This publication contains information that is protected by copyright. No part of it may be reproduced in any form or by any means or used to make any transformation/adaptation without
the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no
representations or warranties with respect to the contents or use of this manual and specifically disclaims any express or implied warranties of merchantability or fitness for any particular
purpose. The user will assume the entire risk of the use or the results of the use of this document. Further, the manufacturer reserves the right to revise this publication and make changes
to its contents at any time, without obligation to notify any person or entity of such revisions
or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification.
http://www.picmg.org/
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
Appendix B - Watchdog Sample Code ................................................78
Appendix C - System Error Message ...................................................79
Appendix D - Troubleshooting ................................................................80
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About this Manual
Static Electricity Precautions
An electronic file of this manual is included in the CD. To view the user’s manual in the CD, insert the CD into a CD-ROM drive. The autorun screen (Main Board Utility CD) will appear. Click
“User’s Manual” on the main menu.
Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circumstances, attempt to perform service, adjustments or repairs on the product, whether in or
out of warranty. It must be returned to the purchase point, factory or authorized service
agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the
product that has been modified or altered.
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are
ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts
or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other components. Perform the upgrade instruction procedures described at an ESD workstation only. If such a station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system
chassis throughout any procedures requiring ESD protection.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servicing. After installation or servicing, cover the system chassis before plugging the power
cord.
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www.dfi .comChapter 1 Introduction
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• One CR960 board
• One DVD
• One QR (Quick Reference)
• Heat spreader with heat sink and fan
Optional Items
• COM331-B carrier board kit
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
Before using the system board, prepare basic system components.
If you are installing the system board in a new system, you will need at least the following
internal components.
• Storage devices such as hard disk drive, CD-ROM, etc.
You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
• Supports 4 USB 3.0 ports
• Supports 8 USB 2.0 ports
• Supports 1 PCIe x16 interface
• Supports 7 PCIe x1 interfaces
• Supports LPC interface
• Supports I
• Supports SMBus interface
• Supports 2 serial interfaces (TX/RX)
• Supports 4-bit input and 4-bit output GPIO
2
C interface
Audio
SSD
(optional)
Trusted
Platform
Module - TPM
(optional)
Watchdog
Timer
BIOS
Power
Consumption
OS Support
Temperature
Humidity
Power
PCB
• Supports High Defi nition Audio interface
• 2GB/4GB/8GB/16GB/32GB/64GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
• Watchdog timeout programmable via software from 1 to 255 seconds
• 64Mbit SPI BIOS
• TBD
• Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
• 0oC to 60oC
• 5% to 90%
• Input: 5VSB (optional), 12V, VCC_RTC
• Dimensions: 95mm (3.74") x 125mm (4.9")
• Compliance: PICMG COM Express
®
R2.1 basic form factor, Type 6
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Chapter 1
Features
• Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set
time interval. If the system hangs or fails to function, it will reset at the set time interval so
that your system will continue to operate.
• DDR3
DDR3 delivers increased system bandwidth and improved performance. The advantages of
DDR3 are its higher bandwidth and its increase in performance at a lower power than DDR2.
• Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance
and features to meet business needs. It provides excellent video and 3D graphics with outstanding graphics responsiveness. These enhancements deliver the performance and compatibility needed for today’s and tomorrow’s business applications. Supports VGA, LVDS and DDI
(HDMI, DVI and DisplayPort) for up to 3 display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of
up to 3Gb/s (SATA 2.0) and 6Gb/s (SATA 3.0), it improves hard drive performance faster than
the standard parallel ATA whose data transfer rate is 100MB/s.
• Gigabit LAN
The Intel® 82579LM Gigabit LAN controller supports up to 1Gbps data transmission.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmission speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)
and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces
power consumption, and is backward compatible with USB 2.0. It is a marked improvement
in device transfer speeds between your computer and a wide range of simultaneously
accessible external Plug and Play peripherals.
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Chapter 2 - Concept
COM Express Module Standards
The figure below indicates the dimensions of the different types of COM Express modules.
CR960-QM77/HM76 is a COM Express Basic. The dimension is 95mm x 125mm.
Common for all Form Factors
Extended only
Basic only
Compact only
Compact and Basic only
Mini only
Chapter 2
106.00
Extended
91.00
18.00
6.00
0.00
4.00
0.00
16.50
Mini
9
74.20
80.00
91.00
BasicCompact
70.00
51.00
4.00
121.00
151.00
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Chapter 2
/
/
/
Specification Comparison Table
The table below shows the COM Express standard specifications and the corresponding specifications supported on the CR960-QM77/HM76 module.
Side View of the Module with Heat Sink and Carrier Board
Bottom View
14.00
2.00
0.00
0.00
70.20
13
12.50
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Chapter 3
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in
boards, and other components. Perform installation procedures at an ESD workstation
only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chassis. If
a wrist strap is unavailable, establish and maintain contact with the system chassis
throughout any procedures requiring ESD protection.
System Memory
The system board is equipped with two 204-pin SODIMM sockets that support DDR3L(1.35V)
memory modules; depends on CPU supported. However, DDR3L memory module can run at
1.5V.
Important:
When the Standby Power LED lit red, it indicates that there is power on the board.
Power-off the PC then unplug the power cord prior to installing any devices. Failure to
do so will cause severe damage to the board and components.
DDR3_2
Installing the DIMM Module
Note:
The system board used in the following illustrations may not resemble the actual one.
These illustrations are for reference only.
1. Make sure the PC and all other peripheral devices connected to it has been powered down.
2. Disconnect all power cords and cables.
3. Locate the SODIMM socket on the system board.
4. Note the key on the socket. The key ensures the module can be plugged into the socket in
only one direction.
Standby
Power LED
DDR3_1
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Chapter 3
5. Grasping the module by its edges, align the module into the socket at an approximately 30
degrees angle. Apply firm even pressure to each end of the module until it slips down into
the socket. The contact fingers on the edge of the module will almost completely disappear
inside the socket.
6. Push down the module until the clips at each end of the socket lock into position. You will
hear a distinctive “click”, indicating the module is correctly locked into position.
Clip
Clip
Connectors
CPU Fan Connector
Sense
+12V
Ground
Connect the CPU fan’s cable connector to the CPU fan connector on the board. The cooling fan
will provide adequate airflow throughout the chassis to prevent overheating the CPU and board
components.
BIOS Setting
“Module Board H/W Monitor” submenu in the Advanced menu of the BIOS will display the current speed of the cooling fan. Refer to chapter 4 of the manual for more information.
1
3
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Chapter 3
COM Express Connectors
The COM Express connectors are used to interface the CR960-QM77/HM76 COM Express board
to a carrier board. Connect the COM Express connectors (lcoated on the solder side of the
board) to the COM Express connectors on the carrier board.
Refer to the “Installing CR960-QM77/HM76 onto a Carrier Board” section for more information.
COM Express Connectors
Refer to the following pages for the pin functions of these connectors.
Pin Types
I Input to the Module
O Output from the Module
I/O Bi-directional input / output signal
OD Open drain output
C97/HDA Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCR960Carrier BoardDescription
AC/HAD_RST#A30O CMOS3.3V Suspend/3.3VConnect to CODEC pin 11 RESET#Reset output to CODEC, active low.
AC/HDA_SYNCA29O CMOS3.3V/3.3VPU 1K to 3.3VSBConnect to CODEC pin 10 SYNCSample-synchronization signal to the CODEC(s).
AC/HDA_BITCLKA32I/O CMOS3.3V/3.3VConnect to CODEC pin 6 BIT_CLKSerial data clock generated by the external CODEC(s).
AC/HDA_SDOUTA33O CMOS3.3V/3.3VConnect to CODEC pin 5 SDATA_OUTSerial TDM data output to the CODEC.
AC/HDA_SDIN2B28I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC2 pin 8 SDATA_IN
AC/HDA_SDIN1B29I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC1 pin 8 SDATA_IN
AC/HDA_SDIN0B30I/O CMOS3.3V Suspend/3.3VConnect 33 ƻ in series to CODEC0 pin 8 SDATA_IN
Gigabit Ethernet Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCR960Carrier BoardDescription
GBE0_MDI0+A13I/O Analog3.3V max Suspend
GBE0_MDI0-A12I/O Analog3.3V max Suspend
GBE0_MDI1+A10I/O Analog3.3V max Suspend
GBE0_MDI1-A9I/O Analog3.3V max Suspend
GBE0_MDI2+A7I/O Analog3.3V max Suspend
GBE0_MDI2-A6I/O Analog3.3V max Suspend
GBE0_MDI3+A3I/O Analog3.3V max Suspend
GBE0_MDI3-
GBE0_ACT#B2OD CMOS3.3V Suspend/3.3V
GBE0_LINK#A8OD CMOS3.3V Suspend/3.3VNCGigabit Ethernet Controller 0 link indicator, active low.
GBE0_LINK100#A4OD CMOS3.3V Suspend/3.3V
GBE0_LINK1000#A5OD CMOS3.3V Suspend/3.3V
SATA Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCR960Carrier BoardDescription
SATA0_TX+A16O SATAAC coupled on Module AC Coupling capacitor
SATA0_TX-A17O SATAAC coupled on Module AC Coupling capacitor
SATA0_RX+A19I SATAAC coupled on Module AC Coupling capacitor
SATA0_RX-A20I SATAAC coupled on Module AC Coupling capacitor
SATA1_TX+B16O SATAAC coupled on Module AC Coupling capacitor
SATA1_TX-B17O SATAAC coupled on Module AC Coupling capacitor
SATA1_RX+B19I SATAAC coupled on Module AC Coupling capacitor
SATA1_RX-B20I SATAAC coupled on Module AC Coupling capacitor
SATA2_TX+A22O SATAAC coupled on Module AC Coupling capacitor
SATA2_TX-A23O SATAAC coupled on Module AC Coupling capacitor
SATA2_RX+A25I SATAAC coupled on Module AC Coupling capacitor
SATA2_RX-A26I SATAAC coupled on Module AC Coupling capacitor
SATA3_TX+B22O SATAAC coupled on Module AC Coupling capacitor
SATA3_TX-B23O SATAAC coupled on Module AC Coupling capacitor
SATA3_RX+B25I SATAAC coupled on Module AC Coupling capacitor
SATA3_RX-B26I SATAAC coupled on Module AC Coupling capacitor
ATA_ACT#A28I/O CMOS3.3V / 3.3VPU 10K to 3.3V
2I
O Analog3.3V max Suspend
Connect to Magnetics Module MDI0+/-
Connect to Magnetics Module MDI1+/-
Connect to Magnetics Module MDI2+/-
Connect to Magnetics Module MDI3+/Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Connect to LED and recommend current limit
resistor 150ȟ to 3.3VSB
Connect to SATA0 Conn TX pin
Connect to SATA0 Conn RX pin
Connect to SATA1 Conn TX pin
Connect to SATA1 Conn RX pin
Connect to SATA2 Conn TX pin
Connect to SATA2 Conn RX pin
Connect to SATA3 Conn TX pin
Connect to SATA3 Conn RX pin
Connect to LED and recommend current limit
resistor 220ƻ to 3.3V
Serial TDM data inputs from up to 3 CODECs.
Gigabit Ethernet Controller 0: Media Dependent Interface Differential
Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec
modes. Some pairs are unused in some modes, per the following:
1000BASE-T 100BASE-TX 10BASE-T
MDI[0]+/- B1_DA+/- TX+/- TX+/ MDI[1]+/- B1_DB+/- RX+/- RX+/ MDI[2]+/- B1_DC+/ MDI[3]+/- B1_DD+/-
Gigabit Ethernet Controller 0 activity indicator, active low.
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
Serial ATA or SAS Channel 0 transmit differential pair.
Serial ATA or SAS Channel 0 receive differential pair.
Serial ATA or SAS Channel 1 transmit differential pair.
Serial ATA or SAS Channel 1 receive differential pair.
Serial ATA or SAS Channel 2 transmit differential pair.
Serial ATA or SAS Channel 2 receive differential pair.
Serial ATA or SAS Channel 3 transmit differential pair.
Serial ATA or SAS Channel 3 receive differential pair.
ATA (parallel and serial) or SAS activity indicator, active low.
(Optional with on board LAN, Default setting as NC)
PCI Express Differential Receive Pairs 7
(Optional with on board LAN, Default setting as NC)
Reference clock output for all PCI Express and PCI Express Graphics
lanes.
PCI Express Graphics lane reversal input strap. Pull low on the Carrier
board to reverse lane order.
PCI ExpressCard: PCI Express capable card request, active low, one per
card
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Chapter 3
/
s
DDI Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCR960Carrier BoardDescription
DDI1_PAIR0+/SDVO1_RED+D26Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR0DDI1_PAIR1+/SDVO1_GRN+D29Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR1-/SDVO1_GRN-D30Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2+/SDVO1_BLU+D32Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR2-/SDVO1_BLU-D33Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3+/SDVO1_CK+D36Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR3-/SDVO1_CK-D37Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4+/SDVO1_INT+C25Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR4-/SDVO1_INT-C26Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR5+/SDVO1_TVCLKIN+C29Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR5-/SDVO1_TVCLKIN-C30Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR6+/SDVO1_FLDSTALL+C15Connect AC Coupling Capacitors 0.1uF to Device
DDI1_PAIR6-/SDVO1_FLDSTALL-C16Connect AC Coupling Capacitors 0.1uF to Device
DDI1_CTRLCLK_AUX+/SDVO1_CTRLCLK D15
DDI1_CTRLCLK_AUX-/SDVO1_CTRLDATA
DDI1_HPDC24I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect
DDI1_DDC_AUX_SELD34I CMOS3.3V / 3.3VPD 1MPU 100K to 3.3V for DDC(HDMI/DVI)
DDI2_PAIR0+D39Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR0-D40Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1+D42Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR1-D43Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2+D46Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR2-D47Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3+D49Connect AC Coupling Capacitors 0.1uF to Device
DDI2_PAIR3-D50Connect AC Coupling Capacitors 0.1uF to Device
DDI2_CTRLCLK_AUX+C32
DDI2_CTRLCLK_AUX-C33
SDVO1_RED-D27Connect AC Coupling Capacitors 0.1uF to Device
D16
O PCIEAC coupled off ModuleDDI 1 Pair 0 differential pairs/Serial Digital Video B red output differential pair
O PCIEAC coupled off ModuleDDI 1 Pair 1 differential pairs/Serial Digital Video B green output differential pair
O PCIE
O PCIEAC coupled off ModuleDDI 1 Pair 3 differential pairs/Serial Digital Video B clock output differential pair.
I PCIE
I PCIEAC coupled off ModuleSerial Digital Video TVOUT synchronization clock input differential pair.
I PCIE
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 2 Pair 1 differential pairs
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 2 Pair 3 differential pairs
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
AC coupled off ModuleDDI 1 Pair 2 differential pairs/Serial Digital Video B blue output differential pair
AC coupled off Module
AC coupled off ModuleSerial Digital Video Field Stall input differential pair.
PD 49.9K to GND
(S/W IC between
Rpd/PCH)
PU 2.2K to 3.3V, PD
49.9K to GND
(S/W IC between
2.2K/49.9K resistor)
PU 100K to 3.3V
(S/W IC between
Rpu/PCH)
PU 2.2K to 3.3V/PU
100K to 3.3V
(S/W IC between
2.2K/100K resistor)
PD 49.9K to GND
(S/W IC between
Rpd/PCH)
PU 2.2K to 3.3V, PD
49.9K to GND
(S/W IC between
2.2K/49.9K resistor)
PU 100K to 3.3V
(S/W IC between
Rpu/PCH)
PU 2.2K to 3.3V/PU
100K to 3.3V
(S/W IC between
2.2K/100K resistor)
Connect to DP AUX+DP AUX+ function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI1_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI1_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI1_DDC_AUX_SEL is pulled high
Connect to DP AUX+DP AUX+ function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI2_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI2_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI2_DDC_AUX_SEL is pulled high
Serial Digital Video B interrupt input differential pair.
Selects the function of DDI1_CTRLCLK_AUX+ and DDI1_CTRLDATA_AUX-.
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
DDI2_HPDD44I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect
Selects the function of DDI2_CTRLCLK_AUX+ and DDI2_CTRLDATA_AUX-.
DDI2_DDC_AUX_SELC34I CMOS3.3V / 3.3VPD 1M to GNDPU 100K to 3.3V for DDC(HDMI/DVI)
DDI3_PAIR0+C39Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR0-C40Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR1+C42Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR1-C43Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR2+C46Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR2-C47Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR3+C49Connect AC Coupling Capacitors 0.1uF to Device
DDI3_PAIR3-C50Connect AC Coupling Capacitors 0.1uF to Device
DDI3_CTRLCLK_AUX+C36
DDI3_CTRLCLK_AUX-C37
DDI3_HPDC44I CMOS3.3V / 3.3VPD 1M and Connect to device Hot Plug Detect DDI Hot-Plug Detect
DDI3_DDC_AUX_SELC38I CMOS3.3V / 3.3VPD 1M to GNDPU 100K to 3.3V for DDC(HDMI/DVI)
O PCIEAC coupled off ModuleDDI 3 Pair 0 differential pairs
O PCIEDDI 3 Pair 1 differential pairs
O PCIEAC coupled off Module
O PCIEAC coupled off ModuleDDI 3 Pair 3 differential pairs
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
I/O PCIEAC coupled on Module
I/O OD CMOS 3.3V / 3.3V
AC coupled off Module
PD 49.9K to GND
(S/W IC between
Rpd/PCH)
PU 2.2K to 3.3V, PD
49.9K to GND
(S/W IC between
2.2 k/49.9K resistor)
PU 100K to 3.3V
(S/W IC between
Rpu/PCH)
PU 2.2K to 3.3V/PU
100K to 3.3V
(S/W IC between
2.2K/100K resistor)
Connect to DP AUX+DP AUX+ function if DDI3_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLCLKHDMI/DVI I2C CTRLCLK if DDI3_DDC_AUX_SEL is pulled high
Connect to DP AUX-DP AUX- function if DDI3_DDC_AUX_SEL is no connect
Connect to HDMI/DVI I2C CTRLDATAHDMI/DVI I2C CTRLDATA if DDI3_DDC_AUX_SEL is pulled high
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
DDI 3 Pair 2 differential pairs
Selects the function of DDI3_CTRLCLK_AUX+ and DDI3_CTRLDATA_AUX-.
DDI[n]_DDC_AUX_SEL shall be pulled to 3.3V on the Carrier with a 100K Ohm
resistor to configure the DDI[n]_AUX pair as the DDC channel.
Carrier DDI[n]_DDC_AUX_SEL should be connected to pin 13 of the DisplayPort
USB_0_1_OC#B44I CMOS3.3V Suspend/3.3VPU 10k to 3.3VSB Connect to Overcurrent of USB Power Switch
USB_2_3_OC#A44I CMOS3.3V Suspend/3.3VPU 10k to 3.3VSB Connect to Overcurrent of USB Power Switch
USB_4_5_OC#B38I CMOS3.3V Suspend/3.3VPU 10k to 3.3VSB Connect to Overcurrent of USB Power Switch
USB_6_7_OC#A38I CMOS3.3V Suspend/3.3VPU 10k to 3.3VSB Connect to Overcurrent of USB Power Switch
USB_SSTX0+D4AC Coupling capacitor
USB_SSTX0-D3AC Coupling capacitor
USB_SSRX0+C4
USB_SSRX0-C3
USB_SSTX1+D7AC Coupling capacitor
USB_SSTX1-D6AC Coupling capacitor
USB_SSRX1+C7
USB_SSRX1-C6
USB_SSTX2+D10AC Coupling capacitor
USB_SSTX2-D9AC Coupling capacitor
USB_SSRX2+C10
USB_SSRX2-C9
USB_SSTX3+D13AC Coupling capacitor
USB_SSTX3-D12AC Coupling capacitor
USB_SSRX3+C13
USB_SSRX3-C12
I/O USB3.3V Suspend/3.3VUSB differential pairs 6
I/O USB3.3V Suspend/3.3V
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off Modul
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.
O PCIEAC coupled on ModuleAdditional transmit signal differential pairs for the SuperSpeed USB data path.
I PCIEAC coupled off ModulAdditional receive signal differential pairs for the SuperSpeed USB data path.
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
Connect 90ಳ @100MHz Common Choke in series
and ESD suppressors to GND to USB connector
USB differential pairs 7, USB7 may be configured as a USB client or as a host, or both, at the
Module designer's discretion.(CR901-B default set as a host)
USB over-current sense, USB channels 0 and 1. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
pull this line high on the Carrier Board.
USB over-current sense, USB channels 2 and 3. A
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 4 and 5. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
USB over-current sense, USB channels 6 and 7. A pull-up for this line
shall be present on the Module. An open drain driver from a USB
current monitor on the Carrier Board may drive this line low. Do not
ull this line high on the Carrier Board.
Additional receive signal differential pairs for the SuperSpeed USB data path.
LVDS_BKLT_CTRLB83O CMOS3.3V / 3.3VPD 100K to GND
LVDS_I2C_CKA83I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to DDC clock of LVDS panelI2C clock output for LVDS display use
LVDS_I2C_DATA84I/O OD CMOS 3.3V / 3.3VPU 2.2K to 3.3VConnect to DDC data of LVDS panelI2C data line for LVDS display use
LPC Signals Description
SignalPin#Pin TypePwr Rail /ToleranceCR960Carrier BoardDescription
LPC_AD0B4
LPC_AD1B5
LPC_AD2B6
LPC_AD3B7
LPC_FRAME#B3O CMOS3.3V / 3.3VLPC frame indicates the start of an LPC cycle
LPC_DRQ0#B8
LPC_DRQ1#B9
LPC_SERIRQA50I/O CMOS3.3V / 3.3VPU 10K to 3.3VLPC serial interrupt
LPC_CLKB10O CMOS3.3V / 3.3VLPC clock output - 33MHz nominal
O LVDSLVDSConnect to LVDS connector
O LVDSConnect to LVDS connector
O LVDSLVDS
O LVDSLVDS
O LVDSLVDSConnect to LVDS connector
O LVDSLVDSConnect to LVDS connector
O LVDS
O LVDSLVDSConnect to LVDS connector
O LVDSLVDSConnect to LVDS connector
I/O CMOS3.3V / 3.3V
I CMOS
LVDS
Connect to LVDS connector
Connect to LVDS connector
LVDS
3.3V / 3.3VLPC serial DMA request
Connect to LVDS connector
Connect to enable control of LVDS
Connect to enable control of LVDS panel backlight
Connect to brightness control of LVDS panel
circuit
ower circuit.
ht power circuit.
backli
Connect to LPC device
anel power
LVDS Channel A differential pairs
Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_A_CK+/-,
LVDS_B_CK+/-) shall have 100ƻ terminations across the pairs at the destination. These
terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer
on-board
LVDS Channel A differential clockO LVDSLVDSConnect to LVDS connector
LVDS Channel B differential pairs
Ther LVDS flat panel differential pairs (LVDS_A[0:3]+/-, LVDS_B[0:3]+/-. LVDS_A_CK+/-,
LVDS_B_CK+/-) shall have 100ƻ terminations across the pairs at the destination. These
terminations may be on the Carrier Board if the Carrier Board implements a LVDS deserializer
on-board
LVDS Channel B differential clock
LVDS panel power enable
LVDS panel backlight enable
LVDS panel backlight brightness control
LPC multiplexed address, command and data bus
25
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