DFI HM960-HM86 User Manual

HM960-QM87/HM86

COM Express Basic Module

User’s Manual

A26810447

www.dﬁ .comChapter 1 Introduction

Copyright

FCC and DOC Statement on Class B

This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.

Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.

COM Express Specification Reference

PICMG® COM Express ModuleTM Base Specification. http://www.picmg.org/

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

www.dﬁ .comChapter 1 Introduction

Trademarks ........................................................................................................2

FCC and DOC Statement on Class B .....................................................2

About this Manual ..........................................................................................4

Chapter 4 - BIOS Setup ............................................................... 34

Overview ..................................................................................................... 34

AMI BIOS Setup Utility .............................................................................35

Main ......................................................................................................... 35

Advanced .................................................................................................. 35

Chipset ..................................................................................................... 44

Boot ......................................................................................................... 51

Security .................................................................................................... 52

Save & Exit ...............................................................................................52

Updating the BIOS ....................................................................................53

Notice: BIOS SPI ROM .............................................................................53

Warranty ..............................................................................................................4

Static Electricity Precautions ......................................................................4

Safety Measures ..............................................................................................4

About the Package .........................................................................................5

Chapter 1 - Introduction .............................................................................6

Specifications ................................................................................................6

Features ........................................................................................................7

Chapter 2 - Concept .......................................................................8

COM Express Module Standards ..............................................................8

Specification Comparison Table ...............................................................9

Chapter 3 - Hardware Installation .............................................. 10

Board Layout ...............................................................................................10

Block Diagram .............................................................................................10

Mechanical Diagram ..................................................................................12

System Memory ..........................................................................................13

Installing the DIMM Module ....................................................................... 13

Connectors ...................................................................................................14

CPU Fan Connector.................................................................................... 14

COM Express Connectors ........................................................................... 15

COM Express Connectors Signal Discription .................................................18

Standby Power LED ................................................................................... 27

Cooling Option ............................................................................................27

Installing HM960-QM87/HM86 onto a Carrier Board .......................28

Installing the COM Express Debug Card .............................................31

Chapter 5 - Supported Software ...........................................................54

Chapter 6 - GPIO Programming Guide...............................................74

Chapter 7 - RAID (HM960-QM87) ...............................................75

RAID Levels .................................................................................75

Settings .......................................................................................75

Chapter 8 - Intel AMT Settings (HM960-QM87) ............................78

Overview ...............................................................................................................78

Enable Intel® AMT in the AMI BIOS .........................................................78

Enable Intel® AMT in the Intel® Management Engine BIOS

Extension (MEBX) Screen ..............................................................................

Appendix A - nLite and AHCI Installation Guide ...........................92

nLite ...............................................................................................................92

AHCI ..............................................................................................................95

Appendix B - Watchdog Sample Code ................................................98

Appendix C - System Error Message ...................................................99

Appendix D - Troubleshooting .............................................................. 100

www.dﬁ .comChapter 1 Introduction

About this Manual

Static Electricity Precautions

An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click “User’s Manual” on the main menu.

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.

It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power cord.

www.dﬁ .comChapter 1 Introduction

About the Package

The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.

• One HM960 board

• One

• One QR (Quick Reference)

DVD

Optional Items

• COM331-B carrier board kit

• COM101-BAT carrier board kit

• Heat spreader with heat sink and fan The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.

Before Using the System Board

Before using the system board, prepare basic system components. If you are installing the system board in a new system, you will need at least the following

internal components.

• Memory module

• Storage devices such as hard disk drive, CD-ROM, etc. You will also need external system peripherals you intend to use which will normally include at

least a keyboard, a mouse and a video display monitor.

www.dﬁ .comChapter 1 Introduction

Chapter 1 - Introduction Specifications

Chapter 1

Processor

Chipset

System Memory

Graphics

Audio LAN

Serial ATA

USB Interface

SSD* (optional)

• 4th generation Intel® CoreTM processors

• BGA 1364 packaging technology

• 22nm process technology

• Intel® QM87 Express Chipset (HM960-QM87)

• Intel

• Two 204-pin DDR3L SODIMM sockets

• Supports DDR3L 1333/1600MHz SODIMM

• Supports up to 16GB system memory

• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3L DRAM technologies are

• Intel® HD Graphics 4600

• Supports 1 VGA, 1 LVDS and 3 DDI

• VGA: resolution up to 2048x1536 @75Hz

• LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920x1200 @60Hz

• Digital Display Interface: HDMI, DVI and DP

• HDMI: resolution up to 4096x2304 @24Hz or 2560x1600 @60Hz

• DVI: resolution up to 1920x1200 @60Hz

• DP: resolution up to 3840x2160 @60Hz

• Intel

• Supports DirectX 11.1, OpenGL 3.2, OpenCL 1.2

Intel® CoreTM i7-4700EQ, 6M Cache, up to 3.4 GHz, 47W

4700EQ:

4400E: Intel 4402E: Intel 4100E: Intel 4102E: Intel 2000E: Intel 2002E: Intel

CoreTM i5-4400E, 3M Cache, up to 3.3 GHz, 37W

CoreTM i5-4402E, 3M Cache, up to 2.7 GHz, 25W

Core

i3-4100E, 3M Cache, 2.4 GHz, 37W

Core

i3-4102E, 3M Cache, 1.6 GHz, 25W

Celeron® 2000E, 2M Cache, 2.2 GHz, 37W

Celeron® 2002E, 2M Cache, 1.5 GHz, 25W

HM86 Express Chipset (HM960-HM86)

supported for x8 and x16 devices, unbuffered, non-ECC

Clear Video Technology

Advanced Vector Extensions (Intel® AVX) Instructions

• Supports High Deﬁ nition Audio interface

• Intel® I217LM with iAMT9.0 Gigabit Ethernet Phy (HM960-QM87)

I217LM Gigabit Ethernet Phy (HM960-HM86)

• Intel

• Integrated 10/100/1000 transceiver

• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab HM960-QM87:

• Supports 4 SATA 3.0 with data transfer rate up to 6Gb/s

• Integrated Advanced Host Controller Interface (AHCI) controller

• Supports RAID 0/1/5/10

• Supports Intel HM960-HM86:

• Supports 2 SATA 3.0, and 2 SATA 2.0

• Supports 2 SATA 3.0, 1 SATA 2.0, and 1 SSD* (optional)

• Integrated Advanced Host Controller Interface (AHCI) controller HM960-QM87:

• XHCI Host Controller supports up to 4 super speed USB 3.0 ports HM960-HM86:

• XHCI Host Controller supports up to 2 super speed USB 3.0 ports

• 2GB/4GB/8GB/16GB/32GB/64GB

• Write: 30MB/sec (max), Read: 70MB/sec (max)

• SATA to SSD onboard

Smart Response Technology

Expansion Interfaces

Trusted Platform Module - TPM*

(optional) Intel® Active

Management Technology AMT (HM960-QM87)

Damage Free Intelligence

BIOS

WatchDog Timer

Temperature

Humidity Power Power

Consumption OS Support

HM960-QM87:

• Supports 4 USB 3.0 interfaces

• Supports 8 USB 2.0 interfaces

• Supports 1 PCIe x16 Gen 3 interface

• Supports 7 PCIe x1 interfaces

• Supports LPC interface

• Supports SMBus interface

• Supports I

• Supports 2 serial interfaces (TX/RX)

• Supports 4-bit input and 4-bit output GPIO HM960-HM86:

• Supports 2 USB 3.0 interfaces

• Supports 8 USB 2.0 interfaces

• Supports 1 PCIe x16 Gen 3 interface

• Supports 7 PCIe x1 interfaces

• Supports LPC interface

• Supports SMBus interface

• Supports I

• Supports 2 serial interfaces (TX/RX)

• Supports 4-bit input and 4-bit output GPIO

• Provides a Trusted PC for secure transactions

• Provides software license protection, enforcement and password protection

• Supports iAMT9.0

• Out-of-band system access

• Remote troubleshooting and recovery

• Hardware-based agent presence checking

• Proactive alerting

• Remote hardware and software asset tracking

• Monitors CPU temperature and overheat alarm

• Monitors CPU fan speed and failure alarm

• Monitors Vcore/1.05V/DDR voltages and failure alarm

• AMI BIOS

- 64Mbit SPI BIOS

C interface

• Software programmable from 1 to 255 seconds

• Operating: 0oC to 60oC

• Storage: -20

C to 85oC

• 5% to 90%

• Input: 12V, VCC_RTC, 5VSB* (optional)

• TBD

• Windows XP Professional x86 & SP3 (32-bit)

• Windows 7 Ultimate x86 & SP1 (32-bit)

• Windows 7 Ultimate x64 & SP1 (64-bit)

• Windows 8 Enterprise x86 (32-bit)

• Windows 8 Enterprise x64 (64-bit) (based on Intel's Windows XP support list)

www.dﬁ .comChapter 1 Introduction

Chapter 1

PCB

Note:

*Optional and is not supported in standard model. Please contact your sales representative for more information.

• Dimensions

- COM Express

- 95mm (3.74") x 125mm (4.9")

• Compliance

- PICMG COM Express

Basic

R2.1, Type 6

Features

• Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.

• DDR3L

DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher speed successor. DDR3L SDRAM modules support 1333/1600MHz for DDR modules. DDR3L delivers increased system bandwidth and improved performance to provide its higher bandwidth and its increase in performance at a lower power.

• Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports VGA, LVDS and DDI interfaces for display outputs.

• Serial ATA

Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of up to 3Gb/s (SATA 2.0) and 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0 will be limited by carrier board design.

• Gigabit LAN

The Intel® I217LM Gigabit LAN controller supports up to 1Gbps data transmission.

• USB

The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.

www.dﬁ .comChapter 1 Introduction

Chapter 2 - Concept COM Express Module Standards

The figure below shows the dimensions of the different types of COM Express modules. HM960-QM87/HM86 is a COM Express Basic module. The dimension is 95mm x 125mm.

Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only

Chapter 2

106.00

Extended

91.00

18.00

6.00

0.00

4.00

0.00

16.50

Mini

74.20

80.00

91.00

BasicCompact

70.00

51.00

4.00

121.00

151.00

www.dﬁ .comChapter 2 Concept

Chapter 2

Specification Comparison Table

The table below shows the COM Express standard specifications and the corresponding specifications supported on the HM960-QM87/HM86 module.

COM Express Module Base

Connector Feature

A-B A-B PCI Express Lanes 0 - 5 1 / 6 6 A-B LVDS Channel A 0 / 1 1 A-B LVDS Channel B 0 / 1 1 A-B eDP on LVDS CH A pins 0 / 1 0 A-B VGA Port 0 / 1 1 A-B TV-Out NA NA A-B DDI 0 NA NA

A-B A-B CAN interface on SER1 0 / 1 0 A-B SATA / SAS Ports 1 / 4 4 A-B AC’97 / HDA Digital Interface 0 / 1 1 A-B USB 2.0 Ports 4 / 8 8 A-B USB Client 0 / 1 0 A-B USB 3.0 Ports NA NA A-B LAN Port 0 1 / 1 1 A-B Express Card Support 1 / 2 2 A-B LPC Bus 1 / 1 1 A-B SPI 1 / 2 1 A-B

A-B A-B SMBus 1 / 1 1

A-B I2C 1 / 1 1 A-B Watchdog Timer 0 / 1 1 A-B Speaker Out 1 / 1 1 A-B External BIOS ROM Support 0 / 2 1 A-B Reset Functions 1 / 1 1

Serial Ports 1 - 2 0 / 2 2

SDIO (muxed on GPIO) 0 / 1 0 General Purpose I/O 8 / 8 8

Specification Type 6

(No IDE or PCI, add DDI+ USB3) Min

Max

System I/O

System Management

DFI HM960-QM87/HM86 Type 6

• 5 Indicates 12V-tolerant features on former VCC_12V signals.

• 6 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.

COM Express Module Base

Connector Feature

A-B A-B Thermal Protection 0 / 1 1 A-B Battery Low Alarm 0 / 1 1 A-B Suspend/Wake Signals 0 / 3 2 A-B Power Button Support 1 / 1 1 A-B Power Good 1 / 1 1 A-B VCC_5V_SBY Contacts 4 / 4 4

A-B

A-B A-B Trusted Platform Modules 0 / 1 1 A-B A-B VCC_12V Contacts 12 / 12 12

Sleep Input 0 / 1 1 Lid Input 0 / 1 1 Fan Control Signals 0 / 2 2

Specification Type 6

(No IDE or PCI, add DDI+ USB3)

Max

Min

Power Management

Power

DFI HM960-QM87/HM86 Type 6

Module Pin-out - Required and Optional Features C-D Connector. PICMG® COM.0Revision 2.1

COM Express Module Base

Connector Feature

C-D

C-D C-D C-D VCC_12V Contacts 12 / 12 12

PCI Express Lanes 16 - 31 0 / 16 16 PCI Express Graphics (PEG) 0 / 1 1 Muxed SDVO Channels 1 - 2 NA NA PCI Express Lanes 6 - 15 0 / 2 1 PCI Bus - 32 Bit NA NA PATA Port NA NA LAN Ports 1 - 2 NA NA DDIs 1 - 3 0 / 3 3 USB 3.0 Ports 0 / 4 4

Specification Type 6

(No IDE or PCI, add DDI+ USB3) Min

Max

System I/O

Power

DFI HM960-QM87/HM86 Type 6

www.dﬁ .comChapter 2 Concept

Chapter 3 - Hardware Installation

4 i

PEG 16x LANES

LPC

Bus

USB

2.0

CRT

PCIe x1

Lane 1~6

SATA 3.0 4x

LAN Port

SATA Port

WDT

Board Layout

Chapter 3

Block Diagram For HM960-QM87

CPU fan

SSD

(optional)

Intel I217LM

PTN346085

iTE

IT8518E

TPM (optional)

Intel

BGA 1364 i3/i5/i7

QM87/HM86

HM960-QM87: QM87 HM960-HM86: HM86

SPI Flash BIOS

Top View

Standby Power LED

CPU fan

Intel

DDR3_1 SODIMM

Standby Power LED

DDR3_2 SODIMM

A / B

4 in/4 out

LVDS Port

DDR3L

SODIMM

DDR3L

SODIMM

CMOS

backup

Bus

WDT

SM Bus

DIO

LAN Port

PTN

3460

SM Bus

DIO

USB 2.0 8x

SATA 3.0 4x

PCIe x1, Lane 1~6

eDP

Channel A

1333/1600MHz

Channel B

1333/1600MHz

LPC Bus

LPC TPM 1.2

SLB9635(option)

Embedded

Controller

CRT

PCIe x1, Lane 8

Processor

CORE

CORE CORE CORE

4th Generation;

Intel

Core™ i7/i5/i3

Graphics

CORE

DMI x4

(Direct Media

Interface)

Mobile Intel®

QM87

Express Chipset

Memory

Controller

Intel® FDI

(Flexible Display

Interface)

PCIe x1

LANE7

SATA

Port

SATA Port

VR12.5 (Vcore)

PEG 16x LANES

IT8892E

PCIe to PCI

88SA8052

SATA to PATA

SSD Chip

(

PCI BUS

C / D

IDE BUS

option)

D110

C110 B110 B1

A110

COM Express connector

Bottom View

Intel® GLAN

PHY I217LM

www.dﬁ .comChapter 3 Hardware Installation

For HM960-HM86

16x LANES

Audio

Bus

SATA 2

CRT

1~6 Bus

Port SATA Ports Port B

Port

Port D 3.0 2x x1 Lane 7

Chapter 3

A / B

LVDS Ports eDP

Backup

EEPROM

I2C Bus

WDT

Sys FAN PWM/

TACH_IN/

SLP/LID SM Bus

4 in/4 out

DIO

PTN

3460

DDR3L

SODIMM

DDR3L

SODIMM

1333/1600MHz

LPC Bus

SLB9635(option)

Embedded

Controller

SM Bus

DIO

Serial Port 1, 2 Tx/Rx

HD Audio

USB 2.0 8x

2.0

3.0

SATA 3.0 2x, SATA 2.0 2x

CRT

PCIe x1, Lane 1~6

SPI Bus

LAN Port

PCIe x1, Lane 8

Channel A

Channel B

LPC TPM 1.2

Processor

CORE

CORE CORE CORE

4th Generation;

Intel

Core™ i7/i5/i3

Graphics

CORE

DMI x4

(Direct Media

Interface)

Mobile

Intel

Express Chipset

Controller

HM86

Memory

(Flexible Display

Intel

FDI

Interface)

PCIe x1 Lane 7

PCIe x1 Lane 8

(Opt. share with onboard LAN)

SATA Ports

VR12.5 (Vcore)

PEG 16x LANES

DDI Port B

DDI Port C

DDI Port D

USB 3.0 2x

SSD Chip

option)

(

C / D

Intel® GLAN

PHY I217LM

www.dﬁ .comChapter 3 Hardware Installation

Mechanical Diagram

Chapter 3

53.00

HM960-QM87/HM86 Module with Heat Sink

20.0022.0011.00

55.00

standoff

Heat sink and fan

Heat spreader

Module PCB

2.00

0.00

4.08

45.61

91.08

95.15

0.00

HM960-QM87/HM86 Module

4.08

37.48

80.08

91.08

104.85

121.08

119.07

125.15

4.08

12.84

Top View

79.64

91.08

Side View of the Module with Heat Sink and Carrier Board

Bottom View

14.00

2.00

70.20

12.50

0.00

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.

System Memory

The system board is equipped with two 204-pin SODIMM sockets that support DDR3L(1.35V) memory modules; depends on CPU supported. However, DDR3L memory module can run at

1.5V.

Important:

When the Standby Power LED lit red, it indicates that there is power on the board. Power-off the PC then unplug the power cord prior to installing any devices. Failure to do so will cause severe damage to the board and components.

DDR3_2

Installing the DIMM Module

Note:

The system board used in the following illustrations may not resemble the actual one. These illustrations are for reference only.

1. Make sure the PC and all other peripheral devices connected to it has been powered down.

2. Disconnect all power cords and cables.

3. Locate the SODIMM socket on the system board.

4. Note the key on the socket. The key ensures the module can be plugged into the socket in only one direction.

Standby

Power LED

DDR3_1

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

5. Grasping the module by its edges, align the module into the socket at an approximately 30 degrees angle. Apply firm even pressure to each end of the module until it slips down into the socket. The contact fingers on the edge of the module will almost completely disappear inside the socket.

6. Push down the module until the clips at each end of the socket lock into position. You will

hear a distinctive “click”, indicating the module is correctly locked into position.

Clip

Connectors

CPU Fan Connector

Sense

+12V

Ground

Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan will provide adequate airflow throughout the chassis to prevent overheating the CPU and board components.

BIOS Setting

“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 4 of the manual for more information.

1 3

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

COM Express Connectors

The COM Express connectors are used to interface the HM960-QM87/HM86 COM Express board to a carrier board. Connect the COM Express connectors (located on the solder side of the board) to the COM Express connectors on the carrier board.

Refer to the “Installing HM960-QM87/HM86 onto a Carrier Board” section for more information.

COM Express Connectors

Refer to the following pages for the pin functions of these connectors.

www.dﬁ .comChapter 3 Hardware Installation

Chapter 3

A29A

A30A

A32A

A33A

COM Express Connectors

Row A Row B

1 GND (FIXED) B1 GND (FIXED) 2 GBE0_MDI3- B2 GBE0_ACT# 3 GBE0_MDI3+ B3 LPC_FRAME# 4 GBE0_LINK100# B4 LPC_AD0 5 GBE0_LINK1000# B5 LPC_AD1 6 GBE0_MDI2- B6 LPC_AD2 7 GBE0_MDI2+ B7 LPC_AD3 8 GBE0_LINK# B8 LPC_DRQ0# 9 GBE0_MDI1- B9 LPC_DRQ1# 10 GBE0_MDI1+ B10 LPC_CLK 11 GND (FIXED) B11 GND (FIXED) 12 GBE0_MDI0- B12 PWRBTN# 13 GBE0_MDI0+ B13 SMB_CK 14 GBE0_CTREF B14 SMB_DAT 15 SLP_S3# B15 SMB_ALERT# 16 SATA0_TX+ B16 SATA1_TX+ 17 SATA0_TX- B17 SATA1_TX- 18 SLP_S4# B18 SUS_STAT# 19 SATA0_RX+ B19 SATA1_RX+ 20 SATA0_RX- B20 SATA1_RX- 21 GND (FIXED) B21 GND (FIXED) 22 SATA2_TX+ B22 SATA3_TX+ 23 SATA2_TX- B23 SATA3_TX- 24 SUS_S5# B24 PWR_OK 25 SATA2_RX+ B25 SATA3_RX+ 26 SATA2_RX- B26 SATA3_RX- 27 BATLOW# B27 WDT 28 (S)ATA_ACT# B28 AC/HDA _SDIN2

C/HDA_SYNC B29 AC/HDA _SDIN1 C/HDA _RST# B30 AC/HDA _SDIN0

31 GND (FIXED) B31 GND (FIXED)

C/HDA _BITCLK B32 SPKR

C/HDA _SDOUT B3 3 I2C_CK 34 BIOS_DIS0# B34 I2C_DAT 35 THRMTRIP# B35 THRM# 36 USB6- B36 USB7- 37 USB6+ B37 USB7+ 38 USB_6_7_OC# B38 USB_4_5_OC# 39 USB4- B39 USB5- 40 USB4+ B40 USB5+ 41 GND (FIXED) B41 GND (FIXED) 42 USB2- B42 USB3- 43 USB2+ B43 USB3+ 44 USB_2_3_OC# B44 USB_0_1_OC# 45 USB0- B45 USB1- 46 USB0+ B46 USB1+ 47 VCC_RTC B47 EXCD1_PERST# 48 EXCD0_PERST# B48 EXCD1_CPPE# 49 EXCD0_CPPE# B49 SYS_RESET# 50 LPC_SERIRQ B50 CB_RESET#

Row A Row B

51 GND (FIXED) B51 GND (FIXED)

52 PCIE_TX5+ B52 PCIE_RX5+ 53 PCIE_TX5- B53 PCIE_RX554 GPI0 B54 GPO1 55 PCIE_TX4+ B55 PCIE_RX4+ 56 PCIE_TX4- B56 PCIE_RX4- 57 GND B57 GPO2 58 PCIE_TX3+ B58 PCIE_RX3+ 59 PCIE_TX3- B59 PCIE_RX360 GND (FIXED) B60 GND (FIXED) 61 PCIE_TX2+ B61 PCIE_RX2+ 62 PCIE_TX2- B62 PCIE_RX2- 63 GPI1 B63 GPO3

64 PCIE_TX1+ B64 PCIE_RX1+

65 PCIE_TX1- B65 PCIE_RX1-

66 GND B66 WAKE0#

67 GPI2 B67 WAKE1#

68 PCIE_TX0+ B68 PCIE_RX0+

69 PCIE_TX0- B69 PCIE_RX0-

70 GND (FIXED) B70 GND (FIXED) 71 LVDS_A0+ B71 LVDS_B0+ 72 LVDS_A0- B72 LVDS_B0- 73 LVDS_A1+ B73 LVDS_B1+ 74 LVDS_A1- B74 LVDS_B1- 75 LVDS_A2+ B75 LVDS_B2+ 76 LVDS_A2- B76 LVDS_B2- 77 LVDS_VDD_EN B77 LVDS_B3+ 78 LVDS_A3+ B78 LVDS_B3- 79 LVDS_A3- B79 LVDS_BKLT_EN 80 GND (FIXED) B80 GND (FIXED) 81 LVDS_A_CK+ B81 LVDS_B_CK+ 82 LVDS_A_CK- B82 LV DS_B_CK-

A83 LVDS_I2C_CK B83 LVDS_BKLT_CTRL

84 LVDS_I2C_DAT B84 VCC_5V_SBY 85 GPI3 B85 VCC_5V_SBY 86 RSVD B86 VCC_5V_SBY 87 RSVD B87 VCC_5V_SBY 88 PCIE0_CK_REF+ B88 BIOS_DIS1# 89 PCIE0_CK_REF- B89 VGA_RED 90 GND (FIXED) B90 GND (FIXED) 91 SPI_POWER B91 VGA_GRN 92 SPI_MISO B92 VGA_BLU 93 GPO0 B93 VGA_HSYNC 94 SPI_CLK B94 VGA_VSYNC 95 SPI_MOSI B95 VGA_I2C_CK 96 TPM_PP B96 VGA_I2C_DAT 97 TYPE10# B97 SPI_CS# 98 SER0_TX B98 RSVD 99 SER0_RX B99 RSVD 100 GND (FIXED) B100 GND (FIXED) 101 SER1_TX B101 FAN_PWMOUT 102 SER1_RX B102 FAN_TACHIN 103 LID# B103 SLEEP# 104 VCC_12V B104 VCC_12V 105 VCC_12V B105 VCC_12V 106 VCC_12V B106 VCC_12V 107 VCC_12V B107 VCC_12V 108 VCC_12V B108 VCC_12V 109 VCC_12V B109 VCC_12V 110 GND (FIXED) B110 GND (FIXED)

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Chapter 3

Row C Row D

C1 GND (FIXED) D1 GND (FIXED) C2 GND D2 GND C3 USB_SSRX0- D3 USB_SSTX0C4 USB_SSRX0+ D4 USB_SSTX0+ C5 GND D5 GND C6 USB_SSRX1- D6 USB_SSTX1C7 USB_SSRX1+ D7 USB_SSTX1+ C8 GND D8 GND C9 USB_SSRX2- D9 USB_SSTX2C10 USB_SSRX2+ D10 USB_SSTX2+ C11 GND (FIXED) D11 GND (FIXED) C12 USB_SSRX3- D12 USB_SSTX3C13 USB_SSRX3+ D13 USB_SSTX3+ C14 GND D14 GND C15 DDI1_PAIR6+ D15 DDI1_CTRLCLK_AUX+ C16 DDI1_PAIR6- D16 DDI1_CTRLDATA_AUXC17 RSVD D17 RSVD C18 RSVD D18 RSVD C19 PCIE_RX6+ D19 PCIE_TX6+ C20 PCIE_RX6- D20 PCIE_TX6C21 GND (FIXED) D21 GND (FIXED) C22 PCIE_RX7+ D22 PCIE_TX7+ C23 PCIE_RX7- D23 PCIE_TX7C24 DDI1_HPD D24 RSVD C25 DDI1_PAIR4+ D25 RSVD C26 DDI1_PAIR4- D26 DDI1_PAIR0+ C27 RSVD D27 DDI1_PAIR0C28 RSVD D28 RSVD C29 DDI1_PAIR5+ D29 DDI1_PAIR1+ C30 DDI1_PAIR5- D30 DDI1_PAIR1C31 GND (FIXED) D31 GND (FIXED) C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+ C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL C35 RSVD D35 RSVD C36 DDI2_CTRLCLK_AUX+ D36 DDI1_PAIR3+ C37 DDI2_CTRLDATA_AUX- D37 DDI1_PAIR3C38 DDI2_DDC_AUX_SEL D38 RSVD C39 DDI3_PAIR0+ D39 DDI2_PAIR0+ C40 DDI3_PAIR0- D40 DDI2_PA IR0C41 GND (FIXED) D41 GND (FIXED) C42 DDI3_PAIR1+ D42 DDI2_PAIR1+ C43 DDI3_PAIR1- D43 DDI2_PAIR1C44 DDI3_HPD D44 DDI2_HPD C45 RSVD D45 RSVD C46 DDI3_PAIR2+ D46 DDI2_PAIR2+ C47 DDI3_PAIR2- D47 DDI2_PAIR2C48 RSVD D48 RSVD C49 DDI3_PAIR3+ D49 DDI2_PAIR3+ C50 DDI3_PAIR3- D50 DDI2_PAIR3-

Row C Row D

C51 GND (FIXED) D51 GND (FIXED) C52 PEG_RX0+ D52 PEG_TX0+ C53 PEG_RX0- D53 PEG_TX0C54 TYPE0# D54 PEG_LANE_RV# C55 PEG_RX1+ D55 PEG_TX1+ C56 PEG_RX1- D56 PEG_TX1C57 TYPE1# D57 TYPE2# C58 PEG_RX2+ D58 PEG_TX2+ C59 PEG_RX2- D59 PEG_TX2C60 GND (FIXED) D60 GND (FIXED) C61 PEG_RX3+ D61 PEG_TX3+ C62 PEG_RX3- D62 PEG_TX3C63 RSVD D63 RSVD C64 RSVD D64 RSVD C65 PEG_RX4+ D65 PEG_TX4+ C66 PEG_RX4- D66 PEG_TX4C67 NC D67 GND C68 PEG_RX5+ D68 PEG_TX5+ C69 PEG_RX5- D69 PEG_TX5C70 GND (FIXED) D70 GND (FIX ED) C71 PEG_RX6+ D71 PEG_TX6+ C72 PEG_RX6- D72 PEG_TX6C73 GND D73 GND C74 PEG_RX7+ D74 PEG_TX7+ C75 PEG_RX7- D75 PEG_TX7C76 GND D76 GND C77 RSVD D77 RSVD C78 PEG_RX8+ D78 PEG_TX8+ C79 PEG_RX8- D79 PEG_TX8C80 GND (FIXED) D80 GND (FIX ED) C81 PEG_RX9+ D81 PEG_TX9+ C82 PEG_RX9- D82 PEG_TX9-

C83 RSVD D83 RSVD

C84 GND D84 GND C85 PEG_RX10+ D85 PEG_TX10+ C86 PEG_RX10- D86 PEG_TX10C87 GND D87 GND C88 PEG_RX11+ D88 PEG_TX11+ C89 PEG_RX11- D89 PEG_TX11C90 GND (FIXED) D90 GND (FIXED) C91 PEG_RX12+ D91 PEG_TX12+ C92 PEG_RX12- D92 PEG_TX12C93 GND D93 GND C94 PEG_RX13+ D94 PEG_TX13+ C95 PEG_RX13- D95 PEG_TX13C96 GND D96 GND C97 RSVD D97 RSVD C98 PEG_RX14+ D98 PEG_TX14+ C99 PEG_RX14- D99 PEG_TX14C100 GND (FIXED) D100 GND (FIXED) C101 PEG_RX15+ D101 PEG_TX15+ C102 PEG_RX15- D102 PEG_TX15- C103 GND D103 GND C104 VCC_12V D104 VCC_12V C105 VCC_12V D105 VCC_12V C106 VCC_12V D106 VCC_12V C107 VCC_12V D107 VCC_12V C108 VCC_12V D108 VCC_12V C109 VCC_12V D109 VCC_12V C110 GND (FIXED) D110 GND (FIXED)

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Chapter 3

[3]

COM Express Connectors Signal Description

Pin Types I Input to the Module O Output from the Module I/O Bi-directional input / output signal OD Open drain output

C97/HDA Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description AC/HAD_RST# A30 O CMOS 3.3V Suspend/3.3V Connect to CODEC pin 11 RESET# Reset output to CODEC, active low. AC/HDA_SYNC A29 O CMOS 3.3V/3.3V PU 1K TO 3V3_DU Connect to CODEC pin 10 SYNC Sample-synchronization signal to the CODEC(s). AC/HDA_BITCLK A32 I/O CMOS 3.3V/3.3V Connect to CODEC pin 6 BIT_CLK Serial data clock generated by the external CODEC(s). AC/HDA_SDOUT A33 O CMOS 3.3V/3.3V Connect to CODEC pin 5 SDATA_OUT Serial TDM data output to the CODEC.

AC/HDA_SDIN2 B28 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC2 pin 8 SDATA_IN AC/HDA_SDIN1 B29 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC1 pin 8 SDATA_IN AC/HDA_SDIN0 B30 I/O CMOS 3.3V Suspend/3.3V Connect 33 ƻ in series to CODEC0 pin 8 SDATA_IN

Gigabit Ethernet Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend GBE0_MDI0- A12 I/O Analog 3.3V max Suspend GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend GBE0_MDI1- A9 I/O Analog 3.3V max Suspend GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend GBE0_MDI2- A6 I/O Analog 3.3V max Suspend GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend GBE0

MDI3-

GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V NC Gigabit Ethernet Controller 0 link indicator, active low.

GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low. GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V

O Analog3.3V max Suspend

Connect to Magnetics Module MDI0+/-

Connect to Magnetics Module MDI1+/-

Connect to Magnetics Module MDI2+/-

Connect to Magnetics Module MDI3+/Connect to LED and recommend current limit

resistor 150ȟ to 3.3VSB

onnect to LED and recommend current lim

Serial TDM data inputs from up to 3 CODECs.

Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs are unused in some modes, per the following: 1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI

Gigabit Ethernet Controller 0 activity indicator, active low.

Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.

+/- B1_DD+/-

SATA Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description SATA4_TX+ A16 O SATA AC coupled on Module AC Coupling capacitor SATA4_TX- A17 O SATA AC coupled on Module AC Coupling capacitor SATA4_RX+ A19 I SATA AC coupled on Module AC Coupling capacitor SATA4_RX- A20 I SATA AC coupled on Module AC Coupling capacitor SATA5_TX+ B16 O SATA AC coupled on Module AC Coupling capacitor SATA5_TX- B17 O SATA AC coupled on Module AC Coupling capacitor SATA5_RX+ B19 I SATA AC coupled on Module AC Coupling capacitor SATA5_RX- B20 I SATA AC coupled on Module AC Coupling capacitor SATA0_TX+ A22 O SATA AC coupled on Module AC Coupling capacitor SATA0_TX- A23 O SATA AC coupled on Module AC Coupling capacitor SATA0_RX+ A25 I SATA AC coupled on Module AC Coupling capacitor SATA0_RX- A26 I SATA AC coupled on Module AC Coupling capacitor SATA2_TX+ B22 O SATA AC coupled on Module AC Coupling capacitor SATA2_TX- B23 O SATA AC coupled on Module AC Coupling capacitor

SATA2_RX+ B25 I SATA AC coupled on Module AC Coupling capacitor SATA2_RX- B26 I SATA AC coupled on Module AC Coupling capacitor

ATA_ACT# A28 I/O CMOS 3.3V / 3.3V PU 10K to 3.3V

Connect to SATA0 Conn TX pin

Connect to SATA0 Conn RX pin Serial ATA or SAS Channel 0 receive differential pair.

Connect to SATA1 Conn TX pin

Connect to SATA1 Conn RX pin Serial ATA or SAS Channel 1 receive differential pair.

Connect to SATA2 Conn TX pin

Connect to SATA2 Conn RX pin Serial ATA or SAS Channel 2 receive differential pair.

Connect to SATA3 Conn TX pin Serial ATA or SAS Channel 3 transmit differential pair.

Connect to SATA3 Conn RX pin Serial ATA or SAS Channel 3 receive differential pair.

Connect to LED and recommend current limit resistor 220ƻ to 3.3V

Serial ATA or SAS Channel 0 transmit differential pair.

Serial ATA or SAS Channel 1 transmit differential pair.

Serial ATA or SAS Channel 2 transmit differential pair.

ATA (parallel and serial) or SAS activity indicator, active low.

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Chapter 3

ress Lanes Signals Descriptions

PCI Ex

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description PCIE_TX0+ A68 AC Coupling capacitor PCIE_TX0- A69 AC Coupling capacitor PCIE_RX0+ B68 PCIE_RX0- B69 PCIE_TX1+ A64 AC Coupling capacitor PCIE_TX1- A65 AC Coupling capacitor PCIE_RX1+ B64 PCIE_RX1- B65 PCIE_TX2+ A61 AC Coupling capacitor PCIE_TX2- A62 AC Coupling capacitor PCIE_RX2+ B61 PCIE_RX2- B62 PCIE_TX3+ A58 AC Coupling capacitor PCIE_TX3- A59 AC Coupling capacitor PCIE_RX3+ B58 PCIE_RX3- B59 PCIE_TX4+ A55 AC Coupling capacitor PCIE_TX4- A56 AC Coupling capacitor PCIE_RX4+ B55 PCIE_RX4- B56 PCIE_TX5+ A52 AC Coupling capacitor PCIE_TX5- A53 AC Coupling capacitor PCIE_RX5+ B52 PCIE_RX5- B53 PCIE_TX6+ D19 AC Coupling capacitor PCIE_TX6- D20 AC Coupling capacitor PCIE_RX6+ C19 PCIE_RX6- C20 PCIE_TX7+ D22 NA PCIE_TX7- D23 NA PCIE_RX7+ C22 NA PCIE_RX7- C23 NA PCIE0_CK_REF+ A88 PCIE0_CK_REF- A89

PEG Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description PEG_TX0+ D52 AC Coupling capacitor PEG_TX0- D53 AC Coupling capacitor PEG_RX0+ C52 PEG_RX0- C53 PEG_TX1+ D55 AC Coupling capacitor PEG_TX1- D56 AC Coupling capacitor PEG_RX1+ C55 PEG_RX1- C56 PEG_TX2+ D58 AC Coupling capacitor PEG_TX2- D59 AC Coupling capacitor PEG_RX2+ C58 PEG_RX2- C59 PEG_TX3+ D61 AC Coupling capacitor PEG_TX3- D62 AC Coupling capacitor PEG_RX3+ C61 PEG_RX3- C62 PEG_TX4+ D65 AC Coupling capacitor PEG_TX4- D66 AC Coupling capacitor PEG_RX4+ C65 PEG_RX4- C66 PEG_TX5+ D68 AC Coupling capacitor PEG_TX5- D69 AC Coupling capacitor PEG_RX5+ C68 PEG_RX5- C69

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Differential Transmit Pairs 0

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Differential Transmit Pairs 1

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Differential Transmit Pairs 2

I PCIE AC coupled off Module

O PCIE AC coupled on Module

I PCIE AC coupled off Module

O PCIE

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Differential Transmit Pairs 5

I PCIE AC coupled off Module

O PCIE AC coupled on Module

I PCIE AC coupled off Module

O PCIE AC coupled on Module NA

I PCIE AC coupled off Module

O PCIE PCIE Connect to PCIE device, PCIe CLK Buffer or slot

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 0

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 0

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 1

I PCIE

O PCIE AC coupled on Module Connect to PCIE device or slot

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 2

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 3

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 3

O PCIE AC coupled on Module Connect to PCIE device or slot

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 5

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 5

AC coupled on Module

AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 1

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device or slot PCI Express Differential Transmit Pairs 3

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device or slot PCI Express Differential Transmit Pairs 4

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect to PCIE device or slot PCI Express Differential Transmit Pairs 6

Device - Connect AC Coupling cap 0.1uF Slot - Connect to PCIE Conn pin

Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 4

PCI Express Differential Receive Pairs 0

PCI Express Differential Receive Pairs 1

PCI Express Differential Receive Pairs 2

PCI Express Differential Receive Pairs 3

PCI Express Differential Receive Pairs 4

PCI Express Differential Receive Pairs 5

PCI Express Differential Receive Pairs 6 PCI Express Differential Transmit Pairs 7

(Optional with on board LAN, Default setting as NC) PCI Express Differential Receive Pairs 7 (Optional with on board LAN, Default setting as NC) Reference clock output for all PCI Express and PCI Express Graphics lanes.

PCI Express Graphics transmit differential pairs 2

PCI Express Graphics transmit differential pairs 4

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PEG Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description PEG_TX6+ D71 AC Coupling capacitor PEG_TX6- D72 AC Coupling capacitor PEG_RX6+ C71 PEG_RX6- C72 PEG_TX7+ D74 AC Coupling capacitor PEG_TX7- D75 AC Coupling capacitor PEG_RX7+ C74 PEG_RX7- C75 PEG_TX8+ D78 AC Coupling capacitor PEG_TX8- D79 AC Coupling capacitor PEG_RX8+ C78 PEG_RX8- C79 PEG_TX9+ D81 AC Coupling capacitor PEG_TX9- D82 AC Coupling capacitor PEG_RX9+ C81 PEG_RX9- C82 PEG_TX10+ D85 AC Coupling capacitor PEG_TX10- D86 AC Coupling capacitor PEG_RX10+ C85 PEG_RX10- C86 PEG_TX11+ D88 AC Coupling capacitor PEG_TX11- D89 AC Coupling capacitor PEG_RX11+ C88 PEG_RX11- C89 PEG_TX12+ D91 AC Coupling capacitor PEG_TX12- D92 AC Coupling capacitor PEG_RX12+ C91 PEG_RX12- C92 PEG_TX13+ D94 AC Coupling capacitor PEG_TX13- D95 AC Coupling capacitor PEG_RX13+ C94 PEG_RX13- C95 PEG_TX14+ D98 AC Coupling capacitor PEG_TX14- D99 AC Coupling capacitor PEG_RX14+ C98 PEG_RX14- C99 PEG_TX15+ D101 AC Coupling capacitor PEG_TX15- D102 AC Coupling capacitor PEG_RX15+ C101 PEG_RX15- C102

PEG_LANE_RV# D54 I CMOS 3.3V / 3.3V

ExpressCard Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description EXCD0_CPPE# A49 EXCD1_CPPE# B48 EXCD0_PERST# A48 EXCD1_PERST# B47

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 6

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 6

O PCIE

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 7

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 8

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 8

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 9

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 9

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 10

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 11

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 11

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 12

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 13

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 13

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 14

I PCIE AC coupled off Module

O PCIE AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 15

I PCIE AC coupled off Module Connect AC Coupling cap 0.22uF PCI Express Graphics receive differential pairs 15

I CMOS 3.3V /3.3V

O CMOS 3.3V /3.3V PCI ExpressCard: reset, active low, one per card

AC coupled on Module Connect to PCIE device or slot PCI Express Graphics transmit differential pairs 7

PCI Express Graphics receive differential pairs 10

Connect AC Coupling cap 0.22uF

PCI Express Graphics receive differential pairs 12

PCI Express Graphics receive differential pairs 14

PCI Express Graphics lane reversal input strap. Pull low on the Carrier board to reverse lane order.

PCI ExpressCard: PCI Express capable card request, active low, one per card

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Chapter 3

DDI Signals Description

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description DDI1_PAIR0+/SDVO1_RED+ D26 Connect AC Coupling Capacitors 0.1uF to Device

PAIR0-/SDVO1_RED- D27 Connect AC Coupling Capacitors 0.1uF to Device

DDI1 DDI1_PAIR1+/SDVO1_GRN+ D29 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR1-/SDVO1_GRN- D30 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR2+/SDVO1_BLU+ D32 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR2-/SDVO1_BLU- D33 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR3+/SDVO1_CK+ D36 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR3-/SDVO1_CK- D37 Connect AC Coupling Capacitors 0.1uF to Device

DDI1_PAIR4+/SDVO1_INT+ C25 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR4-/SDVO1_INT- C26 Connect AC Coupling Capacitors 0.1uF to Device

DDI1_PAIR5+/SDVO1_TVCLKIN+ C29 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR5-/SDVO1_TVCLKIN- C30 Connect AC Coupling Capacitors 0.1uF to Device DDI1_PAIR6+/SDVO1_FLDSTALL+ C15 Connect AC Coupling Capacitors 0.1uF to Device

DDI1_PAIR6-/SDVO1_FLDSTALL- C16 Connect AC Coupling Capacitors 0.1uF to Device

DDI1_CTRLCLK_AUX+/SDVO1_CTRLCLK D15

DDI1_CTRLCLK_AUX-/SDVO1_CTRLDATA D16

DDI1_HPD C24 I CMOS 3.3V / 3.3V PD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect DDI1_DDC_AUX_SEL D34 I CMOS 3.3V / 3.3V PD 1M TO GND DDI2_PAIR0+ D39 Connect AC Coupling Capacitors 0.1uF to Device

DDI2_PAIR0- D40 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR1+ D42 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR1- D43 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR2+ D46 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR2- D47 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR3+ D49 Connect AC Coupling Capacitors 0.1uF to Device DDI2_PAIR3- D50 Connect AC Coupling Capacitors 0.1uF to Device

DDI2_CTRLCLK_AUX+ C32

DDI2_CTRLCLK_AUX- C33

DDI3_HPD D44 I CMOS 3.3V / 3.3V PD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect DDI3_DDC_AUX_SEL C34 I CMOS 3.3V / 3.3V PD 1M TO GND PU 100K to 3.3V for DDC(HDMI/DVI) Selects the function of DDI2_CTRLCLK_AUX+ and DDI2_CTRLDATA_AUX-. DDI3_PAIR0+ C39 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR0- C40 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR1+ C42 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR1- C43 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR2+ C46 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR2- C47 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR3+ C49 Connect AC Coupling Capacitors 0.1uF to Device DDI3_PAIR3- C50 Connect AC Coupling Capacitors 0.1uF to Device

O PCIE AC coupled off Module DDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair

O PCIE

O PCIE AC coupled off Module DDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.

I PCIE

I PCIE AC coupled off Module Serial Digital Video TVOUT synchronization clock input differential pair.

I PCIE

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

O PCIE AC coupled off Module

O PCIE AC coupled off Module DDI 2 Pair 1 differential pairs

O PCIE AC coupled off Module DDI 2 Pair 2 differential pairs

O PCIE AC coupled off Module DDI 2 Pair 3 differential pairs

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

O PCIE AC coupled off Module DDI 3 Pair 0 differential pairs

O PCIE AC coupled off Module

O PCIE AC coupled off Module DDI 3 Pair 3 differential pairs

AC coupled off Module DDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair

AC coupled off Module DDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair

AC coupled off Module Serial Digital Video B interrupt input differential pair.

AC coupled off Module Serial Digital Video Field Stall input differential pair.

PD 49.9K to GND

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V, PD 49.9K to GND

(S/W IC between Rpu/Rpd resistor)

PU 100K to 3.3V

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V/PU 100K to 3.3V

(S/W IC between 2.2K/100K resistor)

PD 49.9K to GND

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V, PD 49.9K to GND

(S/W IC between Rpu/Rpd

PU 100K to 3.3V

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V/PU 100K to 3.3V

(S/W IC between 2.2K/100K resistor)

AC coupled off ModuleO PCIE

Connect to DP AUX+ DP AUX+ function if DDI1_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLCLK HDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high

Connect to DP AUX- DP AUX- function if DDI1_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLDATA HDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high

PU 100K to 3.3V for DDC(HDMI/DVI)

Connect to DP AUX+ DP AUX+ function if DDI2_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLCLK HDMI/DVI I2C CTRLCLK if DDI2_DDC_AUX_SEL is pulled high

Connect to DP AUX- DP AUX- function if DDI2_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLDATA HDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high

Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-. DDI 2 Pair 0 differential pairs

DDI 3 Pair 1 differential pairs

DDI 3 Pair 2 differential pairs

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DDI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description

I/O PCIE AC coupled on Module

DDI3_CTRLCLK_AUX+

DDI3_CTRLCLK_AUX- C37

DDI3_HPD C44 I CMOS 3.3V / 3.3V NC PD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect DDI3_DDC_AUX_SEL C38 I CMOS 3.3V / 3.3V PD 1M TO GND PU 100K to 3.3V for DDC(HDMI/DVI) Selects the function of DDI3_CTRLCLK_AUX+ and DDI3_CTRLDATA_AUX-.

USB Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description USB0+ A46 USB0- A45 USB1+ B46 USB1- B45 USB2+ A43 USB2- A42 USB3+ B43 USB3- B42 USB4+ A40 USB4- A39 USB5+ B40 USB5- B39 USB6+ A37 USB6- A36 USB7+ B37

USB7- B36

USB_0_1_OC# B44 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU Connect to Overcurrent of USB Power Switch

USB_2_3_OC# A44 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU Connect to Overcurrent of USB Power Switch

USB_4_5_OC# B38 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU Connect to Overcurrent of USB Power Switch

USB_6_7_OC# A38 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU Connect to Overcurrent of USB Power Switch

USB_SSTX0+ D4 AC Coupling capacitor USB_SSTX0- D3 AC Coupling capacitor USB_SSRX0+ C4 USB_SSRX0- C3 USB_SSTX1+ D7 AC Coupling capacitor USB_SSTX1- D6 AC Coupling capacitor USB_SSRX1+ C7 USB_SSRX1- C6 USB_SSTX2+ D10 AC Coupling capacitor USB_SSTX2- D9 AC Coupling capacitor USB_SSRX2+ C10 USB_SSRX2- C9 USB_SSTX3+ D13 AC Coupling capacitor USB_SSTX3- D12 AC Coupling capacitor USB_SSRX3+ C13 USB_SSRX3- C12

C36

I/O OD CMOS 3.3V / 3.3V

I/O PCIE AC coupled on Module

I/O OD CMOS 3.3V / 3.3V

I/O USB 3.3V Suspend/3.3V

I/O USB

I/O USB 3.3V Suspend/3.3V

O PCIE AC coupled on Module

I PCIE AC coupled off Modul

O PCIE AC coupled on Module

I PCIE AC coupled off Modul

O PCIE AC coupled on Module

I PCIE AC coupled off Modul

O PCIE AC coupled on Module

I PCIE AC coupled off Modul

3.3V Suspend/3.3V

PD 49.9K to GND

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V, PD 49.9K to GND

(S/W IC between Rpu/Rpd

PU 100K to 3.3V

(S/W IC between Rpu/PCH)

PU 2.2K to 3.3V/PU 100K to 3.3V

(S/W IC between 2.2K/100K resistor)

Connect to DP AUX+ DP AUX+ function if DDI3_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLCLK HDMI/DVI I2C CTRLCLK if DDI3_DDC_AUX_SEL is pulled high

Connect to DP AUX- DP AUX- function if DDI3_DDC_AUX_SEL is no connect

Connect to HDMI/DVI I2C CTRLDATA HDMI/DVI I2C CTRLDATA if DDI3_DDC_AUX_SEL is pulled high

Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

Connect 90ಳ @100MHz Common Choke in series and ESD suppressors to GND to USB connector

USB differential pairs 0

USB differential pairs 1

USB differential pairs 2

USB differential pairs 3

USB differential pairs 4

USB differential pairs 5

USB differential pairs 6

USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the Module designer's discretion.(HM960-QM87/HM86 default set as a host)

USB over-current sense, USB channels 0 and 1. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board. USB over-current sense, USB channels 2 and 3. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board. USB over-current sense, USB channels 4 and 5. A pull-up for this line

shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board. USB over-current sense, USB channels 6 and 7. A pull-up for this line shall be present on the Module. An open drain driver from a USB current monitor on the Carrier Board may drive this line low. Do not

ull this line high on the Carrier Board. Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

Additional transmit signal differential pairs for the SuperSpeed USB data path.

Additional receive signal differential pairs for the SuperSpeed USB data path.

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LVDS Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description LVDS_A0+ A71 LVDS_A0- A72 LVDS_A1+ A73 LVDS_A1- A74 LVDS_A2+ A75 LVDS_A2- A76 LVDS_A3+ A78 LVDS_A3- A79 LVDS_A_CK+ A81 LVDS_A_CK- A82 LVDS_B0+ B71 LVDS_B0- B72 LVDS_B1+ B73 LVDS_B1- B74 LVDS_B2+ B75 LVDS_B2- B76 LVDS_B3+ B77 LVDS_B3- B78 LVDS_B_CK+ B81 LVDS_B_CK- B82 LVDS_VDD_EN A77 O CMOS 3.3V / 3.3V Connect to enable control of LVDS panel power LVDS panel power enable LVDS_BKLT_EN B79 O CMOS 3.3V / 3.3V Connect to enable control of LVDS panel backlight LVDS panel backlight enable LVDS_BKLT_CTRL B83 O CMOS 3.3V / 3.3V Connect to brightness control of LVDS panel backlight LVDS panel backlight brightness control LVDS_I2C_CK A83 I/O OD CMOS 3.3V / 3.3V PU 4.7K TO 3V3 Connect to DDC clock of LVDS panel I2C clock output for LVDS display use LVDS_I2C_DAT A84 I/O OD CMOS 3.3V / 3.3V PU 4.7K TO 3V3 Connect to DDC data of LVDS panel I2C data line for LVDS display use

LPC Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description LPC_AD0 B4 LPC_AD1 B5 LPC_AD2 B6 LPC_AD3 B7 LPC_FRAME# B3 O CMOS 3.3V / 3.3V LPC frame indicates the start of an LPC cycle LPC_DRQ0# B8 LPC_DRQ1# B9 LPC_SERIRQ A50 I/O CMOS 3.3V / 3.3V PU 8.2K TO 3V3 LPC serial interrupt LPC_CLK B10 O CMOS 3.3V / 3.3V LPC clock output - 33MHz nominal

SPI Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description SPI_CS# B97 O CMOS 3.3V Suspend/3.3V SPI_MISO A92 I CMOS 3.3V Suspend/3.3V Connect a series resistor 33

SPI_MOSI A95 O CMOS 3.3V Suspend/3.3V Connect a series resistor 33 SPI_CLK A94 O CMOS 3.3V Suspend/3.3V Connect a series resistor 33

SPI_POWER A91 O 3.3V Suspend/3.3V

BIOS

DIS0#

BIOS_DIS1# B88

O LVDS LVDS

O LVDS

O LVDS LVDS

I/O CMOS 3.3V / 3.3V

I CMOS 3.3V / 3.3V LPC serial DMA request

I CMOS NA

LVDS

Connect to LVDS connector

Connect to LPC device

Connect a series resistor 33 SPI Device CS#

LVDS Channel A differential pairs

LVDS Channel A differential clockO LVDS LVDS

LVDS Channel B differential pairs

LVDS Channel B differential clock

LPC multiplexed address, command and data bus

to Carrier Board to Carrier Board Data in to Module from Carrier SPI

to Carrier Board Data out from Module to Carrier SPI to Carrier Board Clock from Module to Carrier SPI

Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1

Power supply for Carrier Board SPI – sourced from Module – nominally

3.3V. The Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices on the Carrier

Selection straps to determine the BIOS boot device. The Carrier should only float these or pull them low, please refer to COM Express Module Base Specification Revision 2.1 for strapping options of BIOS disable signals.

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GA Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description VGA_RED B89 O Analog Analog PD 150 TO GND PD 150R,connect to VGA connector with EMI Red for monitor. Analog output VGA_GRN B91 O Analog Analog PD 150 TO GND PD 150R,connect to VGA connector with EMI Green for monitor. Analog output VGA_BLU B92 O Analog Analog PD 150 TO GND PD 150R,connect to VGA connector with EMI Blue for monitor. Analog output VGA_HSYNC B93 O CMOS 3.3V / 3.3V Connect to VGA connector with a3.3V Buffer Horizontal sync output to VGA monitor VGA_VSYNC B94 O CMOS 3.3V / 3.3V Connect to VGA connector with a 33V Buffer Vertical sync output to VGA monitor VGA_I2C_CK B95 I/O OD CMOS 3.3V / 3.3V PU 2.2K TO 3V3 Connect to VGA connector with a 3.3V to 5V DDC clock line (I2C port dedicated to identify VGA monitor capabilities) VGA_I2C_DAT B96 I/O OD CMOS 3.3V / 3.3V PU 2.2K TO 3V3 Connect to VGA connector with a 3.3V to 5V DDC data line.

Serial Interface Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description SER0_TX A98 O CMOS 3.3V/5V PD 4.7K TO GND General purpose serial port 0 transmitter

SER0_RX A99 I CMOS 3.3V/5V PU 47K TO 3V3 General purpose serial port 0 receiver SER1_TX A101 O CMOS 3.3V/5V PD 4.7K TO GND General purpose serial port 1 transmitter SER1_RX A102 I CMOS 3.3V/5V PU 47K TO 3V3 General purpose serial port 1 receiver

Miscellaneous Si

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description I2C_CK B33 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K TO 3V3_DU_EC General purpose I2C port clock output I2C_DAT B34 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K TO 3V3_DU_EC General purpose I2C port data I/O line

SPKR B32 O CMOS 3.3V / 3.3V

WDT B27 O CMOS 3.3V FAN_PWNOUT B101 O OD CMOS 3.3V / 12V Fan speed control. Uses the Pulse Width Modulation (PWM) technique to control the fan's RPM. FAN_TACHIN B102 I OD CMOS 3.3V / 12V PU 10K TO 3V3 Fan tachometer input for a fan with a two pulse output.

TPM_PP A96 I CMOS 3.3V / 3.3V PU 0 TO 3V3_DU NC PU 4.7K TO 3V3_SB

Power and S

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description

PWRBTN# B12 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU_EC PU 4.7K TO 3V3_SB

SYS_RESET# B49 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU NC PU 4.7K TO 3V3_SB

CB_RESET# B50 O CMOS 3.3V Suspend/3.3V

PWR_OK B24 I CMOS 3.3V / 3.3V PU 10K TO 3V3

nal Descriptions

stem Management Signals Descriptions

Output for audio enunciator - the "speaker" in PC-AT systems. This port provides the PC beep signal and is mostly intended for

3.3V Output indicating that a watchdog time-out event has occurred

debugging purposes.

Trusted Platform Module (TPM) Physical Presence pin. Active high. TPM chip has an internal pull down. This signal is used to indicate Physical Presence to the TPM.

A falling edge creates a power button event. Power button events can be used to bring a system out of S5 soft off and other suspend states, as well as powering the system down. Reset button input. Active low request for Module to reset and reboot. May be falling edge sensitive. For situations when SYS_RESET# is not able to reestablish control of the system, PWR_OK or a power cycle may be used.

Reset output from Module to Carrier Board. Active low. Issued by Module chipset and may result from a low SYS_RESET# input, a low PWR_OK input, a VCC_12V power input that falls below the minimum specification, a watchdog timeout, or may be initiated by the Module software.

Power OK from main power supply. A high value indicates that the power is good. This signal can be used to hold off Module startup to allow Carrier based FPGAs or other configurable devices time to be programmed.

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Power and System Management Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description SUS_STAT# B18 O CMOS 3.3V Suspend/3.3V Indicates imminent suspend operation; used to notify LPC devices.

SUS_S3# A15 O CMOS 3.3V Suspend/3.3V

SUS_S4# A18 O CMOS 3.3V Suspend/3.3V Indicates system is in Suspend to Disk state. Active low output. SUS_S5# A24 O CMOS 3.3V Suspend/3.3V Indicates system is in Soft Off state.

WAKE0# B66 I CMOS 3.3V Suspend/3.3V PU 1K TO 3V3_DU PCI Express wake up signal. WAKE1# B67 I CMOS 3.3V Suspend/3.3V PU 10K TO 3V3_DU NC PU 10 K TO 3V3_DU

BATLOW# A27 I CMOS 3.3V Suspend/ 3.3V PU 8.2K TO 3V3_DU

LID# A103 I OD CMOS 3.3V Suspend/12V LID switch. Low active signal used by the ACPI operating system for a LID switch. SLEEP# B103 I OD CMOS 3.3V Suspend/12V PU 10K TO 3V3_DU

THRM# B35 I CMOS 3.3V / 3.3V PU 10K TO 3V3 Input from off-Module temp sensor indicating an over-temp situation. THRMTRIP# A35 O CMOS 3.3V / 3.3V PU 10K TO 3V3 Active low output indicating that the CPU has entered thermal shutdown. SMB_CK B13 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K TO 3V3_DU_EC NC PU 4.7K TO 3V3_DU System Management Bus bidirectional clock line.

SMB_DAT B14 I/O OD CMOS 3.3V Suspend/3.3V PU 2.2K TO 3V3_DU_EC NC PU 4.7K TO 3V3_DU System Management Bus bidirectional data line. SMB_ALERT# B15 I CMOS 3.3V Suspend/3.3V

GPIO Signals Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description GPO0 A93 GPO1 B54 GPO2 B57 GPO3 B63 GPI0 A54 PU 100K TO 3V3 GPI1 A63 PU 100K TO 3V3 GPI2 A67 PU 100K TO 3V3 GPI3 A85 PU 100K TO 3V3

O CMOS 3.3V / 3.3V General purpose output pins.

I CMOS 3.3V / 3.3V General purpose input pins.

Indicates system is in Suspend to RAM state. Active low output. An inverted copy of SUS_S3# on the Carrier Board may be used to enable the non-standby power on a typical ATX supply.

General purpose wake up signal. May be used to implement wake-up on PS2 keyboard or mouse activity.

Indicates that external battery is low. This port provides a battery-low signal to the Module for orderly transitioning to power saving or power cut-off ACPI modes.

Sleep button. Low active signal used by the ACPI operating system to bring the system to sleep state or to wake it up again.

System Management Bus Alert – active low input can be used to generate an SMI# (System Management Interrupt) or to wake the system.

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Power and GND Signal Descriptions

Signal Pin# Pin Type Pwr Rail /Tolerance HM960-QM87/HM86 Carrier Board Description

VCC_12V

VCC_5V_SBY B84~B87 Power

VCC_RTC A47 Power Real-time clock circuit-power input. Nominally +3.0V.

GND

104~A109 B104~B109 C104~C109

A1, A11, A21, A31, A41, A51, A57, A60, A66, A70, A80, A90, A100, A110, B1, B11, B21 ,B31, B41, B51, B60, B70, B80, B90, B100, B110, C1, C2, C5, C8, C11, C14, C21, C31, C41, C51, C60, C70, C73, C76, C80, C84, C87, C90, C93, C96, C100, C103, C110, D1, D2, D5, D8, D11, D14, D21, D31, D51, D60, D67, D70, D73, D76, D80, D84, D87, D90, D93, D96, D100, D103, D110

Power Primary power input: +12V nominal. All available VCC_12V pins on the connector(s) shall be used.

Standby power input: +5.0V nominal. If VCC5_SBY is used, all available VCC_5V_SBY pins on the connector(s) shall be used. Only used for standby and suspend functions. May be left unconnected if these functions are not used in the system design.

Power

Ground - DC power and signal and AC signal return path. All available GND connector pins shall be used and tied to Carrier Board GND plane.

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Standby Power LED

This LED will light when the system is in the standby mode.

Standby

Power LED

Cooling Option

Heat Spreader with Heat Sink and Fan

Note:

The system board used in the following illustrations may not resemble the actual board. These illustrations are for reference only.

Top View of the Heat Sink

Bottom View of the Heat Sink

• “1” and “2” denote the locations of the thermal pads designed to contact the corresponding components that are on HM960-QM87/HM86.

Important:

Remove the plastic covering from the thermal pads prior to mounting the heat sink onto HM960-QM87/HM86.

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Installing HM960-QM87/HM86 onto a Carrier Board

Important:

The carrier board (COM331-B) used in this section is for reference purpose only and may not resemble your carrier board. These illustrations are mainly to guide you on how to install HM960-QM87/HM86 onto the carrier board of your choice.

• To download COM331-B datasheet and manual

1. Use the provided screw to install the heatsink onto the module. First align the mounting hole of the heatsink with the mounting hole of the module and then from the bottom side of the module, secure them with the provided screw. The module and heatsink as sembly should look like the one shown below.

bottom side of heat sink

Mounting hole

2. Now install the module and heatsink assembly onto the carrier board. The photo below shows the locations of the mounting holes on carrier board.

Mounting hole

3. Insert the provided mounting screws into the mounting holes - from the bottom through the top of the carrier board.

Mounting screws

Mounting screw

Top viewBottom view

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4. While supporting the mounting screw at the bottom, from the top side of the board, fasten a bolt into the screw.

Bolts

5. The photo below shows the solder side of the board with the screws already fixed in place.

6. The photo below shows the component side of the board with the bolts already fixed in place.

Bolts

7. Position the heat sink on the top of HM960-QM87/HM86 with the heat sink’s mounting holes aligned with HM960-QM87/HM86 mounting holes. Insert one of the provided long screws into the mounting hole shown in the photo below.

Mounting screw

Mounting hole

Long screw

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8. From the bottom of the board, fasten the provided bolt into the screw and then connect the heat spreader/heat spreader with heat sink and fan’s cable to the fan connector on HM960-QM87/HM86.

Fan connector

9. Grasping HM960-QM87/HM86 by its edges, position it on top of the carrier board with its mounting holes aligned with the bolts on the carrier board. This will also align the COM Express connectors of the two boards to each other.

10. Press HM960-QM87/HM86 down firmly until it is completely seated on the COM Express connectors of the carrier board.

HM960-QM87/HM86

Carrier board

11. Use the provided mounting screws to secure HM960-QM87/HM86 with heat sink to the carrier board. The photo below shows the locations of the long/short mounting screws.

COM Express connectors on HM960-QM87/HM86

COM Express connectors on the carrier board

Long screws

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+ 71 hidden pages

DFI HM960-HM86 User Manual

Copyright

FCC and DOC Statement on Class B

Trademarks

Table of Contents

About this Manual

Static Electricity Precautions

Warranty

Safety Measures

About the Package

Features

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Specification Comparison Table

Chapter 3 - Hardware Installation

Board Layout

Mechanical Diagram

System Memory

Connectors

COM Express Connectors Signal Description

Standby Power LED

Cooling Option

Installing HM960-QM87/HM86 onto a Carrier Board