DFI AL9A3 User Manual

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AL9A3
COM Express Mini Module
User’s Manual
A44310830
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This publication contains information that is protected by copyright. No part of it may be re­produced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifi­cally disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this docu­ment. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.
© 2018. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express® Module Base Specification. http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason­able protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encour­aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli­ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
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Table of Contents
Copyright .............................................................................................................2
Trademarks ........................................................................................................2
COM Express Specification Reference ...................................................2
FCC and DOC Statement on Class B ..................................................... 2
Warranty ..............................................................................................................4
Static Electricity Precautions ......................................................................4
Safety Measures ..............................................................................................4
About the Package .........................................................................................5
Optional Items..................................................................................................5
Before Using the System Board ...............................................................5
Chapter 1 - Introduction .............................................................................6
Specifications ................................................................................................6
Features ..........................................................................................................7
Chapter 2 - Concept .......................................................................8
COM Express Module Standards .............................................................. 8
Specification Comparison Table ...............................................................9
Chapter 3 - Hardware Installation ...............................................10
Board Layout ...............................................................................................10
Block Diagram ............................................................................................. 10
Mechanical Diagram ..................................................................................11
System Memory .......................................................................................... 12
Connectors ...................................................................................................13
COM Express Connector .............................................................................13
COM Express Connector Signal Discription ..................................................16
Cooling Option ............................................................................................22
Heat Sink ...................................................................................................22
Installing AL9A3 onto a Carrier Board .................................................22
Installing the COM Express Debug Card ............................................. 23
Chapter 4 - BIOS Setup ............................................................... 26
Overview.......................................................................................................26
AMI BIOS Setup Utility .............................................................................27
Main .........................................................................................................27
Advanced .................................................................................................. 27
Security .................................................................................................... 34
Boot ......................................................................................................... 35
Save & Exit ............................................................................................... 36
Updating the BIOS ....................................................................................37
Notice: BIOS SPI ROM .............................................................................37
Chapter 5 - Supported Software ...........................................................38
Chapter 6 - GPIO Programming Guide...............................................45
Appendix A - Watchdog Sample Code................................................46
Appendix B - System Error Message ...................................................47
Appendix C - Troubleshooting ................................................................49
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Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, inability to use the product, unauthorized replacement or alteration of components and product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal­lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum­stances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in han­dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con­nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic­ing. After installation or servicing, cover the system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com­ponents. Perform the upgrade instruction procedures described at an ESD worksta­tion only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chas­sis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.
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About the Package
The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.
• 1 AL9A3 board
• 1 Heat sink
Optional Items
• COM100-B carrier board kit
• Heat spreader The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.
Before Using the System Board
Before using the system board, prepare basic system components. If you are installing the system board in a new system, you will need at least the following
internal components.
• Storage devices such as hard disk drive, etc. You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
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Chapter 1 - Introduction
Specifications
Chapter 1
SYSTEM Processor
Intel Atom® Processor E3900 Series, BGA 1296 Intel Atom
®
x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom
®
x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom
®
x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel
®
Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel
®
Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory 4GB/8GB Memory Down
Dual Channel DDR3L 1600MHz
BIOS AMI SPI 128Mbit (supports UEFI boot only)
GRAPHICS Controller Intel® HD Graphics
Feature OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display 1 x DDI (HDMI/DVI/DP++)
1 x LVDS/eDP LVDS: single channel 24-bit, resolution up to 1366x768 @ 60Hz HDMI: resolution up to 3840x2160 @ 30Hz DP++: resolution up to 4096x2160 @ 60Hz
eDP: resolution up to 3840x2160 @ 60Hz Dual Display
DDI + LVDS
DDI + eDP
EXPANSION Interface 4 x PCIe x1 (Gen 2)
1 x SDIO (available upon request)
1 x LPC
1 x I²C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
AUDIO Interface HD Audio ETHERNET Controller 1 x Intel® I210AT PCIe (10/100/1000Mbps) (0 to 60°C) or
1 x Intel
®
I210IT PCIe (10/100/1000Mbps) (-40 to 85°C)
I/O USB 2 x USB 3.0
8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s) SSD 1 x 4GB/8GB/16GB/32GB/64GB Onboard SSD (available upon request)
(SM611GXC-BD/64GB Read: 161.5 MB/s, Write 11.01 MB/s) GPIO 1 x 8-bit GPIO
WATCHDOG TIMER
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
POWER Type 4.75V~20V, 5VSB, VCC_RTC (ATX mode)
4.75V~20V, VCC_RTC (AT mode)
Consumption Typical: E3940: 12V @ 0.34A (4.08W)
Max.: E3940: 12V @ 1.62A (19.44W)
OS SUPPORT (UEFI ONLY)
Windows 10 IoT Enterprise 64-bit Ubuntu 15.10 (Intel
®
graphic driver available)
ENVIRONMENT Temperature Operating: 0 to 60°C/-40 to 85°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF 1,090,551 hrs @ 25°C; 509,776 hrs @ 45°C; 283,622 hrs @ 60°C
Calculation model: Telcordia Issue 2 Environment: GB, GC – Ground Benign, Controlled
MECHANICAL Dimensions COM Express® Mini
84mm (3.30") x 55mm (2.16")
Compliance PICMG COM Express
®
R2.1, Type 10
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Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.
DDR3L
DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher speed successor. DDR3L SDRAM modules support 1600MHz for DDR modules. DDR3L delivers increased system bandwidth and improved performance to provide its higher bandwidth and its increase in performance at a lower power.
Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with out­standing graphics responsiveness. These enhancements deliver the performance and compat­ibility needed for today’s and tomorrow’s business applications. Supports 1 x DDI (HDMI/DVI/ DP++) and 1 x LVDS/eDP interfaces for display outputs.
Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s.
Gigabit LAN
The Intel® I210AT Gigabit LAN controller or the Intel® I210IT Gigabit LAN controller supports up to 1Gbps data transmission.
USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis­sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.
Chapter 1
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Chapter 2
Chapter 2 - Concept
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules. AL9A3 is a COM Express Mini. The dimension is 84mm x 55mm.
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50
4.00
0.00
Extended
BasicCompact
Mini
74.20
80.00
91.00
121.00
151.00
Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only
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Chapter 2
Specification Comparison Table
The table below shows the COM Express standard specifications and the corresponding specifications supported on the AL9A3 module.
Module Pin-out - Required and Optional Features C-D Connector. PICMG® COM Express
®
Revision 2.1
Note:
• 5 Indicates 12V-tolerant features on former VCC_12V signals.
• 6 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.
Connector Feature
COM Express Module Base Specification Type 10
(Single Connector) Min / Max
DFI AL9A3
Type 10
A-B A-B PCI Express Lanes 0 - 5 1 / 4
4
A-B LVDS Channel A 0 / 1
1
A-B LVDS Channel B NA
NA
A-B eDP on LVDS CH A pins 0 / 1
1(option)
A-B VGA Port NA
NA
A-B TV-Out NA
NA
A-B DDI 0 0 / 1
1
A-B
5
Serial Ports 1 - 2 0 / 2
2
A-B CAN interface on SER1 0 / 1
1
A-B SATA / SAS Ports 1 / 2
2
A-B AC’97 / HDA Digital Interface 0 / 1
1
A-B USB 2.0 Ports 4 / 8
8
A-B USB Client 0 / 1
0
A-B USB 3.0 Ports 0 / 2
2
A-B LAN Port 0 1 / 1
1
A-B Express Card Support 0 / 2
2
A-B LPC Bus 1 / 1
1
A-B SPI 1 / 2
1
A-B
SDIO (muxed on GPIO) 0 / 1
1(option)
General Purpose I/O 8 / 8
8
A-B SMBus 1 / 1
1
A-B I2C 1 / 1
1
A-B Watchdog Timer 0 / 1
1
A-B Speaker Out 1 / 1
1
A-B External BIOS ROM Support 0 / 2
1
A-B Reset Functions 1 / 1
1
System I/O
System Management
A-B
6
Connector Feature
COM Express Module Base Specification Type 10
(Single Connector) Min / Max
DFI AL9A3
Type 10
A-B A-B Thermal Protection 0 / 1
1
A-B Battery Low Alarm 0 / 1
1
A-B Suspend/Wake Signals 0 / 3
3
A-B Power Button Support 1 / 1
1
A-B Power Good 1 / 1
1
A-B VCC_5V_SBY Contacts 4 / 4
4
A-B
5
Sleep Input 0 / 1
1
A-B
5
Lid Input 0 / 1
1
A-B
5
Fan Control Signals 0 / 2
2
A-B Trusted Platform Modules 0 / 1
0 A-B A-B VCC_12V Contacts 12 / 12
12
Power Management
Power
q p
Connector Feature
COM Express Module Base Specification Type 10
(Single Connector) Min / Max
DFI AL9A3
Type 10
C-D
PCI Express Lanes 16 - 31 NA
NA
PCI Express Graphics (PEG) NA
NA
Muxed SDVO Channels 1 - 2 NA
NA
PCI Express Lanes 6 - 15 NA
NA
PCI Bus - 32 Bit NA
NA
PATA Port NA
NA
LAN Ports 1 - 2 NA
NA
DDIs 1 - 3 NA
NA
USB 3.0 Ports NA
NA C-D C-D VCC_12V Contacts NA
NA
Power
System I/O
C-D
6
C-D
6
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Chapter 3
Chapter 3 - Hardware Installation
Board Layout
Top View
Bottom View
Block Diagram
EEPROM
USB 2.0 8x
SATA 3.0 2x
A / B
USB 2.0 8x
SATA 3.0 2x
Intel Atom
®
Processor
E3900 Series
Intel® I210
AT/IT
MDI
Channel A
DDI Port 0
DDI Port 0
HD Audio
LPC Bus
HD Audio
LPC Bus
WDT
I2C Bus 1, 2
Serial Port 1, 2
Fan PWM/
TACH IN
SLP/LID
S/
USB 3.0 2x
USB 3.0 2x
PCIe x1 4x
PCIe x1 4x
4GB/8GB DDR3L
Memory Down
Channel B
4GB/8GB DDR3L
Memory Down
SIC Bus 1, 2
SMBus
SMBus
8-bit GPIO
TCA6408A
SSD Chip
SATA Ports
eDP/DDI
(optional)
(p )
PTN3460
LVDS
(optional)
(p )
SPI Bus
SPI Bus
SPI BIOS
Embedded Controller
SDIO
MDI
PCIe x1
SMBus
bit GPIO8
-
T
SPI Flash BIOS
NXP PTN3460
Intel Atom
E3900 Series
DDR3L
DDR3L
DDR3L
DDR3L
Intel
I210AT or I210IT
DDR3L
DDR3L
DDR3L
DDR3L
iTE
IT8528VG
SSD (optional)
B110
B1
A110
A1
COM Express connector
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Chapter 3
Mechanical Diagram
AL9A3 Module with Heat Sink
Side View of the Module with Heat Sink and Carrier Board
AL9A3 Module
20.00
16.50
2.00
85.00
60.00
20.00
Standoff
Module PCB
Heatsink
Bottom View
Top View
84.00
55.00
80.00
51.00
4.00
0.00
0.00
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Chapter 3
System Memory
The system board is equipped with eight DDR3L memory chips onboard.
• 4GB/8GB DDR3L memory down
• Supports DDR3L 1600MHz
• Supports dual channel memory interface
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wear­ing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.
System Memory
Top View
DDR3L
Bottom View
DDR3L
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Chapter 3
Connectors
COM Express Connector
The COM Express connector is used to interface the AL9A3 COM Express board to a carrier board. Connect the COM Express connector (located on the solder side of the board) to the COM Express connector on the carrier board.
Refer to the “Installing AL9A3 onto a Carrier Board” section for more information.
Refer to the following pages for the pin functions of the connector.
COM Express Connector
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Chapter 3
COM Express Connector
A1 GND B1 GND A2 GBE_MDI3- B2 GBE_ACT# / 3.3V Suspend A3 GBE_MDI3+ B3 LPC_FRAME# A4 GBE_LED_100- / 3.3V Suspend B4 LPC_AD0 A5 GBE_LED_1000- / 3.3V Suspend B5 LPC_AD1 A6 GBE_MDI2- B6 LPC_AD2 A7 GBE_MDI2+ B7 LPC_AD3 A8 GBE_LED_LINK- / 3.3V Suspend B8 LPC_DRQ0# A9 GBE_MDI1- B9 LPC_DRQ1# A10 GBE_MDI1+ B10 LPC_CLK A11 GND B11 GND A12 GBE_MDI0- B12 PWRBTN# / 3.3V Suspend A13 GBE_MDI0+ B13 SMB_CK / 3.3V Suspend A14 NA B14 SMB_DAT / 3.3V Suspend A15 SUS_S3# B15 SMB_ALERT# / 3.3V Suspend A16 SATA0_TX+ B16 SATA1_TX+ A17 SATA0_TX- B17 SATA1_TX­A18 SUS_S4# B18 SUS_STAT# A19 SATA0_RX+ B19 SATA1_RX+ A20 SATA0_RX- B20 SATA1_RX­A21 GND B21 GND A22 USB_SSRX0- B22 USB_SSTX0­A23 USB_SSRX0+ B23 USB_SSTX0+ A24 SUS_S5# B24 PWR_OK A25 USB_SSRX1- B25 USB_SSTX1­A26 USB_SSRX1+ B26 USB_SSTX1+ A27 BATLOW# / Pull up 4.7kohm to 3.3V Suspend B27 WDT / Pull up 10k ohm to 3.3V A28 ATA_ACT# / Pull up 10kohm to 3.3V Suspend B28 NA A29 AC/HDA_SYNC / 3.3V Suspend B29 NA A30 AC/HDA_RST# / 3.3V Suspend B30 AC/HDA_SDIN0
Row A Row B
Row A Row B
A31 GND B31 GND A32 AC/HDA_BITCLK / 3.3V Suspend B32 SPKR A33 AC/HDA_SDOUT / 3.3V Suspend B33 I2C_CK / 3.3V Suspend A34 BIOS_DIS0# B34 I2C_DAT / 3.3V Suspend A35 THRMTRIP# / 3.3V Suspend B35 THRM# A36 USB6- B36 USB7­A37 USB6+ B37 USB7+ A38 USB_6_7_OC# / 3.3V Suspend B38 USB_4_5_OC# / 3.3V Suspend A39 USB4- B39 USB5­A40 USB4+ B40 USB5+ A41 GND B41 GND A42 USB2- B42 USB3­A43 USB2+ B43 USB3+ A44 USB_2_3_OC# / 3.3V Suspend B44 USB_0_1_OC# / 3.3V Suspend A45 USB0- B45 USB1­A46 USB0+ B46 USB1+ A47 VCC_RTC B47 EXCD1_PERST# A48 EXCD0_PERST# B48 EXCD1_CPPE# A49 EXCD0_CPPE# B49 SYS_RESET# / Pull up to 3.3V Suspend A50 LPC_SERIRQ B50 CB_RESET# / Pull up to 3.3V Suspend A51 GND B51 GND A52 NC (Option I2C_CLK_EC) B52 NC (Option COMe_GPI5) A53 NC (Option I2C_DATA_EC) B53 NC (Option COMe_GPO5) A54 GPI0 B54 GPO1 A55 NC (Option COMe_GPI4) B55 NC (Option COMe_GPI6) A56 NC (Option COMe_GPO4) B56 NC (Option COMe_GPO6) A57 GND B57 GPO2 A58 PCIE_TX3+ B58 PCIE_RX3+ A59 PCIE_TX3- B59 PCIE_RX3­A60 GND B60 GND
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Chapter 3
Row A Row B
A91 SPI_POWER / 3.3V Suspend B91 NA A92 SPI_MISO / 3.3V Suspend B92 NA A93 GPO0 B93 NA A94 SPI_CLK / 3.3V Suspend B94 NA A95 SPI_MOSI / 3.3V Suspend B95 DDI0_DDC_AUX_SEL A96 NA B96 NC / USB_HOST_PRSNT 3.3V (option) A97 TYPE10# / Pull down 47k ohm to GND B97 SPI_CS# / 3.3V Suspend A98 SER0_TX B98 DDI0_CTRLCLK_AUX+ A99 SER0_RX B99 DDI0_CTRLDATA_AUX­A100 GND B100 GND A101 SER1_TX B101 FAN_PWMOUT A102 SER1_RX B102 FAN_TACHIN A103 LID# B103 SLEEP# A104 VCC B104 VCC A105 VCC B105 VCC A106 VCC B106 VCC A107 VCC B107 VCC A108 VCC B108 VCC A109 VCC B109 VCC A110 GND B110 GND
Row A Row B
A61 PCIE_TX2+ B61 PCIE_RX2+ A62 PCIE_TX2- B62 PCIE_RX2­A63 GPI1 B63 GPO3 A64 PCIE_TX1+ B64 PCIE_RX1+ A65 PCIE_TX1- B65 PCIE_RX1­A66 GND B66 WAKE0# A67 GPI2 B67 WAKE1# A68 PCIE_TX0+ B68 PCIE_RX0+ A69 PCIE_TX0- B69 PCIE_RX0­A70 GND B70 GND A71
LVDS_A0+ /
eDP_TX2+ (option)
B71 DDI0_PAIR0+
A72
LVDS_A0- /
eDP_TX2- (option)
B72 DDI0_PAIR0-
A73
LVDS_A1+ /
eDP_TX1+ (option)
B73 DDI0_PAIR1+
A74
LVDS_A1- /
eDP_TX1- (option)
B74 DDI0_PAIR1-
A75
LVDS_A2+ /
eDP_TX0+ (option)
B75 DDI0_PAIR2+
A76
LVDS_A2- /
eDP_TX0- (option)
B76 DDI0_PAIR2-
A77
LVDS_VDD_EN /
eDP_VDD_EN (option)
B77 NA A78 LVDS_A3+ B78 NA A79 LVDS_A3- B79
LVDS_BKLT_EN /
eDP_BKLT_EN (option)
A80 GND B80 GND A81
LVDS_A_CK+ /
eDP_TX3+ (option)
B81 DDI0_PAIR3+ A82
LVDS_A_CK- /
eDP_TX3- (option)
B82 DDI0_PAIR3­A83
LVDS_I2C_CK /
eDP_AUX+ (option)
B83
LVDS_BKLT_CTRL /
eDP_BKLT_CTRL (option)
A84
LVDS_I2C_DAT /
eDP_AUX- (option)
B84 VCC_5V_SBY A85 GPI3 B85 VCC_5V_SBY A86 NA B86 VCC_5V_SBY A87 eDP_HPD B87 VCC_5V_SBY A88 PCIE0_CLK_REF+ B88 BIOS_DIS1# A89 PCIE0_CLK_REF- B89 DD0_HPD A90 GND B90 GND
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