Digi XBee3-PRO, XBee3-PRO Micro, XBee3, XBee3-PRO surface-mount Hardware Reference Manual

XBee3™

RF Module

Hardware Reference Manual

Revision history—900001543

Revision Date Description

A October 2017 Initial release.

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United
States and other countries worldwide. All other trademarks mentioned in this document are the
property of their respective owners.

© 2017 Digi International Inc. All rights reserved.

Disclaimers

Information in this document is subject to change without notice and does not represent a
commitment on the part of Digi International. Digi provides this document “as is,” without warranty of
any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or
merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

Send comments

Documentation feedback: To provide feedback on this document, send your comments to

[e-mail].

Customer support

Digi Technical Support: Digi offers multiple technical support plans and service packages to help our

customers get the most out of their Digi product. For information on Technical Support plans and
pricing, contact us at +1 952.912.3444 or visit us at www.digi.com/support.

XBee3™ RF Module Hardware Reference Manual

2

Contents

XBee3™ RF Module Hardware Reference Manual

General XBee3 specifications

General specifications 7
Regulatory conformity summary 7
Serial communication specifications 8

UART pin assignments 8

GPIO specifications 8

802.15.4-specific specifications

Performance specifications 10
Power requirements 10
Networking and security specifications 10
Communication interface specifications 10

Hardware

Mechanical drawings 12

XBee3 surface-mount (U.FL/RF Pad) 12
XBee3 surface-mount (embedded antenna) 13
XBee3 micro (U.FL/RF Pad) 14

XBee3 micro (chip antenna) 15
Pin signals for the XBee3 surface-mount module 15
Pin signals for the XBee3 micro module 18
Design notes 21

Power supply design 21

Board layout 21

Antenna performance 22

Recommended pin connections 22

Design notes for surface mount PCB antenna and micro footprint chip antenna devices 22

Design notes for RF pad devices 24

Regulatory information

United States (FCC) 28

OEM labeling requirements 28

FCC notices 28

XBee3™ RF Module Hardware Reference Manual

3

FCC-approved antennas (2.4 GHz) 29

RF exposure 35
Europe (CE) 35

Maximum power and frequency specifications 36

OEM labeling requirements 36

Declarations of conformity 37

Antennas 37
IC (Industry Canada) 37

Labeling requirements 37

For XBee3: 37

RF Exposure 38

Manufacturing information

Recommended solder reflow cycle 40
Handling and storage 40
Recommended footprint 41
Flux and cleaning 44
Reworking 44

XBee3™ RF Module Hardware Reference Manual

4

XBee3™ RF Module Hardware Reference Manual

This manual provides information for the XBee3 RF Module hardware. The XBee3 RF Module can be
either the micro or the surface-mount form factor.

For more information about the operation and programming functions of the device, see the XBee3®

Zigbee® User Guide.

XBee3™ RF Module Hardware Reference Manual

5

General XBee3 specifications

The following tables provide general specifications for the hardware.

General specifications 7
Regulatory conformity summary 7
Serial communication specifications 8
GPIO specifications 8

XBee3™ RF Module Hardware Reference Manual

6

General XBee3 specifications General specifications

General specifications

The following table describes the general specifications for the devices.

Specification

Operating frequency
band

Form factor Micro Surface-mount

Dimensions

Operatingtemperature -40 to 85 °C (industrial)

Antenna options

XBee3/XBee3-PRO Micro

ISM 2.4 - 2.5 GHz

Micro: 1.36 cm x 1.93 cm x 0.241 cm
(0.534 in x 0.760 in x 0.095 in)

RF pad, chip antenna, or U.FL
connector

Regulatory conformity summary

This table describes the agency approvals for the devices.

Approval XBee3 XBee3-PRO

United States (FCC Part 15.247)

Industry Canada (IC)

FCC/IC Test Transmit Power Output range -6.8 to +19.9 dBm -6.8 to +19.9 dBm

XBee3/XBee3-PRO surface-mount

Surface-mount: 2.199 x 3.4 x 0.368
cm (0.866 x 1.33 x 0.145 in)

RF pad, embedded antenna, or
U.FL connector

FCC ID: MCQ-XBEE3

IC: 1846A-XBEE3

FCC ID: MCQ-XBEE3

IC: 1846A-XBEE3

Europe (CE) Yes

RoHS Compliant

XBee3™ RF Module Hardware Reference Manual

7

General XBee3 specifications Serial communication specifications

Serial communication specifications

The XBee3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART).

UART pin assignments

Specifications Device pin number

UART pins XBee3 Micro

DOUT/DIO13 3

DIN / CONFIG/DIO14 4

CTS / DIO7 24

RTS/ DIO6 27

GPIO specifications

XBee3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list
depends on the device configuration as some GPIO pads are used for purposes such as serial
communication.

GPIO electrical specification Value

Voltage - supply 2.1 - 3.6 V

Low switching threshold 0.3 x VCC

High switching threshold 0.7 x VCC

Input pull-up resistor value

Input pull-down resistor value

XBee3 Surface-mount

3

4

25

29

40 kΩ (typical)

40 kΩ (typical)

Output voltage for logic 0 0.2 x VCC (maximum)

Output voltage for logic 1 0.8 x VCC (minimum)

Output source/sink current 50 mA (maximum)

Total output current (for GPIO pads) 200 mA (maximum)

XBee3™ RF Module Hardware Reference Manual

8

802.15.4-specific specifications

The following tables provide specifications specific to the XBee3 RF Module when using the 802.15.4
physical layer, for example: Zigbee, DigiMesh, and so forth.

Performance specifications 10
Power requirements 10
Networking and security specifications 10
Communication interface specifications 10

XBee3™ RF Module Hardware Reference Manual

9

802.15.4-specific specifications Performance specifications

Performance specifications

The following table describes the performance specifications for the devices.

Specification

Indoor/urban range Up to 60 m (200 ft)

Outdoor RF line-of-sight range Up to 1200 m (4000 ft)

Transmit power output (maximum) 6.3 mW (+8 dBm)

RF data rate 250,000 b/s

Receiver sensitivity -103 dBm

Power requirements

The following table describes the power requirements for the XBee3 RF Module.

Specification

Adjustable power Yes

Supply voltage 2.1 - 3.6 V

Operating current (transmit) 40 mA @ +3.3 V, +8 dBm 135 mA @ +3.3 V, +19 dBm

Operating current (receive)

Power-down current 1.7 µA @ 25° C

XBee3

15 mA

XBee3

XBee3-PRO

Up to 90 m (300 ft)

Up to 3200 m (2 mi)

79 mW (+19 dBm)

XBee3-PRO

Networking and security specifications

The following table describes the networking and security specifications for the devices.

Specification

Supported network topologies Point-to-point, point-to-multipoint, peer-to-peer, and DigiMesh

Number of channels 16 Direct sequence channels

Interface immunity Direct Sequence Spread Spectrum (DSSS)

Channels 11 to 26

Addressing options PAN ID and addresses, cluster IDs and endpoints (optional)

XBee3/XBee3-PRO

Communication interface specifications

The following table provides the device's communication interface specifications.

Interface options

UART 250 Kb/s maximum

XBee3™ RF Module Hardware Reference Manual

10

Hardware

Mechanical drawings 12
Pin signals for the XBee3 surface-mount module 15
Pin signals for the XBee3 micro module 18
Design notes 21

XBee3™ RF Module Hardware Reference Manual

11

Hardware Mechanical drawings

Mechanical drawings

The following mechanical drawings of the XBee3 RF Modules show all dimensions in inches.

XBee3 surface-mount (U.FL/RF Pad)

XBee3™ RF Module Hardware Reference Manual

12

Hardware Mechanical drawings

XBee3 surface-mount (embedded antenna)

XBee3™ RF Module Hardware Reference Manual

13

Hardware Mechanical drawings

XBee3 micro (U.FL/RF Pad)

XBee3™ RF Module Hardware Reference Manual

14

Hardware Pin signals for the XBee3 surface-mount module

XBee3 micro (chip antenna)

Pin signals for the XBee3 surface-mount module

The following drawing shows the surface-mount (SMT) pin locations.

XBee3™ RF Module Hardware Reference Manual

15

Hardware Pin signals for the XBee3 surface-mount module

The following table shows the pin signals and their descriptions for the surface-mount device.

Default

Pin# Name Direction

1 GND - - Ground.

2 VCC - - Power supply.

3 DOUT /DIO13 Both Output UART data out

4 DIN / CONFIG /DIO14 Both Input UART data in

5 DIO12 Both GPIO.

6 RESET Input Device reset.

7 RSSI PWM/DIO10 Both Output RX signal

8 PWM1/DIO11 Both Disabled Pulse width

9 [reserved] - Disabled Do not connect.

state Description

/GPIO.

/GPIO.

strength
Indicator /GPIO.

modulator/GPIO.

XBee3™ RF Module Hardware Reference Manual

16

Hardware Pin signals for the XBee3 surface-mount module

Default

Pin# Name Direction

10 DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control

11 GND - - Ground.

12 SPI_ATTN/ BOOTMODE/DIO19 Output Output

13 GND - - Ground.

14 SPI_CLK /DIO18 Input Input Serial peripheral

15 SPI_SSEL/DIO17 Input Input Serial peripheral

state Description

Line/GPIO.

Serial peripheral
interface
attention .
Do not tie low on
reset.

interface
clock/GPIO.

interface not
select/GPIO.

16 SPI_MOSI/DIO16 Input Input Serial peripheral

interface data
in/GPIO.

17 SPI_MISO/DIO15 Output Output Serial peripheral

interface data
out/GPIO.

18 [reserved]* - Disabled Do not connect.

19 [reserved]* - Disabled

20 [reserved]* - Disabled

21 [reserved]* - Disabled

22 GND - - Ground.

23 [reserved] - Disabled Do not connect.

24 DIO4 Both Disabled GPIO.

25 CTS/DIO7 Both Output Clear to send

26 ON/SLEEP/DIO9 Both Output Device status

Do not connect.

Do not connect.

Do not connect.

flow
control/GPIO.

indicator/GPIO

XBee3™ RF Module Hardware Reference Manual

17

Hardware Pin signals for the XBee3 micro module

Default

Pin# Name Direction

27 [reserved] - Disabled

28 ASSOCIATE/DIO5 Both Output Associate

29 RTS/DIO6 Both Input Request to send

30 AD3/DIO3 Both Disabled Analog

state Description

Do not connect
or connect to
Ground.

Indicator/GPIO.

flow control
/GPIO.

input/GPIO.

31 AD2/DIO2 Both Disabled

32 AD1/DIO1 Both Disabled

33 AD0 /DIO0 Both Input Analog input /

34 [reserved] - Disabled Do not connect.

35 GND - - Ground.

36 RF Both - RF I/O for RF

37 [reserved] - Disabled Do not connect.

Signal direction is specified with respect to the device.
This is a complete list of functionalities. See the applicable software manual for available
functionalities.
See Design notes for details on pin connections.
* Refer to Writing custom firmware for instructions on using these pins if JTAG functions are needed.

Analog
input/GPIO

Analog
input/GPIO.

GPIO /
Commissioning
button.

pad variant.

Pin signals for the XBee3 micro module

The following drawing shows the micro pin locations.

XBee3™ RF Module Hardware Reference Manual

18

Hardware Pin signals for the XBee3 micro module

The following table shows the pin signals and their descriptions for the XBee3 Micro device.

Default

Pin# Name Direction

1 GND - - Ground.

2 VCC - - Power supply.

3 DOUT /DIO13 Both Output UART data out

4 DIN / CONFIG /DIO14 Both Input UART data in

5 DIO12 Both GPIO.

6 RESET Input Device reset.

7 RSSI PWM/DIO10 Both Output RX signal

8 PWM1/DIO11 Both Disabled Pulse width

9 DTR/SLEEP_RQ /DIO8 Both Input Pin sleep control

state Description

/GPIO.

/GPIO.

strength
Indicator /GPIO.

modulator/GPIO.

Line/GPIO.

10 GND - - Ground.

XBee3™ RF Module Hardware Reference Manual

19

Hardware Pin signals for the XBee3 micro module

Default

Pin# Name Direction

11 SPI_ATTN/ BOOTMODE/DIO19 Output Output

12 GND - - Ground.

13 SPI_CLK /DIO18 Input Input Serial peripheral

14 SPI_SSEL/DIO17 Input Input Serial peripheral

15 SPI_MOSI/DIO16 Input Input Serial peripheral

16 SPI_MISO/DIO15 Output Output Serial peripheral

state Description

Serial peripheral
interface
attention
Do not tie low on
reset.

interface
clock/GPIO.

interface not
select/GPIO.

interface data
in/GPIO.

interface data
out/GPIO.

17 [reserved]* - Disabled Do not connect.

18 [reserved]* - Disabled

19 [reserved]* - Disabled

20 [reserved]* - Disabled

21 GND - - Ground.

22 [reserved] - Disabled Do not connect.

23 DIO4 Both Disabled GPIO.

24 CTS/DIO7 Both Output Clear to send

25 ON/SLEEP/DIO9 Both Output Device status

26 ASSOCIATE/DIO5 Both Output Associate

27 RTS/DIO6 Both Input Request to send

Do not connect.

Do not connect.

Do not connect.

flow
control/GPIO.

indicator/GPIO.

Indicator/GPIO.

flow control
/GPIO.

XBee3™ RF Module Hardware Reference Manual

20

Hardware Design notes

Default

Pin# Name Direction

28 AD3/DIO3 Both Disabled Analog

state Description

input/GPIO.

29 AD2/DIO2 Both Disabled

30 AD1/DIO1 Both Disabled

31 AD0 /DIO0 Both Input Analog input /

32 GND - - Ground.

33 RF Both - RF I/O for RF

34 GND - - Ground.

Signal direction is specified with respect to the device.
This is a complete list of functionalities. See the applicable software manual for available
functionalities.
See Design notes for details on pin connections.
* Refer to Writing custom firmware for instructions on using these pins if JTAG functions are needed.

Design notes

XBee3 modules do not require any external circuitry or specific connections for proper operation.
However, there are some general design guidelines that we recommend to build and troubleshoot a
robust design.

Analog
input/GPIO.

Analog
input/GPIO.

GPIO /
Commissioning
button.

pad variant.

Power supply design

A poor power supply can lead to poor radio performance, especially if you do not keep the supply
voltage within tolerance or if it is excessively noisy. To help reduce noise, place a 1.0 µF and 8.2 pF
capacitor as near as possible to XBee3 pad 2 (VCC) on the PCB. Adding a 10uF decoupling capacitor is
also recommended. If you are using a switching regulator for the power supply, switch the frequencies
above 500 kHz. Limit the power supply ripple to a maximum 50 mV peak to peak. For best results,
place the lower capacitance capacitors closest to the XBee3 module.

Board layout

We design XBee3 modules to be self-sufficient and have minimal sensitivity to nearby processors,
crystals or other printed circuit board (PCB) components. Keep power and ground traces thicker than
signal traces and make sure that they are able to comfortably support the maximum current
specifications. There are no other special PCB design considerations to integrate XBee3 modules, with
the exception of antennas.

XBee3™ RF Module Hardware Reference Manual

21

Hardware Design notes

Antenna performance

Antenna location is important for optimal performance. The following suggestions help you achieve
optimal antenna performance. Point the antenna up vertically (upright). Antennas radiate and receive
the best signal perpendicular to the direction they point, so a vertical antenna's omnidirectional
radiation pattern is strongest across the horizon.

Position the antennas away from metal objects whenever possible. Metal objects between the
transmitter and receiver can block the radiation path or reduce the transmission distance. Objects
that are often overlooked include:

n Metal poles

n Metal studs

n Structure beams

n Concrete, which is usually reinforced with metal rods

If you place the device inside a metal enclosure, use an external antenna. Common objects that have
metal enclosures include:

n Vehicles

n Elevators

n Ventilation ducts

n Refrigerators

n Microwave ovens

n Batteries

n Tall electrolytic capacitors

Use the following additional guidelines for optimal antenna performance:

n Do not place XBee3 modules with the chip antenna or the embedded antenna inside a metal

enclosure.

n Do not place any ground planes or metal objects above or below the antenna.

n For the best results, mount the device at the edge of the host PCB. Ensure that the ground,

power, and signal planes are vacant immediately below the antenna section.

Recommended pin connections

The only required pin connections for two-way communication are VCC, GND, DOUT and DIN. To
support serial firmware updates, you must connect VCC, GND, DOUT, DIN, RTS, and DTR.

For applications that need to ensure the lowest sleep current, never leave unconnected inputs
floating. Use internal or external pull-up or pull-down resistors, or set the unused I/O lines to outputs.

Design notes for surface mount PCB antenna and micro footprint
chip antenna devices

Position PCB/chip antenna devices so there are no ground planes or metal objects above or below the
antenna. For best results, do not place the device in a metal enclosure, as this may greatly reduce the
range. Place the device at the edge of the PCB on which it is mounted. Make sure the ground, power
and signal planes are vacant immediately below the antenna section.

XBee3™ RF Module Hardware Reference Manual

22

Hardware Design notes

The following drawings illustrate important recommendations when you are designing with PCB/chip
antenna devices. For optimal performance, do not mount the device on the RF pad footprint described
in the next section, because the footprint requires a ground plane within the PCB antenna keep out
area.

Surface-mount embedded antenna keepout area

Notes

1. We recommend non-metal enclosures. For metal enclosures, use an external antenna.

2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the

antenna.

3. Maximize the distance between the antenna and metal objects that might be mounted in the

keepout area.

4. These keepout area guidelines do not apply for chip antennas or external RF connectors.

XBee3™ RF Module Hardware Reference Manual

23

Hardware Design notes

XBee3 Micro keepout area

Notes

1. We recommend non-metal enclosures. For metal enclosures, use an external antenna.

2. Keep metal chassis or mounting structures in the keepout area at least 2.54 cm (1 in) from the

antenna.

3. Maximize the distance between the antenna and metal objects that might be mounted in the

keepout area.

4. These keepout area guidelines do not apply for surface-mount embedded antennas or external

RFconnectors.

Design notes for RF pad devices

The RF pad is a soldered antenna connection. The RF signal travels from the RF pad connection (pad
33 on micro modules and pad 36 on surface-mount modules) on the device to the antenna through an
RF trace transmission line on the PCB. Any additional components between the device and antenna
violates modular certification. The controlled impedance for the RF trace is 50 Ω.

We recommend using a microstrip trace, although you can also use a coplanar waveguide if you need
more isolation. A microstrip generally requires less area on the PCB than a coplanar waveguide. We do
not recommend using a stripline because sending the signal to different PCB layers can introduce
matching and performance problems.

Following good design practices is essential when implementing the RF trace on a PCB. Consider the
following points:

n Minimize the length of the trace by placing the RPSMA jack close to the device.

n Connect all of the grounds on the jack and the device to the ground planes directly or through

closely placed vias.

XBee3™ RF Module Hardware Reference Manual

24

Hardware Design notes

n Space any ground fill on the top layer at least twice the distance d, for Micro modules at least

0.028" and for surface mount modules at least 0.050".

Additional considerations:

n The top two layers of the PCB have a controlled thickness dielectric material in between.

n The second layer has a ground plane which runs underneath the entire RF pad area. This

ground plane is a distance d, the thickness of the dielectric, below the top layer.

n The RF trace width determines the impedance of the transmission line with relation to the

ground plane. Many online tools can estimate this value, although you should consult the PCB

manufacturer for the exact width.

Implementing these design suggestions helps ensure that the RF pad device performs to its
specifications.

The following figures show a layout example of a host PCB that connects an RF pad device to a right
angle, through-hole RPSMA jack.

Number Description

1

Maintain a distance of at least 2 d between microstrip and ground fill.

XBee3™ RF Module Hardware Reference Manual

25

Hardware Design notes

Number Description

2 RF pad pin.

3 50 Ω microstrip trace.

4 RF connection of RPSMA jack.

This example is on a surface-mount device. The width in this example is approximately 0.045" for a 50
Ω trace, assuming d=0.025”, and that the dielectric has a relative permittivity of 4.4. This trace width
is a good fit with the device footprint's 0.060" pad width.

Note We do not recommend using a trace wider than the pad width, and using a very narrow trace

(under 0.010") can cause unwanted RF loss.

The following illustration shows PCB layer 2 of an example RF layout.

Number Description

1

2 Put a solid ground plane under RF trace to achieve the desired impedance.

XBee3™ RF Module Hardware Reference Manual

Use multiple vias to help eliminate ground variations.

26

Regulatory information

United States (FCC) 28
Europe (CE) 35
IC (Industry Canada) 37

XBee3™ RF Module Hardware Reference Manual

27

Regulatory information United States (FCC)

United States (FCC)

XBee3 RF Modules comply with Part 15 of the FCC rules and regulations. Compliance with the labeling
requirements, FCC notices and antenna usage guidelines is required.

To fulfill FCC Certification, the OEM must comply with the following regulations:

1. The system integrator must ensure that the text on the external label provided with this

device is placed on the outside of the final product.

2. RF Modules may only be used with antennas that have been tested and approved for use with

the modules.

OEM labeling requirements

WARNING! As an Original Equipment Manufacturer (OEM) you must ensure that FCC

labeling requirements are met. You must include a clearly visible label on the outside of
the final product enclosure that displays the following content:

Required FCC Label for OEM products containing the XBee3 RF Module

Contains FCC ID: MCQ-XBEE3

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1.) this device may not cause harmful interference and (2.) this device must accept any
interference received, including interference that may cause undesired operation.

FCC notices

IMPORTANT: XBee3 RF Modules have been certified by the FCC for use with other products without

any further certification (as per FCC section 2.1091). Modifications not expressly approved by Digi
could void the user's authority to operate the equipment.

IMPORTANT: OEMs must test final product to comply with unintentional radiators (FCC section 15.107
& 15.109) before declaring compliance of their final product to Part 15 of the FCC Rules.

IMPORTANT: The RF module has been certified for remote and base radio applications. If the module
will be used for portable applications, the device must undergo SAR testing.

This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates, uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions, may
cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures: Re-orient or relocate the receiving antenna,
Increase the separation between the equipment and receiver, Connect equipment and receiver to
outlets on different circuits, or Consult the dealer or an experienced radio/TV technician for help.

XBee3™ RF Module Hardware Reference Manual

28

Regulatory information United States (FCC)

FCC-approved antennas (2.4 GHz)

The XBee3 RF Module can be installed using antennas and cables constructed with non-standard
connectors (RPSMA, RPTNC, etc.) An adapter cable may be necessary to attach the XBee connector to
the antenna connector.

The modules are FCC approved for fixed base station and mobile applications for the channels
indicated in the tables below. If the antenna is mounted at least 25 cm (10 in) from nearby persons,
the application is considered a mobile application. Antennas not listed in the table must be tested to
comply with FCC Section 15.203 (Unique Antenna Connectors) and Section 15.247 (Emissions).

The antennas in the tables below have been approved for use with this module. Cable loss is required
when using gain antennas as shown in the tables.

Digi does not carry all of these antenna variants. Contact Digi Sales for available antennas.

XBee3™ RF Module Hardware Reference Manual

29

XBee3™ RF Module Hardware Reference Manual 30

Regulatory information United States (FCC)

XBee3 RF module

The following table shows the antennas approved for use with the XBee3 RF module.

All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option.

Required antenna cable loss (dB)

Type

Partnumber

Integral antennas

29000313 Integral PCB antenna (surface-mount only) 0.0 Fixed/Mobile 20 cm N/A N/A

29000710 Chip antenna (micro only) 0.0 Fixed/Mobile 20 cm N/A N/A

Dipole antennas

A24-HASM­450

A24-HABSM* Dipole (Articulated RPSMA) 2.1 Fixed 20 cm N/A N/A

29000095 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed/Mobile 20 cm N/A N/A

A24-HABUF­P5I

A24-HASM­525

Omni-directional antennas

A24-F2NF Omni-directional (Fiberglass base station) 2.1 Fixed/Mobile 20 cm N/A N/A

A24-F3NF Omni-directional (Fiberglass base station) 3.0 Fixed/Mobile 20 cm N/A N/A

(description)

Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed 20 cm N/A N/A

Dipole (Half-wave articulated bulkhead mount
U.FL. w/ 5” pigtail)

Dipole (Half-wave articulated RPSMA - 5.25") 2.1 Fixed 20 cm N/A N/A

Gain
(dBi) Application* Min. separation

2.1 Fixed/Mobile 20 cm N/A N/A

802.15.4 Based
Protocols (Ex: ZigBee)

BLE (when
available)

A24-F5NF Omni-directional (Fiberglass base station) 5.0 Fixed 20 cm N/A N/A

A24-F8NF Omni-directional (Fiberglass base station) 8.0 Fixed 2 m N/A N/A

XBee3™ RF Module Hardware Reference Manual 31

Regulatory information United States (FCC)

Required antenna cable loss (dB)

Partnumber

Type
(description)

Gain
(dBi) Application* Min. separation

802.15.4 Based
Protocols (Ex: ZigBee)

BLE (when
available)

A24-F9NF Omni-directional (Fiberglass base station) 9.5 Fixed 2 m N/A N/A

A24-F10NF Omni-directional (Fiberglass base station) 10.0 Fixed 2 m N/A N/A

A24-F12NF Omni-directional (Fiberglass base station) 12.0 Fixed 2 m N/A N/A

A24-W7NF Omni-directional (Fiberglass base station) 7.2 Fixed 2 m N/A N/A

A24-M7NF Omni-directional (Mag-mount base station) 7.2 Fixed 2 m N/A N/A

A24-F15NF Omni-directional (Fiberglass base station) 15.0 Fixed 2 m N/A N/A

Panel antennas

A24-P8SF Flat Panel 8.5 Fixed 2 m N/A N/A

A24-P8NF Flat Panel 8.5 Fixed 2 m N/A N/A

A24-P13NF Flat Panel 13.0 Fixed 2 m N/A N/A

A24-P14NF Flat Panel 14.0 Fixed 2 m N/A N/A

A24-P15NF Flat Panel 15.0 Fixed 2 m N/A N/A

A24-P16NF Flat Panel 16.0 Fixed 2 m N/A N/A

A24-P19NF Flat Panel 19.0 Fixed 2 m

N/A

N/A

Yagi antennas

A24-Y6NF Yagi (6-element) 8.8 Fixed 2 m N/A N/A

A24-Y7NF Yagi (7-element) 9.0 Fixed 2 m N/A N/A

A24-Y9NF Yagi (9-element) 10.0 Fixed 2 m N/A N/A

A24-Y10NF Yagi (10-element) 11.0 Fixed 2 m N/A N/A

XBee3™ RF Module Hardware Reference Manual 32

Required antenna cable loss (dB)

Regulatory information United States (FCC)

Type

Partnumber

A24-Y12NF Yagi (12-element) 12.0 Fixed 2 m N/A N/A

A24-Y13NF Yagi (13-element) 12.0 Fixed 2 m N/A N/A

A24-Y15NF Yagi (15-element) 12.5 Fixed 2 m N/A N/A

A24-Y16NF Yagi (16-element) 13.5 Fixed 2 m N/A N/A

A24-Y16RM Yagi (16-element, RPSMA connector) 13.5 Fixed 2 m N/A N/A

A24-Y18NF Yagi (18-element) 15.0 Fixed 2 m N/A N/A

(description)

Gain
(dBi) Application* Min. separation

802.15.4 Based
Protocols (Ex: ZigBee)

BLE (when
available)

XBee3™ RF Module Hardware Reference Manual 33

Regulatory information United States (FCC)

XBee3-PRO RF module

The following table shows the antennas approved for use with the XBee3-PRO RF Module.

All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option.

Required antenna cable loss (dB)

Gain

Partnumber Type (description)

Internal antennas

29000313 Integral PCB antenna (surface mount only) 0.0 Fixed/Mobile 20 cm N/A N/A

29000710 Chip antenna (micro only) 0.0 Fixed/Mobile 20 cm N/A N/A

Dipole antennas

A24-HASM­450

A24-HABSM* Dipole (Articulated RPSMA) 2.1 Fixed 20 cm N/A N/A

29000095 Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed/Mobile 20 cm N/A N/A

A24-HABUF­P5I

A24-HASM­525

Omni-directional antennas

A24-F2NF Omni-directional (Fiberglass base station) 2.1 Fixed/Mobile 20 cm N/A N/A

A24-F3NF Omni-directional (Fiberglass base station) 3.0 Fixed/Mobile 20 cm N/A N/A

Dipole (Half-wave articulated RPSMA - 4.5”) 2.1 Fixed 20 cm N/A N/A

Dipole (Half-wave articulated bulkhead mount
U.FL. w/ 5” pigtail)

Dipole (Half-wave articulated RPSMA - 5.25") 2.1 Fixed 20 cm N/A N/A

(dBi)

2.1 Fixed/Mobile 20 cm N/A N/A

Application*

Min
separation

802.15.4 Based Protocols
(Ex: ZigBee)

BLE (when
available)

A24-F5NF Omni-directional (Fiberglass base station) 5.0 Fixed 20 cm N/A N/A

A24-F8NF Omni-directional (Fiberglass base station) 8.0 Fixed 2 m N/A N/A

XBee3™ RF Module Hardware Reference Manual 34

Regulatory information United States (FCC)

Required antenna cable loss (dB)

Partnumber Type (description)

Gain
(dBi)

Application*

Min
separation

802.15.4 Based Protocols
(Ex: ZigBee)

BLE (when
available)

A24-F9NF Omni-directional (Fiberglass base station) 9.5 Fixed 2 m N/A N/A

A24-F10NF Omni-directional (Fiberglass base station) 10 Fixed 2 m N/A N/A

A24-F12NF Omni-directional (Fiberglass base station) 12 Fixed 2 m N/A N/A

A24-W7NF Omni-directional (Fiberglass base station) 7.2 Fixed 2 m N/A N/A

A24-M7NF Omni-directional (Mag-mount base station) 7.2 Fixed 2 m N/A N/A

A24-F15NF Omni-directional (Fiberglass base station) 15.0 Fixed 2 m N/A 2.0

Panel antennas

A24-P8SF Flat Panel 8.5 Fixed 2 m N/A N/A

A24-P8NF Flat Panel 8.5 Fixed 2 m N/A N/A

A24-P13NF Flat Panel 13.0 Fixed 2 m N/A N/A

A24-P14NF Flat Panel 14.0 Fixed 2 m N/A 1.0

A24-P15NF Flat Panel 15.0 Fixed 2 m N/A 2.0

A24-P16NF Flat Panel 16.0 Fixed 2 m N/A 3.0

A24-P19NF Flat Panel 19.0 Fixed 2 m 3.0 6.0

Yagi antennas

A24-Y6NF Yagi (6-element) 8.8 Fixed 2 m N/A N/A

A24-Y7NF Yagi (7-element) 9.0 Fixed 2 m N/A N/A

A24-Y9NF Yagi (9-element) 10.0 Fixed 2 m N/A N/A

A24-Y10NF Yagi (10-element) 11.0 Fixed 2 m N/A N/A

XBee3™ RF Module Hardware Reference Manual 35

Required antenna cable loss (dB)

Regulatory information Europe (CE)

Gain

Partnumber Type (description)

A24-Y12NF Yagi (12-element) 12.0 Fixed 2 m N/A N/A

A24-Y13NF Yagi (13-element) 12.0 Fixed 2 m N/A N/A

A24-Y15NF Yagi (15-element) 12.5 Fixed 2 m N/A N/A

A24-Y16NF Yagi (16-element) 13.5 Fixed 2 m N/A 0.5

A24-Y16RM Yagi (16-element, RPSMA connector) 13.5 Fixed 2 m N/A 0.5

A24-Y18NF Yagi (18-element) 15.0 Fixed 2 m N/A 2.0

(dBi)

Application*

Min
separation

802.15.4 Based Protocols
(Ex: ZigBee)

BLE (when
available)

RF exposure

If you are an integrating the XBee3 into another product, you must include the following Caution statement in OEMproduct manuals to alert users of FCC
RF exposure compliance:

CAUTION! To satisfy FCC RF exposure requirements for mobile transmitting devices, a separation distance of 25 cm or more should be
maintained between the antenna of this device and persons during device operation. To ensure compliance, operations at closer than this
distance are not recommended. The antenna used for this transmitter must not be co-located in conjunction with any other antenna or
transmitter.

Europe (CE)

The XBee3 RF Module has been tested for use in several European countries. For a complete list, refer to www.digi.com/resources/certifications.

If XBee3 RF Modules are incorporated into a product, the manufacturer must ensure compliance of the final product with articles 3.1a and 3.1b of the
Radio Equipment Directive. A Declaration of Conformity must be issued for each of these standards and kept on file as described in the Radio Equipment
Directive.

Furthermore, the manufacturer must maintain a copy of the XBee3 RF Module user guide documentation and ensure the final product does not exceed
the specified power ratings, antenna specifications, and/or installation requirements as specified in the user guide.

XBee3™ RF Module Hardware Reference Manual 36

Regulatory information Europe (CE)

Maximum power and frequency specifications

For the XBee3 device:

When using 802.15.4 RF physical layer:

n Maximum power: 8.61mW (9.35 dBm) Equivalent Isotropically Radiated Power (EIRP).

n Frequencies: 5 MHz channel spacing, beginning at 2405 MHz and ending at 2480 MHz.

When using BLE RF physical layer:

n Maximum power: 9.02mW (9.55 dBm) Equivalent Isotropically Radiated Power (EIRP).

n Frequencies: 2 MHz channel spacing, beginning at 2402 MHz and ending at 2480 MHz.

OEM labeling requirements

The “CE” marking must be affixed to a visible location on the OEM product. The following figure shows CE labeling requirements.

The CE mark shall consist of the initials “CE” taking the following form:

XBee3™ RF Module Hardware Reference Manual 37

n If the CE marking is reduced or enlarged, the proportions given in the above graduated drawing must be respected.

n The CE marking must have a height of at least 5 mm except where this is not possible on account of the nature of the apparatus.

n The CE marking must be affixed visibly, legibly, and indelibly.

Digi customers assume full responsibility for learning and meeting the required guidelines for each country in their distribution market. Refer to the radio
regulatory agency in the desired countries of operation for more information.

Declarations of conformity

Digi has issued Declarations of Conformity for the XBee3 RF Modules concerning emissions, EMC, and safety. For more information, see

www.digi.com/resources/certifications.

Antennas

The following antennas have been tested and approved for use with the XBee3 RF Module:

All antenna part numbers followed by an asterisk (*) are not available from Digi. Consult with an antenna manufacturer for an equivalent option.

n Dipole (2.1 dBi, Omni-directional, Articulated RPSMA, Digi part number A24-HABSM)

n PCB antenna (surface mount boards only) (0.0 dBi)

n Chip antenna (micro form factor only) (0.0 dBi)

IC (Industry Canada)

Regulatory information IC (Industry Canada)

Labeling requirements

Labeling requirements for Industry Canada are similar to those of the FCC. A clearly visible label on the outside of the final product enclosure must display
the following text.

For XBee3:

Contains Model XBEE3, IC: 1846A-XBEE3

The integrator is responsible for its product to comply with IC ICES-003 & FCC Part 15, Sub. B -Unintentional Radiators. ICES-003 is the same as FCC Part
15 Sub. B and Industry Canada accepts FCC test report or CISPR 22 test report for compliance with ICES-003.

This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

XBee3™ RF Module Hardware Reference Manual 38

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.

Regulatory information IC (Industry Canada)

RF Exposure

CAUTION! This equipment is approved for mobile and base station transmitting devices only. Antenna(s) used for this transmitter must be

installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any
other antenna or transmitter.

ATTENTION! Cet équipement est approuvé pour la mobile et la station base dispositifs d'émission seulement. Antenne(s) utilisé pour cet
émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm à partir de toutes les personnes et ne doit pas être
situé ou fonctionner en conjonction avec tout autre antenne ou émetteur.

Transmitters with Detachable Antennas

This radio transmitter (IC: 1846A-XBEE3) has been approved by Industry Canada to operate with the antenna types listed in FCC-approved antennas (2.4

GHz) with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having

a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Le présent émetteur radio (IC: 1846A-XBEE3) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et
ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est
supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.

Detachable Antenna

Under Industry Canada regulations, this radio transmitter may operate using only an antenna of a type and maximum (or lesser) gain approved for the
transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the
equivalent isotropically radiated power (EIRP) is not more than that necessary for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peutfonctionner avec une antenne d'un type et d'un gain maximal (ou
inférieur) approuvépour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres
utilisateurs, il faut choisir le type d'antenne etson gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépassepas l'intensité
nécessaire àl'établissement d'une communication satisfaisante.

Manufacturing information

Manufacturing information

The XBee3 RF Module (both surface-mount and micro)is designed for surface-mounting on the OEM
PCB. It has castellated pads to allow for easy solder attaching and inspection. The pads are all located
on the edge of the device so there are no hidden solder joints on these devices.

Recommended solder reflow cycle 40
Handling and storage 40
Recommended footprint 41
Flux and cleaning 44
Reworking 44

XBee3™ RF Module Hardware Reference Manual

39

Manufacturing information Recommended solder reflow cycle

Recommended solder reflow cycle

The following diagram shows the recommended solder reflow cycle.

The device reflows during this cycle, and must not be reflowed upside down. Be careful not to jar the
device while the solder is molten, as parts inside the device can be removed from their required
locations.

Hand soldering is possible and should be done in accordance with approved standards.

Handling and storage

The XBee3 RF Modules are level 3 Moisture Sensitive Devices. When using this kind of device, consider
the relative requirements in accordance with standard IPC/JEDEC J-STD-020.

In addition, note the following conditions:

a. Calculated shelf life in sealed bag: 12 months at <40 °C and <90% relative humidity (RH).

b. Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD -

033C, paragraphs 5 through 7.

c. The time between the opening of the sealed bag and the start of the reflow process cannot

exceed 168 hours if condition b) is met.

d. Baking is required if conditions b) or c) are not met.

e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.

f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at 125

°C.

XBee3™ RF Module Hardware Reference Manual

40

Manufacturing information Recommended footprint

Recommended footprint

We recommend that you use the following PCB footprints for surface-mounting. The dimensions
without brackets are in inches, and those in brackets are in millimeters.

XBee3 surface-mount recommended footprint

XBee3™ RF Module Hardware Reference Manual

41

Manufacturing information Recommended footprint

XBee3 Micro recommended footprint

Match the solder footprint to the copper pads, but may need to be adjusted depending on the specific
needs of assembly and product standards. Recommended stencil thickness is 0.15 mm/0.005”. Place
the component last and set the placement speed to the slowest setting.

While the underside of the device is mostly coated with solder resist, we recommended the copper
layer directly below the device be left open to avoid unintended contacts. Copper or vias must not
interfere with the three exposed RF test points on the bottom of the device as shown in the following
diagrams. These devices have a ground plane in the middle on the back side for shielding purposes,
which can be affected by copper traces directly below the device.

XBee3™ RF Module Hardware Reference Manual

42

Manufacturing information Recommended footprint

Copper keepout for the XBee3 surface-mount

XBee3™ RF Module Hardware Reference Manual

43

Manufacturing information Flux and cleaning

Copper keepout for the XBee3 Micro

Flux and cleaning

Digi recommends that a “no clean” solder paste be used in assembling these devices. This eliminates
the clean step and ensures unwanted residual flux is not left under the device where it is difficult to
remove.

In addition the following issues can occur:

n Cleaning with liquids can result in liquid remaining under the shield or in the gap between the

device and the OEM PCB. This can lead to unintended connections between pads on the device.

n The residual moisture and flux residue under the device are not easily seen during an

inspection process.

Factory recommended best practice is to use a “no clean” solder paste to avoid these issues and
ensure proper device operation.

Reworking

Never perform rework on the device itself. The device has been optimized to give the best possible
performance, and reworking the device itself will void warranty coverage and certifications. We
recognize that some customers choose to rework and void the warranty. The following information
serves as a guideline in such cases to increase the chances of success during rework, though the
warranty is still voided.

The device may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Be
careful not to overheat the device. During rework, the device temperature may rise above its internal

XBee3™ RF Module Hardware Reference Manual

44

Manufacturing information Reworking

solder melting point and care should be taken not to dislodge internal components from their
intended positions.

XBee3™ RF Module Hardware Reference Manual

45