DFI AL968 User Manual

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AL968
COM Express Compact Module
User’s Manual
A46500823
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This publication contains information that is protected by copyright. No part of it may be re­produced in any form or by any means or used to make any transformation/adaptation without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes no representations or warranties with respect to the contents or use of this manual and specifi­cally disclaims any express or implied warranties of merchantability or fitness for any particular purpose. The user will assume the entire risk of the use or the results of the use of this docu­ment. Further, the manufacturer reserves the right to revise this publication and make changes to its contents at any time, without obligation to notify any person or entity of such revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website will always provide the most updated information.
© 2018. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and are the properties of the respective owners.
COM Express Specification Reference
PICMG® COM Express ModuleTM Base Specification. http://www.picmg.org/
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason­able protection against harmful interference when the equipment is operated in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encour­aged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for compli­ance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
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Table of Contents
Copyright .........................................................................................................2
Trademarks ....................................................................................................2
COM Express Specification Reference ...................................2
FCC and DOC Statement on Class B ......................................2
Warranty .........................................................................................................4
Static Electricity Precautions ..........................................................4
Safety Measures .......................................................................................4
About the Package .................................................................................5
Optional Items ...........................................................................................5
Before Using the System Board .................................................5
Chapter 1 - Introduction ...................................................................6
Specifications ................................................................................................6
Features ..........................................................................................................7
Chapter 2 - Concept ................................................................ 8
COM Express Module Standards .............................................................. 8
Specification Comparison Table ...............................................................9
Chapter 3 - Hardware Installation .................................. 10
Board Layout ...............................................................................................10
Block Diagram ............................................................................................. 10
Mechanical Diagram ..................................................................................11
System Memory .......................................................................................... 12
Connectors ...................................................................................................13
COM Express Connectors ............................................................................13
COM Express Connectors Signal Discription .................................................. 15
Cooling Option ............................................................................................25
Heat Sink ...................................................................................................25
Installing AL968 onto a Carrier Board .................................................25
Installing the COM Express Debug Card ............................................. 26
Chapter 4 - BIOS Setup .......................................................28
Overview.......................................................................................................28
AMI BIOS Setup Utility .............................................................................29
Main ..........................................................................................................29
Advanced ...................................................................................................29
Security ...................................................................................................... 36
Boot...........................................................................................................37
Exit ............................................................................................................38
Updating the BIOS ....................................................................................38
Notice: BIOS SPI ROM .............................................................................39
Chapter 5 - Supported Software .............................................. 40
Appendix A - Troubleshooting ....................................................47
Appendix B - System Error Message .................................... 49
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Warranty
1. Warranty does not cover damages or failures that arised from misuse of the product, in­ability to use the product, unauthorized replacement or alteration of components and prod­uct specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper instal­lation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any circum­stances, attempt to perform service, adjustments or repairs on the product, whether in or out of warranty. It must be returned to the purchase point, factory or authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequencial damages to the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even before installing them in your system unit. Static electrical discharge can damage computer components without causing any signs of physical damage. You must take extra care in han­dling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components, contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con­nectors by their ends.
Safety Measures
To avoid damage to the system:
• Use the correct AC input voltage range.
To reduce the risk of electric shock:
• Unplug the power cord before removing the system chassis cover for installation or servic­ing. After installation or servicing, cover the system chassis before plugging the power cord.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other com­ponents. Perform the upgrade instruction procedures described at an ESD worksta­tion only. If such a station is not available, you can provide some ESD protection by wearing an antistatic wrist strap and attaching it to a metal part of the system chas­sis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.
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About the Package
The package contains the following items. If any of these items are missing or damaged, please contact your dealer or sales representative for assistance.
• One AL968 board
• One Heat sink (Height: 22.6mm)
Optional Items
• COM332-B carrier board kit
• Heat spreader (Height: 11mm) The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For more information about the standard package in your region, please contact your dealer or sales representative.
Before Using the System Board
Before using the system board, prepare basic system components. If you are installing the system board in a new system, you will need at least the following
internal components.
• Memory module
• Storage devices such as hard disk drive, etc. You will also need external system peripherals you intend to use which will normally include at
least a keyboard, a mouse and a video display monitor.
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Chapter 1 - Introduction
Specifications
Chapter 1
SYSTEM Processor Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom
®
x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom
®
x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom
®
x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel
®
Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel
®
Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory Two 204-pin SODIMM up to 8GB
Dual Channel DDR3L 1866MHz
BIOS AMI SPI 128Mbit
GRAPHICS Controller Intel® HD Graphics
Feature OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display 1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request) 1 x DDI VGA: resolution up to 1920x1200 @ 60Hz LVDS: dual channel 24-bit, resolution up to 1920x1200 @ 60Hz eDP: resolution up to 3840x2160 @ 60Hz HDMI: resolution up to 3840x2160 @ 30Hz DP++: resolution up to 4096x2160 @ 60Hz
Triple Display
VGA + LVDS + DDI DDI + eDP + DDI (available upon request)
EXPANSION Interface 4 x PCIe x1 (Gen 2)
1 x SDIO (available upon request) 1 x LPC 1 x I
2
C 1 x SMBus 1 x SPI 2 x UART (TX/RX)
eMMC 1 x 8GB/16GB/32GB eMMC (available upon request)
AUDIO Interface HD Audio ETHERNET Controller 1 x Intel® I211AT PCIe (10/100/1000Mbps) (0°C to 60°C) or
1 x Intel® I210IT PCIe (10/100/1000Mbps) (-40°C to 85°C)
I/O USB 4 x USB 3.0
8 x USB 2.0 SATA 2 x SATA 3.0 (up to 6Gb/s) DIO 1 x 8-bit DIO
WATCHDOG TIMER
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM Available Upon Request POWER Type 12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption TBD
OS SUPPORT (UEFI ONLY)
Windows Windows 10 IoT Enterprise 64-bit Linux Ubuntu 15.10 (Intel
®
graphic driver available)
ENVIRONMENT Temperature Operating: 0 to 60°C/-40 to 85°C
Storage: -40 to 85°C
Humidity Operating: 10 to 90% RH
Storage: 10 to 90% RH
MTBF TBD
MECHANICAL Dimensions COM Express® Compact
95mm (3.74") x 95mm (3.74")
Compliance PICMG COM Express
®
R2.1, Type 6
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Chapter 1
Features
Watchdog Timer
The Watchdog Timer function allows your application to regularly “clear” the system at the set time interval. If the system hangs or fails to function, it will reset at the set time interval so that your system will continue to operate.
• DDR3L
DDR3L is a higher performance DDR3 SDRAM interface providing less voltage and higher speed successor. DDR3L supporting 1866MHz
delivers increased system bandwidth and im-
proved performance to provide its higher bandwidth and its increase in performance at a lower power.
• Graphics
The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance and features to meet business needs. It provides excellent video and 3D graphics with out­standing graphics responsiveness. These enhancements deliver the performance and compat­ibility needed for today’s and tomorrow’s business applications. It supports 1 x VGA/DDI (DDI available upon request), 1 x LVDS/eDP (eDP available upon request) and 1 x DDI interfaces for triple display outputs.
• Serial ATA
Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0 will be limited by carrier board design.
• Gigabit LAN
The Intel® I211AT Gigabit LAN controller (0°C to 60°C) or Intel® I210IT Gigabit LAN controller (-40°C to 85°C) supports up to 1Gbps data transmission.
• USB
The system board supports the new USB 3.0. It is capable of running at a maximum transmis­sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s) and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces power consumption, and is backward compatible with USB 2.0. It is a marked improvement in device transfer speeds between your computer and a wide range of simultaneously accessible external Plug and Play peripherals.
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Chapter 2
Chapter 2 - Concept
106.00
91.00
70.00
51.00
4.00
18.00
6.00
0.00
16.50
4.00
0.00
Extended
BasicCompact
Mini
74.20
80.00
91.00
121.00
151.00
Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only
COM Express Module Standards
The figure below shows the dimensions of the different types of COM Express modules. AL968 is a COM Express Compact module. The dimension is 95mm (3.74”) x 95mm (3.74”).
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Chapter 2
Specification Comparison Table
Module Pin-out - Required and Optional Features C-D Connector. PICMG® COM.0 Revision 2.1
The table below shows the COM Express standard specifications and the corresponding specifications supported on the AL968 module.
• 5 Indicates 12V-tolerant features on former VCC_12V signals.
• 6 Cells in the connected columns spanning rows provide a rough approximation of features sharing connector pins.
Connector Feature
COM Express Module Base Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min / Ma
x
DFI AL968 Type 6
A-B A-B PCI Express Lanes 0 - 5 1 / 6 3 A-B LVDS Channel A 0 / 1 0 / 1 (Option : eDP or LVDS) A-B LVDS Channel B 0 / 1 1 A-B eDP on LVDS CH A pins 0 / 1 0 / 1 (Option : eDP or LVDS) A-B VGA Port 0 / 1 0 A-B TV-Out NA NA A-B DDI 0 NA NA A-B
5
Serial Ports 1 - 2 0 / 2 2 A-B CAN interface on SER1 0 / 1 0 A-B SATA / SAS Ports 1 / 4 1/2 (Option : SATA or USB3.0) A-B AC’97 / HDA Digital Interface 0 / 1 1 A-B USB 2.0 Ports 4 / 8 8 A-B USB Client 0 / 1 0 A-B USB 3.0 Ports NA NA A-B LAN Port 0 1 / 1 1 A-B Express Card Support 1 / 2 2 A-B LPC Bus 1 / 1 1 A-B SPI 1 / 2 1 A-B
SDIO (muxed on GPIO) 0 / 1 0/1 (Option : SDIO or DIO)
General Purpose I/O 8 / 8 8 (Option : SDIO or DIO) A-B SMBus 1 / 1 1 A-B I2C 1 / 1 1 A-B Watchdog Timer 0 / 1 1 A-B Speaker Out 1 / 1 1 A-B External BIOS ROM Support 0 / 2 1 A-B Reset Functions 1 / 1 1
System I/O
System Management
A-B
6
Connector Feature
COM Express Module Base Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min / Ma
x
DFI AL968 Type 6
A-B A-B Thermal Protection 0 / 1 1 A-B Battery Low Alarm 0 / 1 1 A-B Suspend/Wake Signals 0 / 3 1 A-B Power Button Support 1 / 1 1 A-B Power Good 1 / 1 1 A-B VCC_5V_SBY Contacts 4 / 4 4
A-B
5
Sleep Input 0 / 1 1
A-B
5
Lid Input 0 / 1 1
A-B
5
Fan Control Signals 0 / 2 2 A-B Trusted Platform Modules 0 / 1 1 (Option) A-B A-B VCC_12V Contacts 12 / 12 12
Power Management
Power
Connector Feature
COM Express Module Base Specification Type 6
(No IDE or PCI, add DDI+ USB3) Min / Ma
x
DFI AL968 Type 6
C-D
PCI Express Lanes 16 - 31 0 / 16 0
PCI Express Graphics (PEG) 0 / 1 0
Muxed SDVO Channels 1 - 2 NA NA
PCI Express Lanes 6 - 15 0 / 2 0
PCI Bus - 32 Bit NA NA
PATA Port NA NA
LAN Ports 1 - 2 NA NA
DDIs 1 - 3 0 / 3 DDI0 (Option : DDI0 or VGA)
USB 3.0 Ports 0 / 4 3/4 (Option : SATA or USB3.0)
C-D C-D VCC_12V Contacts 12 / 12 12
Power
C-D
6
C-D
6
System I/O
Module Pin-out - Required and Optional Features A-B Connector. PICMG® COM.0 Revision 2.1
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Chapter 3
Chapter 3 - Hardware Installation
Board Layout
Top View
Bottom View
Block Diagram
EEPROM
SATA 3.0 2x
USB 3.0 4x
A / B
SATA 3.0
0 2x
SMBus
Intel Atom® Processor
E3900 Series
USB 3.0
4x
Intel® GLAN
I211AT/I210IT
MDI
SPI Flash
SPI Bus
C / D
DDR3L 1866MHz
SODIMM
Channel A
PCIe x1
PCIe x1 (3 x1/1 x2, 1 x1)
LPC Bus
PCIe x1 (3 x1/1 x2, 1 x1)
LPC Bus
8-bit DIO
WDT
I
2
C Bus
Serial Port 0,1
Fan PWM/
TACH_IN
SLP/LID
SLP/
LID
TCA6408A
Embedded
Controller
IT8528E
DDR3L 1866MHz
SODIMM
Channel B
DDI Port 1
DDI Port 1
HDA
HDA
USB 2.0 8x
USB 2.0 8x
eDP/DDI
/
PTN3460
LVDS
LVDS
PTN3355
VGA
e.MMC 5.0
MMC
SATA 3.0 port 1 is optional with USB 3.0 port 5
TPM 1.2/2.0
(Option)
EEPROM
SMBus
-bit DIO
8
TCA
640
8A
DDR3L_1 SODIMM
Intel Atom
E3900 Series
eMMC
(optional)
Intel I211AT or I210IT
SPI Flash BIOS
IT8528E
PTN3460
PTN3355
TPM
(optional)
COM Express Connector
C1
D1
C110
D110
B1B110
A1A110
COM Express Connector
DDR3L_2 SODIMM
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Chapter 3
Mechanical Diagram
AL968 Module with Heat Sink
Side View of the Module with Heat Sink and Carrier Board
AL968 Module
95
7
4
15
76
87
17
95
4
0
4
80
91
95
0
4
91
95
Top View
Bottom View
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Chapter 3
System Memory
The system board is equipped with up to 8GB DDR3L system memory onboard supporting 1866MHz, dual channel memory interface.
DDR3L
Important:
Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in boards, and other components. Perform installation procedures at an ESD workstation only. If such a station is not available, you can provide some ESD protection by wear­ing an antistatic wrist strap and attaching it to a metal part of the system chassis. If a wrist strap is unavailable, establish and maintain contact with the system chassis throughout any procedures requiring ESD protection.
System Memory
DDR3L
Top View
Bottom View
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Chapter 3
Connectors
COM Express Connectors
The COM Express connectors are used to interface the AL968 COM Express board to a carrier board. Connect the COM Express connectors (located on the solder side of the board) to the COM Express connectors on the carrier board.
Refer to the “Installing AL968 onto a Carrier Board” section for more information.
Refer to the following pages for the pin functions of these connectors.
COM Express Connectors
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Chapter 3
COM Express Connectors
A1 GND (FIXED) B1 GND (FIXED) A56 NA B56 NA C1 GND (FIXED) D1 GND (FIXED) C56 NA D56 NA A2 GBE0_MDI3- B2 GBE0_ACT# A57 GND B57 GPO2 C2 GND D2 GND C57 Type 1 # D57 Type 2 # A3 GBE0_MDI3+ B3 LPC_FRAME# A58 PCIE_TX3+ B58 PCIE_RX3+ C3 USB_SSRX0- D3 USB_SSTX0- C58 NA D58 NA A4 GBE0_LINK100# B4 LPC_AD0 A59 PCIE_TX3- B59 PCIE_RX3- C4 USB_SSRX0+ D4 USB_SSTX0+ C59 NA D59 NA A5 GBE0_LINK1000# B5 LPC_AD1 A60 GND (FIXED) B60 GND (FIXED) C5 GND D5 GND C60 GND (FIXED) D60 GND (FIXED) A6 GBE0_MDI2- B6 LPC_AD2 A61 PCIE_TX2+ B61 PCIE_RX2+ C6 USB_SSRX1- D6 USB_SSTX1- C61 NA D61 NA A7 GBE0_MDI2+ B7 LPC_AD3 A62 PCIE_TX2- B62 PCIE_RX2- C7 USB_SSRX1+ D7 USB_SSTX1+ C62 NA D62 NA A8 GBE0_LINK# B8 NA A63 GPI1 B63 GPO3 C8 GND D8 GND C63 RSVD D63 RSVD A9 GBE0_MDI1- B9 NA A64 PCIE_TX1+ B64 PCIE_RX1+ C9 USB_SSRX2- D9 USB_SSTX2- C64 RSVD D64 RSVD A10 GBE0_MDI1+ B10 LPC_CLK A65 PCIE_TX1- B65 PCIE_RX1- C10 USB_SSRX2+ D10 USB_SSTX2+ C65 NA D65 NA A11 GND (FIXED) B11 GND (FIXED) A66 GND B66 WAKE0# C11 GND (FIXED) D11 GND (FIXED) C66 NA D66 NA A12 GBE0_MDI0- B12 PWRBTN# A67 GPI2 B67 WAKE1# C12 USB_SSRX3- D12 USB_SSTX3- C67 RSVD D67 GND A13 GBE0_MDI0+ B13 SMB_CK A68 PCIE_TX0+ B68 PCIE_RX0+ C13 USB_SSRX3+ D13 USB_SSTX3+ C68 NA D68 NA A14 NA B14 SMB_DAT A69 PCIE_TX0- B69 PCIE_RX0- C14 GND D14 GND C69 NA D69 NA A15 SUS_S3# B15 SMB_ALERT# A70 GND (FIXED) B70 GND (FIXED) C15 NA D15 DDI1_CTRLCLK_AUX+ C70 GND (FIXED) D70 GND (FIXED) A16 SATA0_TX+ B16 SATA1_TX+ A71 LVDS_A0+/eDP_TX2+* B71 LVDS_B0+ C16 NA D16 DDI1_CTRLDATA_AUX- C71 NA D71 NA A17 SATA0_TX- B17 SATA1_TX- A72 LVDS_A0-/eDP_TX2-* B72 LVDS_B0- C17 RSVD D17 RSVD C72 NA D72 NA A18 SUS_S4# B18 SUS_STAT# A73 LVDS_A1+/eDP_TX1+* B73 LVDS_B1+ C18 RSVD D18 RSVD C73 GND D73 GND A19 SATA0_RX+ B19 SATA1_RX+ A74 LVDS_A1-/eDP_TX1- * B74 LVDS_B1- C19 NA D19 NA C74 NA D74 NA A20 SATA0_RX- B20 SATA1_RX- A75 LVDS_A2+/eDP_TX0+* B75 LVDS_B2+ C20 NA D20 NA C75 NA D75 NA A21 GND (FIXED) B21 GND (FIXED) A76 LVDS_A2-/eDP_TX0-* B76 LVDS_B2- C21 GND (FIXED) D21 GND (FIXED) C76 GND D76 GND A22 NA B22 NA A77 LVDS/eDP_VDD_EN* B77 LVDS_B3+ C22 NA D22 NA C77 RSVD D77 RSVD A23 NA B23 NA A78 LVDS_A3+ B78 LVDS_B3- C23 NA D23 NA C78 NA D78 NA A24 SUS_S5# B24 PWR_OK A79 LVDS_A3- B79 LVDS/eDP_BKLT_EN* C24 DDI1_HPD D24 RSVD C79 NA D79 NA A25 NA B25 NA A80 GND (FIXED) B80 GND (FIXED) C25 NA D25 RSVD C80 GND (FIXED) D80 GND (FIXED) A26 NA B26 NA A81 LVDS_A_CK+/eDP_TX3+* B81 LVDS_B_CK+ C26 NA D26 DDI1_PAIR0+ C81 NA D81 NA A27 BATLOW# B27 WDT A82 LVDS_A_CK-/eDP_TX3-* B82 LVDS_B_CK- C27 RSVD D27 DDI1_PAIR0- C82 NA D82 NA A28 (S)ATA_ACT# B28 NA A83 LVDS_I2C_CK/eDP_AUX+* B83 LVDS/eDP_BKLT_CTRL* C28 RSVD D28 RSVD C83 RSVD D83 RSVD A29 AC/HDA_SYNC B29 NA A84 LVDS_I2C_DAT/eDP_AUX-* B84 VCC_5V_SBY C29 NA D29 DDI1_PAIR1+ C84 GND D84 GND A30 AC/HDA _RST# B30 AC/HDA _SDIN0 A85 GPI3 B85 VCC_5V_SBY C30 NA D30 DDI1_PAIR1- C85 NA D85 NA A31 GND (FIXED) B31 GND (FIXED) A86 RSVD B86 VCC_5V_SBY C31 GND (FIXED) D31 GND (FIXED) C86 NA D86 NA A32 AC/HDA _BITCLK B32 SPKR A87 RSVD/eDP_HPD* B87 VCC_5V_SBY C32 DDI2_CTRLCLK_AUX+ D32 DDI1_PAIR2+ C87 GND D87 GND A33 AC/HDA _SDOUT B33 I2C_CK A88 PCIE_CK_REF+ B88 BIOS_DIS1# C33 DDI2_CTRLDATA_AUX- D33 DDI1_PAIR2- C88 NA D88 NA A34 BIOS_DIS0# B34 I2C_DAT A89 PCIE_CK_REF- B89 VGA_RED C34 DDI2_DDC_AUX_SEL D34 DDI1_DDC_AUX_SEL C89 NA D89 NA A35 THRMTRIP# B35 THRM# A90 GND (FIXED) B90 GND (FIXED) C35 RSVD D35 RSVD C90 GND (FIXED) D90 GND (FIXED) A36 USB6- B36 USB7- A91 SPI_POWER B91 VGA_GRN C36 NA D36 DDI1_PAIR3+ C91 NA D91 NA A37 USB6+ B37 USB7+ A92 SPI_MISO B92 VGA_BLU C37 NA D37 DDI1_PAIR3- C92 NA D92 NA A38 USB_6_7_OC# B38 USB_4_5_OC# A93 GPO0 B93 VGA_HSYNC C38 NA D38 RSVD C93 GND D93 GND A39 USB4- B39 USB5- A94 SPI_CLK B94 VGA_VSYNC C39 NA D39 DDI2_PAIR0+ C94 NA D94 NA A40 USB4+ B40 USB5+ A95 SPI_MOSI B95 VGA_I2C_CK C40 NA D40 DDI2_PAIR0- C95 NA D95 NA A41 GND (FIXED) B41 GND (FIXED) A96 TPM_PP B96 VGA_I2C_DAT C41 GND (FIXED) D41 GND (FIXED) C96 GND D96 GND A42 USB2- B42 USB3- A97 NA B97 SPI_CS# C42 NA D42 DDI2_PAIR1+ C97 RSVD D97 RSVD A43 USB2+ B43 USB3+ A98 SER0_TX B98 RSVD C43 NA D43 DDI2_PAIR1- C98 NA D98 NA A44 USB_2_3_OC# B44 USB_0_1_OC# A99 SER0_RX B99 RSVD C44 NA D44 DDI2_HPD C99 NA D99 NA A45 USB0- B45 USB1- A100 GND (FIXED) B100 GND (FIXED) C45 RSVD D45 RSVD C100
GND (FIXED) D100 GND (FIXED) A46 USB0+ B46 USB1+ A101 SER1_TX B101 FAN_PWMOUT C46 NA D46 DDI2_PAIR2+ C101 NA D101 NA A47 VCC_RTC B47 NA A102 SER1_RX B102 FAN_TACHIN C47 NA D47 DDI2_PAIR2- C102 NA D102 NA A48 NA B48 NA A103 LID# B103 SLEEP# C48 RSVD D48 RSVD C103 GND D103 GND A49 NA B49 SYS_RESET# A104 VCC_12V B104 VCC_12V C49 NA D49 DDI2_PAIR3+ C104 VCC_12V D104 VCC_12V A50 LPC_SERIRQ B50 CB_RESET# A105 VCC_12V B105 VCC_12V C50 NA D50 DDI2_PAIR3- C105 VCC_12V D105 VCC_12V A51 GND (FIXED) B51 GND (FIXED) A106 VCC_12V B106 VCC_12V C51 GND (FIXED) D51 GND (FIXED) C106 VCC_12V D106 VCC_12V A52 NA B52 NA A107 VCC_12V B107 VCC_12V C52 NA D52 NA C107 VCC_12V D107 VCC_12V A53 NA B53 NA A108 VCC_12V B108 VCC_12V C53 NA D53 NA C108 VCC_12V D108 VCC_12V A54 GPI0 B54 GPO1 A109 VCC_12V B109 VCC_12V C54 Type 0 # D54 PEG_LANE_RV# C109 VCC_12V D109 VCC_12V A55 NA B55 NA A110 GND (FIXED) B110 GND (FIXED) C55 NA D55 NA C110
GND (FIXED) D110 GND (FIXED)
* : LVDS (default) eDP (optional)
Row C Row DRow A Row B Row C Row DRow A Row B
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Chapter 3
COM Express Connectors Signal Description
Signal Pin# Module Pin Type Pwr Rail /Tolerance AL968 AC/HDA_RST# A30 O CMOS 3.3V Suspend/3.3V AC/HDA_SYNC A29 O CMOS 3.3V/3.3V AC/HDA_BITCLK A32 I/O CMOS 3.3V/3.3V AC/HDA_SDOUT A33 O CMOS 3.3V/3.3V AC/HDA_SDIN2 B28 I/O CMOS 3.3V Suspend/3.3V NA AC/HDA_SDIN1 B29 I/O CMOS 3.3V Suspend/3.3V NA AC/HDA_SDIN0 B30 I/O CMOS 3.3V Suspend/3.3V
Signal Pin# Module Pin Type Pwr Rail /Tolerance AL968 GBE0_MDI0+ A13 I/O Analog 3.3V max Suspend GBE0_MDI0- A12 I/O Analog 3.3V max Suspend GBE0_MDI1+ A10 I/O Analog 3.3V max Suspend GBE0_MDI1- A9 I/O Analog 3.3V max Suspend GBE0_MDI2+ A7 I/O Analog 3.3V max Suspend GBE0_MDI2- A6 I/O Analog 3.3V max Suspend GBE0_MDI3+ A3 I/O Analog 3.3V max Suspend GBE0_MDI3- A2 I/O Analog 3.3V max Suspend GBE0_ACT# B2 OD CMOS 3.3V Suspend/3.3V GBE0_LINK# A8 OD CMOS 3.3V Suspend/3.3V GBE0_LINK100# A4 OD CMOS 3.3V Suspend/3.3V GBE0_LINK1000# A5 OD CMOS 3.3V Suspend/3.3V
Signal Pin# Module Pin Type Pwr Rail /Tolerance AL968 SATA0_TX+ A16 O SATA AC coupled on Module SATA0_TX- A17 O SATA AC coupled on Module SATA0_RX+ A19 I SATA AC coupled on Module SATA0_RX- A20 I SATA AC coupled on Module SATA1_TX+ B16 O SATA AC coupled on Module Default: SATA 3.0; Option: USB3.0 SATA1_TX- B17 O SATA AC coupled on Module Default: SATA 3.0; Option: USB3.0 SATA1_RX+ B19 I SATA AC coupled on Module Default: SATA 3.0; Option: USB3.0 SATA1_RX- B20 I SATA AC coupled on Module Default: SATA 3.0; Option: USB3.0 SATA2_TX+ A22 O SATA AC coupled on Module NA SATA2_TX- A23 O SATA AC coupled on Module NA SATA2_RX+ A25 I SATA AC coupled on Module NA SATA2_RX- A26 I SATA AC coupled on Module NA SATA3_TX+ B22 O SATA AC coupled on Module NA SATA3_TX- B23 O SATA AC coupled on Module NA SATA3_RX+ B25 I SATA AC coupled on Module NA SATA3_RX- B26 I SATA AC coupled on Module NA (S)ATA_ACT# A28 I/O CMOS 3.3V / 3.3V PU 10K to 3.3V
Pin Types I Input to the Module O Output from the Module I/O Bi-directional input / output signal OD Open drain output
AC97/HDA Signals and Descriptions
Description Reset output to CODEC, active low. Sample-synchronization signal to the CODEC(s). Serial data clock generated by the external CODEC(s). Serial TDM data output to the CODEC. Serial TDM data inputs from up to 1 CODECs.
SATA Signals and Descriptions
Description
Gigabit Ethernet Signals and Descriptions
Description Gigabit Ethernet Controller 0: Media Dependent Interface Differential Pairs 0,1,2,3. The MDI can operate in 1000, 100 and 10 Mbit / sec modes. Some pairs are unused in some modes, per the following: 1000BASE-T 100BASE-TX 10BASE-T MDI[0]+/- B1_DA+/- TX+/- TX+/­ MDI[1]+/- B1_DB+/- RX+/- RX+/­ MDI[2]+/- B1_DC+/­ MDI[3]+/- B1_DD+/­Gigabit Ethernet Controller 0 activity indicator, active low. Gigabit Ethernet Controller 0 link indicator, active low. Gigabit Ethernet Controller 0 100 Mbit / sec link indicator, active low. Gigabit Ethernet Controller 0 1000 Mbit / sec link indicator, active low.
ATA (parallel and serial) or SAS activity indicator, active low.
Serial ATA or SAS Channel 0 transmit differential pair.
Serial ATA or SAS Channel 0 receive differential pair.
Serial ATA or SAS Channel 1 transmit differential pair.
Serial ATA or SAS Channel 1 receive differential pair.
Serial ATA or SAS Channel 2 transmit differential pair.
Serial ATA or SAS Channel 2 receive differential pair.
Serial ATA or SAS Channel 3 transmit differential pair.
Serial ATA or SAS Channel 3 receive differential pair.
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