This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification.
http://www.picmg.org/
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
Appendix A - Watchdog Sample Code................................................92
Appendix B - System Error Message ...................................................93
Appendix C - Troubleshooting ................................................................94
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About this Manual
Static Electricity Precautions
An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click
“User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power
cord.
4
www.dfi .comChapter 1 Introduction
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One HM961 board
• One
• One QR (Quick Reference)
• Heat spreader with heat sink and fan
DVD
Optional Items
• COM331-B carrier board kit
• Heat spreader
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Memory module
• Storage devices such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
• XHCI Host Controller supports up to 4 super speed USB 3.0 ports
HM961-HM86:
• XHCI Host Controller supports up to 2 super speed USB 3.0 ports
®
Smart Response Technology
SSD* (optional)
Expansion
Interfaces
Trusted
Platform
Module - TPM*
(optional)
Intel® Active
Management
Technology AMT
(HM961-QM87)
Damage Free
Intelligence
BIOS
WatchDog
Timer
Power
Power
Consumption
Temperature
Humidity
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
HM961-QM87:
• Supports 4 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
HM961-HM86:
• Supports 2 USB 3.0 interfaces
• Supports 8 USB 2.0 interfaces
• Supports 1 PCIe x16 Gen 3 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
• Supports iAMT9.0
• Out-of-band system access
• Remote troubleshooting and recovery
• Hardware-based agent presence checking
• Proactive alerting
• Remote hardware and software asset tracking
• Monitors CPU temperature and overheat alarm
• Monitors CPU fan speed and failure alarm
• Monitors Vcore/1.05V/DDR voltages and failure alarm
• AMI BIOS
- 64Mbit SPI BIOS
2
C interface
2
C interface
• Software programmable from 1 to 255 seconds
• Input: 12V, VCC_RTC, 5VSB* (optional)
• HM961-QM87BS4-4700EQ: 55.39W with i7-4700EQ at 2.4GHz and 2x 8GB
DDR3L SODIMM
• Operating: 0oC to 60oC
• Storage: -20
o
C to 85oC
• 5% to 90%
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Chapter 1
OS Support
PCB
Note:
*Optional and is not supported in standard model. Please contact your sales representative for more information.
• Windows XP Professional x86 & SP3 (32-bit) (limited function)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• Dimensions
- COM Express® Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express® R2.1, Type 6
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR3L ECC
DDR3L ECC supports low-voltage processors and also ensures high-quality processing performance and computing density, in line with the needs of end systems. The issue of dramatically
reducing system power consumption is the most trusted memory solutions for cloud data centers.
• Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. It supports VGA, LVDS and DDI
interfaces for display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 3Gb/s (SATA 2.0) and 6Gb/s (SATA 3.0), it improves hard drive performance faster than
the standard parallel ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0
will be limited by carrier board design.
• Gigabit LAN
The Intel® I217LM Gigabit LAN controller supports up to 1Gbps data transmission.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously
accessible external Plug and Play peripherals.
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Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
HM961-QM87/HM86 is a COM Express Basic module. The dimension is 95mm x 125mm.
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
Chapter 2
106.00
Extended
91.00
18.00
6.00
0.00
4.00
0.00
16.50
Mini
8
74.20
80.00
91.00
BasicCompact
70.00
51.00
4.00
121.00
151.00
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Chapter 2
/
/
/
Specification Comparison Table
The table below shows the COM Express standard specifications and the corresponding specifications supported on the HM961-QM87/HM86 module.
Side View of the Module with Heat Sink and Carrier Board
Bottom View
14.00
2.00
70.20
12
12.50
0.00
0.00
www.dfi .comChapter 3 Hardware Installation
Chapter 3
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
System Memory
The system board is equipped with two 204-pin SODIMM sockets that only support DDR3L
ECC memory modules. Supports up to 16GB system memory.
Important:
When the Standby Power LED lights red, it indicates that there is power on the board.
Power-off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
DDR3L ECC_2
DDR3L ECC_1
Installing the DIMM Module
Note:
The system board used in the following illustrations may not resemble the actual one.
These illustrations are for reference only.
1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the system board.
4. Note the key on the socket. The key ensures the module can be plugged into the socket in
only one direction.
Power LED
Warning:
HM961-QM87/HM86 ONLY supports DDR3L ECC DRAM.
Standby
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Chapter 3
5. Grasping the module by its edges, align the module into the socket at an approximately 30
degrees angle. Apply firm even pressure to each end of the module until it slips down into
the socket. The contact fingers on the edge of the module will almost completely disappear
inside the socket.
6. Push down the module until the clips at each end of the socket lock into position. You will
hear a distinctive “click”, indicating the module is correctly locked into position.
Clip
Clip
Connectors
CPU Fan Connector
Sense
+12V
Ground
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
BIOS Setting
“PC Health Status” submenu in the Advanced menu of the BIOS will display the current speed
of the cooling fan. Refer to chapter 4 of the manual for more information.
1
3
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Chapter 3
COM Express Connectors
The COM Express connectors are used to interface the HM961-QM87/HM86 COM Express
board to a carrier board. Connect the COM Express connectors (located on the solder side of
the board) to the COM Express connectors on the carrier board.
Refer to the “Installing HM961-QM87/HM86 onto a Carrier Board” section for more information.
A1
COM Express Connectors
Refer to the following pages for the pin functions of these connectors.
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
C97/HDA Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
AC/HAD_RST#A30O CMOS3.3V Suspend/3.3VConnect to CODEC pin 11 RESET#Reset output to CODEC, active low.
AC/HDA_SYNCA29O CMOS3.3V/3.3VConnect to CODEC pin 10 SYNCSample-synchronization signal to the CODEC(s).
AC/HDA_BITCLKA32I/O CMOS3.3V/3.3VConnect to CODEC pin 6 BIT_CLKSerial data clock generated by the external CODEC(s).
AC/HDA_SDOUTA33O CMOS3.3V/3.3VConnect to CODEC pin 5 SDATA_OUTSerial TDM data output to the CODEC.
AC/HDA_SDIN2B28I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC2 pin 8 SDATA_IN
AC/HDA_SDIN1B29I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC1 pin 8 SDATA_IN
AC/HDA_SDIN0B30I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC0 pin 8 SDATA_IN
Gigabit Ethernet Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
GBE0_MDI0+A13I/O Analog3.3V max Suspend
GBE0_MDI0-A12I/O Analog3.3V max Suspend
GBE0_MDI1+A10I/O Analog3.3V max Suspend
GBE0_MDI1-A9I/O Analog3.3V max Suspend
GBE0_MDI2+A7I/O Analog3.3V max Suspend
GBE0_MDI2-A6I/O Analog3.3V max Suspend
GBE0_MDI3+A3I/O Analog3.3V max Suspend
GBE0
MDI3-
GBE0_ACT#B2OD CMOS3.3V Suspend/3.3V
GBE0_LINK#A8OD CMOS3.3V Suspend/3.3VNCGigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100#A4OD CMOS3.3V Suspend/3.3VGigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
GBE0_LINK1000#A5OD CMOS3.3V Suspend/3.3V
2I
O Analog3.3V max Suspend
Connect to Magnetics Module MDI0+/-
Connect to Magnetics Module MDI1+/-
Connect to Magnetics Module MDI2+/-
Connect to Magnetics Module MDI3+/Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
onnect to LED and recommend current lim
Serial TDM data inputs from up to 3 CODECs.
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes. Some pairs are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI
Gigabit Ethernet Controller 0 activity indicator, active low.
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
+/- B1_DD+/-
SATA Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
SATA4_TX+A16O SATAAC coupled on ModuleAC Coupling capacitor
SATA4_TX-A17O SATAAC coupled on ModuleAC Coupling capacitor
SATA4_RX+A19I SATAAC coupled on ModuleAC Coupling capacitor
SATA4_RX-A20I SATAAC coupled on ModuleAC Coupling capacitor
SATA5_TX+B16O SATAAC coupled on ModuleAC Coupling capacitor
SATA5_TX-B17O SATAAC coupled on ModuleAC Coupling capacitor
SATA5_RX+B19I SATAAC coupled on ModuleAC Coupling capacitor
SATA5_RX-B20I SATAAC coupled on ModuleAC Coupling capacitor
SATA0_TX+A22O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_TX-A23O SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX+A25I SATAAC coupled on ModuleAC Coupling capacitor
SATA0_RX-A26I SATAAC coupled on ModuleAC Coupling capacitor
SATA2_TX+B22O SATAAC coupled on ModuleAC Coupling capacitor
SATA2_TX-B23O SATAAC coupled on ModuleAC Coupling capacitor
SATA2_RX+B25I SATAAC coupled on ModuleAC Coupling capacitor
SATA2_RX-B26I SATAAC coupled on ModuleAC Coupling capacitor
ATA_ACT#A28I/O CMOS3.3V / 3.3VPU 10K to 3.3V
Connect to SATA0 Conn TX pin
Connect to SATA0 Conn RX pinSerial ATA or SAS Channel 0 receive differential pair.
Connect to SATA1 Conn TX pin
Connect to SATA1 Conn RX pinSerial ATA or SAS Channel 1 receive differential pair.
Connect to SATA2 Conn TX pin
Connect to SATA2 Conn RX pinSerial ATA or SAS Channel 2 receive differential pair.
Connect to SATA3 Conn TX pinSerial ATA or SAS Channel 3 transmit differential pair.
Connect to SATA3 Conn RX pinSerial ATA or SAS Channel 3 receive differential pair.
Connect to LED and recommend current limit
resistor 220ƻ to 3.3V
18
Serial ATA or SAS Channel 0 transmit differential pair.
Serial ATA or SAS Channel 1 transmit differential pair.
Serial ATA or SAS Channel 2 transmit differential pair.
ATA (parallel and serial) or SAS activity indicator, active low.
(Optional with on board LAN, Default setting as NC)
PCI Express Differential Receive Pairs 7
(Optional with on board LAN, Default setting as NC)
Reference clock output for all PCI Express and PCI Express Graphics
lanes.
PCI Express Graphics lane reversal input strap. Pull low on the Carrier
board to reverse lane order.
PCI ExpressCard: PCI Express capable card request, active low, one per
card
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Chapter 3
_
e
DDI Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
DDI1_PAIR0+/SDVO1_RED+D26Connect AC Coupling Capacitors 0.1uF to Device
PAIR0-/SDVO1_RED-D27Connect AC Coupling Capacitors 0.1uF to Devic
DDI1
DDI1_PAIR1+/SDVO1_GRN+D29Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1-/SDVO1_GRN-D30Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2+/SDVO1_BLU+D32Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2-/SDVO1_BLU-D33Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3+/SDVO1_CK+D36Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3-/SDVO1_CK-D37Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4+/SDVO1_INT+C25Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4-/SDVO1_INT-C26Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR5+/SDVO1_TVCLKIN+C29Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR5-/SDVO1_TVCLKIN-C30Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR6+/SDVO1_FLDSTALL+C15Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR6-/SDVO1_FLDSTALL-C16Connect AC Coupling Capacitors 0.1uF to Device
DDI1_CTRLCLK_AUX+/SDVO1_CTRLCLK D15
DDI1_CTRLCLK_AUX/SDVO1_CTRLDATA
DDI1_HPDC24I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug DetectDDI Hot-Plug Detect
DDI1_DDC_AUX_SELD34I CMOS3.3V / 3.3VPD 1M TO GND
DDI2_PAIR0+D39Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR0-D40Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1+D42Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1-D43Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2+D46Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2-D47Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3+D49Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3-D50Connect AC Coupling Capacitors 0.1uF to Device
DDI2_CTRLCLK_AUX+C32
DDI2_CTRLCLK_AUX-C33
DDI2_HPDD44I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug DetectDDI Hot-Plug Detect
DDI2_DDC_AUX_SELC34I CMOS3.3V / 3.3VPD 1M TO GNDPU 100K to 3.3V for DDC(HDMI/DVI)Selects the function of DDI2_CTRLCLK_AUX+ and DDI2_CTRLDATA_AUX-.
DDI3_PAIR0+C39Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR0-C40Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR1+C42Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR1-C43Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR2+C46Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR2-C47Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR3+C49Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR3-C50Connect AC Coupling Capacitors 0.1uF to Device
D16
O PCIEAC coupled off ModuleDDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair
O PCIE
O PCIE
O PCIEAC coupled off ModuleDDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.
I PCIE
I PCIEAC coupled off ModuleSerial Digital Video TVOUT synchronization clock input differential pair.
I PCIE
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 2 Pair 1 differential pairs
O PCIEAC coupled off ModuleDDI 2 Pair 2 differential pairs
O PCIEAC coupled off ModuleDDI 2 Pair 3 differential pairs
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
O PCIEAC coupled off ModuleDDI 3 Pair 0 differential pairs
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 3 Pair 3 differential pairs
AC coupled off ModuleDDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair
AC coupled off ModuleDDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair
AC coupled off ModuleSerial Digital Video B interrupt input differential pair.
AC coupled off ModuleSerial Digital Video Field Stall input differential pair.
PD 49.9K to GND
(S/W IC between Rpu/PCH)
PU 2.2K to 3.3V, PD 49.9K to
GND
(S/W IC between Rpu/Rpd
resistor)
PU 100K to 3.3V
(S/W IC between Rpu/PCH)
PU 2.2K to 3.3V/PU 100K to 3.3V
(S/W IC between 2.2K/100K
resistor)
PD 49.9K to GND
(S/W IC between Rpu/PCH)
PU 2.2K to 3.3V, PD 49.9K to
GND
(S/W IC between Rpu/Rpd
PU 100K to 3.3V
(S/W IC between Rpu/PCH)
PU 2.2K to 3.3V/PU 100K to 3.3V
(S/W IC between 2.2K/100K
resistor)
AC coupled off ModuleO PCIE
Connect to DP AUX+DP AUX+ function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high
PU 100K to 3.3V for DDC(HDMI/DVI)
Connect to DP AUX+DP AUX+ function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI2_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high
Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-.
DDI 2 Pair 0 differential pairs
DDI3_HPDC44I CMOS3.3V / 3.3VNCPD 1M and Connect to device Hot Plug DetectDDI Hot-Plug Detect
DDI3_DDC_AUX_SELC38I CMOS3.3V / 3.3VPD 1M TO GNDPU 100K to 3.3V for DDC(HDMI/DVI)Selects the function of DDI3_CTRLCLK_AUX+ and DDI3_CTRLDATA_AUX-.
Connect to DP AUX+DP AUX+ function if DDI3_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI3_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI3_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI3_DDC_AUX_SEL is pulled high
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
USB differential pairs 0
USB differential pairs 1
USB differential pairs 2
USB differential pairs 3
USB differential pairs 4
USB differential pairs 5
USB differential pairs 6
USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the
Module designer's discretion.(HM961-QM87/HM86 default set as a host)
USB over-current sense, USB channels 0 and 1. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 2 and 3. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 4 and 5. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 6 and 7. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
LVDS_A0+A71
LVDS_A0-A72
LVDS_A1+A73
LVDS_A1-A74
LVDS_A2+A75
LVDS_A2-A76
LVDS_A3+A78
LVDS_A3-A79
LVDS_A_CK+A81
LVDS_A_CK-A82
LVDS_B0+B71
LVDS_B0-B72
LVDS_B1+B73
LVDS_B1-B74
LVDS_B2+B75
LVDS_B2-B76
LVDS_B3+B77
LVDS_B3-B78
LVDS_B_CK+B81
LVDS_B_CK-B82
LVDS_VDD_ENA77O CMOS3.3V / 3.3VConnect to enable control of LVDS panel powerLVDS panel power enable
LVDS_BKLT_ENB79O CMOS3.3V / 3.3VConnect to enable control of LVDS panel backlightLVDS panel backlight enable
LVDS_BKLT_CTRLB83O CMOS3.3V / 3.3VConnect to brightness control of LVDS panel backlight LVDS panel backlight brightness control
LVDS_I2C_CKA83I/O OD CMOS 3.3V / 3.3VPU 4.7K TO 3V3Connect to DDC clock of LVDS panelI2C clock output for LVDS display use
LVDS_I2C_DATA84I/O OD CMOS 3.3V / 3.3VPU 4.7K TO 3V3Connect to DDC data of LVDS panelI2C data line for LVDS display use
LPC Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
LPC_AD0B4
LPC_AD1B5
LPC_AD2B6
LPC_AD3B7
LPC_FRAME#B3O CMOS3.3V / 3.3VLPC frame indicates the start of an LPC cycle
LPC_DRQ0#B8
LPC_DRQ1#B9
LPC_SERIRQA50I/O CMOS3.3V / 3.3VPU 8.2K TO 3V3LPC serial interrupt
LPC_CLKB10O CMOS3.3V / 3.3VLPC clock output - 33MHz nominal
I PCIEAC coupled off Modul
O PCIEAC coupled on Module
I PCIEAC coupled off Modul
O LVDSLVDS
O LVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
O LVDSLVDS
I/O CMOS3.3V / 3.3V
I CMOS3.3V / 3.3VLPC serial DMA request
LVDS
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LVDS connector
Connect to LPC device
Additional receive signal differential pairs for the SuperSpeed USB data path.
Additional transmit signal differential pairs for the SuperSpeed USB data path.
Additional receive signal differential pairs for the SuperSpeed USB data path.
LVDS Channel A differential pairs
LVDS Channel A differential clockO LVDSLVDS
LVDS Channel B differential pairs
LVDS Channel B differential clock
LPC multiplexed address, command and data bus
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Chapter 3
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SPI Si
nals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
SPI_CS#B97O CMOS3.3V Suspend/3.3V
SPI_MISOA92I CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_MOSIA95O CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_CLKA94O CMOS3.3V Suspend/3.3VConnect a series resistor 33
SPI_POWERA91O3.3V Suspend/3.3V
BIOS
DIS0#
BIOS_DIS1#B88
GA Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
VGA_REDB89O AnalogAnalogPD 150 TO GNDPD 150R,connect to VGA connector with EMI Red for monitor. Analog output
VGA_GRNB91O AnalogAnalogPD 150 TO GNDPD 150R,connect to VGA connector with EMI Green for monitor. Analog output
VGA_BLUB92O AnalogAnalogPD 150 TO GNDPD 150R,connect to VGA connector with EMI Blue for monitor. Analog output
VGA_HSYNCB93O CMOS3.3V / 3.3VConnect to VGA connector with a3.3V BufferHorizontal sync output to VGA monitor
VGA_VSYNCB94O CMOS3.3V / 3.3VConnect to VGA connector with a 33V BufferVertical sync output to VGA monitor
VGA_I2C_CKB95I/O OD CMOS 3.3V / 3.3VPU 2.2K TO 3V3Connect to VGA connector with a 3.3V to 5VDDC clock line (I2C port dedicated to identify VGA monitor capabilities)
VGA_I2C_DATB96I/O OD CMOS 3.3V / 3.3VPU 2.2K TO 3V3Connect to VGA connector with a 3.3V to 5VDDC data line.
Serial Interface Signals Descriptions
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
SER0_TXA98O CMOS3.3V/5VPD 4.7K TO GNDGeneral purpose serial port 0 transmitter
SER0_RXA99I CMOS3.3V/5VPU 47K TO 3V3General purpose serial port 0 receiver
SER1_TXA101O CMOS3.3V/5VPD 4.7K TO GNDGeneral purpose serial port 1 transmitter
SER1_RXA102I CMOS3.3V/5VPU 47K TO 3V3General purpose serial port 1 receiver
34
I CMOS NA
Connect a series resistor 33
SPI Device CS#
in
to Carrier Board
to Carrier Board Data in to Module from Carrier SPI
to Carrier Board Data out from Module to Carrier SPI
to Carrier Board Clock from Module to Carrier SPI
Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1
Power supply for Carrier Board SPI – sourced from Module – nominally
3.3V. The Module shall provide a minimum of 100mA on SPI_POWER.
Carriers shall use less than 100mA of SPI_POWER. SPI_POWER
shall only be used to power SPI devices on the Carrier
Selection straps to determine the BIOS boot device.
The Carrier should only float these or pull them low, please refer to
COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.
Miscellaneous Si
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
I2C_CKB33I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K TO 3V3_DU_ECGeneral purpose I2C port clock output
I2C_DATB34I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K TO 3V3_DU_ECGeneral purpose I2C port data I/O line
SPKRB32O CMOS3.3V / 3.3V
WDTB27O CMOS3.3V
FAN_PWNOUTB101O OD CMOS 3.3V / 12VFan speed control. Uses the Pulse Width Modulation (PWM) technique to control the fan's RPM.
FAN_TACHINB102I OD CMOS 3.3V / 12VPU 10K TO 3V3Fan tachometer input for a fan with a two pulse output.
TPM_PPA96I CMOS3.3V / 3.3VPU 10K TO GND
nal Descriptions
Output for audio enunciator - the "speaker" in PC-AT systems.
This port provides the PC beep signal and is mostly intended for
3.3VOutput indicating that a watchdog time-out event has occurred
24
debugging purposes.
Trusted Platform Module (TPM) Physical Presence pin. Active high.
TPM chip has an internal pull down. This signal is used to indicate
Physical Presence to the TPM.
PWRBTN#B12I CMOS3.3V Suspend/3.3VPU 10K TO 3V3_DU_ECPU 4.7K TO 3V3_SB
SYS_RESET#B49I CMOS3.3V Suspend/3.3VPU 10K TO 3V3_DUNC PU 4.7K TO 3V3_SB
CB_RESET#B50O CMOS3.3V Suspend/3.3V
PWR_OKB24I CMOS3.3V / 3.3VPU 10K TO 3V3
SUS_STAT#B18O CMOS3.3V Suspend/3.3VIndicates imminent suspend operation; used to notify LPC devices.
SUS_S3#A15O CMOS3.3V Suspend/3.3V
SUS_S4#A18O CMOS3.3V Suspend/3.3VIndicates system is in Suspend to Disk state. Active low output.
SUS_S5#A24O CMOS3.3V Suspend/3.3VIndicates system is in Soft Off state.
WAKE0#B66I CMOS3.3V Suspend/3.3VPU 1K TO 3V3_DUPCI Express wake up signal.
WAKE1#B67I CMOS3.3V Suspend/3.3VPU 10K TO 3V3_DUNC PU 10 K TO 3V3_DU
BATLOW#A27I CMOS3.3V Suspend/ 3.3V PU 8.2K TO 3V3_DU
LID#A103I OD CMOS 3.3V Suspend/12VLID switch. Low active signal used by the ACPI operating system for a LID switch.
SLEEP#B103I OD CMOS 3.3V Suspend/12VPU 10K TO 3V3_DU
THRM#B35I CMOS3.3V / 3.3VPU 10K TO 3V3Input from off-Module temp sensor indicating an over-temp situation.
THRMTRIP#A35O CMOS3.3V / 3.3VPU 10K TO 3V3Active low output indicating that the CPU has entered thermal shutdown.
SMB_CKB13I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K TO 3V3_DU_ECNC PU 4.7K TO 3V3_DUSystem Management Bus bidirectional clock line.
SMB_DATB14I/O OD CMOS 3.3V Suspend/3.3VPU 2.2K TO 3V3_DU_ECNC PU 4.7K TO 3V3_DUSystem Management Bus bidirectional data line.
SMB_ALERT#B15I CMOS3.3V Suspend/3.3V
GPIO Si
SignalPin#Pin TypePwr Rail /ToleranceHM961-QM87/HM86Carrier BoardDescription
GPO0A93
GPO1B54
GPO2B57
GPO3B63
GPI0A54PU 47K TO 3V3
GPI1A63PU 47K TO 3V3
GPI2A67PU 47K TO 3V3
GPI3A85PU 47K TO 3V3
nals Descriptions
O CMOS3.3V / 3.3V
I CMOS3.3V / 3.3VGeneral purpose input pins.
A falling edge creates a power button event. Power button events can
be used to bring a system out of S5 soft off and other suspend states,
as well as powering the system down.
Reset button input. Active low request for Module to reset and reboot.
May be falling edge sensitive. For situations when SYS_RESET# is
not able to reestablish control of the system, PWR_OK or a power
cycle may be used.
Reset output from Module to Carrier Board. Active low. Issued by
Module chipset and may result from a low SYS_RESET# input, a low
PWR_OK input, a VCC_12V power input that falls below the minimum
specification, a watchdog timeout, or may be initiated by the Module
software.
Power OK from main power supply. A high value indicates that the
power is good. This signal can be used to hold off Module startup to
allow Carrier based FPGAs or other configurable devices time to be
programmed.
Indicates system is in Suspend to RAM state. Active low output. An
inverted copy of SUS_S3# on the Carrier Board may be used to
enable the non-standby power on a typical ATX supply.
General purpose wake up signal. May be used to implement wake-up
on PS2 keyboard or mouse activity.
Indicates that external battery is low.
This port provides a battery-low signal to the Module for orderly
transitioning to power saving or power cut-off ACPI modes.
Sleep button. Low active signal used by the ACPI operating system to bring the
system to sleep state or to wake it up again.
System Management Bus Alert – active low input can be used to
generate an SMI# (System Management Interrupt) or to wake the system.
PowerPrimary power input: +12V nominal. All available VCC_12V pins on the connector(s) shall be used.
Standby power input: +5.0V nominal. If VCC5_SBY is used, all
available VCC_5V_SBY pins on the connector(s) shall be used. Only
used for standby and suspend functions. May be left unconnected if
these functions are not used in the system design.
Power
Ground - DC power and signal and AC signal return path.
All available GND connector pins shall be used and tied to Carrier
Board GND plane.
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Chapter 3
Standby Power LED
This LED will light when the system is in the standby mode.
Standby
Power LED
Cooling Option
Heat Spreader with Heat Sink and Fan
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
Top View of the Heat Sink
1
2
Bottom View of the Heat Sink
• “1” and “2” denote the locations of the thermal
pads designed to contact the corresponding components that are on HM961-QM87/HM86.
Important:
Remove the plastic covering from the thermal pads prior to mounting the heat sink
onto HM961-QM87/HM86.
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www.dfi .comChapter 3 Hardware Installation
Chapter 3
Installing HM961-QM87/HM86 onto a Carrier Board
Important:
The carrier board (COM331-B) used in this section is for reference purpose only and
may not resemble your carrier board. These illustrations are mainly to guide you on
how to install HM961-QM87/HM86 onto the carrier board of your choice.
• To download COM331-B datasheet and manual
1. Use the provided screw to install the heatsink onto the module. First align the mounting
hole of the heatsink with the mounting hole of the module and then from the bottom
side of the module, secure them with the provided screw. The module and heatsink as
sembly should look like the one shown below.
bottom side of heat sink
Mounting hole
Mounting hole
2. Now install the module and heatsink assembly onto the carrier board. The photo below
shows the locations of the mounting holes on carrier board.
Mounting hole
3. Insert the provided mounting screws into the mounting holes - from the bottom through
the top of the carrier board.
Mounting screws
Mounting
screw
Top viewBottom view
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Chapter 3
4. While supporting the mounting screw at the bottom, from the top side of the board, fasten
a bolt into the screw.
Bolts
5. The photo below shows the solder side of the board with the screws already fixed in place.
6. The photo below shows the component side of the board with the bolts already fixed in
place.
Bolts
7. Position the heat sink on the top of HM961-QM87/HM86 with the heat sink’s mounting
holes aligned with HM961-QM87/HM86 mounting holes. Insert one of the provided long
screws into the mounting hole shown in the photo below.
Mounting screw
Mounting hole
Long screw
29
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