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SIRIUS
Technical Reference Manual
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DEWESOFT SIRIUS Technical Reference Manual

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Page 1
SIRIUS®
Technical Reference Manual
Version: 1.4.2
Thank you!
Thank you very much for your investment in our unique data acquisition systems. These are top-quality instruments
which are designed to provide you years of reliable service. This guide has been prepared to help you get the most
from your investment, starting from the day you take it out of the box, and extending for years into the future.
www.dewesoft.com
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Table Of Contents
Table Of Contents
1 Notice................................................................................................................................................................................1
1.1 Safety instructions....................................................................................................................................................2
2 About this document.........................................................................................................................................................7
2.1 Legend......................................................................................................................................................................7
2.2 Online versions........................................................................................................................................................8
2.2.1 SIRIUS® technical reference manual.............................................................................................................8
2.2.2 DEWESoft® tutorials......................................................................................................................................8
3 Getting started...................................................................................................................................................................9
3.1 Software installation................................................................................................................................................9
3.1.1 DEWESoft® installation.................................................................................................................................9
3.2 Connecting a Single Slice......................................................................................................................................16
3.3 Connecting Multiple Slices....................................................................................................................................17
3.4 Simple Measurement..............................................................................................................................................17
3.4.1 Online Help...................................................................................................................................................17
3.4.2 Analogue channel setup.................................................................................................................................18
3.4.3 Measurement Mode.......................................................................................................................................19
3.4.4 Analysis Mode...............................................................................................................................................20
3.5 Advanced configuration.........................................................................................................................................20
3.5.1 Counters and CAN........................................................................................................................................21
3.6 Licensing................................................................................................................................................................21
3.7 Troubleshooting.....................................................................................................................................................22
4 Enclosure Overview........................................................................................................................................................23
4.1 Enclosure types......................................................................................................................................................23
4.1.1 Single Slice....................................................................................................................................................23
4.1.2 Multi Slice.....................................................................................................................................................24
4.1.3 Extended Height Enclosure...........................................................................................................................25
4.1.4 SIRIUS-R8....................................................................................................................................................25
4.2 Connectors at the rear side.....................................................................................................................................26
4.2.1 Single Slice Version USB..............................................................................................................................26
4.2.2 Single Slice Version EtherCAT®..................................................................................................................27
4.2.3 Multi Slice Version........................................................................................................................................28
4.2.4 Analogue out version.....................................................................................................................................29
4.3 SIRIUS-SBOX2.....................................................................................................................................................30
4.3.1 Specifications SBOX2...................................................................................................................................30
4.3.2 Front side.......................................................................................................................................................31
4.3.3 Rear side........................................................................................................................................................31
4.4 SIRIUSf-SBOX......................................................................................................................................................32
4.4.1 Specifications f-SBOX..................................................................................................................................33
4.4.2 Front Side......................................................................................................................................................33
4.4.3 Rear Side.......................................................................................................................................................33
4.5 SIRIUS-R2D..........................................................................................................................................................34
4.5.1 Frontside........................................................................................................................................................35
4.6 SIRIUS-R8.............................................................................................................................................................36
4.6.1 Specifications R8...........................................................................................................................................37
4.6.2 Front Side......................................................................................................................................................38
4.6.3 Rear Side.......................................................................................................................................................39
4.7 SIRIUS-R8D..........................................................................................................................................................40
4.7.1 Specifications R8D........................................................................................................................................40
4.7.2 Front Side (Display)......................................................................................................................................41
4.7.3 Rear Side.......................................................................................................................................................41
4.8 Dimensions.............................................................................................................................................................43
4.8.1 Single Slice Version.......................................................................................................................................43
4.8.2 Multi Slice Version........................................................................................................................................44
4.8.3 Sirius R2D.....................................................................................................................................................44
4.8.4 Sirius R8D.....................................................................................................................................................45
4.8.5 Sirius R8........................................................................................................................................................46
5 SIRIUS® Measurement Modules...................................................................................................................................47
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5.1 Data Transfer Overview.........................................................................................................................................47
5.1.1 USB...............................................................................................................................................................47
5.1.2 EtherCAT®....................................................................................................................................................47
5.1.3 Data Transfer Combinations..........................................................................................................................49
5.2 Technology overview.............................................................................................................................................49
5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB).........................................................................49
5.2.2 SIRIUS®-HD-series: High density (16 channel per slice)...........................................................................49
5.2.3 SIRIUS®-HS series: High speed and bandwidth..........................................................................................49
5.2.4 Isolated version: USB....................................................................................................................................50
5.2.5 SIRIUS® differential version: USB..............................................................................................................51
5.2.6 Isolated version: EtherCAT® .......................................................................................................................51
5.3 SIRIUS® Slice Configuration...............................................................................................................................52
5.4 SIRIUS® Dual Core specifications.......................................................................................................................54
5.5 SIRIUS® HD and HS specifications.....................................................................................................................55
5.6 General Specifications...........................................................................................................................................56
5.7 ACC / ACC+..........................................................................................................................................................57
5.7.1 ACC: Specifications......................................................................................................................................57
5.7.2 ACC BNC......................................................................................................................................................57
5.7.3 ACC+ (Counter) L1B7f ................................................................................................................................57
5.7.4 ACC: Voltage.................................................................................................................................................58
5.7.5 ACC: IEPE....................................................................................................................................................58
5.8 CHG / CHG+.........................................................................................................................................................59
5.8.1 CHG: Specifications......................................................................................................................................59
5.8.2 CHG BNC.....................................................................................................................................................60
5.8.3 CHG+ (Counter) L1B7f ...............................................................................................................................60
5.8.4 CHG: Voltage................................................................................................................................................61
5.8.5 CHG: IEPE....................................................................................................................................................61
5.8.6 CHG: Charge.................................................................................................................................................61
5.9 HV..........................................................................................................................................................................62
5.9.1 HVv2 Specifications......................................................................................................................................62
5.9.2 HV: Banana...................................................................................................................................................62
5.10 LV / LV+..............................................................................................................................................................64
5.10.1 LVv2 Specifications....................................................................................................................................64
5.10.2 LV+ (Counter) L1B7f..................................................................................................................................65
5.10.3 LV BAN.......................................................................................................................................................65
5.10.4 LV BNC.......................................................................................................................................................66
5.10.5 LV DSUB-9.................................................................................................................................................66
5.11 MULTI.................................................................................................................................................................69
5.11.1 MULTI: Specifications................................................................................................................................69
5.11.2 MULTI DSUB-15........................................................................................................................................70
5.11.3 MULTI-L2B16f...........................................................................................................................................73
5.12 STGM / STGM+..................................................................................................................................................76
5.12.1 STGMv2: Specifications.............................................................................................................................76
5.12.2 STGM+ (Counter) L1B7f............................................................................................................................77
5.12.3 STGM-DB...................................................................................................................................................77
5.12.4 STGM DSUB-9...........................................................................................................................................79
5.12.5 STGM-L2B8f..............................................................................................................................................81
5.12.6 STGM-L2B16f............................................................................................................................................84
5.13 STG / STG+.........................................................................................................................................................87
5.13.1 STGv2: Specifications.................................................................................................................................87
5.13.2 STG+ (Counter) L1B7f...............................................................................................................................88
5.13.3 STG-L2B7f..................................................................................................................................................88
5.13.4 STG-L2B10f................................................................................................................................................91
5.13.5 STG DSUB-9..............................................................................................................................................94
5.14 HD-ACC..............................................................................................................................................................98
5.14.1 HD-ACC Specifications..............................................................................................................................98
5.14.2 HD-ACC BNC............................................................................................................................................98
5.14.3 HD-ACC: Voltage.......................................................................................................................................99
5.14.4 HD-ACC: IEPE...........................................................................................................................................99
5.15 HD-LV................................................................................................................................................................100
5.15.1 HD-LV: Specifications..............................................................................................................................100
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5.15.2 HD-LV DSUB-9........................................................................................................................................100
5.15.3 HD-LV BNC..............................................................................................................................................102
5.15.4 HD-LV BNC: Voltage................................................................................................................................102
5.16 HD-STGS...........................................................................................................................................................103
5.16.1 HD-STGS: Specifications.........................................................................................................................103
5.16.2 HD-STGS..................................................................................................................................................104
5.16.3 HD-STGS-L1B10f....................................................................................................................................106
5.17 HS-ACC / HS-ACC+.........................................................................................................................................108
5.17.1 HS-ACC: Specifications............................................................................................................................108
5.17.2 HS-ACC BNC...........................................................................................................................................108
5.17.3 HS-ACC+ (Counter) L1B7f .....................................................................................................................109
5.17.4 HS-ACC: Voltage......................................................................................................................................109
5.17.5 HS-ACC: IEPE..........................................................................................................................................110
5.18 HS-CHG / HS-CHG+.........................................................................................................................................111
5.18.1 HS-CHG: Specifications............................................................................................................................111
5.18.2 HS-CHG BNC...........................................................................................................................................112
5.18.3 HS-CHG+ (Counter) L1B7f .....................................................................................................................112
5.18.4 HS-CHG: Voltage......................................................................................................................................113
5.18.5 HS-CHG: IEPE..........................................................................................................................................113
5.18.6 HS-CHG: Charge.......................................................................................................................................113
5.19 HS-HV................................................................................................................................................................114
5.19.1 HS-HV: Specifications..............................................................................................................................114
5.19.2 HS-HV Banana..........................................................................................................................................115
5.20 HS-LV / HS-LV+................................................................................................................................................116
5.20.1 HS-LV Specifications................................................................................................................................116
5.20.2 HS-LV+ (Counter) L1B7f.........................................................................................................................117
5.20.3 HS-LV BAN..............................................................................................................................................117
5.20.4 HS-LV BNC...............................................................................................................................................118
5.20.5 HS-LV DSUB-9.........................................................................................................................................118
5.21 HS-STG / HS-STG+..........................................................................................................................................120
5.21.1 HS-STG Specifications.............................................................................................................................120
5.21.2 HS-STG+ (Counter) L1B7f.......................................................................................................................121
5.21.3 HS-STG DSUB-9......................................................................................................................................122
5.22 Analogue out OPTION.......................................................................................................................................125
5.22.1 Analogue out: Specifications.....................................................................................................................125
6 Measurement.................................................................................................................................................................127
6.1 Filtering................................................................................................................................................................127
6.1.1 Filtering Glossary........................................................................................................................................127
6.1.2 Filter Design................................................................................................................................................130
6.1.3 Sirius® DualCore & HD: Anti-Aliasing.....................................................................................................132
6.1.4 DEWESoft®: Custom Low Pass Filter Settings.........................................................................................135
7 Accessories...................................................................................................................................................................137
7.1 MSI-Adapters.......................................................................................................................................................137
7.1.1 MSI Overview.............................................................................................................................................137
7.1.2 General Specifications.................................................................................................................................137
7.1.3 MSI-TH-x....................................................................................................................................................138
7.2 DS Battery Packs.................................................................................................................................................140
7.2.1 Specifications..............................................................................................................................................140
7.2.2 DS-BP2i: Battery Pack................................................................................................................................140
7.2.3 DS-BP4i: Battery Pack................................................................................................................................142
7.2.4 Dimensions..................................................................................................................................................143
8 Advanced Topics...........................................................................................................................................................145
8.1 Wireless Connection............................................................................................................................................145
8.1.1 Prerequisites................................................................................................................................................145
8.1.2 Hosted Network on Windows 7...................................................................................................................145
8.1.3 Android: WiFi connection...........................................................................................................................147
8.1.4 Android: VNC.............................................................................................................................................147
8.2 Synchronisation....................................................................................................................................................149
8.2.1 Synchronisation Glossary............................................................................................................................150
8.2.2 Sync options................................................................................................................................................153
8.3 Firmware upgrade................................................................................................................................................155
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8.3.1 Preparation...................................................................................................................................................156
8.3.2 System Firmware Upgrade..........................................................................................................................157
8.3.3 Module Firmware Upgrade.........................................................................................................................158
8.3.4 Troubleshooting...........................................................................................................................................158
9 Appendix.......................................................................................................................................................................159
9.1 Glossary and abbreviations..................................................................................................................................159
9.2 Documentation version history............................................................................................................................164
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Notice

1 Notice

The information contained in this document is subject to change without notice.
CAUTION
Dewesoft GmbH. shall not be liable for any errors contained in this document. Dewesoft MAKES NO WARRANTIES OF ANY KIND WITH REGARD TO THIS DOCUMENT, WHETHER EXPRESS OR IMPLIED. DEWESOFT SPECIFICALLY DISCLAIMS THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Dewesoft shall not be liable for any direct, indirect, special, incidental, or consequential damages, whether based on contract, tort, or any other legal theory, in connection with the furnishing of this document or the use of the information in this document.
Warranty Information:
A copy of the specific warranty terms applicable to your Dewesoft product and replacement parts can be obtained from your local sales and service office.
To find a local dealer for your country, please visit this link: http://www.dewesoft.com/contact and scroll down to the list of Worldwide distributors.
Calibration
Every instrument needs to be calibrated at regular intervals. The standard norm across nearly every industry is annual calibration. Before your Dewesoft data acquisition system is delivered, it is calibrated. Detailed calibration reports for your Dewesoft system can be requested. We retain them for at least one year, after system delivery.
Support
Dewesoft has a team of people ready to assist you if you have any questions or any technical difficulties regarding the system. For any support please contact your local distributor first or Dewesoft directly.
Austria Slovenia
Dewesoft GmbH Grazerstrasse 7 A-8062 Kumberg Austria / Europe
Tel.: +43 3132 2252 Fax: +43 3132 2252-2
Web: http://www.dewesoft.com
The telephone hotline is available Monday to Thursday between 09:00-12:00 (GMT +1:00) 13:00-17:00 (GMT +1:00) Friday: 09:00-13:00 (GMT +1:00)
Dewesoft d.o.o. Gabrsko 11a 1420 Trbovlje Slovenia / Europe
Tel.: +386 356 25 300 Fax: +386 356 25 301
Web: http://www.dewesoft.com
The telephone hotline is available Monday to Friday between 08:00 and 16:00 CET (GMT +1:00)
Service/repairs
The team of Dewesoft also performs any kinds of repairs to your system to assure a safe and proper operation in the future. For information regarding service and repairs please contact your local distributor first or Dewesoft directly.
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SIRIUS®
Restricted Rights Legend:
Use Austrian law for duplication or disclosure.
Dewesoft GmbH Grazerstrasse 7 A-8062 Kumberg Austria / Europe
Printing History:
Version Revision 850 Released 2013 Last changed: 13. November 2015 09:22
Copyright
Copyright © 2011-2015 Dewesoft GmbH
This document contains information which is protected by copyright. All rights are reserved. Reproduction, adaptation, or translation without prior written permission is prohibited, except as allowed under the copyright laws.
All trademarks and registered trademarks are acknowledged to be the property of their owners.

1.1 Safety instructions

Your safety is our primary concern! Please be safe!
Safety symbols in the manual
WARNING
Calls attention to a procedure, practice, or condition that could cause body injury or death.
CAUTION
Calls attention to a procedure, practice, or condition that could possibly cause damage to equipment or permanent loss of data.
General Safety Instructions
WARNING
The following general safety precautions must be observed during all phases of operation, service, and repair of this product. Failure to comply with these precautions or with specific warnings elsewhere in this manual violates safety standards of design, manufacture, and intended use of the product. Dewesoft GmbH assumes no liability for the customer’s failure to comply with these requirements.
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Notice
All accessories shown in this document are available as option and will not be shipped as standard parts.
Environmental Considerations
Information about the environmental impact of the product.
Product End-of-Life Handling
Observe the following guidelines when recycling a Dewesoft system:
System and Components Recycling
Production of these components required the extraction and use of natural resources. The substances contained in the system could be harmful to your health and to the environment if the system is improperly handled at it's end of life! Please recycle this product in an appropriate way to avoid an unnecessary pollution of the environment and to keep natural resources.
This symbol indicates that this system complies with the European Union’s requirements according to Directive 2002/96/EC on waste electrical and electronic equipment (WEEE). Please find further information about recycling on the Dewesoft web site
www.dewesoft.com
Restriction of Hazardous Substances
This product has been classified as Monitoring and Control equipment, and is outside the scope of the 2002/95/EC RoHS Directive. However we take care about our environment and the product is lead free.
General safety and hazard warnings for all Dewesoft systems
Safety of the operator and the unit depend on following these rules
Use this system under the terms of the specifications only to avoid any possible danger.
Read your manual before operating the system.
Observe local laws when using the instrument.
DO NOT touch internal wiring!
DO NOT use higher supply voltage than specified!
Use only original plugs and cables for harnessing.
You may not connect higher voltages than rated to any connectors.
The power-cable and -connector serve as Power-Breaker. The cable must not exceed 3 meters, disconnect function must be possible without tools.
Maintenance must be executed by qualified staff only.
During the use of the system, it might be possible to access other parts of a more comprehensive system. Please read and follow the safety instructions provided in the manuals of all other components regarding warning and security advices for using the system.
With this product, only use the power cable delivered or defined for the host country.
DO NOT connect or disconnect sensors, probes or test leads, as these parts are connected to a voltage supply unit.
Ground the equipment: For Safety Class 1 equipment (equipment having a protective earth terminal), a non interruptible safety earth ground must be provided from the mains power source to the product input wiring terminals.
Please note the characteristics and indicators on the system to avoid fire or electric shocks. Before connecting the system, please read the corresponding specifications in the product manual carefully.
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SIRIUS®
The inputs must not, unless otherwise noted (CATx identification), be connected to the main circuit of category II, III and IV.
The power cord separates the system from the power supply. Do not block the power cord, since it has to be accessible for the users.
DO NOT use the system if equipment covers or shields are removed.
If you assume the system is damaged, get it examined by authorised personnel only.
Adverse environmental conditions are:
Moisture or high humidity
Dust, flammable gases, fumes or dissolver
Thunderstorm or thunderstorm conditions (except assembly PNA)
Electrostatic fields, et cetera.
The measurement category can be adjusted depending on module configuration.
Any other use than described above may damage your system and is attended with dangers like short-circuit, fire or electric shocks.
The whole system must not be changed, rebuilt or opened
DO NOT operate damaged equipment: Whenever it is possible that the safety protection features built into this product have been impaired, either through physical damage, excessive moisture, or any other reason, REMOVE POWER and do not use the product until safe operation can be verified by service-trained personnel. If necessary, return the product to Dewesoft sales and service office for service and repair to ensure that safety features are maintained.
DO NOT service or adjust alone. Do not attempt internal service or adjustment unless another person, capable of rendering first aid and resuscitation, is present.
If you assume a more risk less use is not provided any more, the system has to be rendered inoperative and should be protected against inadvertent operation. It is assumed that a more risk less operation is not possible any more, if
the system is damaged obviously or causes strange noises.
the system does not work any more.
the system has been exposed to long storage in adverse environmental.
the system has been exposed to heavy shipment strain.
DO NOT touch any exposed connectors or components if they are live wired. The use of metal bare wires is not allowed. There is a risk of short cut and fire hazard!
Warranty void if damages caused by disregarding this manual. For consequential damages NO liability will be assumed!
Warranty void if damages to property or persons caused by improper use or disregarding the safety instructions.
Unauthorized changing or rebuilding the system is prohibited due to safety and permission reasons (CE).
Be careful with voltages >25 VAC or >35 VDC! These voltages are already high enough in order to get a perilous electric shock by touching the wiring.
The product heats during operation. Make sure there is adequate ventilation. Ventilation slots must not be covered!
Only fuses of the specified type and nominal current may be used. The use of patched fuses is prohibited.
Prevent using metal bare wires! Risk of short circuit and fire hazard!
DO NOT use the system before, during or shortly after a thunderstorm (risk of lightning and high energy over-voltage). An advanced range of application under certain conditions is allowed with therefore designed products only. For details please refer to the specifications.
Make sure that your hands, shoes, clothes, the floor, the system or measuring leads, integrated circuits and so on, are dry.
DO NOT use the system in rooms with flammable gases, fumes or dust or in adverse environmental conditions.
Avoid operation in the immediate vicinity of:
high magnetic or electromagnetic fields
transmitting antennas or high-frequency generators
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Notice
for exact values please refer to enclosed specifications.
Use measurement leads or measurement accessories aligned to the specification of the system only. Fire hazard in case of overload!
Do not switch on the system after transporting it from a cold into a warm room and vice versa. The thereby created condensation may damage your system. Acclimatise the system unpowered to room temperature.
Do not disassemble the system! There is a high risk of getting a perilous electric shock. Capacitors still might be charged, even if the system has been removed from the power supply.
The electrical installations and equipments in industrial facilities must be observed by the security regulations and insurance institutions.
The use of the measuring system in schools and other training facilities must be observed by skilled personnel.
The measuring systems are not designed for use at humans and animals.
Please contact a professional if you have doubts about the method of operation, safety or the connection of the system.
Please be careful with the product. Shocks, hits and dropping it from already lower level may damage your system.
Please also consider the detailed technical reference manual as well as the security advices of the connected systems.
This product has left the factory in safety-related flawless and in proper condition. In order to maintain this condition and guarantee safety use, the user has to consider the security advices and warnings in this manual.
EN 61326-3-1:2008
IEC 61326-1 applies to this part of IEC 61326 but is limited to systems and equipment for industrial applications intended to perform safety functions as defined in IEC 61508 with SIL 1-3.
The electromagnetic environments encompassed by this product family standard are industrial, both indoor and outdoor, as described for industrial locations in IEC 61000-6-2 or defined in 3.7 of IEC 61326-1. Equipment and systems intended for use in other electromagnetic environments, for example, in the process industry or in environments with potentially explosive atmospheres, are excluded from the scope of this product family standard, IEC 61326-3-1.
Devices and systems according to IEC 61508 or IEC 61511 which are considered as “operationally well-tried”, are excluded from the scope of IEC 61326-3-1.
Fire-alarm and safety-alarm systems, intended for protection of buildings, are excluded from the scope of IEC 61326-3-1.
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About this document

2 About this document

This is the Technical Reference Manual for SIRIUS® Version 1.4.2.
The manual is divided into several chapters. You will find:
A description of the system and the main combination and expansion options
The description of the connection variants and the pin assignments on the inputs and outputs
A comprehensive introduction to the configuration of the modules using DEWESoft®
Technical data
Make sure to use at least the following versions of the software (we recommend to download the newest released software regularly from our homepage):
DEWESoft® Version X7.1-b108 or higher
Firmware of the SIRIUS® system/s must be: version 4.3.1.16. higher

2.1 Legend

The following symbols and formats will be used throughout the document.
IMPORTANT
Gives you an important information about a subject. Please read carefully!
HINT
Gives you a hint or provides additional information about a subject.
EXAMPLE
Gives you an example to a specific subject.
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Example Meaning Description
Cancel Button a button that you can click
File
Menu Item a menu item, will open a sub menu or a dialogue
Times New Roman
List Item an item in a list (or tree) that you can select
Events
Tab Sheet a tab sheet that you can select
C:\Program Files\OpenOffice.org 3\readme.txt
File Path and Name a file name or path
Windows Key a term any kind of term (maybe also compound)
SNR: 85dB Preliminary info Preliminary information: e.g. specifications that
are not confirmed yet
Table 1: Layout formats used in the documentation

2.2 Online versions

2.2.1 SIRIUS® technical reference manual

The most recent version of this manual can be downloaded from our homepage:
http://www.dewesoft.com/download
In the HW Manuals section click the download link for the SIRIUS® users manual.

2.2.2 DEWESoft® tutorials

The DEWESoft® tutorials document, provides basics and additional information and examples for working with DEWESoft® and certain parts of the program.
The latest version of the DEWESoft® tutorials can be found here:
http://www.dewesoft.com/download
In the the SW Manuals section click the download link of the DEWESoft 7 tutorials entry.
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Getting started

3 Getting started

This chapter will help you to install the software, connect your SIRIUS® system to the PC via USB and will show you how to configure DEWESoft®.
To follow these steps, you need the following items:
your brand new SIRIUS® system (included in the shipment)
your SIRIUS® USB stick (included in the shipment)
your PC with Windows 7 or Windows-XP installed (Windows-Vista is not recommended, but may work)

3.1 Software installation

This chapter will explain how to correctly install all the required software for your SIRIUS® system on your measurement PC.
The software installation procedures and screen-shots in chapter 3.1 Software installation refer to Windows® 7.

3.1.1 DEWESoft® installation

This chapter includes information about installing DEWESoft® on your computer in order to use your SIRIUS® system.
IMPORTANT
Do not connect your SIRIUS® system to the PC before the software installation is finished.
A general guideline of how to install DEWESoft® can be found here:
http://www.dewesoft.com/download?file=Dewesoft7_QuickStart.doc
SIRIUS® is supported in DEWESoft® 7.1 or higher.
Attach the SIRIUS®-USB stick to your computer and start the DEWESoft® installer by double clicking on the full installer executable file: at the time of writing it is called DEWESoftX_FULL_7_1_0_Beta98.exe (see Illustration 1).
HINT
In the future, there may be a newer version of the installer: e.g. DEWESoftX_FULL_7_1_0.exe, DEWESoftX_FULL_7_1_1.exe, etc.
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Illustration 1: DEWESoft® installer file
3.1.1.1 Uninstall previous version
If you already have an older incompatible version of DEWESoft® installed, the installer may show you this error dialogue:
Illustration 2: Uninstall previous version message
DEWESoft® can be uninstalled like any other windows program: Go to Start – Control Panel – Uninstall program then right-click on the item of your current DEWESoft® installation and select Uninstall from the pop-up menu and follow the instructions of the uninstall wizard.
Illustration 3: Uninstall previous DEWESoft® version
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Getting started
3.1.1.2 Installing new DEWESoft® version
The first screen you see is the Welcome Screen:
click Next > to continue.
In the License Agreement screen, read the license conditions carefully.
Illustration 4: Installer: Welcome Screen
Illustration 5: Installer: License Agreement
If you agree, select the I accept the terms of the license agreement radio box and click Next > to continue.
In the Setup Type page, you must select the type of installation.
Illustration 6: Installer: Setup Type
The default and recommended setup type is DEWESoft Measurement Unit.
Note, that the path of the DEWESoft® installation may vary depending on the setup type that you chose and on the number of hard-disk-partitions that are available on your system:
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In Illustration 7, you can see that two hard-disk-partitions
C: and D: exist (E: is a DVD drive)
In Illustration 8, you can see that only one hard-disk­partition C: exist (D: is a DVD drive)
Illustration 7: Two partitions Illustration 8: One partition
Table 2: Hard-disk-partitions
DEWESoft measurement unit
The setup type DEWESoft Measurement Unit will install DEWESoft® for highest performance and data safety.
If you have 2 or more hard-disk-partitions, then we recommend to to have all the data on the second partition (or even second hard disk or array of disks) which are separated from the system partition. The System partition gets fragmented over time and then the writing performance dramatically drops Therefore in this installation mode DEWESoft® binaries, setups as well as the data folder will be installed in the same folder e.g. D:/Dewesoft7) on the second hard-drive-partition. If you ever need to install a new operating system or need to reformat the system hard-drive-partition, the DEWESoft® installation can remain: just the device drivers need to be reinstalled.
Directory
name
Explanation Default path
Bin
contains DEWSoft.exe
D:\DEWESoft7\Bin\V7_1
Addons
.dll files for plugins must be copied into this directory
D:\DEWESoft7\Bin\V7_1\Addons
Data
this is where DEWESoft® will store your measurement data
D:\DEWESoft7\Data
Setups
this is where your DEWESoft® setup files will be stored
D:\DEWESoft7\Setups
System
this is where DEWESoft® project files are stored
D:\DEWESoft7\System\V7_1
Log
this is where DEWESoft® will store log files
D:\DEWESoft7\System\V7_1\Logs
Table 3: DEWESoft® directories (Measurement Unit Installation)
Windows standard
The setup type Windows Standard will install DEWESoft® binaries in the Windows program files folder and setups and data files in the My documents folder.
This installation fully complies with Windows installation policies and is recommended for installing DEWESoft® for viewing the data on corporate computers with strict IT policies.
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Getting started
Directory name Default path
Bin C:\Programme\DEWESoft7\Bin\V7_1
Addons C:\Programme\DEWESoft7\Bin\V7_1\Addons
Data
user dependant directory:
C:\Dokumente und Einstellungen\All Users\Dokumente\DEWESoft7\Data
Setups
user dependant directory:
C:\Dokumente und Einstellungen\All Users\Dokumente\DEWESoft7\Setups
System
user dependant directory:
C:\Dokumente und Einstellungen\All Users\Dokumente\DEWESoft7\System\V7_1
Log
user dependant directory:
C:\Dokumente und Einstellungen\All Users\Dokumente\DEWESoft7\System\V7_1\Logs
Table 4: DEWESoft® directories (Windows Standard Installation)
click Next > to continue.
The installer now let's you choose the Destination Location for the installation:
Illustration 9: Installer: Destination Location
Note that the path shown in the screen shot above is dependant on what setup type you have chosen.
IMPORTANT
Do not change the installation location! This might cause problems with some plugins and features of DEWESoft®.
click Next > to continue.
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Enter your customer information:
click Next > to continue.
Select the optional features that you want to install from the list. On production PCs it is recommended to only install the features, that you really need.
click Next > to continue.
Illustration 10: Installer: Customer Info
Illustration 11: Installer: Select Features
HINT
The information in the red rectangle of Illustration 10 is only available for setup type Windows Standard.
Select the language that you want to use in DEWESoft®:
Click Next > to continue.
Note: The language can be changed later in DEWESoft® at any time.
Now the installer has all the information that is required to start the installation:
Press Install to start the installation.
Illustration 12: Installer: Select Language
Illustration 13: Installer: Ready To Install
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Getting started
You may get a Windows Security warning (see Illustration
14). You can safely click on 'Install this driver software anyway' and continue the installation.
You may also get another Windows Security dialogue (see Illustration 15). You can check the 'Always trust software from “Dewesoft”' check-box and click the Install button to continue the installation.
Illustration 14: Windows Security Warning
Illustration 15: Windows Security Dialogue
Before the installation of any drivers, you may see a warning like this: After clicking OK, the driver will be installed:
Illustration 16: Driver installation warning
Illustration 17: Driver installation
When the DEWESoft® installation has completed successfully, you will see the final screen: Make sure to restart your PC after the installation:
Illustration 18: Installer: Complete Illustration 19: Installer: Restart
After the restart you will notice that there is a new icon in the Windows task tray: it is the DEWESoft® launcher which will pop up the DEWESoft® launcher program when you connect a Dewesoft measurement device (e.g. SIRIUS®, DEWE-43, ..).
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3.2 Connecting a Single Slice

First connect the power supply to the connector named POWER IN (see Illustration 20 below) of your SIRIUS® system/s (see 4.2.1.4 Power In on page 27).
Illustration 20: SIRIUS® chassis: connectors on the rear side
see also: 4.2 Connectors at the rear side on page 26
Then connect the USB cable (Illustration 21 above) to the rear-side of the SIRIUS® system (see connector named USB in Illustration 20 above). Finally connect the other side of the USB cable to the USB port of your computer:
When you connect your Dewesoft USB device for the first time to the USB port, automatically install the Dewesoft USB driver:
When the driver installation is complete Windows will show a notification message:
Illustration 22: Installing USB driver
Illustration 23: USB driver installation succeeded
When the driver installation is complete, Windows will show a notification Window:
Then the Dewesoft launcher will pop up and show you a list of all connected devices and their status. Finally click Run Dewesoft… to start DEWESoft®.
Illustration 24: USB Driver Notification
Illustration 25: Dewesoft Launcher
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Illustration 21: USB cable
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Getting started
If you see the Power Missing status in the Dewesoft Launcher, then connected the power cable to the measurement slice. As soon as the power is available, the status will switch to Ok.
Illustration 26: Dewesoft Launcher: Power Missing

3.3 Connecting Multiple Slices

When you connect multiple slices to the same S-BOX or PC, you must also connect the slices with synchronisation cables to the SYNC connectors (see Illustration 20 on page 16) on the rear side.
When everything is okay, the status will be Ok and you can click the Run Dewesoft… button to start DEWESoft®.
If the Sync status is Missing, then you must connect a sync cable to the measurement slices. Then the Sync status of both devices will switch to Ok.
Illustration 27: Dewesoft Launcher: All Okay Illustration 28: Dewesoft Launcher: Sync Missing

3.4 Simple Measurement

This chapter describes measurement basics, how to configure SIRIUS® and gives some details on the measurement setup.

3.4.1 Online Help

Note that this is just a quick start guide. For detailed information consult the online help. To open the online help you can press the key or click on Help and then select Manual from the pop-up menu.
Illustration 29: Online Help
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When DEWESoft® has started up, you will be in the Acquisition mode and see the Setup files list.
Click on Ch.setup (on the right of
Setup files) to switch to the Channel setup mode.
Illustration 30: Setup files

3.4.2 Analogue channel setup

In the analogue channel setup screen you can see all channels of your connected SIRIUS® systems. Per default only the first channel will be set to Used.
Unused channels will not show up in measure mode and can thus not be used for display, calculations or storing: thus, we will also set the other 7 channels to used. You can left-click on the Used column of channel 2 (), hold the mouse button and move the mouse down to channel 8 (): then release the mouse button and all 7 channels will be selected – this is shown by the black rectangle around the buttons. Then you can click into the selected region to toggle Used/Unused for all 7 channels at once. The selected channels will also be highlighted in the small preview image of the device ().
When you press the Setup button of a channel (the column at the right edge of the channel table – not shown in this screen-shot), you can change all settings of the channel amplifier.
You can also change the sample rate of the SIRIUS® slice ().
Illustration 31: Channel setup screen
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Getting started
3.4.2.1 Sample rate
One of the most important settings is the sample rate. The sample rate defines how many data points, SIRIUS® will transfer to DEWESoft®. So a higher sample rate also means that more data needs to be transferred via USB to your computer.
The sampling speed mainly depends on your application. To display your signal in time domain with a good time resolution, you should sample 10 to 20 times faster than the frequency of the signal that you want to measure. (for example 1 kS/s for a 50 Hz sinewave).
If you have a lot of high frequency components, it may be necessary to sample 100 times faster (e.g. 5 kS/s for the 50 Hz sinewave) or even more.
If you display only the frequency domain (FFT analysis), a 2.5 times faster sampling would be sufficient (125 S/s for the 50 Hz sinewave).
The higher the sampling rate, the better the time resolution. But also the file size will increase.

3.4.3 Measurement Mode

A click on Measure (at the right side of Ch. Setup in Illustration 31) will take you to the Recorder screen measure mode where you can already see live data (Note: the data will not be stored yet!):
Illustration 33: Measure mode
In measure mode you can have several measurement screens (). DEWESoft® will create 3 default screens: Recorder, Scope and FFT, but you can also create new screens or change the visual displays of the existing screens as you like.
See the chapter Displays design in the online-help (see 3.4.1 Online Help on page 17) for more details.
The most important sections of the Measure mode are highlighted in screen-shot Illustration 33:
: show the live measurement data in different measurement instruments which are depending on the selected measurement screen. In this case we see a recorder instrument witch displays all your measurement channels. You can use the channel-selector list () to assign measurement channels to the instruments. Each instrument has different settings. shows the settings of the currently selected recorder instrument.
To start storing the data to a file, press the Store button (). When you are done, press the Stop button to stop recording.
Now DEWESoft® has created a datafile with all the data that you have seen during the recording session. You can now click the Analysis button (on the left-top of the screen to the right of the Acquisition button) to go to Analysis mode.
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Illustration 32: Sample Rate
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3.4.4 Analysis Mode

When you have just stopped a measurement, DEWESoft® will automatically open the last recorded data file in Review mode, so that you can start the analysis right away:
Illustration 34: Analysis Mode: Review
The Review mode is much like the Measurement Mode. You will see the same measurement screens, the channel-selector list and the properties of the currently selected instrument.
Differences are:
: you have additional tool-buttons
: there is a Signal overview window which will show you the whole data of one selected channel of the data file
Now you can use the cursors to analyse you data, zoom in and out of the data, click Offline math to add computations based on your data, etc. You can also change the design of your measurement screens, print reports based on your data and export the data to other file formats for further analysis.
Details about all these functions can be found in the Analyse chapter of the online-help (see 3.4.1 Online Help on page
17).

3.5 Advanced configuration

Note, that the DEWESoft® launcher has already done the hardware setup for you – you can check this by going to Settings – Hardware setup...:
Illustration 35: DEWESoft®: Open Hardware setup
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HINT
If Hardware setup … is disabled, then click Acquisition and then Ch. setup (see Illustration 36):
Now that you are in channel Channel Setup mode, the Hardware setup … option will be enabled.
In the Analog tab sheet, DEWESoft USB must be selected in order to user you SIRIUS® device (see in the image below).
All SIRIUS® devices will be shown in the device list ().
If you add a device while this screen is open (or if your device is not shown yet), you can press the Auto Detect button () to scan for devices.
The Registration status () will show the license that is stored inside of the SIRIUS® device (see also
3.6 Licensing below).
Illustration 37: DEWESoft®: Demo mode
On the CAN tab-sheet DEWESoft USB is also selected so that you can use the CAN ports of your SIRIUS® device.
Illustration 38: SIRIUS® CAN ports

3.5.1 Counters and CAN

The use of analogue inputs, CAN inputs and digital interface is the same as with all other DAQ devices, which are supported in DEWESoft®. Please consult the DEWESoft® online-help for more information (see 3.4.1 Online Help on page 17).

3.6 Licensing

As soon as you activate your SIRIUS® system in the hardware setup (see 3.5 Advanced configuration above), DEWESoft® will be licensed and you are ready to go (the license information is stored in the SIRIUS® device). No need for any online or offline licensing!
Note, that all licenses regarding SIRIUS® will only work when the SIRIUS® system is connected to your PC and the device has been activated in the hardware setup.
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Illustration 36: Channel Setup
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3.7 Troubleshooting

If your SIRIUS® device is not found by DEWESoft®:
If you did not restart Windows after the software installation, restart now
Make sure, that you have started DEWESoft® version 7.1 or higher (7.0.x versions do not support SIRIUS®)
Make sure that the external power supply is connected and okay
Disconnect the USB cable and reconnect it. If this does not work, try to connect the USB cable to another USB port of your PC
Check if DEWESoft USB device shows up in the Windows Device Manager (under the node called Universal Serial Bus controllers)
Try to restart DEWESoft®
Try to restart the PC
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Enclosure Overview

4 Enclosure Overview

SIRIUS® is a data acquisition device, which offers the highest flexibility for inputs like voltage, current, temperature, strain, vibration, pressure, counters, CAN and more. The data-transfer to the PC can be done via USB or EtherCAT®.
The SIRIUS® system consists of Slices which contain up to 8 measurement Modules.
Each SIRIUS® module has one analogue channel. Some modules are available with an additional counter channel - those modules have a plus sign + at the end: e.g. SIRIUS ACC+, SIRIUS STGM+
Optionally available is a version with 8 analogue outputs on the side of a Slice (see 4.2.4 Analogue out version on page
29).
Multiple Slices can be combined and synced together to get a multi-channel solution.
Illustration 39: SIRIUS® hardware components

4.1 Enclosure types

You can choose from 2 types of enclosures for your SIRIUS® systems: Either the flexible Single slice or the compact Box version.

4.1.1 Single Slice

A single SIRIUS® slice can have up to 16 measurement modules (see 5 SIRIUS® Measurement Modules no page
47).
Each measurement module has one analogue channel. Some modules also have an optional counter channel (e.g. ACC+).
Depending on the motherboard that you use the slice can also have analogue output connectors at the rear side (see
4.2 Connectors at the rear side on page 26).
We offer several standard chassis with predefined modules (see 5.4 SIRIUS® Dual Core specifications on page 54), but you can also choose a customized slice with any combination of the SIRIUS® measurement modules (see
5.3 SIRIUS® Slice Configuration on page 52).
Illustration 40: Single SIRIUS® slice
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4.1.1.1 Click mechanism
You can use your SIRIUS® slices independently or combine them to a single fully-synchronised1 multi-channel measurement system with the clever click-mechanism.
Also the S-BOX (see 4.3 SIRIUS-SBOX2 on page 30) and the Battery Pack (see 7 Accessories on page 137) are fully compatible to this click-mechanism.
Illustration 41: Single SIRIUS® slice
4.1.1.2 Power/USB LED
LED status Description
Green USB and power are connected – ready for measurement
Red USB is connected, but power is missing.
You must connect the Power plug – see Power In on page 27
Off USB is not connected – SIRIUS® is switched off.
Note: Since SIRIUS® will be switched on only via USB the LED even remain off when you have connected the Power plug – you MUST connect USB – see USB on page 27

4.1.2 Multi Slice

In a single box you can have 1, 2, 3 or 4 slices, plus an optional S-BOX (see 4.3 SIRIUS-SBOX2 on page 30) at the bottom.
Illustration 42: S-BOX with one slice Illustration 43: 2-slices box Illustration 44: 4-slices box
The main advantage over the single slice version is that all the cabling between the slices is done internally – no external USB or sync cables necessary.
In Illustration 45 you can see that the upper 3 slices only have a CAN connector. The USB and sync and power connectors are all wired internally to the bottom slice.
Thus you only need to connect one USB cable to your PC.
Note: of course you can also choose to use the click-mechanism to connect S-BOX (see 4.3 SIRIUS­SBOX2 on page 30) and a Battery Pack (see 7 Accessories no page 137) to the bottom of this 4-slice box.
Illustration 45: Rear side of a box with 4 slices
1 You need to connect sync-cables to the sync-connectors (at the back of the measurement slices): see 4.2.1.2 Sync connectors: Pin-out (LEMO
4pin) on page 26
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Enclosure Overview

4.1.3 Extended Height Enclosure

Some modules may require a higher enclosure, depending on the connector type: e.g. the STGM+ (see 5.12.2 STGM+ (Counter) L1B7f on page 77):
The higher enclosures are available for the Single- and for the
Multi Slice version.
Illustration 46: Extended Height Enclosure

4.1.4 SIRIUS-R8

The complete SIRIUSx amplifier series is also available as modular rack system. All module combinations are possible
(except for the Extended Height Enclosure modules): The Dual-Core series can be mixed with HD (high density) and
HS (high speed) modules. You can even mix isolated and differential slices.
The analogue output option is available only for for the dual core series.
For more detailed information about the system please refer to 4.6 SIRIUS-R8 on page 36.
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SIRIUS®

4.2 Connectors at the rear side

4.2.1 Single Slice Version USB

The SIRIUS® USB chassis has following connectors at the rear side.
Illustration 47: SIRIUS chassis: connectors on the back side
4.2.1.1 CAN (DSUB-9)
See also connector CAN in Illustration 47 on page 26.
Pin Name Description
Illustration 48: SIRIUS-CAN: pin-out (DSUB-9)
1 +5V 5V supply
max. current: 500mA
2 CAN_LOW CAN low
3 DGND Digital Ground
4 RES Reserved
5 RES Reserved
6 DGND Digital Ground
7 CAN_HIGH CAN high
8 RES Reserved
9 +12V 12V supply
max. current: 200mA
CAN: Specifications
Interface type CAN 2.0B, up to 1MBit/s
Special applications OBDII, J1939, CAN output
Table 5: SIRIUS-CAN specifications
4.2.1.2 Sync connectors: Pin-out (LEMO 4pin)
Illustration 49: SIRIUS Sync connector: pin-out (LEMO
4pin)
Mating connector: FGG.00.302.CLAD27Z
When IRIG-synchronisation is used, the IRIG signal is on pins 1, 2.
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Enclosure Overview
Since there are 2 connectors it's easy to chain several SIRIUS® chassis (or DEWE-43, DS-CAN2, etc.) together. Note that there is no distinction between IN and OUT – it does not matter which connector you use.
4.2.1.3 USB
The USB connector is used to transfer the measurement data from the SIRIUS® device to the measurement PC.
4.2.1.4 Power In
Illustration 50: Power In
Connector 2pin
Pin Name
For the power supply an unregulated DC voltage between 6 and 36 Volts is required, which is connected to LEMO 1B connector on the rear side of the chassis.
Power In connector (on the device): EXJ.1B.302.CLA Mating connector (for the cable): FGJ.1B.302.CLLD52Z
1 V+
2 V-
4.2.1.5 Power Out
Illustration 51: Power Out
Connector 2pin
Pin Name
The Power Out power plug that can be used to chain several chassis together.
Power Out connector (on the device): EXG.1B.302.CLL Mating connector (for the cable): FGG.1B.302.CLAD52Z
1 V+
2 V-
4.2.1.6 GND connector
See connector GND in Illustration 47 on page 26.
For correct measurements, it is highly recommended to ground the SIRIUS® with GND banana plug on the rear side.
WARNING
It is mandatory to connect a ground cable to the GND connector of the SIRIUS® when you are working with high voltages: e.g. when you are working with the HV modules (see 5.9 HV on page 62).

4.2.2 Single Slice Version EtherCAT®

This chapter describes the connectors on the rear side of the SIRIUS® EtherCAT® slices (see also 5.1.2 EtherCAT® on page 47):
Illustration 52: SIRIUS® EtherCAT® rear side connectors
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4.2.2.1 EtherCAT® connector
The EtherCAT® connector can provide power and transfer the measurement data and synchronisation in one single cable.
Pinout
Illustration 53:
EtherCAT® pinout
Pin Name Colour
Connectors (on the device):
EGG.1T.308.CLN LemoT 8pin FEMALE EGJ.1T.308.CLD LemoT 8pin MALE
Mating connector (for the cable):
FGG.1T.308.CLA.1433 cable, MALE FGJ.1T.308.CLL.1433 cable FEMALE
1 V+ Red
2 GND Blue
3 RD- Blue
4 RD+ White
5 TD- Red
6 TD+ Yellow
4.2.2.2 EtherCAT®: USB connector
The USB connector on the SIRIUS® EtherCAT® slices is required to boost the data-throughput (see also
5.1.2 EtherCAT® on page 47): i.e. then the data can be transferred via EtherCAT® and USB at the same time.
Note: when you use multiple slices, then DEWESoft® must be the EtherCAT® master.
4.2.2.3 EtherCAT®: GND connector
See connector GND in Illustration 52 on page 27.
For correct measurements, it is highly recommended to ground the SIRIUS® with GND banana plug on the rear side.
WARNING
It is mandatory to connect a ground cable to the GND connector of the SIRIUS® when you are working with high voltages: e.g. when you are working with the HV modules (see 5.9 HV on page 62).

4.2.3 Multi Slice Version

In the Multi Slice Version, the bottom slice has the same connectors as the Single Slice Version. All other Slices have only a CAN connector. All other wiring is done inside of the enclosure (Power, Ground, Sync, USB).
Illustration 54: Rear side of the Multi Slice Version
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4.2.4 Analogue out version

The optional analogue output version has the same connectors, as the Single Slice version plus 8 BNC connectors for the analogue output channels (see also: 5.22 Analogue out OPTION on page 125):
Illustration 55: Rear side connectors of the Analogue-out version
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SIRIUS®
4.3 SIRIUS-SBOX2
The SIRIUS-SBOX2 is an integrated powerful PC in a rugged SIRIUS® chassis: with an Intel® Core™ i7 processor and a fast SSD drive. The SIRIUS-SBOX2 is available in the single slice version and also in the box version (see
4.1 Enclosure types on page 23).
High speed CPU Intel® Core™ i7 is the most powerful processor of the Intel® Core™ processor family.
High speed interfaces USB 3.0 (nearly 10 times faster than USB 2.0) and GLAN interfaces provide highest bandwidth for data-transfer from and to the S-BOX.
Removable High speed SSD With 180 MB/s write rate to the Solid State Disk, there is enough capability not only for transient recording, but also for e.g. external high-speed video cameras.
Flash option For even better performance and maximum safety and convenience, we recommend separating the operating system from the measurement data. With the S-BOX-FLASH120 option, the operating system is stored on an internal flash disk with 120 GB, while the measurement data is stored on the exchangeable SSD. This allows for a quick exchange of the SSD where your valuable data is stored on. This feature also allows to continue storing on a new media immediately.
Illustration 56: SIRIUS-SBOX2 with removable SSD

4.3.1 Specifications SBOX2

Physical Specifications Technical Specifications
Power Supply 9-36VDC Processor Intel® Core™ i7 processor
Power Consumption Typ. 25 W, (max. 55W) CPU clock frequency 4 x 2 GHz
Physical Dimensions 265x150x75 [mm] RAM 4 GB
Humidity (@60°C) 95% RH non-condensing Flash S-BOX-FLASH120 option
USB Front: 4x USB 3.0
Rear: 2x USB 2.0
SSD 240GB (960GB as option,
others on request)
Ethernet GLAN, WLAN Chipset Intel QM57
Operating Temperature 0 to 50°C Optional GPS 10Hz, 20Hz, 100Hz, RTK
Storage Temperature -40 to 85°C
Humidity 95% RH non condensing @ 60°C
Shock & Vibration VIBRATION SWEEP SINUS (EN 60068-2-6:2008)
VIBRATION RANDOM (EN 60721-3-2: 1997 - Class 2M2) SHOCK (EN 60068-2-27:2009)
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4.3.2 Front side

Illustration 57: SIRIUS-SBOX2: Connectors at the front side

4.3.3 Rear side

Illustration 58: SIRIUS-SBOX2: Connectors at the rear side
4.3.3.1 Power connector
Illustration 59: Power
Connector
Pin Name L2B3f
Power connector (on the S-BOX): ECG.2B.303.CLV Mating connector (for the cable): FGJ.2B.303.CLAD92
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
1 V+
2 GND
3 Remote-On
2
2 If not available then use pin 6 of the GPS connector
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4.3.3.2 Option: GPS connector
Illustration 60: GPS Connector
Pin Name
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
GPS port A is used for GPS-Display or for the RF-modem when RTK option is in use.
GPS port D is reserved. Do not connect!
1 +5V (max. 0.5A)
2 TXD GPS port A
3 RXD GPS port A
4 GPS PPS
5 GND
6 Remote-On
3
7 RXD GPS port D
8 TXD GPS port D
9 +12V (max. 0.5A)
4.4 SIRIUSf-SBOX
The SIRIUSf-BOX is an integrated powerful PC in a rugged SIRIUS® fanless chassis: with an Intel® Core™ i7 ULV processor and a fast SSD drive. The S-BOX is also available in a single slice version.
High speed CPU: Intel® Core™ i7 (3517UE) is the most powerful processor of the Intel® Core™ processor family for
fanless operation.
High speed CPU Intel® Core™ i7 is the most powerful processor of the Intel® Core™ processor family.
High speed interfaces USB 3.0 (nearly 10 times faster than USB 2.0) and GLAN interfaces provide highest bandwidth for data-transfer from and to the S-BOX.
Removable High speed SSD With 180 MB/s write rate to the Solid State Disk, there is enough capability not only for transient recording, but also for e.g. external high-speed video cameras.
Flash option For even better performance and maximum safety and convenience, we recommend separating the operating system from the measurement data. With the S-BOX-FLASH120 option, the operating system is stored on an internal flash disk with 120 GB, while the measurement data is stored on the exchangeable SSD. This allows for a quick exchange of the SSD where your valuable data is stored on. This feature also allows to continue storing on a new media immediately.
Illustration 61: SIRIUSf-SBOX with removable SSD
3 Remote-On may not be available for units before Q1/2013
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4.4.1 Specifications f-SBOX

Physical Specifications Technical Specifications
Power Supply 9-36VDC Processor Intel® Core™ i7-3517UE
Max. Power Consumption 30W CPU clock frequency 2x1.7GHz
Physical Dimensions 265x150x75 [mm] RAM 4 GB
Humidity (@60°C) 95% RH non-condensing Flash S-BOX-FLASH120 option
USB Front: 4x USB 3.0
Rear: 2x USB 2.0
SSD 240GB (960GB as option,
others on request)
Ethernet GLAN, WLAN Chipset Intel QM77
Operating Temperature -20 to 40°C GPS Optional: 10Hz, 20Hz, 100Hz,
RTK
Storage Temperature -40 to 85°C
Humidity 95% RH non condensing @ 60°C
Shock & Vibration VIBRATION SWEEP SINUS (EN 60068-2-6:2008)
VIBRATION RANDOM (EN 60721-3-2: 1997 - Class 2M2) SHOCK (EN 60068-2-27:2009)

4.4.2 Front Side

Illustration 62: SIRIUSf S-BOX Frontside

4.4.3 Rear Side

Illustration 63: SIRIUSf S-BOX: Connectors at the rear side
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4.4.3.1 Power connector
Illustration 64:
Power Connector 2pin
Pin Name L2B2f
Power connector (on the S-BOX): ECG.2B.302 Mating connector (for the cable): FGJ.2B.302
1 V+
2 GND
4.4.3.2 Option: GPS connector
Illustration 65: GPS Connector
Pin Name
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
GPS port A is used for GPS-Display or for the RF-modem when RTK option is in use.
GPS port D is reserved. Do not connect!
1 +5V (max. 0.5A)
2 TXD GPS port A
3 RXD GPS port A
4 GPS PPS
5 GND
6 Remote-On
4
7 RXD GPS port D
8 TXD GPS port D
9 +12V (max. 0.5A)
4.5 SIRIUS-R2D
The SIRIUS-R2D is a box that can have up to 2 SIRIUS ir/r slices (32 channels).
A Microsoft® Surface 2 Pro which must be mounted in the closable top cover and provides following features:
Technical Specifications
Display 10.6“ Full-HD, Touch screen
Processor Intel® Core™ i5
Operating System Windows® 7 Ultimate Multi-language
USB DEWESoft® X Professional
HINT
The Microsoft® Surface 2 Pro is not included, but can be ordered as an option.
4 Remote-On may not be available for units before Q1/2013
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4.5.1 Frontside

4.5.1.1 USB
The internal USB hub is connected via a USB3 connection to the Surface device.
4.5.1.2 Power connector
Illustration 66:
Power Connector 2pin
Pin Name L2B2f
Power connector (on the S-BOX): ECG.2B.302 Mating connector (for the cable): FGJ.2B.302
1 V+
2 GND
The supply voltage can be between 9 and 36V.
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4.5.1.3 Option: GPS connector
Illustration 67: GPS Connector
Pin Name
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
GPS port A is used for GPS-Display or for the RF-modem when RTK option is in use.
GPS port D is reserved. Do not connect!
1 +5V (max. 0.5A)
2 TXD GPS port A
3 RXD GPS port A
4 GPS PPS
5 GND
6 Remote-On
5
7 RXD GPS port D
8 TXD GPS port D
9 +12V (max. 0.5A)
4.5.1.4 Sync connectors: Pin-out (LEMO 4pin)
Illustration 68: SIRIUS Sync connector: pin-out (LEMO
4pin)
Mating connector: FGG.00.302.CLAD27Z
When IRIG-synchronisation is used, the IRIG signal is on pins 1, 2.
Since there are 2 connectors it's easy to chain several SIRIUS® chassis (or DEWE-43, DS-CAN2, etc.) together. Note that there is no distinction between IN and OUT – it does not matter which connector you use.
4.6 SIRIUS-R8
The SIRIUS-R8 is a rugged chassis which provides 8 slots for SIRIUS® measurement modules and has an integrated powerful PC: with an Intel® Core™ i7 processor and a fast SSD drive.
The SIRIUS-R8 has the highest possible data through-put, since each measurement module has a dedicated USB2 line to the CPU (no USB-hub).
5 Remote-On may not be available for units before Q1/2013
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High speed CPU Intel® Core™ i7 is the most powerful processor of the Intel® Core™ processor family.
High speed interfaces USB 3.0 (nearly 10 times faster than USB 2.0) and GLAN interfaces provide highest bandwidth for data-transfer from and to the S-BOX.
Removable High speed SSD With 180 MB/s write rate to the Solid State Disk, there is enough capability not only for transient recording, but also for e.g. external high-speed video cameras.
Flash option For even better performance and maximum safety and convenience, we recommend separating the operating system from the measurement data. With the S-BOX-FLASH120 option, the operating system is stored on an internal flash disk with 120 GB, while the measurement data is stored on the exchangeable SSD. This allows for a quick exchange of the SSD where your valuable data is stored on. This feature also allows to continue storing on a new media immediately.
Illustration 69: SIRIUS-R8 front-side

4.6.1 Specifications R8

Physical Specifications Technical Specifications
Power Supply 12-36VDC Processor Intel® Core™ i7 processor
Power Consumption Typ. 25 W, (max. 55W) CPU clock frequency 4x2 GHz
Physical Dimensions 447x309x147 [mm] RAM 4 GB
Humidity (@60°C) 95% RH non-condensing Flash S-BOX-FLASH120 option
USB Front: 4x USB 3.0 SSD
240GB (960GB as option, others on request)
Ethernet GLAN, WLAN Chipset Intel QM57
Operating Temperature 0 to 50°C
Optional GPS 10Hz, 20Hz, 100Hz, RTK
Storage Temperature -40 to 85°C
Humidity 95% RH non condensing @ 60°C
Shock & Vibration
VIBRATION SWEEP SINUS (EN 60068-2-6:2008) VIBRATION RANDOM (EN 60721-3-2: 1997 - Class 2M2) SHOCK (EN 60068-2-27:2009)
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4.6.2 Front Side

Illustration 70: SIRIUS-R8: Frontside
4.6.2.1 Power connector
Illustration 71:
Power Connector 2pin
Pin Name L2B2f
Power connector (on the S-BOX): ECG.2B.302 Mating connector (for the cable): FGJ.2B.302
1 V+
2 GND
4.6.2.2 Sync connectors: Pin-out (LEMO 4pin)
Illustration 72: SIRIUS Sync connector: pin-out (LEMO
4pin)
Mating connector: FGG.00.302.CLAD27Z
When IRIG-synchronisation is used, the IRIG signal is on pins 1, 2.
Since there are 2 connectors it's easy to chain several SIRIUS® chassis (or DEWE-43, DS-CAN2, etc.) together. Note that there is no distinction between IN and OUT – it does not matter which connector you use.
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4.6.2.3 Option: GPS connector
Illustration 73: GPS Connector
Pin Name
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
GPS port A is used for GPS-Display or for the RF-modem when RTK option is in use.
GPS port D is reserved. Do not connect!
1 +5V (max. 0.5A)
2 TXD GPS port A
3 RXD GPS port A
4 GPS PPS
5 GND
6 Remote-On
6
7 RXD GPS port D
8 TXD GPS port D
9 +12V (max. 0.5A)

4.6.3 Rear Side

Illustration 74: SIRIUS-R8: Rearside
6 Remote-On may not be available for units before Q1/2013
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4.7 SIRIUS-R8D
The SIRIUS-R8D is a rugged chassis which provides 8 slots for SIRIUS® measurement modules and has an integrated powerful PC: with an Intel® Core™ i7 processor and a fast SSD drive.
The SIRIUS-R8D has the highest possible data through-put, since each measurement module has a dedicated USB2 line to the CPU (no USB-hub).
Illustration 75: SIRIUS-R8D (left: front-side, right: rear-side)
High speed CPU Intel® Core™ i7 is the most powerful processor of the Intel® Core™ processor family.
High speed interfaces USB 3.0 (nearly 10 times faster than USB 2.0) and GLAN interfaces provide highest bandwidth for data-transfer from and to the S-BOX.
Removable High speed SSD With 180 MB/s write rate to the Solid State Disk, there is enough capability not only for transient recording, but also for e.g. external high-speed video cameras.
Flash option For even better performance and maximum safety and convenience, we recommend separating the operating system from the measurement data. With the S-BOX-FLASH120 option, the operating system is stored on an internal flash disk with 120 GB, while the measurement data is stored on the exchangeable SSD. This allows for a quick exchange of the SSD where your valuable data is stored on. This feature also allows to continue storing on a new media immediately.

4.7.1 Specifications R8D

Physical Specifications Technical Specifications
Power Supply 12-36VDC Processor Intel® Core™ i7 processor
Power Consumption Typ. 35 W, (max. 65W) CPU clock frequency 4 x 2 GHz
Physical Dimensions 447x309x165 [mm] RAM 4 GB
Humidity (@60°C) 95% RH non-condensing Flash S-BOX-FLASH120 option
USB
Front: 3xUSB3, 1xUSB2 Rear: 2x USB 2.0
SSD
240GB (960GB as option, others on request)
Ethernet GLAN, WLAN Chipset Intel QM57
Operating Temperature 0 to 50°C
Optional GPS 10Hz, 20Hz, 100Hz, RTK
Storage Temperature -40 to 85°C
Humidity 95% RH non condensing @ 60°C
Shock & Vibration
VIBRATION SWEEP SINUS (EN 60068-2-6:2008) VIBRATION RANDOM (EN 60721-3-2: 1997 - Class 2M2) SHOCK (EN 60068-2-27:2009)
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4.7.2 Front Side (Display)

Illustration 76: SIRIUS-R8D: Front-side

4.7.3 Rear Side

Illustration 77: SIRIUS-R8D: Rearside
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4.7.3.1 Power connector
Illustration 78:
Power Connector 2pin
Pin Name L2B2f
Power connector (on the S-BOX): ECG.2B.302 Mating connector (for the cable): FGJ.2B.302
1 V+
2 GND
4.7.3.2 Option: GPS connector
Illustration 79: GPS Connector
Pin Name
To power the system on, press the Power switch OR apply a voltage between 3 and 30V to Remote-On pin
To power off the system press the Power switch or reduce the voltage on Remote-On below 0.5V for more than one second.
GPS port A is used for GPS-Display or for the RF-modem when RTK option is in use.
GPS port D is reserved. Do not connect!
1 +5V (max. 0.5A)
2 TXD GPS port A
3 RXD GPS port A
4 GPS PPS
5 GND
6 Remote-On
7
7 RXD GPS port D
8 TXD GPS port D
9 +12V (max. 0.5A)
4.7.3.3 Sync connectors: Pin-out (LEMO 4pin)
Illustration 80: SIRIUS Sync connector: pin-out (LEMO
4pin)
Mating connector: FGG.00.302.CLAD27Z
When IRIG-synchronisation is used, the IRIG signal is on pins 1, 2.
Since there are 2 connectors it's easy to chain several SIRIUS® chassis (or DEWE-43, DS-CAN2, etc.) together. Note that there is no distinction between IN and OUT – it does not matter which connector you use.
7 Remote-On may not be available for units before Q1/2013
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4.8 Dimensions

All versions (Single Slice, Multi Slice, S-BOX) have the same depth:
Illustration 81: Dimensions: Single Slice Version

4.8.1 Single Slice Version

Illustration 82: Dimensions: Single Slice Version
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4.8.2 Multi Slice Version

Illustration 83: Dimensions: MultiSlice Version

4.8.3 Sirius R2D

Illustration 84: Dimensions: R2D
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4.8.4 Sirius R8D

Illustration 85: Dimensions: R8D
4.8.4.1 R8D Mounting
Front Handle Alu:
Vijak M5x10 Vgr.Gl TX RF
19'' Bracket:
Vijak M4X8 Vgr.Gl. TX RF
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4.8.5 Sirius R8

Illustration 86: SIRIUS® Rack Dimensions
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5 SIRIUS® Measurement Modules

5.1 Data Transfer Overview

Dewesoft offers SIRIUS® slices that can use different data-transfer technologies:
USB
high data-throughput allows for high sampling rates (up to 1MS)
extra connectors for power and synchronisation required
direct connection to USB ports on the PC
Standard EtherCAT®
only one single cable needed for data, synchronisation and power
data-throughput allows for sampling rates up to 20kS/s
direct connection to standard Ethernet port on the PC possible
DS-EtherCAT+
this is a Dewesoft enhancement to the EtherCAT® standard, so that we can combine the advantages of Standard Ethernet and USB data-transfer

5.1.1 USB

USB is a high speed data bus being able to transmit full speed data for all channels to the measurement PC.
The SIRIUS® USB slices allow sampling rates of up to 1MHz (high-speed) and can be directly connected to USB port s on the measurement PC (or S-BOX).
If a USB hub is used, the USB bandwidth is shared by the connected USB devices (i.e. SIRIUS® slices) and thus you may not be able to use the max. possible sampling rate. Note, that also the USB connectors on laptops are often internally connected to a USB hub!
Note, that this will for sure not happen when you use the SIRIUS-R8 (see 4.6 SIRIUS-R8 on page 36 ), because the internal wiring of the SIRIUS-R8 is designed with great care, so that none of the USB ports are shared and every single measurement slice can use the full maximum sampling rate: for all 64 (dual core) channels or 128 (high density) channels.
In comparison to the EtherCAT® version, the SIRIUS®-USB slices need extra connectors for power supply and synchronisation.

5.1.2 EtherCAT®

EtherCAT® - Ethernet for Control Automation Technology - is a 100 Mbit Ethernet-based fieldbus system. The protocol is standardized in IEC 61158 and is suitable for both hard and soft real-time requirements. EtherCAT® can be used for applications that require short data update times with low communication jitter (for precise synchronisation purposes).
5.1.2.1 Standard EtherCAT® features
Strong points of standard EtherCAT®:
Point to point communication
High distance between modules possible (75 m)
Only a single cable for power, data and synchronisation
100x faster than CAN bus
Real time performance
Physically fully compatible to Ethernet: i.e. same connector, no Gate-modules or adapters required
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Weak points of standard EtherCAT®:
Master sends the empty message train i.e. when DEWESoft® is the master and does not send the empty message for some reason, there will be no data on the bus
Real time performance required from computer
No data-buffer on the devices
Ethernet packet (no TCP/IP) is prone to data-loss
Time synchronisation is mostly done based on master precision of sending messages
→ this makes standard EtherCAT® good for real-time application, but not good for data-acquisition.
Since the standard EtherCAT® is originally intended for real time, it lacks few very important elements. This is why DEWESoft®uses an enhanced DS-EtherCAT+ protocol:
5.1.2.2 DS-EtherCAT+
In comparison to standard EtherCAT® the DS-EtherCAT+ protocol has following benefits:
Buffering: DEWESoft® EtherCAT® devices buffer the measurement data for some seconds, so that all data can still be accessed, even if the Master (i.e. DEWESoft® on Windows®) is a little late.
Synchronisation: DEWESoft® EtherCAT® devices can acquire the samples at an exact time stamp. The timestamp can be provided by an external timing source (e.g. GPS or IRIG)
Retransmit: since EtherCAT® packets are below the TCP/IP level, the standard protocol does not handle lost packets. The enhanced DS-EtherCAT+ protocol will detect lost packets and retransmit them.
Notes:
Since the SIRIUS® devices are EtherCAT® slaves, an external EtherCAT® master is required
EtherCAT® needs a dedicated network interface: i.e. you cannot mix EtherCAT® to your existing Intranet (LAN network) or Internet1 (i.e. connect them to the same Ethernet-switch)
In comparison to the SIRIUS-USB slices, the SIRIUS EtherCAT® modules do not have CAN and no analogue output
HINT
The maximum number of samples per device using EtherCAT® bus is 160 kS/sec for all transmitted channels: i.e. for 8 channels the rate would be 20 kHz. The maximum speed per bus is limited to the 100 Mbit EtherCAT® bus speed. When DEWESoft® is the master, it can utilize approximatively half of this bandwidth, but other masters might be more efficient.
5.1.2.3 EtherCAT® specifications
Max. Sample Rate ADC Type
8
20kS/sec (Dual Core), 10kS/sec (High Density) Note: High-speed modules are NOT supported.
Max. Throughput per slice 640 kByte/sec (=160kS/sec total rate)
Max. Throughput per chain 3200 kByte/sec (=800kS/sec total rate)
Max. distance between slices 75 meters
9
Max. number of slices10100 (additional power injectors required)
Connector type Lemo 1B 8 pin (Data and power supply)
8 The data rate decreases when you activate counter channels (8 Byte per counter channel) 9 The distance can easily be increased by using fiber optics instead of standard Ethernet cables 10 When the max. allowed current and supply voltage dropout is reached, you must add power injectors
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5.1.3 Data Transfer Combinations

DEWESoft® can only acquire data from Dewesoft Hardware which uses the DS-EtherCAT+ protocol.
The SIRIUS EtherCAT® slices have 2 modes of operation:
Buffered mode: for DEWESoft® software
Standard EtherCAT® mode: for standard EtherCAT® masters

5.2 Technology overview

5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB)

This new technology solves the often faced problem that the signal is just much higher than expected and therefore clipped. Dewesoft DUAL CORE ADC technology always gives you the full possible measuring range, because the signal is measured with a high and a low gain at the same time.
Illustration 87: Dual Core ADC (isolated)

5.2.2 SIRIUS®-HD-series: High density (16 channel per slice)

For highest channel density this solution offers 24Bit resolution with up to 200 kS/sec sample rate.
Illustration 88: High Density (isolated)

5.2.3 SIRIUS®-HS series: High speed and bandwidth

This series combines high bandwidth with alias free acquisition with 16 Bit of up to 1 MS/sec acquisition rate. The analogue anti-aliasing filter (100 kHz, 5th order, Bessel) is combined with a free programmable digital IIR filter block inside the FGPA. For bandwidth requirement of up to 2 MHz the complete filter chain can be bypassed.
Illustration 89: High Speed (isolated)
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5.2.4 Isolated version: USB

The (standard) SIRIUSi modules are isolated between themselves and the main board.
Some modules generate power for electronics and for external pins: this power supply is again isolated against other modules, the main board and the housing. Inside of one module, the power supply pins, counter and analogue inputs are not isolated between themselves (they have the same ground) that is available on the GND connector pin (e.g. The analogue input and the counter of one ACC+ module share the same GND).
Illustration 90: Isolated Motherboard
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5.2.5 SIRIUS® differential version: USB

The basic concept is the same like on the isolated version but without galvanic isolation for the module power supply and the data interface.
Illustration 91: Differential Motherboard

5.2.6 Isolated version: EtherCAT®

The basic concept is the same like on the isolated USB version but the EtherCAT® slices do not have CAN or analogue-output. They also do not have a separate sync-connector, since the synchronisation is done via the EtherCAT® protocol.
Illustration 92: EtherCAT® Motherboard
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5.3 SIRIUS® Slice Configuration

Standard Slice
SIRIUSi 8xACC
8 x ACC channels (see page 57)
SIRIUSi 6xACC, 2xACC+
6 x ACC, 2 x ACC+ channels (see page 57)
SIRIUSi 8xMULTI
8 x MULTI channels (see page 69)
SIRIUSi 8xSTGMv2
8xSTGMv2 channels (see page 76)
SIRIUSi 8xSTG
8 x STG modules (see page 87)
SIRIUSi 8xSTG-L2B10f
8xSTG-L2B10f channels (see page 91)
SIRIUSi HV
8 x HV channels (see page 62)
SIRIUSi-HS 8xHS-ACC
8xHS-ACC channels (see page 108)
SIRIUS-HD 16xHD-STGS
16 x HD-STGS channels (see page 103)
SIRIUS-HD 16xHD-LV
16 x HD-LV channels (see page 100)
Customized Slice
We can build a customised slice with exactly the modules that you want, in the order that you want. Example: 2 x ACC, 2 x ACC+, 1x MULTI, 1x STG, 2x HV
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5.4 SIRIUS® Dual Core specifications

High Dynamic: Dual Core with 2x24Bit
Analogue modules ACC CHG HV LV MULTI STG STGM
With counter and DIO ACC+ CHG+ - LV+ - STG+
STGM+
STGM-DB
Isolated version i
■ ■ ■ ■ ■ ■ ■
EtherCAT® version ■ ■ ■ ■ ■ ■ ■
Differential version ■ ■ - ■ ■ ■ ■
Rack version r
12
■ ■ ■ ■ ■ ■ ■
Fanless version f
■ - ■ ■
13
- - ■
Analogue Inputs
14
Inputs per module 1 1 1 1 1 1 1
Data Rate per
Channel [Hz]
USB 200k 200k 200k 200k 200k 200k 200k
EtherCAT® 20k 20k 20k 20k 20k 20k 20k
Vertical Resolution 2 * 24bit 2 * 24bit 2 * 24bit 2 * 24bit 2 * 24bit 2 * 24bit 2 * 24bit
Bandwidth 75 kHz 75 kHz 75 kHz 75 kHz 75 kHz 75 kHz 75 kHz
Voltage
±10 V,
±500 mV
±10 V,
±500 mV
±1200 V,
±50 V
±200 V to
±100 mV
±10 V to
±50 mV
±50 V to
±100 mV
±10 V to ±10 mV
Input coupling
DC, AC 1 Hz (3,10Hz SW)
DC, AC 0.1, 1,
10, 100Hz
DC DC, AC 1 Hz
(3,10Hz)
DC DC, AC 1 Hz
(3,10Hz SW)
DC
Sensor Excitation - - -
2-30V bipol.
0-24V unipol
max.0.2A/2W
0-12 V (<44mA)
and fixed 12 V, 5 V
0-20 V
max.0.1A/0.8W
0-60 mA
0-12 V,
max. 44mA
Bridge connections
(internal completion)
- - - Full
Full, Half,
¼ .120/350Ω
3-wire
Full, Half,
¼.120/350Ω
3 or 4-wire
Full, Half,
¼ 120/350Ω
3-wire
Programmable Shunt
(default Values)
- - - - 59.88kΩ
59.88kΩ,
175kΩ bipolar
100 kΩ, bipolar
IEPE/ICP Sensors 4 or 8mA 4, 8 or 12 mA - MSI MSI MSI MSI
Resistance - - - MSI MSI ■ MSI
Temp. (Pt100 to Pt2000) - - - MSI MSI ■ MSI
Temp. Thermocouple - - - MSI MSI MSI MSI
Potentiometer - - - - ■ ■ ■
Charge -
100,000 pC,
10,000 pC
- MSI MSI MSI MSI
Current ext. Shunt ext. Shunt - ext. Shunt ext. Shunt ext. Shunt ext. Shunt
TEDS interface ■ ■ - ■ ■ ■ ■
Advanced Functions
Sensor error detection, high dynamic range
Sensor error
detection in
IEPE and charge
mode (injection)
High Voltage
High Isolation
High sensor
power and
multi range
Analogue and digital inputs,
analogue out
Supports all strain types and high input range
Low power,
Sensor&Amp.
balance, Bipolar
shunt
Analogue input Connectors
Connector type (Default)
BNC BNC,
TNC
Banana DB9,
BNC,
Banana
DB15,
L2B16f
DB9,
L2B7f, L2B10f
DB9,
L2B8f
L2B16f
Digital types only on + slices
Counter (connector) 1 ch(L1B7f) 1 ch(L1B7f) - 1 ch(L1B7f)
1 ch(DB15)
1 ch(L2B16f)
1 ch(L1B7f)
1ch(L2B10f)
11
1 ch(L1B7f)
Digital Input (connector) 3 ch(L1B7f) 3 ch(L1B7f) - 3 ch(L1B7f)
3 ch(DB15)
3 ch(L2B16f)
3 ch(L1B7f)
1ch(L2B10f)11
3 ch(L1B7f)
Digital Output (connector) 1 ch(L1B7f) 1 ch(L1B7f) - 1 ch(L1B7f) -
1 ch(L1B7f)
1ch(L2B10f
)
11
1 ch(L1B7f)
Additional Information
Isolation Voltage
16
1000V 1000V CAT II 1000V 1000V 1000V 1000V 1000V
Power Consumption/Max
17
8W/15W 10W/18W 8W 10W/25W 15W/25W 15W/25W 11W/20W
Table 6: Dual Core Specifications
11 One digital IO per amplifier with Lemo 2B10f connector
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5.5 SIRIUS® HD and HS specifications

High Density: 24Bit, 16ch. per slice High Speed: 16 Bit with high bandwidth
Analogue modules HD-ACC HD-STGS HD-LV HS-ACC HS-CHG HS-HV HS-LV HS-STG
With counter and DIO - - - HS-ACC+ HS-CHG+ - HS-LV+ HS-STG+
Isolated version i
■ ■ ■ ■ ■ ■ ■ ■
EtherCAT® version ■ ■ ■ - - - - -
Differential version ■ ■ ■ ■ ■ - ■ ■
Rack version r
12
■ ■ ■ ■ ■ ■ ■ ■
Fanless version f
- - - - - ■ ■
13
-
Analogue Inputs
14
Inputs per module 2 2 2 1 1 1 1 1
Data Rate/
channel [Hz]
USB 200k 200k 200k 500 k 1 M 500 k 1 M 1 M
EtherCAT 10k 10k 10k - - - - -
Vertical Resolution 24 Bit 24 Bit 24 Bit 16 Bit 16 Bit 16 Bit 16 Bit 16 Bit
Bandwidth 75 kHz 75 kHz 75 kHz 500 kHz 500/20015 kHz 2 MHz 1 MHz 1 MHz
Voltage
±10 Volt to
±200 mV
±10 Volt to
±10 mV
±100 V to
±100mV
±10 Volt to
±200 mV
±10 Volt to
±100 mV
±1600 Volt to
±20 V
±100 Volt to
±50 mV
±50 V to
±20mV
Input coupling
DC,
AC 0.1,1Hz
(3,10Hz SW)
DC DC
DC, AC 1 Hz
(3,10Hz SW)
DC, AC (0.1,
1, 10, 100Hz)
DC
DC, AC 1 Hz (3,10Hz SW)
DC, AC 1 Hz (3,10Hz SW)
Sensor Excitation -
0 .. 12 Volt, max. 44mA
2..30V bipolar
0..24V unipol. max.0.2A/2W
- - -
2..30V bipolar
0..24V unipol. max.0.2A/2W
0 .. 20 V max.
0.1A/0.8W, 0 .. 60 mA
Bridge connections
(internal completion)
-
Full, Half,
¼ 120/350Ω
3 wire
Full - - - Full
Full, Half,
¼ 120/350Ω
3 or 4-wire
Programmable Shunt
(default Values)
- 100 kΩ - - - - -
59.88kΩ,
175kΩ, bipol.
IEPE/ICP Sensors 4,8 or 12mA MSI MSI 4 or 8mA 4,8 or 12mA - MSI MSI
Resistance - MSI MSI - - - MSI ■
Temp. (Pt100 to Pt2000) - MSI MSI - - - MSI ■
Temp. Thermocouple - MSI MSI - - - - ■
Potentiometer - ■ - - - - - ■
Charge - MSI MSI -
100,000 pC to 1,000 pC
- MSI MSI
Current ext. Shunt ext. Shunt ext. Shunt ext. Shunt ext. Shunt - ext. Shunt ext. Shunt
TEDS interface ■ ■ ■ ■ ■ - ■ ■
Advanced Functions
Sens. error
detection
Low power,
Sensor and
Amplifier
balance
Low power,
high input
range, high
sensor supply
High speed,
Sens. error
detection,
Sensor error
detection in
IEPE and
charge mode
(injection)
High Voltage
High
Bandwidth
High sensor
power and
multi range
High speed,
Support all
strain types
and high input
range
Analogue input connectors
Connector type (Default) BNC
DB9,
L1B10f
DB9,
BNC
BNC BNC Banana
DB9,
BNC, Banana
DB9
Digital types only on + slices
Counter (connector) - - - 1 ch(L1B7f) 1 ch(L1B7f) - 1 ch(L1B7f) 1 ch(L1B7f)
Digital Input (connector) - - - 3 ch(L1B7f) 3 ch(L1B7f) - 3 ch(L1B7f) 3 ch(L1B7f)
Digital Output (connector) - - - 1 ch(L1B7f) 1 ch(L1B7f) - 1 ch(L1B7f) 1 ch(L1B7f)
Additional Information
Isolation Voltage
16
500 V 500 V 500 V 1000 V 1000 V CAT II 1000 V 1000 V 1000 V
Power Cons./Max1710W/20W 11W/22W 11W/22W 15W/22W 10W/18W 8W 10W/25W 15W/25W
Table 7: HD and HS Specifications
12 Rack version modules not available with extended height (e.g. STG+). 13 Fanless operation only for BNC or Banana version (without excitation) 14 Pinout of analogue input connector may limit functionality. MSI-Option requires DB9 connector. 15 200kHz for Charge 16 Applies only to isolated SIRIUS version 17 One complete slice with same modules
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SIRIUS®

5.6 General Specifications

Misc
Power Supply 6-36V
DC
Operating Temperature -10 to 50°C (40°C for fanless series1)
Storage Temperature -40 to 85°C
Humidity 5% to 95% RH non condensing @ 60°C
Shock & Vibration
Sweep sinus (EN 60068-2-6:2008)
Random (EN 60721-3-2: 1997 - Class 2M2)
Shock (EN 60068-2-27:2009)
EMC EN 61326-1, EN 61000-3-2, EN61000-3-3
Counter
Timebase 102.4MHz
Time base accuracy Typical: 5 ppm, Max: 20 ppm
Max. Bandwidth 10MHz
Input Filter 500 ns, 1µs, 2µs, 4µs, 5µs and 7.5µs
Acquisition rate
Time base accuracy Typical: 5 ppm, Max: 20 ppm
Synchronisation
Delay between slices 50 nsec
USB: Max. Sync-cable length 100 m (Master/Slave), 200 m (Irig)
EtherCAT®: Max. cable length 75m
Table 8: SIRIUS® Modules: General Specifications
1 50°C with airflow of 3m/sec
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SIRIUS® Measurement Modules

5.7 ACC / ACC+

The ACC modules are perfect for sound and vibration IEPE channels.

5.7.1 ACC: Specifications

Inputs
Voltage, IEPE, current (ext. Shunt), ACC+ only: counter, discrete
ADC Type
24bit delta-sigma dual core with anti-aliasing filter (5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Ranges (Dual Core Low Range) ±10V (±500mV) ±500mV (NA)
Input Accuracy (Dual Core) ±0.1% of reading ±10(1)mV ±0.1 of reading ±1(NA)mV
Dynamic Range@10kS (Dual Core) 140 dB (160 dB) 135 dB (NA)
Typ. SNR@50kS (Dual Core) 107 dB (125 dB) 100 dB (NA)
Typ. CMR @ 50Hz (1kHz) 140 dB (120 dB) 140 dB (120 dB)
Gain Drift Typical 10 ppm/K, max. 30 ppm/K
Offset Drift Typical 2 μV/K + 10 ppm of range/K, max 2 μV/K + 20 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec)
Channel Cross talk 200 dB @ 50Hz; 165 dB @ 1kHz
Input Coupling DC, AC 1Hz (3 Hz, 10 Hz per SW)
Input Impedance 1 MΩ in parallel with 0.4nF
Overvoltage Protection In+ to In-: 50 V continuous; 200V peak (10msec)
IEPE mode
Excitation 4 or 8mA
Compliance voltage 25 Volt
Output Impedance >100 kΩ
Sensor detection Shortcut: <4Volt; Open: > 19Volt
Counters (ACC+ type only) 1 counter/3 digital input, fully synchronised with analogue data
Counter Modes counting, waveform timing, encoder, tacho, gear-tooth sensor
Input Level Compatibility CMOS, LVTTL
Input Protection ±25Volt continuous
Alarm output Open collector, max. 100mA/30Volt
Sensor supply 5V/100mA;12V/50mA
Additional Specifications
Input connector BNC
TEDS support IEPE mode only
Table 9: SIRIUS-ACC8 specifications

5.7.2 ACC BNC

Illustration 93: SIRIUS-ACC: pin-out
(BNC)
Illustration 94: SIRIUSi 8xACC

5.7.3 ACC+ (Counter) L1B7f

As an additional function to the ACC module, the ACC+ module also has a 7-pin Lemo connector for digital counters.
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Illustration 95: CNT: counter pin-out
(LEMO 7pin)
Illustration 96: SIRIUSi 6xACC, 2xACC+
Connector type L1B7f
Connector on the module: EGG.1B.307.CLL Mating cable connector: FGG.1B.307.CLAD52
Table 10: ACC+ counter connector type
Digital Output Configuration
The “switch” of the open collector output is closed when active.

5.7.4 ACC: Voltage

Illustration 97: ACC Voltage

5.7.5 ACC: IEPE

Illustration 98: ACC IEPE
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SIRIUS® Measurement Modules

5.8 CHG / CHG+

5.8.1 CHG: Specifications

Inputs Voltage, IEPE, Charge, current (ext. Shunt),
ADC Type 24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter
Sampling Rate Simultaneous 200kS/sec
Ranges (Dual Core Low Range) ±10V (500mV) ±500mV (NA)
Input Accuracy (Dual Core) ±0.05% of reading ±5 (0.5) mV ±0.05 of reading ±0.5 mV
Typ. Dynamic Range@10kS (Dual Core) 140 dB (155 dB) 130 dB (NA)
SNR@50kS (Dual Core) 107 dB (124 dB) 98 dB (NA)
Typ. CMR @ 50Hz (1 kHz) 140 dB (120 dB) 140 dB (120 dB)
Gain Drift Typical 10 ppm/K, max. 30 ppm/K
Offset Drift Typical 1 μV/K + 5 ppm of range/K, max 5 μV/K + 10 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec)
Channel Cross talk 180 dB @ 50Hz; 160 dB @ 1kHz
Input Coupling DC, AC (0.1 Hz, 1 Hz, 10 Hz or 100 Hz)
Input Impedance 1 MΩ in parallel with 100pF
Overvoltage Protection In+ to In-: 50 V continuous; 200V peak (10msec)
IEPE mode
Excitation 4, 8 or 12 mA
Compliance voltage 25 Volt
Output Impedance >100 kΩ
Sensor detection Shortcut: <4 Volt; Open: > 19Volt
Charge ranges (Low Range) ±100 000 pC (5000 pC) ±10 000 pC (500 pC)
Input accuracy (HPF 0.1Hz) ±0.5% of reading ±20 pC ±0.5% of reading ±5 pC
Dynamic Range@10kS (Dual Core) 130 dB (150 dB) 120 dB (140dB)
SNR@50kS (Dual Core) 107 dB (120 dB) 105 dB (118 dB)
Input coupling 0.01 Hz, 0.03 Hz, 0.1 Hz, 0.5 Hz, 1 Hz, 10 Hz or 100 Hz
Charge injection 1V
rms
, 20 Hz, 0.5% accuracy
Counters (only in CHG+ type) 1 counter/3 digital input, fully synchronised with analogue data
Counter Modes counting, waveform timing, encoder, tacho, geartooth sensor
Input Level Compatibility CMOS, LVTTL
Input Protection ±25Volt continuous
Alarm output Open collector, max. 100mA/30Volt
Sensor supply 5V/100mA;12V/50mA
Additional Specifications
Input connector BNC or TNC (others on request)
TEDS support IEPE mode only
Table 11: SIRIUS-CHG specifications
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5.8.2 CHG BNC

Illustration 99: SIRIUS-CHG: pin-out
(BNC)
Illustration 100: SIRIUSi 8xCHG

5.8.3 CHG+ (Counter) L1B7f

Illustration 101: CNT: counter pin-out
(LEMO 7pin)
Illustration 102: SIRIUSi 6xCHG, 2xCHG+
Connector type L1B7f
Connector on the module: EGG.1B.307.CLL Mating cable connector: FGG.1B.307.CLAD52
Table 12: CHG+ counter connector type
Digital Output Configuration
The “switch” of the open collector output is closed when active.
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5.8.4 CHG: Voltage

Illustration 103: CHG Voltage

5.8.5 CHG: IEPE

Illustration 104: CHG IEPE

5.8.6 CHG: Charge

Illustration 105: CHG Charge
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5.9 HV

The HV modules are perfect for high voltage measurements.

5.9.1 HVv2 Specifications

Inputs Voltage
ADC Type
24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter (5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Ranges (Dual Core Low Range) ±1200V (±50V) ±50V (NA)
Gain accuracy ±0.05% of reading
Offset accuracy (Dual Core) ±100 (50) mV ±50 mV
Typ. Dynamic Range@10kS (Dual Core) 142 dB (158 dB) 132 dB (NA)
Typ. SNR@50kS (Dual Core) 107 dB (120 dB) 95 dB (NA)
Typ. CMR @ 50Hz (1kHz) 85 dB (60 dB) 85 dB (60 dB)
Gain Drift Typical 5 ppm/K, max. 30 ppm/K
Offset Drift Typical 1 mV/K + 1 ppm of range/K, max 2 mV/K + 5 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.04° * fin [kHz] + 0.2° (@ 200 kS/sec)
Channel Cross talk 115 dB @ 50Hz; 90 dB @ 1kHz
Input Coupling DC
Input Impedance 10 MΩ || 2pF
Protection class CAT III 600 V; CAT II 1000 V
Overvoltage Protection In+ to In-: 1.8 kV
RMS
, Inx to GND: 1.4kV
RMS
)
Additional Specifications
Input connector Banana
TEDS support NA
Table 13: SIRIUS-HV specifications

5.9.2 HV: Banana

The HV modules are perfect for high voltage measurements.
Illustration 106: SIRIUS-HV pin-out
Banana plug
Illustration 107: SIRIUSi 8xHV-BAN
WARNING
It is mandatory to connect a ground cable to the GND connector of the SIRIUS® when you are working with high voltages (see also 4.2.1.6 GND connector on page 27)
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5.9.2.1 HV: Voltage
Illustration 108: SIRIUS-HV: Voltage
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5.10 LV / LV+

5.10.1 LVv2 Specifications

Inputs Voltage, full bridge strain, current (ext. Shunt)
ADC Type
24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter (5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Dual Core Ranges (Low Range) ±200V (10 V) ±10V (500 mV) ±1V (50 mV) ±100mV (5 mV)
Gain accuracy ±0.05% of reading
Offset accuracy (Dual Core) ± 40 (20) mV ±2 (1) mV ± 0.2 (0.2) mV ± 0.1 (0.1) mV
Offset accuracy after Balance Amplifier 2mV 0.1mV 0.02mV 0.01mV
Typ. Dynamic Range@10kS (Dual Core) 136 dB (146 dB) 137 dB (152 dB) 137 dB (147 dB) 130 dB (132 dB)
Typ. SNR@10kS (Dual Core) 109 dB (118 dB) 109 dB (126 dB) 109 dB (116 dB) 97 dB (97 dB)
Typ. CMR @ 50 Hz/400 Hz/10 kHz 70 / 70 / 55 dB 95 / 95 / 84 dB 105 / 105 / 95 dB 115 / 112 / 102 dB
Gain Drift Typical 10 ppm/K, max. 30 ppm/K
Offset Drift Typical 0.3 μV/K + 5ppm of range/K, max: 2 µV/k + 10 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec and 10 V Range)
Channel Cross talk 120 dB @ 10kHz (Range ≤ 10 V); 95 dB @ 10kHz (Range = 100V)
Input Coupling11DC, AC 1Hz (3 Hz, 10 Hz per SW)
Input Impedance (200V/20V Range) 10 (1) MΩ between IN+ or IN- against GND
Max. common mode voltage 200V and 20V Range: 200V; all other Ranges: 12 V
Input Overvoltage Protection 200V and 20V Range: 300V; all other Ranges: 100V (250 V peak for 10msec)
Excitation Voltage Unipolar or Bipolar Software selectable (programmable with 16 Bit DAC)
Excitation Level unipolar 0 .. 24 Volt; Predefined levels: 1, 2.5, 5, 10, 12, 15, 20 and V
DC
Excitation Level bipolar 2 .. 30 Volt; Predefined levels: 2.5, 5, 10, 12, 15, 24 and 30 V
DC
Accuracy ±0.1 % ±5 mV
Drift ±50 ppm/K ±100µV/K
Stability 10% to 90% load (bipolar) < 0.01%
Current limit 200 mA (2 Watt max. per channel, 12 Watt max. per Slice)
Protection Continuous short to ground
Bridge connection types Full bridge
Ranges @ 10 V
exc
(low Range) 2mV/V…1000mV/V free programmable with Dual Core
Input short, Sensor offset adjust Software selectable
Counters (only on LV+ type) 1 counter/3 digital input, fully synchronised and alarm output
Counter modes Counting, waveform timing, encoder, tacho, geartooth sensor
Input level compatibility CMOS, LVTTL
Input protection Up to ±25Volt
Alarm output Open collector, max. 100mA/30Volt
Sensor supply 5V/100mA; 12V/50mA
Additional Specifications
Misc function Excitation control monitoring, Amplifier Short, Single Ended/Differential
Input connector
DSUB 9, BNC, Banana (others on request)
TEDS support Standard + MSI adapters
Table 14: SIRIUS-LV specifications
1 In- must be within ±10V referred to GND(iso); for Ranges >10 V the DC value of In- is not rejected
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SIRIUS® Measurement Modules

5.10.2 LV+ (Counter) L1B7f

As an additional function to the ACC module, the ACC+ module also has a 7-pin Lemo connector for digital counters.
Illustration 109: CNT: counter pin-out
(LEMO 7pin)
Illustration 110: SIRIUSi 8xLV+
Connector type L1B7f
Connector on the module: EGG.1B.307.CLL Mating cable connector: FGG.1B.307.CLAD52
Table 15: LV+ counter connector type
Digital Output Configuration
The “switch” of the open collector output is closed when active.

5.10.3 LV BAN

Illustration 111: SIRIUS-LV pin-out
Banana plug
Illustration 112: SIRIUSi 8xLV-BAN
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SIRIUS®

5.10.4 LV BNC

Illustration 113: SIRIUS-LV: pin-out
(BNC)
Illustration 114: SIRIUSi 8xLV-BNC

5.10.5 LV DSUB-9

Illustration 115: SIRIUS-LV pin-out
DSUB-9
Illustration 116: SIRIUSi 8xLV
Digital Status Input
Pin 5 DI (Status) can be used for digital status input: i.e. show alarm status in DEWESoft® when a current clamp is open.
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5.10.5.1 LV DSUB-9: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
5.10.5.2 LV DSUB-9: Current
External Direct Shunt External Loop Powered Shunt
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5.10.5.3 LV DSUB-9: Bridge
Full Bridge
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5.11 MULTI

The MULTI modules are perfect for multi-purpose analogue in/out and digital/counters.

5.11.1 MULTI: Specifications

Inputs Voltage, full, ½, ¼ bridge (120Ω and 350Ω), current (ext. Shunt), counter, digital
ADC Type
24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter (5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Dual Core Ranges (Low) ±10V (±500mV) ±1V (50mV) ±100mV (±5mV) ±50mV (±2.5mV)
Input Accuracy ±0.05% of value ±10mV ±0.05% of value ±1mV ±0.05% of value ±0.2mV ±0.05% of value ±0.2mV
Typ. Dynamic Range@10kS (Dual Core) 137 dB (152 dB) 137 dB (147 dB) 135 dB (137 dB) 133 dB (133 dB)
Typ. SNR@10kS (Dual Core) 105 dB (121 dB) 104 dB (111 dB) 100 dB (101 dB) 95 dB (95 dB)
Typ. CMR @ 400Hz (1kHz) 86 dB (84 dB) 96 dB (95 dB) 112 dB (102 dB) 112 dB (102 dB)
Gain Drift Typical 10 ppm/K, max. 40 ppm/K
Offset Drift Typical 0.3 μV/K + 5 ppm of range/K, max 2 μV/K + 10 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec)
Channel Cross talk 120 dB @ 10kHz
Input Coupling/ Impedance DC / 10 MΩ
Overvoltage Protection In+ to In-: 50 V continuous; 200V peak (10msec)
Excitation Voltage Free programmable (16 Bit DAC)
Predefined levels 0, 1, 2.5, 5, 10 and 12 V
DC
Accuracy ±0.1 % ±10 mV
Drift ±50 ppm/K ±100 μV/K
Stability 10% to 90% load <0.01%
Current limit 45mA (0.4W max. Power)
Protection Continuous short to ground
Additional Fixed Excitations 12V (max. 50 mA); 5 V (max. 100 mA) Accuracy 5%
Bridge Connection Types Full bridge, ½ bridge, ¼ bridge (3-wire)
Ranges 2mV/V…1000mV/V free programmable with Dual Core
Internal Bridge Completion ½ bridge 1 kΩ and ¼ bridge 120Ω and 350Ω
Typ. Bridge Completion Accuracy 0.05 %; TCR: 5 ppm/K (others on request)
Internal Shunt Resistor 59.88 kΩ, software selectable (others on request)
Typ. Shunt Resistor Accuracy 0.05 %; TCR: 10 ppm/K (others on request)
Input Short, Sensor Offset Adjust Software selectable
Counters 1 counter/3 digital input, fully synchronised with analogue data
Counter Modes counting, waveform timing, encoder, tacho, gear-tooth sensor
Input Level Compatibility CMOS, LVTTL (protected up to ±25Volt continuous)
FRONT Analogue Out
18
1 channel, 24 bit sigma delta 200 kHz, ±10V
Accuracy ±0.1% of reading ±0.02 V
Temperature Drift ±50ppm/K of reading ± 200 µV/K
Output Impedance < 10 Ω
Maximum Output Current / Load 20 mA / > 1000 Ω
Output Protection Continuous short to ground
Additional Specifications
Input connector High Density DSUB - 15, LEMO - 2B 16pin (others on request)
TEDS support Standard + MSI adapters
Table 16: SIRIUS-MULTI specifications
18 Not available when ordered with the Analogue-out OPTION (see 5.22 Analogue out OPTION on page 125)
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5.11.2 MULTI DSUB-15

Illustration 117: SIRIUSi 8xMULTI
Pin Name Description
Illustration 118: SIRIUS-MULTI pin-out DSUB-15
1 TEDS TEDS
2 Exc- Excitation -
3 Exc+ Excitation +
4 R+ ¼ Bridge/Shunt
5 In+ Input +
6 Aout Analogue output
7 Sns+ Sense +
8 Sns- Sense -
9 GND Ground
10 In- Input -
11 +5V +5V supply
12 +12V +12V supply
13 IN0/A Counter input IN0/A
14 IN1/B Counter input IN1/B
15 IN2/Z Counter input IN2/Z
HINT
You can use the analogue input, analogue output and counters at the same time.
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5.11.2.1 MULTI DSUB-15: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
5.11.2.2 MULTI DSUB-15: Current
External Direct Shunt External Loop Powered Shunt
5.11.2.3 MULTI DSUB-15: Potentiometer
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5.11.2.4 MULTI DSUB-15: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire
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5.11.3 MULTI-L2B16f

Pin Name Description
Illustration 119: SIRIUS-MULTI-L2B16F pin-out
1 TEDS TEDS
2 Exc+ Excitation +
3 Exc- Excitation -
4 R+ ¼ Bridge/Shunt
5 In+ Input +
6 Aout Analogue output
7 Sns+ Sense +
8 Sns- Sense -
9 GND Ground
10 In- Input -
11 +5V +5V (max. 100mA) supply
12 +14V5 +14.5V (max. 50mA) supply
13 IN0/A Counter input IN0/A
14 IN1/B Counter input IN1/B
15 IN2/Z Counter input IN2/Z
16 -14V5 -14.5V (max. 50mA) supply
HINT
You can use the analogue input, analogue output and counters at the same time.
5.11.3.1 MULTI-L2B16f: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
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5.11.3.2 MULTI-L2B16f: Current
External Direct Shunt External Loop Powered Shunt
5.11.3.3 MULTI-L2B16f: Potentiometer
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5.11.3.4 MULTI-L2B16f: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire
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5.12 STGM / STGM+

The STG-M module is a universal amplifier perfectly fitting for strain gage and voltage measurements.

5.12.1 STGMv2: Specifications

Inputs Voltage, full bridge strain, ½ bridge strain, ¼ bridge strain (120Ω and 350Ω), current (ext. Shunt)
ADC Type
24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter (5.2.1 SIRIUS® Dual Core series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Dual Core Ranges (Low) ±10V (±500mV) ±1V (50mV) ±100mV (±5mV) ±10mV (±0.5mV)
Gain accuracy ±0.05% of reading
Offset accuracy (Dual Core) ±5 (2) mV ±0.5 (0.2) mV ±0.1 (0.1) mV ±0.1 (0.1) mV
Offset accuracy after Balance Amplifier 0.2mV 0.02mV 0.02mV 0.02mV
Typ. Dynamic Range@10kS (Dual Core) 137 dB (152 dB) 137 dB (147 dB) 130 dB (132 dB) 112 dB (112 dB)
Typ. SNR@10kS (Dual Core) 105 dB (121 dB) 104 dB (111 dB) 95 dB (95 dB) 75 dB (75 dB)
Typ. CMR @ 400Hz (1kHz) 86 dB (96 dB) 96 dB (95 dB) 110 dB (102 dB) 110 dB (102 dB)
Gain Drift Typical 10 PPM/K, max. 40 PPM/K
Offset Drift Typical 0.3 μV/K + 5 ppm of range/K, max 2 μV/K + 10 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec)
Channel Cross talk 120 dB @ 10kHz
Input Coupling DC
Input Impedance 10 MΩ
Overvoltage Protection In+ to In-: 50 V continuous; 200V peak (10msec)
Excitation Voltage Free programmable (16 Bit DAC)
Predefined levels 0, 1, 2.5, 5, 10 and 12 V
DC
Accuracy ±0.05 % ±2 mV
Drift ±50 ppm/K ±100 μV/K
Load stability: 0% to 100% load <0.01%
Noise @ 10V/350Ω < 150 µVrms@10 kS
Line regulation over 20Ω of change < 0.005% @ 120Ω load
Sense Impedance to Exc / to GND 100 kΩ / > 100 MΩ
Current limit 45mA
Protection Continuous short to ground
Bridge Connection Types Full bridge, ½ bridge, ¼ bridge (3-wire)
Ranges 2mV/V…1000mV/V free programmable with Dual Core
Internal Bridge Completion ½ bridge 1 kΩ and ¼ bridge 120Ω and 350Ω
Typ. Bridge Completion Accuracy 0.05 %; TCR: 5 ppm/K (others on request)
Internal Shunt Resistor 59.88 kΩ, software selectable (others on request)
Typ. Shunt Resistor Accuracy 0.05 %; TCR: 10 ppm/K (others on request)
Input Short, Sensor Offset Adjust Software selectable
Counters (only on STGMv2+ type) 1 counter / 3 digital input, fully synchronised and alarm outpu
Counter Modes counting, waveform timing, encoder, tacho, geartooth sensor
Input Level Compatibility CMOS, LVTTL
Input Protection ±25Volt continuous
Alarm output Open collector, max. 100mA/30Volt
Sensor supply 5V/100mA; 12V/50mA
Additional Specifications
Input connector DSUB - 9, Lemo2B 8pin, Lemo2B 16pin (others on request)
TEDS support Standard + MSI adapters
Table 17: SIRIUS STG-M specifications
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5.12.2 STGM+ (Counter) L1B7f

The STGM+ is the same as the STG-M but has an additional Lemo7 connector for the counter. Thus the enclosure is higher than the standard enclosure (see 4.1.3 Extended Height Enclosure on page 25).
Illustration 120: CNT: counter pin-out
(LEMO 7pin)
Illustration 121: SIRIUSi 8xSTGM+
Connector type L1B7f
Connector on the module: EGG.1B.307.CLL Mating cable connector: FGG.1B.307.CLAD52
Table 18: STGM+ Counter Specifications (per module)
Digital Output Configuration
The “switch” of the open collector output is closed when active.

5.12.3 STGM-DB

The STGM-DB is the same as the STG-M but has an additional DSUB-37 male connector for 8 counter or 24 digital inputs and an additional DSUB-25 female connector for 8 digital outputs. Thus the enclosure is higher than the standard enclosure (see 4.1.3 Extended Height Enclosure on page 25).
Illustration 122: SIRIUS-STGM-DB (2 slices)
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Illustration 123: DSUB 37 pins Illustration 124: DSUB 25 pins
1) this voltage is guaranteed to be <= 12V When the supply voltage is <12V, then this voltage will be 2V lower than the supply voltage: e.g. when the supply voltage is 10V, the voltage will be 8V
2) The supply voltage from the slice is routed to this pin.
Counters
Parallel use
8 counter/24 digital inputs fully synchronised with analogue
Modes counting, waveform timing, encoder, tacho, gear-tooth sensor
Digital Out High side switch to supply voltage with internal 3.9 kΩ pull
down, max. 150mA, short circuit protected.
Connector type DSUB 37 male, DSUB 25 female
Table 19: STGM-DB Counter Specifications (per module)
Digital Output Configuration
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5.12.4 STGM DSUB-9
Illustration 125: SIRIUSi 8xSTGM
Pin Name Description
Illustration 126: SIRIUS-STGM pin-out DSUB-9
1 Exc+ Excitation +
2 In+ Input +
3 Sns- Sense -
4 GND Ground
5 R+ ¼ Bridge/Shunt
6 Sns+ Sense +
7 In- Input -
8 Exc- Excitation -
9 TEDS TEDS
5.12.4.1 STGM DSUB-9: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
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5.12.4.2 STGM DSUB-9: Current
External Direct Shunt External Loop Powered Shunt
5.12.4.3 STGM DSUB-9: Potentiometer
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5.12.4.4 STGM DSUB-9: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire

5.12.5 STGM-L2B8f

Pin Name Description
Illustration 127: SIRIUS-STG-M: pin-out Lemo 8- pin
1 Exc+ Excitation +
2 In- Input -
3 In+ Input +
4 Exc- Excitation -
5 SHD Shield
6 Teds Teds
7 GND Ground
8 RES Reserved
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5.12.5.1 STGM-L2B8f: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
5.12.5.2 STGM-L2B8f: Current
External Direct Shunt External Loop Powered Shunt
5.12.5.3 STGM-L2B8f: Potentiometer
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5.12.5.4 STGM-L2B8f: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire
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5.12.6 STGM-L2B16f

Pin Name Description
Illustration 128: SIRIUS-STGM-L2B16f pin-out
1 TEDS TEDS
2 Exc+ Excitation +
3 Exc- Excitation -
4 R+ ¼ Bridge/Shunt
5 In+ Input +
6 nc Not Connected
7 Sns+ Sense +
8 Sns- Sense -
9 GND Ground
10 In- Input -
11 +5V +5V (max. 100mA) supply
12 +14V5 +14.5V (max. 50mA) supply
13 IN0/A Counter input IN0/A
14 IN1/B Counter input IN1/B
15 IN2/Z Counter input IN2/Z
16 -14V5 -14.5V (max. 50mA) supply
HINT
You can use the analogue input and counters at the same time.
5.12.6.1 STGM-L2B16f: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
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5.12.6.2 STGM-L2B16f: Current
External Direct Shunt External Loop Powered Shunt
5.12.6.3 STGM-L2B16f: Potentiometer
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5.12.6.4 STGM-L2B16f: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire
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5.13 STG / STG+

5.13.1 STGv2: Specifications

Inputs Voltage, full bridge strain, ½ bridge strain, ¼ bridge strain, potentiometer, RTD, Resistance
ADC Type 24bit delta-sigma dual core with 100/5 kHz analogue anti-aliasing filter (5.2.1 SIRIUS® Dual Core
series: High Dynamic (up to 160 dB) page 49)
Sampling Rate Simultaneous 200kS/sec
Dual Core Ranges (Low) ±50V (2.5 V) ±10V (500 mV) ±1V (50 mV) ±100mV (5 mV)
Gain Accuracy ±0.05% of reading
Offset Accuracy (Dual Core) ±20(10)mV ±2(1)mV ±0.2(0.2)mV ±0.1(0.1)mV
Offset Accuracy after Balance Amplifier ±1mV ±0.1mV ±0.02mV ±0.01mV
Typ. Dynamic Range@10kS (Dual core) 137 dB (147 dB) 137 dB (152dB) 137 dB (147dB) 135dB (137 dB)
Typ. SNR@10kS (Dual Core) 108 dB (118 dB) 107 dB (125 dB) 107 dB (113 dB) 100 dB (100 dB)
Typ. CMR @ 50Hz/400Hz/1kHz 56 / 56 / 56 dB 88 / 86 / 84 dB 97 / 96 / 95 dB 115 / 112 / 102 dB
Gain Drift Typical 10 ppm/K, max. 30 ppm/K
Offset Drift Typical 0.3 μV/K + 2 ppm of range/K, max 0.8μV/K + 10 ppm of range/K
Gain Linearity <0.02%
Inter Channel Phase-mismatch 0.02° * fin [kHz] + 0.1° (@ 200 kS/sec and 10V range)
Channel Cross talk
120 dB @ 10kHz (Range  10V); 95 dB @ 10kHz (Range = 50V)
Input Coupling1DC, AC 1 Hz (3 Hz, 10 Hz per SW)
Input Impedance 1 MΩ between IN+ and IN- for 50 V Range; all other Ranges > 1GΩ
Input overvoltage protection 50 V Range: 300 V; all other Ranges: 50V (200 V peak for 10msec)
Excitation Voltage Free programmable (16 Bit DAC)
Predefined levels 0, 1, 2.5, 5, 10, 15 and 20 V
CD
Accuracy ±0.05 % ±2 mV
Drift ±10 ppm/K ±100 μV/K
Load stability: 0% to 100% load < 0.01%
Line regulation over 20 Ω of change < 0.005% @ 120 Ω load
Noise @ 10 Volt / 350 Ω < 150 µVrms@10 kS
Sense Impedance to Exc / to GND 100 kΩ / > 100 MΩ
Current limit 100mA (max. 800mW)
Protection Continuous short to ground
Excitation Current Free programmable (16 Bit DAC)
Predefined levels 0.1, 1, 2, 5, 10, 20 and 60 mA
DC
Accuracy (> 10mA) 0.1% ±2μA [0.5% ±50 μA]
Drift (> 10mA) 15 ppm/K [100 ppm/K]
Compliance voltage 20 Volt, max. 500 mW
Output Impedance >1 MΩ
Bridge connection types full bridge, ½ bridge and ¼ bridge (3- or 4-wire)
Ranges 2mV/V…1000mV/V free programmable with Dual Core
Internal bridge completion ½ bridge and ¼ bridge 120Ω and 350Ω
Bridge completion accuracy 0.05 %; TCR: 5 ppm/K (others on request)
Internal Shunt resistor 59.88 kΩ and 175 kΩ, bipolar to Exc+ or Exc- (others on request)
Short resistor accuracy 0.05 %; TCR: 10 ppm/K (others on request)
Input short, Sensor offset adjust Software selectable
Table 20: SIRIUS-STG specifications I
1 In- must be within ±10V referred to GND(iso); for Ranges 100 V the DC value of In- is not rejected
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Counters (only on STGv2+ type) 1counter / 3 digital input, fully synchronised and alarm outpu
Counter Modes counting, waveform timing, encoder, tacho, gear-tooth sensor
Input Level Compatibility CMOS, LVTTL
Input Protection ±25Volt continuous
Alarm output Open collector, max. 100mA/30Volt
Sensor supply 5V/100mA; 12V/50mA
Additional Specifications
Misc. function Excitation level monitoring, self check function
Input Connector DSUB - 9, LEMO2B 7pin LEMO2B 10pin (others on request)
TEDS support Standard + MSI adapters
Table 21: SIRIUS-STG specifications II

5.13.2 STG+ (Counter) L1B7f

Illustration 129: CNT: counter pin-out
(LEMO 7pin)
Illustration 130: SIRIUSi 8xSTG+
Connector type L1B7f
Connector on the module: EGG.1B.307.CLL Mating cable connector: FGG.1B.307.CLAD52
Table 22: STG+ counter connector type
Digital Output Configuration
The “switch” of the open collector output is closed when active.

5.13.3 STG-L2B7f

Illustration 131: STG8 with 7-pin Lemo connectors
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Pin Name Description
Illustration 132: SIRIUS-STG: pin-out Lemo 7-pin
1 Exc+ Excitation +
2 Sns+ Sense +
3 In+ Input +
4 Exc- Excitation -
5 Sns- Sense -
6 In- Input -
7 R+ ¼ Bridge/Shunt
5.13.3.1 STG-L2B7f: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
5.13.3.2 STG-L2B7f: Current
External Direct Shunt External Loop Powered Shunt
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5.13.3.3 STG-L2B7f: Temperature
5.13.3.4 STG-L2B7f: Resistance
5.13.3.5 STG-L2B7f: Potentiometer
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5.13.3.6 STG-L2B7f: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire Quarter Bridge – 4 wire

5.13.4 STG-L2B10f

Illustration 133: STG8 with 10-pin Lemo connectors
Pin Name Description
Illustration 134: SIRIUS-STG: pin-out Lemo 10-pin
1 Exc+ Excitation +
2 Exc- Excitation -
3 In+ Input +
4 In- Input -
5 Sns+ Sense +
6 Sns- Sense -
7 Di-Cnt Digital I/O, Counter
8 TEDS TEDs
9 R+/SHUNT Resistance/SHUNT
10 GND GND-iso
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5.13.4.1 STG-L2B10f: Voltage
Voltage - Single Ended
Voltage – Differential
Use only when the sensor is powered by the excitation voltage of the module.
5.13.4.2 STG-L2B10f: Current
External Direct Shunt External Loop Powered Shunt
5.13.4.3 STG-L2B10f: Temperature
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5.13.4.4 STG-L2B10f: Resistance
5.13.4.5 STG-L2B10f: Potentiometer
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5.13.4.6 STG-L2B10f: Bridge
Full Bridge Half Bridge
Quarter Bridge – 3 wire Quarter Bridge – 4 wire
5.13.5 STG DSUB-9
Illustration 135: SIRIUS-STG pin-out
DSUB-9 Illustration 136: SIRIUS STG8 DSUB9
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