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DV970
COM Express Basic Module
User’s Manual
A47900847
Preliminary
Version
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2
Copyright
This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2018. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification.
http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
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Table of Contents
Copyright ........................................................................................................... ..2
Trademarks ........................................................................................................2
COM Express Specification Reference ................................................... 2
FCC and DOC Statement on Class B ..................................................... 2
Warranty .............................................................................................................. 4
Static Electricity Precautions ...................................................................... 4
Safety Measures ..............................................................................................4
About the Package .........................................................................................5
Optional Items..................................................................................................5
Before Using the System Board ............................................................... 5
Chapter 1 - Introduction .............................................................................6
Specifications ................................................................................................6
Features ..........................................................................................................7
Chapter 2 - Concept ....................................................................... 8
COM Express Module Standards .............................................................. 8
Specification Comparison Table ...............................................................9
DV970 PCIe Lanes Routing Table .........................................................10
Chapter 3 - Hardware Installation .............................................. 11
Board Layout ............................................................................................... 11
System Memory .......................................................................................... 12
Installing the DIMM Module .......................................................................12
Connectors ................................................................................................... 13
CPU Fan Connector....................................................................................13
COM Express Connectors ...........................................................................14
COM Express Connectors Signal Discription ................................................. 17
Standby Power LED ................................................................................... 29
Cooling Option ............................................................................................ 29
Heat Sink with Fan .....................................................................................29
Installing DV970 onto a Carrier Board ................................................ 30
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Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to the
product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power
cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
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About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One DV970 board
• One Cooler (Height: TBD)
Optional Items
• COM333-I carrier board kit
• Heat spreader (Height: 11mm)
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Memory module
• Storage devices such as hard disk drive, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
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Chapter 1 - Introduction
Specifications
Chapter 1
SYSTEM Processor Intel Atom® Processor C3000 Series, BGA1310
Intel Atom
®
C3958 Processor, 16 Cores, 16M Cache, 2.0GHz, 31W
Intel Atom
®
C3808 Processor, 12 Cores, 12M Cache, 2.0GHz, 25W
Intel Atom
®
C3708 Processor, 8 Cores, 16M Cache, 1.7GHz, 17W
Memory Two 260-pin ECC SODIMM up to 32GB
Dual Channel DDR4 2400MHz
(Memory max speed depends on CPU SKU)
BIOS Insyde SPI 128Mbit
EXPANSION Interface 000G/200G/300G:
B1: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
B2: 1 x PCIe x2 (Gen 3) + 1 x PCIe x1 (Gen 2) or
2 x PCIe x1 (Lane 8 Gen 3, Lane 12 Gen 2)
B3: 1 x PCIe x8 or 2 x PCIe x4 or 4 x PCIe x2 or 4 x PCIe x1 (Gen 3)
100G:
B1: 1 x PCIe x8 or 2 x PCIe x4 or 4 x PCIe x2 or 4 x PCIe x1 (Gen 3)
B3: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
B4: 2 x PCIe x2 or 2 x PCIe x1 (Gen 3)
1 x LPC
1 x I
2
C
1 x SMBus
2 x UART (TX/RX)
ETHERNET Controller PHY for X557 or CS4227/CS4223 and Controller for Intel® I210AT/
Intel
®
I210IT
2 x Independent 10GbE Media Access Controller (Sku dependent)
Supports up to Two 10GBASE-KR Interfaces and Max up to Four 10GbE
MAC Ports
Supports Intel
®
X557-AT/AT2/AT4 10GbE PHY
Supports Inphi CS4227 (2 port)/CS4223 (4 port)
(maximum bandwidth is 20Gb when 4 ports of 10G interface active at
the same time)
1 x Intel
®
I210AT (10/100/1000Mbps) (normal temp.) or
1 x Intel
®
I210IT (10/100/1000Mbps) (wide temp.)
I/O USB 2 x USB 3.0
4 x USB 2.0
SATA 2 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/10
DIO 1 x 8-bit DIO (4 in, 4 out)
WATCHDOG
TIMER
Output &
Interval
System Reset, Programmable via Software from 15 to 255 Seconds
SECURITY TPM Available Upon Request
POWER Type 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption TBD
OS SUPPORT Windows Server 2012
Windows Server 2016
Yocto Project v1.8/v2.0
ENVIRONMENT Temperature Operating:
0 to 60°C or -20 to 70°C
Storage:
-40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TBD
Mechanical Dimensions COM Express® Basic
95mm (3.74") x 125mm (4.9")
Compliance PICMG COM Express
®
R3.0, Type 7
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Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR4
DDR4 delivers increased system bandwidth and improves performance. The advantages of
DDR4 provide an extended battery life and improve the performance at a lower power than
DDR3/DDR2.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s. However, the bandwidth of the SATA 3.0 will be
limited by carrier board design.
• Gigabit LAN
The Intel® I210AT or I210IT Gigabit LAN PHY controller features up to 1Gbps data transmission with support for Intel
®
Active Management Technology. It provides remote maintenance
and manageability for networked computing assets in an enterprise environment.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60
MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission and
is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds
between your computer and a wide range of simultaneously accessible external Plug and Play
peripherals.
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Chapter 2
Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules.
DV970 is a COM Express Basic module. Its dimension is 95mm x 125mm.
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50
4.00
0.00
Extended
BasicCompact
Mini
74.20
80.00
91.00
121.00
151.00
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
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Chapter 2
Specification Comparison Table
• 5 Indicates 12V-tolerant features on former VCC_12V signals.
•
6
Cells in the connected columns spanning rows provide a rough approximation of features
sharing connector pins.
The table below shows the COM Express standard specifications and the corresponding specifications supported on the DV970 module.
Connector Feature
COM Express Module Base
Specification Type 7
Min / Max
DFI DV970
Type 7
(000G/200G/300G)
DFI DV970
Type 7
(100G)
A-B PCI Express Lanes 0 - 5
6 / 6
46
A-B
,
C-D PCI Express Lanes 6 - 15
0 / 10
32
C-D PCI Ex
p
ress Lanes 16 - 31
0 / 16
88
C-D PCI Ex
p
ress Graphics(PEG
)
NA
NA NA
C-D 10G LAN Ports 0 - 3
0 / 4
44
A-B NC-SI
0 / 1 1
0
A-B 1Gb LAN Port 0
1 / 1 1
0
A-B DDI 0
NA
NA NA
A-B DDIs 1 - 3
NA
NA NA
A-B LVDS Channel A
NA
NA NA
A-B LVDS Channel B
NA
NA NA
A-B eDP on LVDS CH A
p
ins
NA
NA NA
A-B VGA Por
t
NA
NA NA
A-B Serial Ports 1 - 2
0 / 2 2
2
A-B CAN interface on SER1
0 / 1
00
A-B SATA Ports
0 / 2
22
A-B HDA Di
g
ital Interface
NA
NA NA
A-B USB 2.0 Ports
4 / 4
44
A-B USB0 Client
0 / 1
00
A-B USB7 Client
NA
NA NA
C-D USB 3.0 Ports
0 / 4
22
A-B LPC Bus or eSPI
1 / 1
1 LPC 1 LPC
A-B SPI
(
Devices
)
1 / 2
11
C-D Ra
p
id Shutdown
0 / 1
00
A-B
6
SDIO(muxed on GPIO
)
0 / 1
00
A-B
General Pur
p
ose I/O
8 / 8
88
A-B SMBus
1 / 1
11
A-B I2C
1 / 1
11
A-B Watchdo
g
Timer
0 / 1
11
A-B S
p
eaker Out
1 / 1
11
A-B Carrier Board BIOS Flash
Su
pport
0 / 1 1 1
A-B Reset Functions
1 / 1
11
A-B
T
rusted Platform Module
0 / 1
11
A-B
T
hermal Protection
0 / 1 1
1
A-B Batter
y
Low Alarm
0 / 1 1
1
A-B Sus
p
end/Wake Signals
0 / 3 2
2
A-B Power Button Su
pport
1 / 1 1
1
A-B Power Good
1 / 1 1
1
A-B VCC_5V_SBY Contacts
4 / 4 4
4
A-B
5
Sleep Input
0 / 1 1 1
A-B
5
Lid Input
0 / 1 1 1
A-B
5
Carrier Board Fan Control
0 / 1 1 1
A-B
,
C-D VCC_12V Contacts 24 / 24 24 24
System Management
Power Management
Power
System I/O
Type 7 Based on Type 6. Modules trades all audio and video interfaces, 2 SATA ports and four USB 2.0 for
additional PCI Express lanes, four 10 Gb Ethernet ports and an NC-SI management interface for the GbE port.
Features C3958 C3808 C3708
Thermal Design Power (TDP) (Watts) 31 25 17
Number of 64-bit Intel Atom® Microarchitecture
Goldmont Cores
16 12 8
Processor Base Frequency (GHz) 2 2 1.7
Total SoC L2 Cache (MB) 16 12 16
Max. Number of Memory Channels Available 2
Max. DDR4 (1.2V) Memory Data Rate Supported
(MT/s)
2400 2133
Number of High-Speed I/O (HSIO) Lanes Shared
between PCIe, SATA, and USB 3.0
20
HSIO Lane Numbers (0 through 19) Available Lanes 0-19
Max. Number of PCI Express (8.0/5.0/2.5 GT/s)
Lanes
16 via HSIO Lanes
from Lanes 0-15
Max. Number of SATA (6.0/3.0/1.5 Gbps) Lanes 16 via HSIO Lanes
from Lanes 4-19
Max. Number of Sets of USB 3.0 Signals
(SSTX+/SSTX- SSRX+/SSRX-)
4 via HSIO Lanes
from Lanes 16-19
Number of Sets of USB 2.0 Signals
(DATA+/DATA-)
4
LAN Controller 0 (Gb/s)* 10/2.5/1
LAN Controller 1 (Gb/s)* 10/2.5/1
* Each LAN controller must run the same LEK.
Note: Different SKUs may require different BIOS.
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Chapter 2
DV970 PCIe Lanes Routing Table
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Page 11
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11
Chapter 3
Chapter 3 - Hardware Installation
Board Layout
Top View
Bottom View
DDR4_1 SODIMM
DDR4_2 SODIMM
1
CPU fan
Intel
I210AT or
I210IT
Standby
Power LED
SPI Flash BIOS
TPM (optional)
Intel Atom
C3000 Series
P17C9X2G
304SL
CA
AAA
5
1
COM Express Connector
C1
D1
C110
D110
B1
B110
A1
A110
COM Express Connector
iTE
IT8528E
Page 12
Chapter 3 Hardware Installation
12
Chapter 3
System Memory
DDR4_2
Standby
Power LED
DDR4_1
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
Important:
When the Standby Power LED is red, it indicates that there is power on the board.
Power off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
Installing the DIMM Module
1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the system board.
4. Note the key on the socket. The key ensures that the module can be plugged into the
socket in only one direction.
Note:
The system board used in the following illustrations may not resemble the actual one.
These illustrations are for reference only.
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Chapter 3
Connectors
CPU Fan Connector
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
3
1
Sense
+12V
Ground
6. Push down the module until the clips at each end of the socket lock into position. You will
hear a distinctive “click”, indicating the module is correctly locked into position.
Clip
Clip
5. Grasping the module by its edges, align the module into the socket at an approximately 30
degrees angle. Apply firm even pressure to each end of the module until it slips down into
the socket. The contact fingers on the edge of the module will almost completely disappear
inside the socket.
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Chapter 3
COM Express Connectors
The COM Express connectors are used to interface the DV970 COM Express board to a carrier
board. Connect the COM Express connectors (located on the solder side of the board) to the
COM Express connectors on the carrier board.
COM Express Connectors
Refer to the following pages for the pin functions of these connectors.
CA
AAA
5
1
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15
Chapter 3
COM Express Connectors-Continued
A1 GND (FIXED) B1 GND (FIXED) A56
PCIE_TX4-
B56
PCIE_RX4-
A2
GBE0_MDI3-
B2
GBE0_ACT#
A57
GND
B57
GPO2
A3
GBE0_MDI3+
B3
LPC_FRAME# / ESPI_CS0#*
A58
PCIE_TX3+
B58
PCIE_RX3+
A4
GBE0_LINK100#
B4
LPC_AD0 / ESPI_IO_0*
A59
PCIE_TX3-
B59
PCIE_RX3-
A5
GBE0_LINK1000#
B5
LPC_AD1 / ESPI_IO_1*
A60 GND (FIXED) B60 GND (FIXED)
A6
GBE0_MDI2-
B6
LPC_AD2 / ESPI_IO_2*
A61
PCIE_TX2+
B61
PCIE_RX2+
A7
GBE0_MDI2+
B7
LPC_AD3 / ESPI_IO_3*
A62
PCIE_TX2-
B62
PCIE_RX2-
A8
GBE0_LINK#
B8
LPC_DRQ0# / ESPI_ALERT0#*
A63
GPI1
B63
GPO3
A9
GBE0_MDI1-
B9
LPC_DRQ1# / ESPI_ALERT1#*
A64
PCIE_TX1+
B64
PCIE_RX1+
A10
GBE0_MDI1+
B10
LPC_CLK / ESPI_CK*
A65
PCIE_TX1-
B65
PCIE_RX1-
A11 GND (FIXED) B11 GND (FIXED) A66
GND
B66
WAKE0#
A12
GBE0_MDI0-
B12
PWRBTN#
A67
GPI2
B67
WAKE1#
A13
GBE0_MDI0+
B13
SMB_CK
A68
PCIE_TX0+
B68
PCIE_RX0+
A14
GBE0_CTREF
B14
SMB_DAT
A69
PCIE_TX0-
B69
PCIE_RX0-
A15
SUS_S3#
B15
SMB_ALERT#
A70 GND (FIXED) B70 GND (FIXED)
A16
SATA0_TX+
B16
SATA1_TX+
A71
PCIE_TX8+
B71
PCIE_RX8+
A17
SATA0_TX-
B17
SATA1_TX-
A72
PCIE_TX8-
B72
PCIE_RX8-
A18
SUS_S4#
B18
SUS_STAT# / ESPI_RESET#*
A73
GND
B73
GND
A19
SATA0_RX+
B19
SATA1_RX+
A74
PCIE_TX9+
B74
PCIE_RX9+
A20
SATA0_RX-
B20
SATA1_RX-
A75
PCIE_TX9-
B75
PCIE_RX9-
A21 GND (FIXED) B21 GND (FIXED) A76
GND
B76
GND
A22
N.C.
B22
N.C.
A77
N.C.
B77
N.C.
A23
N.C.
B23
N.C.
A78
N.C.
B78
N.C.
A24
SUS_S5#
B24
PWR_OK
A79
GND
B79
GND
A25
N.C.
B25
N.C.
A80 GND (FIXED) B80 GND (FIXED)
A26
N.C.
B26
N.C.
A81
N.C.
B81
N.C.
A27
BATLOW#
B27
WDT
A82
N.C.
B82
N.C.
A28
(S)ATA_ACT#
B28
RSVD
A83
GND
B83
GND
A29
RSVD
B29
RSVD
A84
NCSI_TX_EN
B84
VCC_5V_SBY
A30
RSVD
B30
RSVD
A85
GPI3
B85
VCC_5V_SBY
A31 GND (FIXED) B31 GND (FIXED) A86
RSVD
B86
VCC_5V_SBY
A32
RSVD
B32
SPKR
A87
RSVD
B87
VCC_5V_SBY
A33
RSVD
B33
I2C_CK
A88
PCIE_CK_REF+
B88
BIOS_DIS1#
A34
BIOS_DIS0# / ESPI_SAFS*
B34
I2C_DAT
A89
PCIE_CK_REF-
B89
NCSI_RX_ER
A35
THRMTRIP#
B35
THRM#
A90 GND (FIXED) B90 GND (FIXED)
A36
N.C.
B36
N.C.
A91
SPI_POWER
B91
NCSI_CLK_IN
A37
N.C.
B37
N.C.
A92
SPI_MISO
B92
NCSI_RXD1
A38
GND
B38
GND
A93
GPO0
B93
NCSI_RXD0
A39
PCIE_TX12+
B39
PCIE_RX12+
A94
SPI_CLK
B94
NCSI_CRS_DV
A40
PCIE_TX12-
B40
PCIE_RX12-
A95
SPI_MOSI
B95
NCSI_TXD1
A41 GND (FIXED) B41 GND (FIXED) A96
TPM_PP
B96
NCSI_TXD0
A42
USB2-
B42
USB3-
A97
N.C.
B97
SPI_CS#
A43
USB2+
B43
USB3+
A98
SER0_TX
B98
NCSI_ARB_IN
A44
USB_2_3_OC#
B44
USB_0_1_OC#
A99
SER0_RX
B99
NCSI_ARB_OUT
A45
USB0-
B45
USB1-
A100 GND (FIXED) B100 GND (FIXED)
A46
USB0+
B46
USB1+
A101
SER1_TX
B101
FAN_PWMOUT
A47
VCC_RTC
B47
ESPI_EN#*
A102
SER1_RX
B102
FAN_TACHIN
A48
RSVD
B48
N.C.
A103
LID#
B103
SLEEP#
A49
GBE0_SDP
B49
SYS_RESET#
A104
VCC_12V
B104
VCC_12V
A50
LPC_SERIRQ / ESPI_CS1#*
B50
CB_RESET#
A105
VCC_12V
B105
VCC_12V
A51 GND (FIXED) B51 GND (FIXED) A106
VCC_12V
B106
VCC_12V
A52
PCIE_TX5+
B52
PCIE_RX5+
A107
VCC_12V
B107
VCC_12V
A53
PCIE_TX5-
B53
PCIE_RX5-
A108
VCC_12V
B108
VCC_12V
A54
GPI0
B54
GPO1
A109
VCC_12V
B109
VCC_12V
A55
PCIE_TX4+
B55
PCIE_RX4+
A110 GND (FIXED) B110 GND (FIXED)
* : DV970 only supports LPC interface, no eSPI mode interface.
Row A Row B Row A Row B
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Chapter 3
C1 GND (FIXED) D1 GND (FIXED) C56
PCIE_RX17-
D56
PCIE_TX17-
C2
GND
D2
GND
C57
N.C.
D57
TYPE2#
C3
USB_SSRX0-
D3
USB_SSTX0-
C58
PCIE_RX18+
D58
PCIE_TX18+
C4
USB_SSRX0+
D4
USB_SSTX0+
C59
PCIE_RX18-
D59
PCIE_TX18-
C5
GND
D5
GND
C60 GND (FIXED) D60 GND (FIXED)
C6
USB_SSRX1-
D6
USB_SSTX1-
C61
PCIE_RX19+
D61
PCIE_TX19+
C7
USB_SSRX1+
D7
USB_SSTX1+
C62
PCIE_RX19-
D62
PCIE_TX19-
C8
GND
D8
GND
C63
RSVD
D63
RSVD
C9
N.C.
D9
N.C.
C64
RSVD
D64
RSVD
C10
N.C.
D10
N.C.
C65
PCIE_RX20+
D65
PCIE_TX20+
C11 GND (FIXED) D11 GND (FIXED) C66
PCIE_RX20-
D66
PCIE_TX20-
C12
N.C.
D12
N.C.
C67
RAPID_SHUTDOWN
D67
GND
C13
N.C.
D13
N.C.
C68
PCIE_RX21+
D68
PCIE_TX21+
C14
GND
D14
GND
C69
PCIE_RX21-
D69
PCIE_TX21-
C15
10G_PHY_MDC_SCL3
D15
10G_PHY_MDIO_SDA3
C70 GND (FIXED) D70 GND (FIXED)
C16
10G_PHY_MDC_SCL2
D16
10G_PHY_MDIO_SDA2
C71
PCIE_RX22+
D71
PCIE_TX22+
C17
10G_SDP2
D17
10G_SDP3
C72
PCIE_RX22-
D72
PCIE_TX22-
C18
GND
D18
GND
C73
GND
D73
GND
C19
PCIE_RX6+
D19
PCIE_TX6+
C74
PCIE_RX23+
D74
PCIE_TX23+
C20
PCIE_RX6-
D20
PCIE_TX6-
C75
PCIE_RX23-
D75
PCIE_TX23-
C21 GND (FIXED) D21 GND (FIXED) C76
GND
D76
GND
C22
PCIE_RX7+
D22
PCIE_TX7+
C77
RSVD
D77
RSVD
C23
PCIE_RX7-
D23
PCIE_TX7-
C78
PCIE_RX24+
D78
PCIE_TX24+
C24
10G_INT2
D24
10G_INT3
C79
PCIE_RX24-
D79
PCIE_TX24-
C25
GND
D25
GND
C80 GND (FIXED) D80 GND (FIXED)
C26
10G_KR_RX3+
D26
10G_KR_TX3+
C81
PCIE_RX25+
D81
PCIE_TX25+
C27
10G_KR_RX3-
D27
10G_KR_TX3-
C82
PCIE_RX25-
D82
PCIE_TX25-
C28
GND
D28
GND
C83
RSVD
D83
RSVD
C29
10G_KR_RX2+
D29
10G_KR_TX2+
C84
GND
D84
GND
C30
10G_KR_RX2-
D30
10G_KR_TX2-
C85
N.C.
D85
N.C.
C31 GND (FIXED) D31 GND (FIXED) C86
N.C.
D86
N.C.
C32
10G_SFP_SDA3
D32
10G_SFP_SCL3
C87
GND
D87
GND
C33
10G_SFP_SDA2
D33
10G_SFP_SCL2
C88
N.C.
D88
N.C.
C34
10G_PHY_RST_23
D34
10G_PHY_CAP_23
C89
N.C.
D89
N.C.
C35
10G_PHY_RST_01
D35
10G_PHY_CAP_01
C90 GND (FIXED) D90 GND (FIXED)
C36
10G_LED_SDA
D36
RSVD
C91
PCIE_RX28+
D91
PCIE_TX28+
C37
10G_LED_SCL
D37
RSVD
C92
PCIE_RX28-
D92
PCIE_TX28-
C38
10G_SFP_SDA1
D38
10G_SFP_SCL1
C93
GND
D93
GND
C39
10G_SFP_SDA0
D39
10G_SFP_SCL0
C94
PCIE_RX29+
D94
PCIE_TX29+
C40
10G_SDP0
D40
10G_SDP1
C95
PCIE_RX29-
D95
PCIE_TX29-
C41 GND (FIXED) D41 GND (FIXED) C96
GND
D96
GND
C42
10G_KR_RX1+
D42
10G_KR_TX1+
C97
RSVD
D97
RSVD
C43
10G_KR_RX1-
D43
10G_KR_TX1-
C98
N.C.
D98
N.C.
C44
GND
D44
GND
C99
N.C.
D99
N.C.
C45
10G_PHY_MDC_SCL1
D45
10G_PHY_MDIO_SDA1
C100 GND (FIXED) D100 GND (FIXED)
C46
10G_PHY_MDC_SCL0
D46
10G_PHY_MDIO_SDA0
C101
N.C.
D101
N.C.
C47
10G_INT0
D47
10G_INT1
C102
N.C.
D102
N.C.
C48
GND
D48
GND
C103
GND
D103
GND
C49
10G_KR_RX0+
D49
10G_KR_TX0+
C104
VCC_12V
D104
VCC_12V
C50
10G_KR_RX0-
D50
10G_KR_TX0-
C105
VCC_12V
D105
VCC_12V
C51 GND (FIXED) D51 GND (FIXED) C106
VCC_12V
D106
VCC_12V
C52
PCIE_RX16+
D52
PCIE_TX16+
C107
VCC_12V
D107
VCC_12V
C53
PCIE_RX16-
D53
PCIE_TX16-
C108
VCC_12V
D108
VCC_12V
C54
TYPE0#
D54
RSVD
C109
VCC_12V
D109
VCC_12V
C55
PCIE_RX17+
D55
PCIE_TX17+
C110 GND (FIXED) D110 GND (FIXED)
Row C Row DRow C Row D
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Chapter 3
COM Express Connectors Signals and Descriptions
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend
GBE0_MDI0- A12 I/O Analog 3.3V max Suspend
GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend
GBE0_MDI1- A9 I/O Analog 3.3V max Suspend
GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend
GBE0_MDI2- A6 I/O Analog 3.3V max Suspend
GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend
GBE0_MDI3- A2 I/O Analog 3.3V max Suspend
GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 activity indicator, active low.
GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low.
GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
GBE0_CTREF A14 REF GND min, 3.3V max N.C.
Reference voltage for Carrier Board Ethernet channel 0 magnetics center tap. The
reference voltage is determined by the requirements of the Module PHY and may
be as low as 0V and as high as 3.3V. The reference voltage output shall be
current limited on the Module. In the case in which the reference is shorted to
ground, the current shall be limited to 250 mA or less.
GBE0_SDP A49 I/O 3.3V Suspend/3.3V
RSVD PU 10Kɏ
Gigabit Ethernet Controller 0 Software-Definable Pin. Can also be used for
IEEE1588 support such as a 1pps signal.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
NCSI_CLK_IN B91 I CMOS 3.3V Suspend/3.3V
PD 10Kɏ PD 10Kɏ to GND
NC-SI Clock reference for receive, transmit, and control interface.
NCSI_RXD0 B93 O CMOS 3.3V Suspend/3.3V PD 3Kƻ to GND NC-SI Receive Data (from NC to BMC).
NCSI_RXD1 B92 O CMOS 3.3V Suspend/3.3V PD 3Kƻ to GND NC-SI Receive Data (from NC to BMC).
NCSI_TXD0 B96 I CMOS 3.3V Suspend/3.3V
PD 10Kɏ
PD 10Kƻ to GND NC-SI Transmit Data (from BMC to NC).
NCSI_TXD1 B95 I CMOS 3.3V Suspend/3.3V
PD 10Kɏ
PD 10Kƻ to GND NC-SI Transmit Data (from BMC to NC).
NCSI_CRS_DV B94 O CMOS 3.3V Suspend/3.3V PD 10Kƻ to GND
NC-SI Carrier Sense/Receive Data Valid to MC, indicating that the transmitted
data from NC to BMC is valid.
NCSI_TX_EN A84 I CMOS 3.3V Suspend/3.3V PD 10Kƻ PD 10Kƻ to GND NC-SI Transmit enable.
NCSI_RX_ER B89 O CMOS 3.3V Suspend/3.3V
RSVD PU 10Kɏ to
3.3V Suspend
NC-SI Receive error.
NCSI_ARB_IN B98 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
RSVD PU 4.7Kɏ to
3.3V Suspend
(IPD 20Kȟ)
NC-SI hardware arbitration input.
NCSI_ARB_OUT B99 O CMOS 3.3V Suspend/3.3V NC-SI hardware arbitration output.
NC-SI Signals Descriptions
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
RSVD pins are reserved for future use and should be no connect. Do not tie the RSVD pins together.
Power Inputs used for power delivery to the Module electronics.
KR 10GBASE-KR compatible signal.
Gigabit Ethernet Signals Descriptions
Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs
0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs
are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-
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Chapter 3
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
10G_KR_TX0+ D49 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX0- D50 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX1+ D42 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX1- D43 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX2+ D29 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX2- D30 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX3+ D26 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_TX3- D27 O KR AC coupled at receiver
10GBASE-KR ports, transmit output differential pairs.
See section ‘AC Coupling of 10G_KR_TX Signals‘ below for details on AC coupling
10G_KR_RX0+ C49 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX0- C50 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX1+ C42 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX1- C43 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX2+ C29 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX2- C30 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX3+ C26 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_KR_RX3- C27 I KR AC coupled on Module AC Coupling capacitor 10GBASE-KR ports, receive input differential pairs.
10G_PHY_MDIO_SDA0 D46
10G_PHY_MDIO_SDA1 D45
10G_PHY_MDIO_SDA2 D16
10G_PHY_MDIO_SDA3 D15
10G_PHY_MDC_SCL0 C46
10G_PHY_MDC_SCL1 C45
10G_PHY_MDC_SCL2 C16
10G_PHY_MDC_SCL3 C15
10G_PHY_CAP_01 D35 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
PU 100Kƻ to
3.3V Suspend
Phy mode capability pin: Indicates if the PHY for 10G lanes 0 and 1 is capable of
configuration by I²C. High indicates MDIO-only configuration, and low indicates
configuration capability via I²C or MDIO. The actual protocol used for PHY
configuration is determined by the module, in part based on this input. The actual
protocol used is indicated over the dedicated I²C interface
10G_PHY_CAP_23 D34 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
PU 100Kƻ to
3.3V Suspend
Phy mode capability pin: Indicates if the PHY for 10G lanes 2 and 3 is capable of
configuration by I²C. High indicates MDIO-only configuration, and low indicates
configurationcapability via I²C or MDIO. The actual protocol used for PHY
configuration is determined by the module, in part based on this input. The actual
protocol used is indicated over the dedicated I²C interface
10G_SFP_SDA0 C39
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻ to
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SDA1 C38
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻ to
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
MDIO:
PU 2.2Kƻ to
3.3V Suspend
MDC :
PU 2.2Kƻ to
3.3V Suspend
10Gb Ethernet Signals Descriptions
MDIO Mode: Management Data I/O interface mode data signal for serial data
transfers between the MAC and an external PHY.
I2C Mode: I2C data signal, of the 2-wire management interface used for serial
data transfers between the MAC and an external PHY.
3.3V Suspend/3.3V
O CMOS
I/O OD
CMOS
PU 2.2Kƻ to 3.3V Suspend
MDIO Mode: Management Data I/O Interface mode clock signal for serial data
transfers between the MAC and an external PHY.
I2C Mode: I2C Clock signal, of the 2-wire management interface used for serial
data transfers between the MAC and an external PHY.
O CMOS
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
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Chapter 3
10G_SFP_SDA2 C33
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SDA3 C32
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C data signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL0 D39
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻ to
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL1 D38
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
IPU 5Kƻ,
RSV PU 4.7Kƻ to
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL2 D33
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_SFP_SCL3 D32
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C clock signal of the 2-wire management interface used by the 10GbE controller
to access the management registers of an external Optical SFP Module.
10G_LED_SDA C36
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C Data of the 2-wire interface that transfers LED signals and PHY straps for I2C
or MDIO operation of optical PHYs. Refer to the details in I2C Data Mapping to
Carrier Board Based PCA9539 I/O Expander.
10G_LED_SCL C37
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 4.7Kƻ to
3.3V Suspend
I2C Clock of the 2-wire interface that transfers LED and strap signals for I2C or
MDIO operation of optical PHYs.
10G_INT0 C47 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kƻ to
3.3V Suspend
Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT1 D47 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kƻ to
3.3V Suspend
Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT2 C24 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kƻ to
3.3V Suspend
Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_INT3 D24 I CMOS 3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kƻ to
3.3V Suspend
Interrupt pin from copper PHY or optical SFP Module to the 10GbE controller.
10G_SDP0 C40 I/O CMOS 3.3V Suspend/3.3V
Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP1 D40 I/O CMOS 3.3V Suspend/3.3V
Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP2 C17 I/O CMOS 3.3V Suspend/3.3V
Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_SDP3 D17 I/O CMOS 3.3V Suspend/3.3V
Software-Definable Pins. Can also be used for IEEE1588 support such as a 1pps
signal.
10G_PHY_RST_01 C35 O CMOS 3.3V Suspend/3.3V
PU 10Kƻ to
3.3V Suspend
Output signal that resets an optical PHY on port 0 and port1 (with copper PHY
this signal is not used).
10G_PHY_RST_23 C34 O CMOS 3.3V Suspend/3.3V
PU 10Kƻ to
3.3V Suspend
Output signal that resets an Optical PHY on port 2 and port 3 (with Copper PHY
this signal is not used).
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
SATA0_TX+ A16 O SATA AC coupled on Module AC Coupling capacitor
SATA0_TX- A17 O SATA AC coupled on Module AC Coupling capacitor
SATA0_RX+ A19 I SATA AC coupled on Module AC Coupling capacitor
SATA0_RX- A20 I SATA AC coupled on Module AC Coupling capacitor
SATA1_TX+ B16 O SATA AC coupled on Module AC Coupling capacitor
SATA1_TX- B17 O SATA AC coupled on Module AC Coupling capacitor
SATA1_RX+ B19 I SATA AC coupled on Module AC Coupling capacitor
SATA1_RX- B20 I SATA AC coupled on Module AC Coupling capacitor
Serial ATA Channel 1 receive differential pair.
SATA Signals Descriptions
Serial ATA Channel 0 transmit differential pair.
Serial ATA Channel 0 receive differential pair.
Serial ATA Channel 1 transmit differential pair.
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Chapter 3
(S)ATA_ACT# A28 I/O CMOS 3.3V / 3.3V
AND Gate out,
up to 3.3V
Serial ATA (activity indicator), active low.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
PCIE_TX0+ A68 AC Coupling capacitor
PCIE_TX0- A69 AC Coupling capacitor
PCIE_RX0+ B68
PCIE_RX0- B69
PCIE_TX1+ A64 AC Coupling capacitor
PCIE_TX1- A65 AC Coupling capacitor
PCIE_RX1+ B64
PCIE_RX1- B65
PCIE_TX2+ A61 AC Coupling capacitor
PCIE_TX2- A62 AC Coupling capacitor
PCIE_RX2+ B61
PCIE_RX2- B62
PCIE_TX3+ A58 AC Coupling capacitor
PCIE_TX3- A59 AC Coupling capacitor
PCIE_RX3+ B58
PCIE_RX3- B59
PCIE_TX4+ A55 AC Coupling capacitor
PCIE_TX4- A56 AC Coupling capacitor
PCIE_RX4+ B55
PCIE_RX4- B56
PCIE_TX5+ A52 AC Coupling capacitor
PCIE_TX5- A53 AC Coupling capacitor
PCIE_RX5+ B52
PCIE_RX5- B53
PCIE_TX6+ D19 AC Coupling capacitor
PCIE_TX6- D20 AC Coupling capacitor
PCIE_RX6+ C19
PCIE_RX6- C20
PCIE_TX7+ D22 AC Coupling capacitor
PCIE_TX7- D23 AC Coupling capacitor
PCIE_RX7+ C22
PCIE_RX7- C23
PCIE_TX8+ A71 AC Coupling capacitor
PCIE_TX8- A72 AC Coupling capacitor
PCIE_RX8+ B71
PCIE_RX8- B72
PCIE_TX9+ A74 AC Coupling capacitor
PCIE_TX9- A75 AC Coupling capacitor
PCIE_RX9+ B74
PCIE_RX9- B75
PCIE_TX10+ A77 N.C.
PCIE_TX10- A78 N.C.
PCIE_RX10+ B77 N.C.
PCIE_RX10- B78 N.C.
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 6
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 8
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 9
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 9
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 10
Different connector layout for Type 7
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 5
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 6
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 4
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 5
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 1
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 3
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 4
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 2
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 3
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 8
Different connector layout for Type 7
General Purpose PCI Express Lanes Signals Descriptions
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 0
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 1
O PCIE AC coupled on Module PCI Express Differential Transmit Pairs 2
I PCIE AC coupled off Module PCI Express Differential Receive Pairs 0
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 10
Different connector layout for Type 7
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Chapter 3
PCIE_TX11+ A81 N.C.
PCIE_TX11- A82 N.C.
PCIE_RX11+ B81 N.C.
PCIE_RX11- B82 N.C.
PCIE_TX12+ A39 AC Coupling capacitor
PCIE_TX12- A40 AC Coupling capacitor
PCIE_RX12+ B39
PCIE_RX12- B40
PCIE_TX13+ A36 N.C.
PCIE_TX13- A37 N.C.
PCIE_RX13+ B36 N.C.
PCIE_RX13- B37 N.C.
PCIE_TX14+ A25 N.C.
PCIE_TX14- A26 N.C.
PCIE_RX14+ B25 N.C.
PCIE_RX14- B26 N.C.
PCIE_TX15+ A22 N.C.
PCIE_TX15- A23 N.C.
PCIE_RX15+ B22 N.C.
PCIE_RX15- B23 N.C.
PCIE_TX16+ D52 AC Coupling capacitor
PCIE_TX16- D53 AC Coupling capacitor
PCIE_RX16+ C52
PCIE_RX16- C53
PCIE_TX17+ D55 AC Coupling capacitor
PCIE_TX17- D56 AC Coupling capacitor
PCIE_RX17+ C55
PCIE_RX17- C56
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 11
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 11
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 12
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 12
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 13
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 13
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 14
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 14
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 15
Different connector layout for Type 7
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 15
Different connector layout for Type 7
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 16
These are the same lines as Type 7 PEG_TX0±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 16
These are the same lines as Type 7 PEG_RX0±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 17
These are the same lines as Type 7 PEG_TX1±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 17
These are the same lines as Type 7 PEG_RX1±
PCIE_TX18+ D58 AC Coupling capacitor
PCIE_TX18- D59 AC Coupling capacitor
PCIE_RX18+ C58
PCIE_RX18- C59
PCIE_TX19+ D61 AC Coupling capacitor
PCIE_TX19- D62 AC Coupling capacitor
PCIE_RX19+ C61
PCIE_RX19- C62
PCIE_TX20+ D65 AC Coupling capacitor
PCIE_TX20- D66 AC Coupling capacitor
PCIE_RX20+ C65
PCIE_RX20- C66
PCIE_TX21+ D68 AC Coupling capacitor
PCIE_TX21- D69 AC Coupling capacitor
PCIE_RX21+ C68
PCIE_RX21- C69
PCIE_TX22+ D71 AC Coupling capacitor
PCIE_TX22- D72 AC Coupling capacitor
PCIE_RX22+ C71
PCIE_RX22- C72
PCIE_TX23+ D74 AC Coupling capacitor
PCIE_TX23- D75 AC Coupling capacitor
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 18
These are the same lines as Type 7 PEG_TX2±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 18
These are the same lines as Type 7 PEG_RX2±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 19
These are the same lines as Type 7 PEG_TX3±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 19
These are the same lines as Type 7 PEG_RX3±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 20
These are the same lines as Type 7 PEG_TX4±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 20
These are the same lines as Type 7 PEG_RX4±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 21
These are the same lines as Type 7 PEG_TX5±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 21
These are the same lines as Type 7 PEG_RX5±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 22
These are the same lines as Type 7 PEG_TX6±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 22
These are the same lines as Type 7 PEG_RX6±
AC coupled on Module
PCI Express Differential Transmit Pairs 23
These are the same lines as Type 7 PEG_TX7±
O PCIE
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Chapter 3
PCIE_RX23+ C74
PCIE_RX23- C75
PCIE_TX24+ D78 AC Coupling capacitor
PCIE_TX24- D79 AC Coupling capacitor
PCIE_RX24+ C78
PCIE_RX24- C79
PCIE_TX25+ D81 AC Coupling capacitor
PCIE_TX25- D82 AC Coupling capacitor
PCIE_RX25+ C81
PCIE_RX25- C82
PCIE_TX26+ D85 N.C.
PCIE_TX26- D86 N.C.
PCIE_RX26+ C85 N.C.
PCIE_RX26- C86 N.C.
PCIE_TX27+ D88 N.C.
PCIE_TX27- D89 N.C.
PCIE_RX27+ C88 N.C.
PCIE_RX27- C89 N.C.
PCIE_TX28+ D91 AC Coupling capacitor
PCIE_TX28- D92 AC Coupling capacitor
PCIE_RX28+ C91
PCIE_RX28- C92
PCIE_TX29+ D94 AC Coupling capacitor
PCIE_TX29- D95 AC Coupling capacitor
PCIE_RX29+ C94
PCIE_RX29- C95
PCIE_TX30+ D98 N.C.
PCIE_TX30- D99 N.C.
PCIE_RX30+ C98 N.C.
PCIE_RX30- C99 N.C.
PCIE_TX31+ D101 N.C.
PCIE_TX31- D102 N.C.
PCIE_RX31+ C101 N.C.
PCIE_RX31- C102 N.C.
PCIE_CLK_REF+ A88
PCIE_CLK_REF- A89
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
USB0+ A46
USB0- A45
USB1+ B46
USB1- B45
USB2+ A43
USB2- A42
USB3+ B43
USB3- B42
I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 2.
I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 3.
USB Signals Descriptions
I/O USB 3.3V Suspend/3.3V
USB differential pairs, channels 0. For type 7 only, USB0 may be configured as a
USB client or as a host, or both at the Module designer's discretion. All other USB
ports, if implemented, shall be host ports.
I/O USB 3.3V Suspend/3.3V USB differential pairs, channel 1.
O PCIE PCIE Reference clock output for all PCI Express and PCI Express Graphics lanes.
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 25
These are the same lines as Type 7 PEG_TX9±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 25
These are the same lines as Type 7 PEG_RX9±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 23
These are the same lines as Type 7 PEG_RX7±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 24
These are the same lines as Type 7 PEG_TX8±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 28
These are the same lines as Type 7 PEG_TX12±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 28
These are the same lines as Type 7 PEG_RX12±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 26
These are the same lines as Type 7 PEG_RX10±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 27
These are the same lines as Type 7 PEG_TX11±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 31
These are the same lines as Type 7 PEG_TX15±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 31
These are the same lines as Type 7 PEG_RX15±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 29
These are the same lines as Type 7 PEG_RX13±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 30
These are the same lines as Type 7 PEG_TX14±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 30
These are the same lines as Type 7 PEG_RX14±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 29
These are the same lines as Type 7 PEG_TX13±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 27
These are the same lines as Type 7 PEG_RX11±
O PCIE AC coupled on Module
PCI Express Differential Transmit Pairs 26
These are the same lines as Type 7 PEG_TX10±
I PCIE AC coupled off Module
PCI Express Differential Receive Pairs 24
These are the same lines as Type 7 PEG_RX8±
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Chapter 3
USB_0_1_OC# B44 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
IPU 20Kƻ
RSV PU 10Kƻ to
3V3 Suspend.
USB over-current sense, USB channels 0 and 1. A pull-up for this line shall be
present on the Module. An open drain driver from a USB current monitor on the
Carrier Board may drive this line low. Do not pull this line high on the Carrier
Board.
USB_2_3_OC# A44 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
IPU 20Kƻ
RSV PU 10Kƻ to
3V3 Suspend.
USB over-current sense, USB channels 2 and 3. A pull-up for this line shall be
present on the Module. An open drain driver from a USB current monitor on the
Carrier Board may drive this line low. Do not pull this line high on the Carrier
Board.
USB_SSTX0+ D4
AC Coupling capacitor
USB_SSTX0- D3 AC Coupling capacitor
USB_SSRX0+ C4
USB_SSRX0- C3
USB_SSTX1+ D7 AC Coupling capacitor
USB_SSTX1- D6 AC Coupling capacitor
USB_SSRX1+ C7
USB_SSRX1- C6
USB_SSTX2+ D10 N.C.
USB_SSTX2- D9 N.C.
USB_SSRX2+ C10 N.C.
USB_SSRX2- C9 N.C.
USB_SSTX3+ D13 N.C.
USB_SSTX3- D12 N.C.
USB_SSRX3+ C13 N.C.
USB_SSRX3- C12 N.C.
USB0_HOST_PRSNT B48 I COMS 3.3V Suspend/3.3V N.C.
Module USB client may detect the presence of a USB host on USB0. A high value
indicates that a host is present.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD (LPC mode) Module Base Specification R3.0
LPC_AD0 / ESPI_IO_0 B4
LPC_AD1 / ESPI_IO_1 B5
LPC_AD2 / ESPI_IO_2 B6
LPC_AD3 / ESPI_IO_3 B7
LPC_FRAME# / ESPI_CS0# B3 O CMOS
3.3V / 3.3V
1.8V Suspend / 1.8V
LPC Mode: LPC frame indicates the start of an LPC cycle
ESPI Mode: eSPI Master Chip Select Outputs Driving Chip Select0#. A
lowselects a particular eSPI slave for the transaction. Each of the eSPI slaves is
connected to a dedicated Chip Selectn# pin.
LPC_DRQ0# / ESPI_ALERT0# B8
ESPI mode:
PU 1Kƻ to 1.8V
PU 10Kɏ to 3.3V,
not support ESPI mode.
LPC_DRQ1# / ESPI_ARERT1# B9
ESPI mode:
PU 1Kƻ to 1.8V
PU 10Kɏ to 3.3V,
not support ESPI mode.
LPC_SERIRQ / ESPI_CS1# A50
I/O CMOS
O CMOS
3.3V / 3.3V
1.8V Suspend / 1.8V
LPC_SERIRQ :
PU 8.2Kƻ to 3.3V
PU 10Kɏ to 3.3V
LPC Mode: LPC serial interrupt
ESPI Mode: eSPI Master Chip Select Outputs Driving Chip Select# A low selects
a particular eSPI slave for the transaction. Each of the eSPI slaves is connected to
a dedicated Chip Selectn# pin.
O PCIE AC coupled on Module
O PCIE AC coupled on Module Additional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIE AC coupled off Module Additional receive signal differential pairs for the SuperSpeed USB data path.
3.3V / 3.3V
1.8V Suspend / 1.8V
LPC Mode: LPC multiplexed address, command and data bus.
ESPI Mode: eSPI Master Data Input / Outputs These are bi-directional
input/output pins used to transfer data between master and slaves.
LPC and eSPI Signals Descriptions
I/O CMOS
Additional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIE AC coupled off Module Additional receive signal differential pairs for the SuperSpeed USB data path.
I CMOS
3.3V / 3.3V
1.8V Suspend / 1.8V
LPC Mode: LPC serial DMA request
ESPI Mode: eSPI pins used by eSPI slave to request service from the eSPI
master.
O PCIE AC coupled on Module Additional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIE AC coupled off Module Additional receive signal differential pairs for the SuperSpeed USB data path.
O PCIE AC coupled on Module Additional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIE AC coupled off Module Additional receive signal differential pairs for the SuperSpeed USB data path.
LPC_CLK / ESPI_CK B10 O CMOS
3.3V / 3.3V
1.8V Suspend / 1.8V
series 22ƻ resistor series 22ƻ resistor
LPC Mode: LPC clock output - 33MHz nominal
ESPI Mode: eSPI Master Clock Output This pin provides the reference timing for
all the serial input and output operations.
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SUS_STAT# / ESPI_RESET# B18 O CMOS
3.3V Suspend / 3.3V
1.8V Suspend / 1.8V
IPU 20Kɏ to
3V3 Suspend.
LPC Mode: SUS_STAT# indicates imminent suspend operation. It is used to
notify LPC devices that a low power state will be entered soon. LPC devices may
need to preserve memory or isolate outputs during the low power state.
ESPI Mode: eSPI Reset, Reset the eSPI interface for both master and slaves.
eSPI Reset# is typically driven from eSPI master to eSPI slaves.
ESPI_EN# B47 I CMOS NA PU 20Kƻ to logic high.
PU 20Kɏ to
3V3 Suspend.
This signal is used by the Carrier to indicate the operating mode of the LPC/eSPI
bus. If left unconnected on the carrier, LPC mode (default) is selected. If pulled
to GND on the carrier, eSPI mode is selected. This signal is pulled to a logic high
on the module through a resistor. The Carrier should only float this line or pull it
BIOS_DIS0# A34 PU 10Kƻ to 3V3 Suspend.
PU 10Kɏ to
3V3 Suspend.
BIOS_DIS1# B88 PU 10Kƻ to 3V3 Suspend.
PU 10Kɏ to
3V3 Suspend.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 (SPI_3VDU) PU/PD Module Base Specification R3.0
SPI_CS# B97 O CMOS
3.3V Suspend / 3.3V
1.8V Suspend / 3.3V
Chip select for Carrier Board SPI - may be sourced from chipset SPI0 or SPI1
SPI_MISO A92 I CMOS
3.3V Suspend / 3.3V
1.8V Suspend / 3.3V
Series resistor 33ɏ
Series resistor 33ƻ Data in to Module from Carrier SPI
SPI_MOSI A95 O CMOS
3.3V Suspend / 3.3V
1.8V Suspend / 3.3V
Data out from Module to Carrier SPI
SPI_CLK A94 O CMOS
3.3V Suspend / 3.3V
1.8V Suspend / 3.3V
Clock from Module to Carrier SPI
SPI_POWER A91 O
3.3V Suspend / 3.3V
1.8V Suspend / 3.3V
Power supply for Carrier Board SPI – sourced from Module – nominally 3.3V. The
Module shall provide a minimum of 100mA on SPI_POWER. Carriers shall use less
than 100mA of SPI_POWER. SPI_POWER shall only be used to power SPI devices
on the Carrier Board.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
SER0_TX A98 O CMOS-T 5V/12V General purpose serial port 0 transmitter
SER0_RX A99 I CMOS-T 5V/12V
PU 10
K
ɏ to 3.3
V
& isolate by Diode
General purpose serial port 0 receiver
SER1_TX /
CAN_TX
A101 O CMOS-T
5V/12V
3.3V/12V
General purpose serial port 1 transmitter
CAN TX output for CAN Bus channel 0.
SER1_RX /
CAN_RX
A102 I CMOS-T
5V/12V
3.3V/12V
PU 10Kɏ to 3.3V
& isolate by Diode
General purpose serial port 1 receiver
RX input for CAN Bus channel 0.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
I2C_CK B33
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kȟ to
3.3V Suspend
General purpose I2C port clock output
I2C_DAT B34
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kȟ to
3.3V Suspend
General purpose I2C port data I/O line
General Purpose Serial Interface Signals Descriptions
I2C Signal Descriptions
SPI Signals Descriptions
I CMOS NA
Selection straps to determine the BIOS boot device. The Carrier should only float
these or pull them low, please refer to 4.13 for strapping options of BIOS disable
signals.
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Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
SPKR B32 O CMOS 3.3V / 3.3V
Output for audio enunciator - the "speaker" in PC-AT systems. This port provides
the PC beep signal and is mostly intended for debugging purposes.
WDT B27 O CMOS 3.3V / 3.3V PD 100Kƻ to GND. Output indicating that a watchdog time-out event has occurred.
FAN_PWMOUT B101 O OD CMOS 3.3V / 12V
RSV PD 100Kɏ to GND
Fan speed control. Uses the Pulse Width Modulation (PWM) technique to control
the fan's RPM.
FAN_TACHIN B102 I OD CMOS 3.3V / 12V
PU 47Kɏ to 3.3V PU 47Kɏ to 3.3V
Fan tachometer input for a fan with a two pulse output.
TPM_PP A96 I CMOS 3.3V / 3.3V PD to GND.
PD 100Kɏ to GND.
Trusted Platform Module (TPM) Physical Presence pin. Active high. TPM chip has
an internal pull down. This signal is used to indicate Physical Presence to the
TPM.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
PWRBTN# B12 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
PU 10Kɏ to
3.3V Suspend
A falling edge creates a power button event. Power button events can be used to
bring a system out of S5 soft off and other suspend states, as well as powering
the system down.
SYS_RESET# B49 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
PU 10Kƻ to
3.3V Suspend
Reset button input. Active low request for Module to reset and reboot. May be
falling edge sensitive. For situations when SYS_RESET# is not able to reestablish
control of the system, PWR_OK or a power cycle may be used.
CB_RESET# B50 O CMOS 3.3V Suspend/3.3V
PD 100Kɏ to GND
Reset output from Module to Carrier Board. Active low. Issued by Module chipset
and may result from a low SYS_RESET# input, a low PWR_OK input, a VCC_12V
power input that falls below the minimum specification, a watchdog timeout, or
may be initiated by the Module software.
PWR_OK B24 I CMOS 3.3V / 3.3V PU to 3.3V PU to 3.3V
Power OK from main power supply. A high value indicates that the power is good.
This signal can be used to hold off Module startup to allow Carrier based FPGAs
or other configurable devices time to be programmed.
SUS_STAT# B18 O CMOS 3.3V Suspend / 3.3V
Indicates imminent suspend operation; used to notify LPC devices. Not used in
eSPI implementations.
SUS_S3# A15 O CMOS 3.3V Suspend/3.3V PD 100K
ƻ to GND
Indicates system is in Suspend to RAM state. Active low output. An inverted copy
of SUS_S3# on the Carrier Board may be used to enable the non-standby power
on a typical ATX supply.
SUS_S4# A18 O CMOS 3.3V Suspend/3.3V PD 100Kƻ to GND Indicates system is in Suspend to Disk state. Active low output.
SUS_S5# A24 O CMOS 3.3V Suspend/3.3V PD 100Kƻ to GND Indicates system is in Soft Off state.
WAKE0# B66 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend PCI Express wake up signal.
WAKE1# B67 I CMOS 3.3V Suspend/3.3V PU 10Kƻ to 3.3V Suspend
General purpose wake up signal. May be used to implement wake-up on PS2
keyboard or mouse activity.
BATLOW# A27 I CMOS 3.3V Suspend/ 3.3V PU 10Kƻ to 3.3V Suspend
PU 10Kƻ to
3.3V Suspend
Indicates that external battery is low. This port provides a battery-low signal to
the Module for orderly transitioning to power saving or power cut-off ACPI
modes. In a type 7 system, BATLOW# can be used as a power fail indication.
LID# A103 I OD CMOS 3.3V Suspend/12V PU 47Kƻ to 3.3V Suspend
PU 47Kƻ to 3.3V Suspend
& isolate by Diode
LID switch. Low active signal used by the ACPI operating system for a LID switch.
SLEEP# B103 I OD CMOS 3.3V Suspend/12V PU 47K
ƻ to 3.3V Suspend
PU 47Kƻ to 3.3V Suspend
& isolate by Diode
Sleep button. Low active signal used by the ACPI operating system to bring the
system to sleep state or to wake it up again.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
RAPID_SHUTDOWN C67 I CMOS 5.0V Suspend / 5.0V
Trigger for Rapid Shutdown. Must be driven to 5V though a <=50 ohm source
impedance for ೈ 20 μs.
Miscellaneous Signal Description
s
Power and System Management Signals Descriptions
Rapid Shutdown Signals Descriptions
PU 2.2Kƻ to
3.3V Suspend
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Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
THRM# B35 I CMOS 3.3V / 3.3V
IPU 10Kɏ to 3.3V
Input from off-Module temp sensor indicating an over-temp situation.
THRMTRIP# A35 O CMOS 3.3V / 3.3V Active low output indicating that the CPU has entered thermal shutdown.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
SMB_CK B13
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kɏ to
3.3V Suspend
System Management Bus bidirectional clock line.
Thermal Protection Signals Description
s
SMBUS Signals Descriptions
SMB_DAT B14
I/O OD
CMOS
3.3V Suspend/3.3V PU 2.2Kƻ to 3.3V Suspend
PU 2.2Kɏ to
3.3V Suspend
System Management Bus bidirectional data line.
SMB_ALERT# B15 I CMOS 3.3V Suspend/3.3V
PU 2.2Kɏ to
3.3V Suspend
System Management Bus Alert – active low input can be used to generate an
SMI# (System Management Interrupt) or to wake the system.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
GPO0 A93
GPO1 B54
GPO2 B57
GPO3 B63
GPI0 A54
PU 47Kɏ to 3.3V
GPI1 A63
PU 47Kɏ to 3.3V
GPI2 A67
PU 47Kɏ to 3.3V
GPI3 A85
PU 47Kɏ to 3.3V
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD Module Base Specification R3.0
VCC_12V
A104~A109
B104~B109
C104~C109
D104~D109
Power
Primary power input: +12V nominal. All available VCC_12V pins on the
connector(s) shall be used.
VCC_5V_SBY B84~B87 Power
Standby power input: +5.0V nominal. If VCC5_SBY is used, all available
VCC_5V_SBY pins on the connector(s) shall be used. Only used for standby and
suspend functions. May be left unconnected if these functions are not used in the
system design.
VCC_RTC A47 Power Real-time clock circuit-power input. Nominally +3.0V.
Power and GND Signal Descriptions
GPIO Signals Descriptions
O CMOS 3.3V / 3.3V
General purpose output pins. Upon a hardware reset, these outputs should be
low.
I CMOS 3.3V / 3.3V General purpose input pins. Pulled high internally on the Module.
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GND
A1, A11, A21, A31,
A38, A41, A51, A57,
A60, A66, A70, A73,
A76, A79, A80, A83,
A90, A100, A110, B1,
B11, B21 ,B31, B38,
B41, B51, B60, B70,
B73, B76, B79, B80,
B83, B90, B100, B110,
C1, C2, C5, C8, C11,
C14, C18, C21, C25,
C28, C31, C41, C44,
C48, C51, C60, C70,
C73, C76, C80, C84,
C87, C90, C93, C96,
C100, C103, C110,
D1, D2, D5, D8, D11,
D14, D18, D21, D25,
D28, D31, D41, D44,
D48, D51, D60, D67,
D70, D73, D76, D80,
D84, D87, D90, D93,
D96, D100, D103,
Power
Ground - DC power and signal and AC signal return path.
All available GND connector pins shall be used and tied to Carrier Board GND
plane.
Signal Pin# Pin Type Pwr Rail /Tolerance COMe SPEC PU/PD DV970 PU/PD (T7) Module Base Specification R3.0
TYPE0# C54 PDS
PD 0ɏ to GND
TYPE1# C57 PDS N.C.
TYPE2# D57 PDS
PD 0ɏ to GND
Module type Signal Descriptions
The TYPE pins indicate to the Carrier Board the Pin-out Type that is implemented
on the Module. The pins are tied on the Module to either ground (GND) or are
no-connects (NC). For Pin-out Type 1 and Type 10, these pins are not present
(X).
TYPE2# TYPE1# TYPE0#
X X X pin out Type 1 (deprecated)
NC NC NC pin out Type 2 (deprecated)
NC NC GND pin out Type 3 (no IDE) (deprecated)
NC GND NC pin out Type 4 (no PCI) (deprecated)
NC GND GND pin out Type 5 (no IDEˣPCI) (deprecated)
GND NC NC pin out Type 6 (no IDE, no PCI)
GND NC GND pin out Type 7 *
The Carrier Board should implement combinatorial logic that monitors the Module
TYPE pins and keeps power off (e.g deactivates the ATX_ON signal for an ATX
power supply) if an incompatible Module pin out type is detected. The Carrier
Board logic may also implement a fault indicator such as an LED.
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TYPE10# A97 PDS N.C.
Dual use pin. Indicates to the Carrier Board that a Type 10 Module is installed.
Indicates to the Carrier that a Rev 1.0 or a Rev 2.0/3.0 Module is installed.
TYPE10#
NC Pin-out R2.0
PD Pin-out Type 10 pull down to ground with 47K resistor
12V Pin-out R1.0
This pin is reclaimed from the VCC_12V pool. In R1.0 Modules this pin will
connect to other VCC_12V pins. In R2.0 this pin is defined as a no connect for
types 1-6. In R3.0 this pin is defined as a no connect for types 6 and 7. A Carrier
can detect a R1.0 Module by the presence of 12V on this pin. R2.0 Module types
1-6 will no connect this pin. R3.0 Module types 6 and 7 will no connect this pin.
Type 10 Modules shall pull this pin to ground through a 47K resistor.
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Standby Power LED
Standby
Power LED
This LED will light when module board has suspend power rail.
Cooling Option
Heat Sink with Fan
• “1” denotes the location of the thermal pad designed to contact the corresponding components on DV970.
Important:
Remove the plastic covering from the thermal pads prior to mounting the heat sink
onto DV970.
Note:
The system board used in the following illustrations may not resemble the actual
board. These illustrations are for reference only.
Top View of the Heat Sink
Bottom View of the Heat Sink
1
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Installing DV970 onto a Carrier Board
Important:
The carrier board used in this section is for reference purpose only and may not
resemble your carrier board. These illustrations are mainly to guide you on how to
install DV970 onto the carrier board of your choice.
1. Grasp DV970 by its edges and position it on top of the carrier board with its mounting
holes aligned with the standoffs on the carrier board. This helps align the COM Express
connectors of the two boards to each other.
COM Express connectors on
DV970
COM Express connectors on the
carrier board
2. Apply firm even pressure to the side with the connectors first and push down the entire
board. You will hear a “click”, indicating the module is correctly seated in the COM Express connectors of the carrier board.
Note:
The illustrations above show the pressing points of the module onto the carrier board.
Be careful when pressing the module, it may damage the socket.
Pressing
points
BIOS ROM socket
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4. Connect the heat sink and fan’s cable to the fan connector on DV970.
Fan connector
3. Install a heat sink onto the DV970 with the carrier board. First align the mounting holes of
the heat sink with the mounting holes of the module.
3
4
2
5
1
Side View of the Heat sink, Module, and Carrier Board
Carrier board
Heat sink
DV970
Note:
Install the heat sink according to the sequence of the screws shown in the image
above to avoid damages to the CPU.
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