dialog DA14531, UM-B-125 User Manual

User Manual
DA14531 USB Development Kit
Hardware
UM-B-125

Abstract

This document outlines the system design, configuration options, and supported features of DA14531 USB Development Kit rev.C (3 76-13-C).
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

Contents

Abstract ................................................................................................................................................ 1
1 Terms and Definitions ................................................................................................................... 4
2 References ..................................................................................................................................... 4
3 Introduction.................................................................................................................................... 5
4 System Overview ........................................................................................................................... 5
4.1 Features ................................................................................................................................ 5
4.2 System and Components Description (Top View) ................................................................ 6
4.3 System and Components Description (Bottom View) ........................................................... 7
5 USB Kit System ............................................................................................................................. 8
5.1 Overview ............................................................................................................................... 8
5.2 DA14531 System .................................................................................................................. 9
5.3 DA14531 GPIO Assignment ............................................................................................... 10
5.4 Default Configuration .......................................................................................................... 11
5.5 1-wire Bootable UART ........................................................................................................ 12
5.6 Optional 2-/4-Wire UART .................................................................................................... 13
5.7 Crystals ............................................................................................................................... 14
5.8 Antenna and RF Port .......................................................................................................... 15
5.9 SPI Data Flash Memory (U2) .............................................................................................. 16
5.10 Reset Circuit ........................................................................................................................ 17
5.11 General Purpose Push Button ............................................................................................ 18
5.12 Debugging Port DIP Switch ................................................................................................ 19
5.13 MikroBUS™ Module ............................................................................................................ 20
5.14 User Controlled LED ........................................................................................................... 21
5.15 GND Test Point ................................................................................................................... 21
5.16 Over Voltage Protection Circuit (OVP) ................................................................................ 22
5.17 Debug Interface (U4) ........................................................................................................... 23
5.18 Power Measurements ......................................................................................................... 24
5.19 Operation from a Wall Adapter or Power Pack ................................................................... 25
5.20 Operation from a Coin Cell Battery ..................................................................................... 26
Appendix A Schematics .................................................................................................................... 27
Appendix B Components Placement on PCB ................................................................................ 29
Appendix C PCB Layer Chart ........................................................................................................... 30
Revision History ................................................................................................................................ 31
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

Figures

Figure 1: DA14531 USB Kit ................................................................................................................... 5
Figure 2: USB Kit - Top Side ................................................................................................................. 6
Figure 3: USB Kit - Bottom Side ............................................................................................................ 7
Figure 4: Block diagram of DA14531 USB Development Kit ................................................................ 9
Figure 5: DA14531 Section Schematic ................................................................................................. 9
Figure 6: Default DIP Switch Configuration ......................................................................................... 11
Figure 7: Single Pin UART Multiplexer ................................................................................................ 12
Figure 8: DIP Switch Configuration for UART ..................................................................................... 13
Figure 9: RF Section ............................................................................................................................ 15
Figure 10: SPI Data Flash ................................................................................................................... 16
Figure 11: SPI Flash Package Options ............................................................................................... 16
Figure 12: Reset Circuit ....................................................................................................................... 17
Figure 13: RESET Push Button (SW1) ............................................................................................... 17
Figure 14: General Purpose Push Button ........................................................................................... 18
Figure 15: General Purpose Push Button SW2................................................................................... 18
Figure 16: DIP Switch Configuration ................................................................................................... 19
Figure 17: MikroBus™ Pin Assignment ............................................................................................... 20
Figure 18: Guides for Proper MikroBus™ Click Board Insertion ......................................................... 20
Figure 19: MikroBus™ Pin Assignment (Bottom View) ....................................................................... 21
Figure 20: General Purpose LED ........................................................................................................ 21
Figure 21: GND Support Point............................................................................................................. 21
Figure 22: Over Voltage Protection Circuit .......................................................................................... 22
Figure 23: Debugging Processor - UART and JTAG Interface (U4) ................................................... 23
Figure 24: Power Measurement Header ............................................................................................. 24
Figure 25: Current Measurement Header (J2) .................................................................................... 24
Figure 26: Operation with a Battery Pack ............................................................................................ 25
Figure 27: Resistor R48 ....................................................................................................................... 25
Figure 28: Resistors R50 and R51 ...................................................................................................... 26
Figure 29: DA14531 SoC and Peripherals .......................................................................................... 27
Figure 30: Debug Interface (UART/JTAG) .......................................................................................... 28
Figure 31: Components Placement, Top Side on the Left and Bottom Side on the Right .................. 29
Figure 32: PCB Cross Section ............................................................................................................ 30

Tables

Table 1: DA14531 USB Development Kit Pin Assignment ................................................................. 10
Table 2: Default Configuration DIP Settings........................................................................................ 11
Table 3: UART Configuration DIP Settings ......................................................................................... 13
Table 4: Y1 (32 MHz Crystal) Characteristics ..................................................................................... 14
Table 5: Y2 (32 kHz Crystal) Characteristics ...................................................................................... 14
Table 6: RF Components Names and Values ..................................................................................... 15
Table 7: DIP Switch Configuration ...................................................................................................... 19
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

1 Terms and Definitions

CIB Communication Interface Board DCR Direct Current Resistor DMIPS Dhrystone Million Instructions per Second ESR Effective Series Resistance GPIO General Purpose Input Output I2C Inter-Integrated Circuit JTAG Join Test Action Group LDO Low Dropout MISO Master In Slave Out MOSI Master Out Slave In OTP One Time Programmable OVP Over Voltage Protection PC Personal Computer PCB Printed Circuit Board PCBA Printed Circuit Board Assembly PLL Phase-Locked Loop QSPI Quad Serial Peripheral Interface RF Radio Frequency RFIO Radio Frequency Input Output SDK Software Development Kit SIMO Single-Inductor Multiple-Output SMA Sub-Miniature version A SMD Surface-Mount Device SoC System on Chip SOIC Small Outline Integrated Circuit SPI Serial Peripheral Interface SW Software UART Universal Asynchronous Receiver-Transmitter USB Universal Serial Bus

2 References

[1] DA14531, Datasheet, Dialog Semiconductor. [2] AN-B-052, DA1458x/68x Development kit J-Link Interface, Application Note, Dialog
Semiconductor. [3] AN-B-072, DA14531 Booting Options, Application Note, Dialog Semiconductor. [4] AN-B-027, Designing Printed Antennas for Bluetooth Smart, Application Note, Dialog
Semiconductor.
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

3 Introduction

This document describes Dialog’s DA14531 USB Kit (board reference number 376-13-C). This kit offers a low-cost development board with basic functionality. The development kit is implemented on a single PCB. The block diagram, the actual board, the various sections and settings as well as the connectivity are presented. The purpose of this cost-effective USB kit is to provide users with the capability for:
Software development
Programming DA14531 via JTAG or UART using Dialog's DA14531 SDK
Connecting MikroBUS™ modules
Figure 1: DA14531 USB Kit

4 System Overview

4.1 Features

The features of DA14531 USB kit include:
Highly integrated DA14531 Bluetooth® Smart SoC from Dialog Semiconductor
Access on GPIOs provided from the chip, when no MikroBUS™ is plugged in
The ability to be connected directly to PC USB without extra cables
Reset push button
General purpose LED and button
Using USB LDO 3V3 as a power source
Unpopulated coin cell battery holder as a powering option
JTAG and UART interface over USB (on-board SEGGER J-Link)
2 Mbit SPI flash on board
2.4GHz printed antenna and option for SMA connector
32 MHz main crystal and option for 32.768 kHz low-power crystal
Low cost
Compact design
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

4.2 System and Components Description (Top View)

Figure 2: USB Kit - Top Side
This USB development kit is based on the DA14531 SoC in an FCGQFN-24 package. The marked and numbered sections of the system are:
1. Type-A USB connector (J1)
2. OVP Circuit
3. LDO 3.3 V (U3)
4. Unpopulated power selection header (J2)
5. J-Link status LED (green)
6. Reset button (SW1)
7. User button (SW2)
8. Debug interface μController (U4)
9. Inverter for J-Link reset (U6)
10. Multiplexer for 1-pin UART (U5)
11. System configuration DIP-switch (S1)
12. Unpopulated MikroBus™ socket (or breakout header in general)
13. 2 Mbit SPI Flash (U2)
14. Unpopulated 32.468 kHz crystal (Y2)
15. DA14531 Bluetooth® Smart SoC
16. 32 MHz crystal
17. Printed Antenna
18. GND test-point
19. Unpopulated SMA connector (J5)
20. User LED (orange)
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

4.3 System and Components Description (Bottom View)

Figure 3: USB Kit - Bottom Side
The bottom side of the USB development kit provides information about the MikroBus™ pins assignment, the SEGGER ID, and the date code. Test points have been placed for monitoring various signal behaviors and voltage levels of the components. The marked and numbered sections of the system are:
21. Unpopulated resistor for bypass mode
22. GPIO numbers (add P0_ before the number for the full name)
23. J-Link debugger serial number
24. Pads to solder a coin cell holder
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

5 USB Kit System

5.1 Overview

Board name/number:
DA14531 USB development kit/376-13-C
SoC:
DA14531 in FCGQFN-24 package
Flash memory:
MX25R2035F (2 Mbit) QSPI Flash Memory in 8-pin U-SON (2 mm × 3 mm) package. Note
that it is accessed in plain SPI mode.
3.3 V power supply (VHIGH)
Clock inputs:
32 MHz crystal Optional low power 32.768 kHz crystal
Power
3.3 V LDO powering VHIGH on DA14531 (buck mode configuration)
Ports:
USB port for debugging purposes
Interfaces:
UART-J-Link CDC UART Port (listed under Ports in Device Manager) JTAG-J-Link Driver (listed under Universal Serial Bus Controllers in Device Manager) DIP switch to select between interfaces and isolate the signals for accurate power
measurements
Connectivity expansion connectors:
One MikroBUS™ module can be plugged to J3/J4. Note that most GPIOs are already used
for booting and debugging, so compatibility with any random Click board is not guaranteed
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

5.2 DA14531 System

Figure 4: Block diagram of DA14531 USB Development Kit
Dialog’s DA14531 is an ultra-low power SoC integrating a 2.4 GHz Bluetooth Low Energy transceiver and an ARM® CortexM0+ microcontroller with 48 kB RAM and 32 kB One-Time Programmable (OTP) ROM. It can be used as a standalone application processor or as a data pump in hosted systems.
The DA14531 SoC also includes a cryptography engine, a power management unit, digital and analog peripherals, and a radio transceiver.
The DA14531 has dedicated hardware for the Link Layer implementation of BLE and interface controllers for enhanced connectivity capabilities. The radio transceiver, the baseband processor, and the qualified Bluetooth® low energy stack is fully compliant with the Bluetooth® Low Energy 5.1 standard.
Figure 5: DA14531 Section Schematic
The DA14531 SoC power management subsystem consists of:
VHIGH: LDO/Battery input (buck configuration, default is 3.3 V from LDO)
A 2.2 μF decoupling capacitor (C1) is required close to the pin
VLOW: 1.1 V typical output (buck configuration)
A 10 μF decoupling capacitor (C2) is required close to the pin
The inductor needed for DC-DC operation is placed externally. A low DCR 2.2 µH inductor (L1) is
connected between LX and VLOW pins
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DA14531 24-pin FCGQFN
U1
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P0_7
15
P0_6
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VBAT_HIGH
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GNDRF1
19
P0_9
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V_LOW
RF2
P0_1
P0_0
P0_8
P0_7
P0_6
P0_5
P0_2
P0_11
P0_10
P0_9
P0_3
P0_4
R5 36
R4 36
R1 36 R2 36
R6 36
R3 36
R12 36
R11 36
R8 36
R7 36
R10 36
R9 36
TP1
VLOW
TP2
GND
Z6
1.8pF
Z7
3.3nH
UM-B-125
DA14531 USB Development Kit Hardware
User Manual
09-Mar-2020
CFR0012
© 2020 Dialog Semiconductor

5.3 DA14531 GPIO Assignment

Most of the available signals are utilized or extracted on the breakout connectors.

Table 1 shows the pin assignment on the development kit peripheral function and the related pin

name on the FCGQFN24 package of the DA14531.
Table 1: DA14531 USB Development Kit Pin Assignment
UART
2-wires
JTAG
SPI Flash
Full
UART
XTAL
32KHz
Single
UART
Other
GPIOs
P0_0
UTX
(Note 1)
SWDIO
(Note 1)
MOSI
UTX
(Note 1)
UTX/URX
(Note 1)
SW1/
RESET
P0_1
URX
(Note 1)
/CS
URX
(Note 1)
P0_2
SWCLK
P0_3
MISO
UCTS
(Note 1)
XTAL
(Note 1)
UTX/URX
(Note 1)
P0_4
SCK
URTS
(Note 1)
XTAL
(Note 1)
P0_5
SWDIO
(Note 1)
UTX/URX
P0_6
P0_7
P0_8
P0_9
LED
P0_10
SWDIO
P0_11
BUTTON
Note 1 This option is available for the pin and can be implemented on the board but requires software,
hardware, and/or OTP modifications.
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