Digi XBee 3 Reference Manual

Digi XBee® 3

RF Module

Hardware Reference Manual

Revision history—90001543

Revision Date Description

M May 2019 Added FCC publication 996369 related information.

N December

2019

P January

2020

R April 2020 Added weight and electrical characteristics. Updated the EUantenna

S July 2020 Added graphics of attaching a device to a board. Added information on

Added antennas.

Added Mexican certifications.

section.

over-voltage detection.

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United
States and other countries worldwide. All other trademarks mentioned in this document are the
property of their respective owners.

© 2020 Digi International Inc. All rights reserved.

Disclaimers

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merchantability for a particular purpose. Digi may make improvements and/or changes in this manual
or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

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Gather support information: Before contacting Digi technical support for help, gather the following

information:

Product name and model

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Operating system/browser (if applicable)

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Trace (if possible)

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Contents

Digi XBee® 3 RF Module Hardware Reference Manual

General XBee 3 specifications

General specifications 9
Electrical characteristics 9
Regulatory conformity summary 10
Serial communication specifications 11

UART pin assignments 11

SPI pin assignments 11
GPIO specifications 11
Electro Static Discharge (ESD) 12

IEEE 802.15.4-specific specifications

Performance specifications 14
Power requirements 14
Networking and security specifications 14
Communication interface specifications 15

Mechanical drawings

XBee 3 surface-mount antennas 17

XBee 3 surface-mount - U.FL/RF pad antenna 17

XBee 3 surface-mount - embedded antenna 18
XBee 3 micro antennas 19

XBee 3 micro (U.FL/RF Pad) 19

XBee 3 micro (chip antenna) 20
XBee 3 through-hole antennas 21

XBee 3 through-hole - PCB antenna 21

XBee 3 through-hole - U.FL antenna 21

XBee 3 through-hole - RPSMA antenna 22

Pin signals

Pin signals for the XBee 3 surface-mount module 24
Pin signals for the XBee 3 micro module 27
Pin signals for the XBee 3 through-hole module 30
Recommended pin connections 31

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Design notes

Power supply design 33
Board layout 33
Antenna performance 33
Design notes for PCB antenna and chip antenna devices 34

Surface-mount embedded antenna keepout area 34

XBee 3 Micro chip antenna keepout area 35

Through-hole embedded antenna keepout area 36
Design notes for RF pad devices 37
Copper keepout for test points 39

Regulatory information

United States (FCC) 43

OEM labeling requirements 43

FCC notices 43

FCC-approved antennas (2.4 GHz) 44

RF exposure 52

XBee 3 USB Adapter 52

FCC publication 996369 related information 52

Over-voltage detection 53
Europe (CE) 53

Maximum power and frequency specifications 53

OEM labeling requirements 54

Declarations of conformity 54

Antennas 54
ISED (Innovation, Science and Economic Development Canada) 55

Labeling requirements 55

For XBee 3 55

RF Exposure 55
Australia (RCM)/New Zealand 56
Brazil ANATEL 56

Modelo: XBee 3 56
Japan (TELEC) 57
Mexico (IFETEL) 58

OEM labeling requirements 58
South Korea 58

XBIB-C development boards

XBIB-C Micro Mount reference 61
XBIB-C SMT reference 63
XBIB-CU TH reference 65
XBIB-C-GPS reference 67
Interface with the XBIB-C-GPS module 69

I2C communication 70

UART communication 70
Attach the XBee 3 RF Module 70

Micro 70

Surface-mount 71

Through-hole 71

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Manufacturing information

Recommended solder reflow cycle 73
Handling and storage 73
Recommended footprint 73
Flux and cleaning 75
Reworking 76

Troubleshooting

Brownout issue 78

Voltage brownout 78

Voltage ramp up discontinuities 78

How to distinguish revision B parts 78

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Digi XBee® 3 RF Module Hardware Reference Manual

This manual provides information for the XBee 3 RF Module hardware. The XBee 3 RF Module can be
any of the following form factors:

n Micro-mount

n Through-hole

n Surface-mount

For more information about the operation and programming functions of the device, see:

n XBee 3 DigiMesh RF Module User Guide

n XBee 3 Zigbee RFModule User Guide

n XBee 3 802.15.4 RFModule User Guide

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General XBee 3 specifications

The following tables provide general specifications for the hardware.

General specifications 9
Electrical characteristics 9
Regulatory conformity summary 10
Serial communication specifications 11
GPIO specifications 11
Electro Static Discharge (ESD) 12

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General XBee 3 specifications General specifications

General specifications

The following table describes the general specifications for the devices.

XBee 3/XBee 3-PRO

Specification

Operating frequency
band

Form factor Micro-mount Surface-mount Through-hole

Dimensions

Weight 1.2 g 2.9 g 3.1 g

Operatingtemperature -40 to 85 °C (industrial)

Antenna options

Analog-to-digital
converter (ADC)

micro-mount

ISM 2.4 – 2.4835 GHz

Micro-mount: 1.36 cm x

1.93 cm x 0.241 cm (0.534
in x 0.760 in x 0.095 in)

RF pad, chip antenna, or
U.FL connector

4 10-bit analog inputs 4 10-bit analog inputs 4 10-bit analog

Electrical characteristics

The following table lists the electrical characteristics for the XBee 3 RF Module.

XBee 3/XBee 3-PRO
surface-mount

Surface-mount: 2.199
x 3.4 x 0.368 cm (0.866
x 1.33 x 0.145 in)

RF pad, embedded
antenna, or U.FL
connector

XBee 3/XBee 3-PRO
through-hole

Through-hole: 2.438
x 2.761 cm (0.960 x

1.087 in)

RPSMA connector,
embedded antenna,
or U.FL connector

inputs

Symbol Parameter Condition Min Typical Max Units

V

I

V

IL

V

IH

V

OL

V

OH

I

IN

RPU Internal pull-up

RPD Internal pull-down

Input pins -0.3 VCC

+0.3

Input low voltage 0.3 *

VCC

Input high voltage 0.7 *

VCC

Output low voltage Sinking 3 mA VCC = 3.3 V 0.2 *

VCC

Output high voltage Sourcing 3 mA VCC = 3.3 V 0.8 *

VCC

Input leakage
current

resistor

resistor

High Z state I/O connected to
Ground or VCC

Enabled

Enabled 40 - kΩ

0.1 100 nA

40

- kΩ

V

V

V

V

V

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General XBee 3 specifications Regulatory conformity summary

Regulatory conformity summary

This table describes the agency approvals for the devices.

Approval XBee 3 XBee 3-PRO

United States (FCC Part 15.247)

Innovation, Science and Economic Development
Canada (ISED)

FCC/IC Test Transmit Power Output range -6.8 to +8 dBm -6.8 to +19.9 dBm

Bluetooth® (XBee 3 Zigbee only) Declaration ID:

Australia RCM RCM

Brazil ANATEL 06329-18-

Europe (CE) Yes No

Japan (TELEC) R210-119309 No

Mexico (IFETEL) IFT #: RCPDIXB19-

RoHS Compliant

South Korea (KCC) R-C-DIG-XBEE3 No

FCC ID: MCQ-XBEE3

IC: 1846A-XBEE3

D042514
QDID: 121268

01209

1820

FCC ID: MCQ-XBEE3

IC: 1846A-XBEE3

Declaration ID:
D042514
QDID: 121268

ANATEL 06329-18­01209

IFT #: RCPDIXB19­1820

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General XBee 3 specifications Serial communication specifications

Serial communication specifications

The XBee 3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART) and Serial
Peripheral Interface (SPI)serial connections.

UART pin assignments

UART pins Device pin number

XBee 3 micro-mount

DOUT/DIO13 3

DIN / CONFIG/DIO14 4

CTS / DIO7 24

RTS/ DIO6 27

XBee 3 surface-mount XBee 3 through-hole

3 2

4 3

25 12

29 16

SPI pin assignments

SPI pins Device pin number

XBee 3 micro-mount

SPI_CLK 13 14 18

SPI_SSEL

SPI_MOSI 15 16 11

SPI_MISO 16 17 4

SPI_ATTN

14 15 17

11 12 19

XBee 3 surface-mount XBee 3 through-hole

GPIO specifications

XBee 3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list
depends on the device configuration as some GPIO pads are used for purposes such as serial
communication.

GPIO electrical specification Value

Voltage - supply 2.1 - 3.6 V

Low switching threshold 0.3 x VCC

High switching threshold 0.7 x VCC

Input pull-up resistor value

Digi XBee® 3 RF Module Hardware Reference Manual

40 kΩ (typical)

11

General XBee 3 specifications Electro Static Discharge (ESD)

GPIO electrical specification Value

Input pull-down resistor value

Output voltage for logic 0 0.2 x VCC (maximum)

Output voltage for logic 1 0.8 x VCC (minimum)

Output source/sink current 50 mA (maximum)

Total output current (for GPIO pads) 200 mA (maximum)

Electro Static Discharge (ESD)

XBee 3 RF Module pins are tolerant to human-body model ± 1.5 kV.

Note Take care to limit all electrostatic discharges to the device.

40 kΩ (typical)

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IEEE 802.15.4-specific specifications

The following tables provide specifications specific to the XBee 3 RF Module when using the IEEE

802.15.4 physical layer, for example: XBee 802.15.4, Zigbee, DigiMesh, and so on.

Performance specifications 14
Power requirements 14
Networking and security specifications 14
Communication interface specifications 15

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IEEE 802.15.4-specific specifications Performance specifications

Performance specifications

The following table describes the performance specifications for the devices.

Specification

Indoor/urban range Up to 60 m (200 ft)

Outdoor RF line-of-sight range Up to 1200 m (4000 ft)

RF Transmit power output (maximum) 6.3 mW (+8 dBm)

BLEpower output 6.3 mW (+8 dBm) 6.3 mW (+8 dBm)

RF data rate 250,000 b/s

Receiver sensitivity -103 dBm

Note Range figure estimates are based on free-air terrain with limited sources of interference. Actual

range will vary based on transmitting power, orientation of transmitter and receiver, height of
transmitting antenna, height of receiving antenna, weather conditions, interference sources in the
area, and terrain between receiver and transmitter, including indoor and outdoor structures such as
walls, trees, buildings, hills, and mountains.

Power requirements

The following table describes the power requirements for the XBee 3 RF Module.

Specification

XBee 3

XBee 3

XBee 3-PRO

Up to 90 m (300 ft)

Up to 3200 m (2 mi)

79 mW (+19 dBm)

XBee 3-PRO

Adjustable power Yes

Supply voltage 2.1 - 3.6 V

Operating current (transmit, typical) 40 mA @ +3.3 V, +8 dBm 135 mA @ +3.3 V, +19 dBm

Operating current (receive, typical)

Power-down current, typical 2 µA @ 25° C

17 mA

Networking and security specifications

The following table describes the networking and security specifications for the devices.

Specification

Supported network topologies Point-to-point, point-to-multipoint, peer-to-peer, and DigiMesh

Number of channels 16 Direct sequence channels

Interface immunity Direct Sequence Spread Spectrum (DSSS)

Channels 11 to 26

Addressing options PAN ID and addresses, cluster IDs and endpoints (optional)

XBee 3/XBee 3-PRO

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IEEE 802.15.4-specific specifications Communication interface specifications

Communication interface specifications

The following table provides the device's communication interface specifications.

Interface options

UART

SPI 5 Mb/s (burst)

Standard UART baud rates up to 921600 b/s
Non-standard UART baud rates up to 967680 b/s

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Mechanical drawings

The following mechanical drawings of the XBee 3 RF Modules show all dimensions in inches.

XBee 3 surface-mount antennas 17
XBee 3 micro antennas 19
XBee 3 through-hole antennas 21

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Mechanical drawings XBee 3 surface-mount antennas

XBee 3 surface-mount antennas

The following mechanical drawings are for the XBee 3 surface-mount antennas.

XBee 3 surface-mount - U.FL/RF pad antenna

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Mechanical drawings XBee 3 surface-mount antennas

XBee 3 surface-mount - embedded antenna

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Mechanical drawings XBee 3 micro antennas

XBee 3 micro antennas

The following mechanical drawings are for the XBee 3 micro antennas.

XBee 3 micro (U.FL/RF Pad)

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Mechanical drawings XBee 3 micro antennas

XBee 3 micro (chip antenna)

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Mechanical drawings XBee 3 through-hole antennas

XBee 3 through-hole antennas

The following mechanical drawings are for the XBee 3 through-hole antennas.

XBee 3 through-hole - PCB antenna

XBee 3 through-hole - U.FL antenna

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Mechanical drawings XBee 3 through-hole antennas

XBee 3 through-hole - RPSMA antenna

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Pin signals

Pin signals for the XBee 3 surface-mount module 24
Pin signals for the XBee 3 micro module 27
Pin signals for the XBee 3 through-hole module 30
Recommended pin connections 31

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Pin signals Pin signals for the XBee 3 surface-mount module

Pin signals for the XBee 3 surface-mount module

The following drawing shows the surface-mount (SMT) pin locations.

The following table shows the pin signals and their descriptions for the surface-mount device.

Pin# Name Direction Default state Description

1 GND - - Ground.

2 VCC - - Power supply.

3 DOUT /DIO13 Both Output UART data out /GPIO.

4 DIN / CONFIG

/DIO14

5 DIO12 Both GPIO.

6 RESET Input Device reset.

7 RSSI PWM/DIO10 Both Output RX signal strength

8 PWM1/DIO11/I2C

SDA

9 [reserved] - Disabled Do not connect.

Both Input UART data in /GPIO.

Indicator /GPIO.

Both Disabled Pulse width

modulator/GPIO/I2C
SDA.

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