DFI NP900-B16C User Manual
NP900-B16C
COM Express Board
User’s Manual
935-NP9001-000G
A07800843
Copyright
This publication contains information that is protected by copyright.
No part of it may be reproduced in any form or by any means or
used to make any transformation/adaptation without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The
manufacturer makes no representations or warranties with respect to
the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the
results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its
contents at any time, without obligation to notify any person or entity of such revisions or changes.
© 2008. All Rights Reserved.
Trademarks
Windows® 2000, Windows® CE, Windows® XP and Windows® XP
Embedded are registered trademarks of Microsoft Corporation.
Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits
for a Class B digital device, pursuant to Part 15 of the FCC rules.
These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not
occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try
to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from
that to which the receiver is connected.
• Consult the dealer or an experienced radio TV technician for
help.
Notice:
1. The changes or modifications not expressly approved by the
party responsible for compliance could void the user's authority
to operate the equipment.
2. Shielded interface cables must be used in order to comply with
the emission limits.
Table of Contents
About this Manual................................................................................
Warranty.................................................................................................
Static Electricity Precaution................................................................
Safety Measures.....................................................................................
About the Package...............................................................................
Chapter 1 - Introduction....................................................................
Specifications...................................................................................................................................
Features..............................................................................................................................................
Chapter 2 - Hardware Installation....................................................
System Board Layout ..........................................................................................................
Mechanical Diagram................................................................................................................
System Memory..........................................................................................................................
Jumper Settings............................................................................................................................
Connectors......................................................................................................................................
LEDs......................................................................................................................................................
SPI Flash ROM Socket.........................................................................................................
Cooling Options.........................................................................................................................
Installing NP900-B16C onto a Carrier Board..............................................
5
5
6
6
7
8
8
10
11
11
12
13
16
17
22
24
25
31
Chapter 3 - BIOS Setup......................................................................
Award BIOS Setup Utility.................................................................................................
Updating the BIOS..................................................................................................................
Chapter 4 - Supported Softwares.....................................................
Drivers for Windows Vista System..........................................................................
Drivers for Windows XP System..............................................................................
Appendix A - Watchdog Timer.............................................................
36
36
73
75
76
98
118
About this Manual
An electronic file of this manual is included in the CD. To view the
user’s manual in the CD, insert the CD into a CD-ROM drive. The
autorun screen (Main Board Utility CD) will appear. Click “User’s
Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from
misuse of the product, inability to use the product, unauthorized
replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may
not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty.
It must be returned to the purchase point, factory or authorized
service agency for all such work.
4. We will not be liable for any indirect, special, incidental or
consequencial damages to the product that has been modified
or altered.
1
Introduction
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board,
components or devices even before installing them in your system
unit. Static electrical discharge can damage computer components
without causing any signs of physical damage. You must take extra
care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the board in its anti-static
bag until you are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of
the components, contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor,
disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation
only. If such a station is not available, you can provide
some ESD protection by wearing an antistatic wrist strap
and attaching it to a metal part of the system chassis. If a
wrist strap is unavailable, establish and maintain contact
with the system chassis throughout any procedures requiring ESD protection.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis
cover for installation or servicing. After installation or servicing,
cover the system chassis before plugging the power cord.
..
.
..
6
About the Package
The package contains the following items. If any of these items are
missing or damaged, please contact your dealer or sales representative for assistance.
; The system board
; A user’s manual
; One heat sink
; One “Main Board Utility” CD
; One QR (Quick Reference)
The board and accessories in the package may not come similar to
the information listed above. This may differ in accordance to the
sales region or models in which it was sold. For more information
about the standard package in your region, please contact your
dealer or sales representative.
Introduction
1
7
1
Introduction
Chapter 1 - Introduction
Specifications
Processor
Chipset
System Memory
BIOS
Graphics
DMI
• Intel® AtomTM N270 (Diamondville SC) processor
• 1.6GHz core frequency, 1.10V voltage
• 2.5W thermal design power
• 512KB on-die second level cache
• 533-MT/s FSB
• 22x22 mm, 1.0 mm ball pitch and 437 balls FCBGA
®
• Intel
• One 200-pin SODIMM socket (1.8V)
• Maximum memory supports up to 2GB
• Supports 400MHz and 533MHz DDR2 SDRAM
• SPI interface BIOS (8Mbit)
• 133/166MHz internal graphics core render frequency at 1.05V
• One SDVO port (Port B)
• Supports 18-bit dual-channel LVDS
• Suppor ts CRT resolutions up to SXGA+
• DMI lane width - x2 only
• DMI lane reversal not suppor ted
chipset
- Intel® 945GSE Graphics Memory Controller Hub (GMCH)
- Intel® 82801GBM I/O Controller Hub (ICH7M)
core voltage
- SDVO slot reversal not supported
LAN
Audio
Expansion
Interfaces
• One Realtek RTL8111C PCI Express Gigabit controller
• Suppor ts 10Mbps, 100Mbps and 1Gbps data transmission
• IEEE 802.3 (10/100Mbps) and IEEE 802.3ab (1Gbps) compliant
• Suppor ts Azalia AC97 interface
• PCI 2.3 interface (supports 4 PCI bus masters)
• Supports 8 USB ports (USB 1.1/2.0 host controllers)
• Supports 3 PCIE x1 interface
8
Introduction
1
Serial ATA
IDE
Temperature
Humidity
Power
Regulatory
PCB
• SATA interface supports data transfer rate up to 1.5Gb/s
(150MB/s) per port
• Two SATA ports with independent DMA operation supported
on ports 0 and 2
• Two-mode operation supports legacy mode using I/O space or
an AHCI mode using memory space
• SATA and PATA can be used in a combined function mode
(When SATA is used with PATA, AHCI mode is not suppor ted.)
• Bus Master IDE (PATA) controller
• Suppor ts up to two IDE devices
• Ultra ATA 100/66/33
• Operating: 0
• Operating: 10% to 90%
• Input: 12V, 5VSB, VCC_RTC
• EMC: CE, FCC Part 15 Class B
• Dimensions
- COM Express basic form factor
- 9.5cm (3.74") x 12.5cm (4.9")
• Compliance
- PICMG COM Express R1.0 basic form factor, Type 2
o
C to 60oC
9
1
Introduction
Features
watchdog timer
the set time interval. If the system hangs or fails to function, it will
reset at the set time interval so that your system will continue to
operate.
DDR2
GB per second and beyond. That is twice the speed of the conventional DDR without increasing its power consumption. DDR2
SDRAM modules work at 1.8V supply compared to 2.6V memory
voltage for DDR modules. DDR2 also incorporates new innovations
such as the On-Die Termination (ODT) as well as larger 4-bit prefetch against DDR which fetches 2 bits per clock cycle.
graphics
gigabit lan
transmission.
DDR2 is a higher performance DDR technology
whose data transfer rate delivers bandwidth of 4.3
The integrated graphics delivers exceptional 3D
graphics performance.
The Watchdog Timer function allows your
application to regularly “clear” the system at
The Realtek RTL8111C PCI Express Gigabit
controller supports up to 1Gbps data
10
Chapter 2 - Hardware Installation
System Board Layout
2
Hardware Installation
11
2
Hardware Installation
Mechanical Diagram
0.00
4.00
121.00
117.00
91.00
87.00
14.00
2.00
0.00
4.00
4.00
0.00
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
12345678910111213141516171819202122232425
12.50
27
28
26
NP900
3331
30 32
27 292823 25
26242120 22
91.00
87.00
F
H
K
M
B
V
Y
AA
U
W
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
17 191815
A
11 13129
14 16
8105761234
D
T
P
E
G
R
J
L
N
A
C
12345 89
67
10
11
12
13
14
15
16
17
18
19
20
21
0.00
4.00
70.20
76.00
117.00
121.00
12
System Memory
SODIMM
2
Hardware Installation
BIOS Setting
Configure the system memory in the Advanced Chipset Features
submenu of the BIOS.
13
2
Hardware Installation
Installing SODIMM
Note:
The board used in the following illustrations may not resemble
the actual board. These illustrations are for reference only.
1. Make sure the PC and all other peripheral devices connected to
it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the board.
4. Note the key on the socket. The keying mechanism ensures the
module can be plugged into the socket in only one way.
14
5. Grasping the module by its edges, inser t the module into the
socket at an approximately 30 degrees angle. Note that the
socket and module are both keyed, which means the module can
be plugged into the socket in only one direction.
Hardware Installation
6. To seat the module into the socket, apply firm even pressure to
each end of the module until it slips down into the socket. The
contact fingers on the edge of the module will almost completely
disappear inside the socket.
2
7. Push down the module until the clips at each side of the socket
lock into position. You will hear a distinctive “click”, indicating the
module is correctly locked into position.
ClipClip
8. To remove the module, simultaneously push the retaining clips
outward to unlock the module.
15
2
Hardware Installation
Jumper Settings
Clear CMOS Data
1
X
2
3
1-2 On: Normal
(default)
1
2
3
2-3 On:
Clear CMOS Data
JP1
If you encounter the following,
a) CMOS data becomes corrupted.
b) You forgot the supervisor or user password.
you can reconfigure the system with the default values stored in the
ROM BIOS.
To load the default values stored in the ROM BIOS, please follow
the steps below.
1. Power-off the system and unplug the power cord.
2. Set JP1 pins 2 and 3 to On. Wait for a few seconds and set JP1
back to its default setting, pins 1 and 2 On.
3. Now plug the power cord and power-on the system.
16
Connectors
COM Express Connectors
The COM Express connectors are used to interface the NP900B16C COM Express board to a carrier board.
Connect the COM Express connectors, lcoated on the solder side of
the board, to the COM Express connectors on the carrier board.
Refer to the “Installing NP900-B16C onto a Carrier Board” section
for more information.
2
Hardware Installation
COM Express
connectors
Refer to the following pages for the pin functions of these connectors.
17
2
Q
Hardware Installation
1 GND 56 PCIE_TX52 GBE0_MDI3- 57 GND
3 GBE0_MDI3+ 58 PCIE_TX4+
4 GBE0_LINK100# 59 PCIE_TX45 GBE0_LINK1000# 60 GND
6 GBE0_MDI2- 61 PCIE_TX2+
7 GBE0_MDI2+ 62 PCIE_TX28 GBE0_LINK# 63 GPIO13
9 GBE0_MDI1- 64 PCIE_TX1+
10 GBE0_MDI1+ 65 PCIE_TX111 GND 66 GND
12 GBE0_MDI0- 67 GPIO14
13 GBE0_MDI0+ 68 PCIE_TX0+
14 GBE0_CTREF 69 PCIE_TX015 SUS_S3# 70 GND
16 SATA0_TX+ 71 LVDS_A0+
17 SATA0_TX- 72 LVDS_A018 SUS_S4# 73 LVDS_A1+
19 SATA0_RX+ 74 LVDS_A120 SATA0_RX- 75 LVDS_A2+
21 GND 76 LVDS_A222 SATA2_TX+ 77 LVDS_VDD_EN
23 SATA2_TX- 78 N. C.
24 SUS_S5# 79 N. C.
25 SATA2_RX+ 80 GND
26 SATA2_RX- 81 LVDS_A_CK+
27 BATLOW# 82 LVDS_A_CK28 ATA_ACT# 83 LVDS_I2C_CK
29 AC_SYNC 84 LVDS_I2C_DAT
30 AC_RST# 85 GPIO15
31 GND 86 KBD_RST#
32 AC_BITCLK 87 KBD_A20GATE
33 AC_SDOUT 88 PCIE0_CK_REF+
34 BIOS_DISABLE# 89 PCIE0_CK_REF35 THRMTRIP# 90 GND
36 USB6- 91 N. C.
37 USB6+ 92 N. C.
38 USB_6_7_OC# 93 GPIO6
39 USB4- 94 N. C.
40 USB4+ 95 N. C.
41 GND 96 GND
42 USB2- 97 VCC_12V
43 USB2+ 98 VCC_12V
44 USB_2_3_OC# 99 VCC_12V
45 USB0- 100 GND
46 USB0+ 101 VCC_12V
47 VCC_RTC 102 VCC_12V
48 EXCD0_PERST# 103 VCC_12V
49 EXCD0_CPPE# 104 VCC_12V
50 LPC_SERIR
51 GND 106 VCC_12V
52 N. C. 107 VCC_12V
53 N. C. 108 VCC_12V
54 GPIO12 109 VCC_12V
55 PCIE_TX5+ 110 GND
Row A
105 VCC_12V
18
Hardware Installation
Q
Q
L
R
Row B
1 GND 56 PCIE_RX52 GBE_ACT# 57 GPIO38
3 LPC_FRAME# 58 PCIE_RX4+
4 LPC_AD0 59 PCIE_RX45 LPC_AD1 60 GND
6 LPC_AD2 61 PCIE_RX2+
7 LPC_AD3 62 PCIE_RX28 LPC_DR
9 LPC_DR
10 LPC_CLK 65 PCIE_RX111 GND 66 WAKE0#
12 PWRBTN# 67 ICH_IR
13 SMB_CK 68 PCIE_RX0+
14 SMB_DAT 69 PCIE_RX015 SMB_ALERT# 70 GND
16 SATA1_TX+ 71 LVDS_B0+
17 SATA1_TX- 72 LVDS_B018 SUS_STAT# 73 LVDS_B1+
19 SATA1_RX+ 74 LVDS_B120 SATA1_RX- 75 LVDS_B2+
21 GND 76 LVDS_B222 SATA3_TX+ 77 N. C.
23 SATA3_TX- 78 N. C.
24 PWR_OK 79 LVDS_BKLT_EN
25 SATA3_RX+ 80 GND
26 SATA3_RX- 81 LVDS_B_CK+
27 WDT 82 LVDS_B_CK28 AC_SDIN2 83 LVDS_BKLT_CTR
29 AC_SDIN1 84 VCC_5V_SBY
30 AC_SDIN0 85 VCC_5V_SBY
31 GND 86 VCC_5V_SBY
32 SPK
33 SMLINK0 88 N. C.
34 SMLINK1 89 VGA_RED
35 THRM# 90 GND
36 USB7- 91 VGA_GRN
37 USB7+ 92 VGA_BLU
38 USB_4_5_OC# 93 VGA_HSYNC
39 USB5- 94 VGA_VSYNC
40 USB5+ 95 VGA_I2C_CK
41 GND 96 VGA_I2C_DAT
42 USB3- 97 N. C.
43 USB3+ 98 N. C.
44 USB_0_1_OC# 99 N. C.
45 USB1- 100 GND
46 USB1+ 101 VCC_12V
47 EXCD1_PERST# 102 VCC_12V
48 EXCD1_CPPE# 103 VCC_12V
49 SYS_RESET# 104 VCC_12V
50 CB_RESET# 105 VCC_12V
51 GND 106 VCC_12V
52 N. C. 107 VCC_12V
53 N. C. 108 VCC_12V
54 GPIO7 109 VCC_12V
55 PCIE_RX5+ 110 GND
0# 63 GPIO39
1# 64 PCIE_RX1+
87 VCC_5V_SBY
2
19
2
Q
Q
Q
Q
Q
Hardware Installation
1 GND 56 SDVOB_INT
2 IDE_D7 57 N. C.
3 IDE_D6 58 SDVO_FLDSTALL+
4 IDE_D3 59 SDVO_FLDSTALL5 IDE_D15 60 GND
6 IDE_D8 61 N. C.
7 IDE_D9 62 N. C.
8 IDE_D2 63 N. C.
9 IDE_D13 64 N. C.
10 IDE_D1 65 N. C.
11 GND 66 N. C.
12 IDE_D14 67 N. C.
13 IDE_IORDY 68 N. C.
14 IDE_IOR# 69 N. C.
15 PCI_PME# 70 GND
16 PCI_GNT2# 71 N. C.
17 PCI_RE
18 PCI_GNT1# 73 SDVO_DATA
19 PCI_RE
20 PCI_GNT0# 75 N. C.
21 GND 76 GND
22 PCI_RE
23 PCI_RESET# 78 N. C.
24 PCI_AD0 79 N. C.
25 PCI_AD2 80 GND
26 PCI_AD4 81 N. C.
27 PCI_AD6 82 N. C.
28 PCI_AD8 83 N. C.
29 PCI_AD10 84 GND
30 PCI_AD12 85 N. C.
31 GND 86 N. C.
32 PCI_AD14 87 GND
33 PCI_C/BE1# 88 N. C.
34 PCI_PERR# 89 N. C.
35 PCI_LOCK# 90 GND
36 PCI_DEVSEL# 91 N. C.
37 PCI_IRDY# 92 N. C.
38 PCI_C/BE2# 93 GND
39 PCI_AD17 94 N. C.
40 PCI_AD19 95 N. C.
41 GND 96 GND
42 PCI_AD21 97 N. C.
43 PCI_AD23 98 N. C.
44 PCI_C/BE3# 99 N. C.
45 PCI_AD25 100 GND
46 PCI_AD27 101 N. C.
47 PCI_AD29 102 N. C.
48 PCI_AD31 103 GND
49 PCI_IR
50 PCI_IR
51 GND 106 VCC_12V
SDVO_TVCLKIN+
52
SDVO_TVCLKIN-
53
54 N. C. 109 VCC_12V
55 SDVOB_INT+ 110 GND
Row C
2# 72 N. C.
1# 74 N. C.
0# 77 N. C.
A# 104 VCC_12V
B# 105 VCC_12V
107 VCC_12V
108 VCC_12V
20
Hardware Installation
Q
Q
Q
Q
Q
Row D
1 GND 56 SDVOB_GRN2 IDE_D5 57 N. C.
3 IDE_D10 58 SDVOB_BLU+
4 IDE_D11 59 SDVOB_BLU5 IDE_D12 60 GND
6 IDE_D4 61 SDVOB_CK+
7 IDE_D0 62 SDVOB_CK8 IDE_RE
9 IDE_IOW# 64 N. C.
10 IDE_ACK# 65 N. C.
11 GND 66 N. C.
12 IDE_IR
13 IDE_A0 68 N. C.
14 IDE_A1 69 N. C.
15 IDE_A2 70 GND
16 IDE_CS1 71 N. C.
17 IDE_CS3 72 N. C.
18 IDE_RESET# 73 SDVO_CLK
19 PCI_GNT3# 74 N. C.
20 PCI_RE
21 GND 76 GND
22 PCI_AD1 77 IDE_CBLID#
23 PCI_AD3 78 N. C.
24 PCI_AD5 79 N. C.
25 PCI_AD7 80 GND
26 PCI_C/BE0# 81 N. C.
27 PCI_AD9 82 N. C.
28 PCI_AD11 83 N. C.
29 PCI_AD13 84 GND
30 PCI_AD15 85 N. C.
31 GND 86 N. C.
32 PCI_PAR 87 GND
33 PCI_SERR# 88 N. C.
34 PCI_STOP# 89 N. C.
35 PCI_TRDY# 90 GND
36 PCI_FRAME# 91 N. C.
37 PCI_AD16 92 N. C.
38 PCI_AD18 93 GND
39 PCI_AD20 94 N. C.
40 PCI_AD22 95 N. C.
41 GND 96 GND
42 PCI_AD24 97 N. C.
43 PCI_AD26 98 N. C.
44 PCI_AD28 99 N. C.
45 PCI_AD30 100 GND
46 PCI_IR
47 PCI_IR
48 PCI_CLKRUN# 103 GND
49 N. C. 104 VCC_12V
50 PCI_CLK 105 VCC_12V
51 GND 106 VCC_12V
52 SDVOB_RED+ 107 VCC_12V
53 SDVOB_RED- 108 VCC_12V
54 N. C. 109 VCC_12V
55 SDVOB_GRN+ 110 GND
3# 75 N. C.
C# 101 N. C.
D# 102 N. C.
63 N. C.
67 GND
2
21
2
Hardware Installation
LEDs
DRAM/Standby Power LED
DRAM
Power LED
Standby
Power LED
DRAM Power LED
This LED will light when the system’s power is on.
Standby Power LED
This LED will light when the system is in the standby mode.
Important:
If the DRAM Power LED or Standby Power LED is lighted, you
must power-off the system then turn off the power supply’s
switch or unplug the power cord prior to installing any memory
modules or add-in cards.
22
Diagnostic LEDs
LEDs 5-8 are
located behind
LEDs 1-4
2
Hardware Installation
The Diagnostic LEDs display POST codes. POST (Power-On Self
Tests) which is controlled by the BIOS is performed whenever you
power-on the system. POST will detect the status of the system and
its components. Each code displayed on the LED corresponds to a
certain system status.
Note:
These LEDs are available only during the sample stage.
23
2
Hardware Installation
SPI Flash ROM Socket
1. The photo on the right
shows the location of
the SPI flash ROM
socket.
2. If you need to replace
the ROM, open the left
cover first then the right
cover of the socket.
3. Take out the ROM and
replace it with a new
one. Close the right
cover first then the left
cover.
Open left cover
Open right cover
SPI Flash ROM
24
Cooling Options
2
Hardware Installation
Heatspreader
Heatspreader on NP900-B16C
(top view)
1
2
5
Bottom View of the Heatspreader
• "1" to "5" denote the locations of the thermal pads
designed to contact the corresponding components that are on NP900-B16C.
• Remove the plastic covering from the thermal
pads prior to mounting the heatspreader onto
NP900-B16C.
3
4
25
2
Hardware Installation
Dimensions
79.80 5.70
7.00
21.50
R1.50
87.00
95.00
45.50
66.50
4.00
4.00 117.00
76.00
40.00
125.00
4.50
2-M2.5
5-Ø
2.70
47.50
5.22
A
0.05
Top View
5.09
0.05
B
Side View
5.74
C
5.12
E
5- 5.00Ø
0.05
0.05
6.50
3.00
8.00
0.05
D
26
29.75
2
Hardware Installation
102.85
96.80
64.80
39.10
40.50
F
26.00
A
26.00
I
85.15
B
12.00
12.00
7.00
G
D
14.00
5.10
C
12.00
E
7.00
H
11.60
41.70
63.78
12.00
J
Bottom View
“A” to “E”
• Denotes the locations of the thermal pads.
“F” to “J”
• Denotes the locations of the mounting posts.
These mounting posts are used to mount the
heatspreader and NP900-B16C assembly onto a
carrier board.
• Use M2.5 screws with minimum length of 16 mm.
27
2
Hardware Installation
Heat Sink
Heat Sink on NP900-B16C
(top view)
1
2
5
Bottom View of the Passive Heat Sink
• "1" to "5" denote the locations of the thermal pads
designed to contact the corresponding components that are on NP900-B16C.
• Remove the plastic covering from the thermal
pads prior to mounting the heat sink onto NP900B16C.
3
4
28
Dimensions
2
Hardware Installation
95.00
87.00
7.00
21.50
66.50
R1.50
79.80
5.70
4.50
5-Ø
2.70
4.00
4.00 117.00
76.00
Top View
0.05
3.72
A
B
125.00
3.59
0.05
3.62
0.05
5- 5.00Ø
4.24
C
0.05
2.50
6.50
5.00
D
25.00
0.05
Side View
29
2
Hardware Installation
102.85
96.80
64.80
29.75
39.10
40.50
12.00
7.00
G
D
14.00
5.10
C
12.00
E
7.00
F
26.00
A
26.00
I
85.15
B
12.00
Bottom View
“A” to “E”
• Denotes the locations of the thermal pads.
H
11.60
41.70
63.78
12.00
J
“F” to “J”
• Denotes the locations of the mounting posts.
These mounting posts are used to mount the
heat sink and NP900-B16C assembly onto a carrier board.
• Use M2.5 screws with minimum length of 12 mm.
30
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