2is the runtime current of the secondary processor and Irxis the receive current of the
primary processor.
Optional secondary processor specification
Runtime current for 32 k running at 20 MHz +14 mA
Runtime current for 32 k running at 1 MHz +1 mA
Sleep current +0.5µ A typical
For additional specifications see the NXP datasheet
and manual
Voltage requirement for secondary processor to
operate at maximum clock frequency
XBee®-PRO 900HP/XSC RF Modules
Add these numbers to power requirement
specifications
(add to RX, TX, and sleep currents
depending on mode of operation)
MC9S08QE32
2.4 to 3.6 VDC
20
Technical specifications Secondary processor specifications
Add these numbers to power requirement
specifications
(add to RX, TX, and sleep currents
Optional secondary processor specification
Minimum reset pulse for programmable variant 100 nS
Minimum reset pulse to radio 50 nS
Voltage reference (VREF) range 1.8 VDC to VCC
depending on mode of operation)
XBee®-PRO 900HP/XSC RF Modules
21
Hardware
Mechanical drawings 23
Pin signals 24
Design notes 26
XBee®-PRO 900HP/XSC RF Modules
22
Hardware Mechanical drawings
Mechanical drawings
The following figures show the mechanical drawings for the XBee-PRO 900HP RF Module. The
drawings do not show antenna options.
XBee®-PRO 900HP/XSC RF Modules
23
Hardware Pin signals
Pin signals
The following table shows the pin signals and their descriptions. The table specifies signal direction
with respect to the device. For more information on pin connections, see Design notes.
Pin # Name Direction
1 VCC Power supply
XBee®-PRO 900HP/XSC RF Modules
Default
state Description
24
Hardware Pin signals
Default
Pin # Name Direction
2 DOUT/DIO13 Both Output GPIO/UART data out
state Description
3 DIN/CONFIG
/DIO14
4 DIO12/SPI_MISO Both Output GPIO/SPI slave out
5 RESET Input Device reset. Drive low to reset the device.
6 DIO10/PWM0 Both GPIO/RX signal strength indicator
7 DIO11/PWM1 Both GPIO/pulse width modulator
8 Reserved Disabled Do not connect
9 DTR/SLEEP_
RQ/DIO8
10 GND Ground
11 DIO4/SPI_MOSI Both GPIO/SPI slave in
12 CTS/DIO7 Both Output GPIO/clear-to-send flow control
13 ON_SLEEP /DIO9 Output Output GPIO/module status indicator
Both Input GPIO/UART data in
This is also an output with an open drain
configuration with an internal 20 kΩ pull-up
(never drive to logic high, as the device may be
driving it low). The minimum pulse width is 1
mS.
Both Input GPIO/pin sleep control line (DTR on the
development board)
14 VREF Input Internally used for the programmable
secondary processor. For compatibility with
other XBee devices, we recommend
connecting this pin to the voltage reference if
you desire analog sampling. Otherwise,
connect to GND.
15 Associate/DIO5 Both Output GPIO/associate indicator
16 RTS /DIO6 Both Input GPIO/request-to-send flow control
17 AD3/DIO3/SPI_
SSEL
18 AD2/DIO2/SPI_
CLK
19 AD1/DIO1/SPI_
ATTN
20 AD0/DIO0 Both GPIO/analog input
Both GPIO/analog input/SPI slave select
Both GPIO/analog input /SPI clock
Both GPIO/analog input /SPI attention
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Hardware Design notes
Design notes
The XBee modules do not require any external circuitry or specific connections for proper operation.
However, there are some general design guidelines that we recommend to build and troubleshoot a
robust design.
Power supply design
A poor power supply can lead to poor radio performance, especially if you do not keep the supply
voltage within tolerance or if the noise is excessive. To help reduce noise, place a 1.0 µF and 47 pF
capacitor as near as possible to pin 1 on the PCB. If you are using a switching regulator for the power
supply, switch the frequencies above 500 kHz. Limit the power supply ripple to a maximum 50 mV
peak to peak.
For designs using the programmable modules, we recommend an additional 10 µF decoupling cap
near pin 1 of the device. The nearest proximity to pin 1 of the three caps should be in the following
order:
1. 47 pf
2. 1 µF
3. 10 µF
Board layout
We design XBee modules to be self-sufficient and have minimal sensitivity to nearby processors,
crystals or other printed circuit board (PCB) components. Keep power and ground traces thicker than
signal traces and make sure that they are able to comfortably support the maximum current
specifications. There are no other special PCB design considerations to integrate XBee modules, with
the exception of antennas.
Antenna performance
Antenna location is important for optimal performance. The following suggestions help you achieve
optimal antenna performance. Point the antenna up vertically (upright). Antennas radiate and receive
the best signal perpendicular to the direction they point, so a vertical antenna's omnidirectional
radiation pattern is strongest across the horizon.
Position the antennas away from metal objects whenever possible. Metal objects between the
transmitter and receiver can block the radiation path or reduce the transmission distance. Objects
that are often overlooked include:
n Metal poles
n Metal studs
n Structure beams
n Concrete, which is usually reinforced with metal rods
If you place the device inside a metal enclosure, use an external antenna. Common objects that have
metal enclosures include:
n Vehicles
n Elevators
n Ventilation ducts
n Refrigerators
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Hardware Design notes
n Microwave ovens
n Batteries
n Tall electrolytic capacitors
Use the following additional guidelines for optimal antenna performance:
n Do not place XBee modules with the chip antenna inside a metal enclosure.
n Do not place any ground planes or metal objects above or below the antenna.
n For the best results, mount the device at the edge of the host PCB. Ensure that the ground,
power, and signal planes are vacant immediately below the antenna section.
Recommended pin connections
The only required pin connections for two-way communication are VCC, GND, DOUT and DIN. To
support serial firmware updates, you must connect VCC, GND, DOUT, DIN, RTS, and DTR.
Do not connect any pins that are not in use. Use the PR and PD commands to pull all inputs on the
radio high with internal pull-up resistors. Unused outputs do not require any specific treatment.
For applications that need to ensure the lowest sleep current, never leave unconnected inputs
floating. Use internal or external pull-up or pull-down resistors, or set the unused I/O lines to outputs.
You can connect other pins to external circuitry for convenience of operation including the Associate
LED pin (pin 15) and the Commissioning pin (pin 20). The Associate LED pin flashes differently
depending on the state of the module, and a pushbutton attached to pin 20 can enable various
deployment and troubleshooting functions without you sending UART commands. For more
information, see Commissioning pushbutton and associate LED.
Only the programmable versions of these devices use the VREF pin (pin 14). For compatibility with
other XBee modules, we recommend connecting this pin to a voltage reference if you want to enable
analog sampling. Otherwise, connect to GND.
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XBee®-PRO 900HP/XSC RF Modules 28
Hardware Design notes
Module operation for the programmable variant
The modules with the programmable option have a secondary processor with 32k of flash and 2k of RAM. This allows module integrators to put custom
code on the XBee module to fit their own unique needs. The DIN, DOUT, RTS, CTS, and RESET lines are intercepted by the secondary processor to allow it
to be in control of the data transmitted and received. All other lines are in parallel and can be controlled by either the internal microcontroller or the
MC9SO8QE micro; see the block diagram in Operation for details. The internal microcontroller by default has control of certain lines. The internal
microcontroller can release these lines by sending the proper command(s) to disable the desired DIO line(s). For more information about commands, see
AT commands.
For the secondary processor to sample with ADCs, the XBee 14 (VREF) must be connected to a reference voltage.
Digi provides a bootloader that can take care of programming the processor over-the-air or through the serial interface. This means that over-the-air
updates can be supported through an XMODEM protocol. The processor can also be programmed and debugged through a one wire interface BKGD (Pin
8).
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Hardware Design notes
Hardware Design notes
Programmable XBee SDK
The XBee Programmable module is equipped with a NXP MC9S08QE32 application processor. This
application processor comes with a supplied bootloader. To interface your application code running on
this processor to the XBee Programmable module's supplied bootloader, use the Programmable XBee
SDK.
To use the SDK, you must also download CodeWarrior. The download links are:
n CodeWarrior IDE: http://ftp1.digi.com/support/sampleapplications/40003004_B.exe
n Programmable XBee SDK: http://ftp1.digi.com/support/sampleapplications/40003003_D.exe
If these revisions change, search for the part number on Digi’s website. For example, search for
40003003.
Install the IDE first, and then install the SDK.
The documentation for the Programmable XBee SDK is built into the SDK, so the Getting Started guide
appears when you open CodeWarrior.
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