Before working on your thin client...................................................................................................................................... 5
ESD field service kit ..............................................................................................................................................................7
After working on your thin client......................................................................................................................................... 8
2 Removing and installing components............................................................................................. 9
Removing the easel stand............................................................................................................................................. 10
Installing the easel stand................................................................................................................................................12
Back cover............................................................................................................................................................................ 14
Removing the back cover..............................................................................................................................................14
Installing the back cover................................................................................................................................................15
Removing the VESA-mount bracket........................................................................................................................... 16
Installing the VESA-mount bracket.............................................................................................................................. 17
Removing the OSD board............................................................................................................................................. 18
Installing the OSD board................................................................................................................................................19
Removing the solid-state drive....................................................................................................................................20
Installing the solid-state drive....................................................................................................................................... 21
Removing the memory modules ................................................................................................................................. 22
Installing the memory modules.....................................................................................................................................23
Removing the wireless card......................................................................................................................................... 24
Installing the wireless card............................................................................................................................................25
Removing the heat sink................................................................................................................................................ 26
Installing the heat sink...................................................................................................................................................27
Removing the coin-cell battery....................................................................................................................................28
Installing the coin-cell battery...................................................................................................................................... 29
Removing the camera...................................................................................................................................................30
Installing the camera...................................................................................................................................................... 31
System board....................................................................................................................................................................... 32
Removing the system board........................................................................................................................................ 32
Contents3
Installing the system board...........................................................................................................................................33
Removing the speakers................................................................................................................................................ 35
Installing the speakers...................................................................................................................................................35
Removing the middle frame......................................................................................................................................... 36
Installing the middle frame............................................................................................................................................37
Removing the rubber feet............................................................................................................................................ 39
Installing the rubber feet...............................................................................................................................................39
Removing the display panel..........................................................................................................................................40
Installing the display panel............................................................................................................................................. 41
3 System setup.............................................................................................................................43
System Setup overview......................................................................................................................................................43
General screen options....................................................................................................................................................... 44
System Configuration screen options...............................................................................................................................45
Video screen option.............................................................................................................................................................46
Power management screen options................................................................................................................................. 50
POST behavior screen options...........................................................................................................................................51
Virtualization support screen options................................................................................................................................ 51
System Logs screen option................................................................................................................................................52
4 Troubleshooting your system...................................................................................................... 53
Enhanced Pre-Boot System Assessment diagnostics....................................................................................................53
Running the ePSA diagnostics.....................................................................................................................................53
Power behavior....................................................................................................................................................................54
Power state and LED status..............................................................................................................................................55
Use the following safety guidelines to protect your thin client from potential damage and to ensure your personal safety. Unless otherwise
noted, each procedure included in this document assumes that the following conditions exist:
•You have read the safety information that shipped with your thin client.
•A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order.
About this task
WARNING: Disconnect all power sources before opening the thin client cover or panels. After you finish working inside
the computer, replace all covers, panels, and screws before connecting to the electrical outlet.
NOTE: Before working on your thin client, read the safety information that shipped with your thin client. For additional
safety best practices information, see the Regulatory Compliance home page at www.Dell.com/regulatory_compliance.
CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and
simple repairs as authorized in your product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow
the safety instructions that ship with the product.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching
an unpainted metal surface at the same time as touching a connector on the back of the thin client.
CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by
its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.
CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables
have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you
disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also,
before you connect a cable, ensure that both connectors are correctly oriented and aligned.
NOTE: The color of your thin client and certain components may appear differently than shown in this document.
Before working on your thin client
You must perform the below steps before you work on the thin client.
About this task
NOTE:
regulatory_compliance.
Steps
1. Save and close all open files and exit all open applications.
2. Click Start > Power > Shut down to shut down your thin client.
For more safety best practices, see the Regulatory Compliance home page at www.Dell.com/
NOTE:
3. Disconnect your thin client and all the attached devices from their electrical outlets.
For shut down instructions, see documentation of the respective operating system.
Working on your thin client5
4. Disconnect all network cables from your thin client.
5. Disconnect all attached devices and peripherals, such as keyboard, mouse, and monitor, from your thin client.
Safety precautions
The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.
Observe the following safety precautions before you perform any installation or break/fix procedures involving disassembly or reassembly:
•Turn off the system and all attached peripherals.
•Disconnect the system and all attached peripherals from AC power.
•Disconnect all network cables, telephone, and telecommunications lines from the system.
•Use an ESD field service kit when working inside any tabletnotebookdesktop to avoid electrostatic discharge (ESD) damage.
•After removing any system component, carefully place the removed component on an anti-static mat.
•Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.
Standby power
Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are essentially
powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and suspended into a sleep
mode and has other advanced power management features.
Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board. Remove the
battery from portablestabletsnotebooks.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a
field service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare metal and never to a
painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and ensure that you remove all jewelry
such as watches, bracelets, or rings prior to bonding yourself and the equipment.
Electrostatic discharge—ESD protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,
memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent
problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is
an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in
previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
Two recognized types of ESD damage are catastrophic and intermittent failures.
•Catastrophic—Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate
and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and
immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.
•Intermittent—Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures
means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the
tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may
take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure.
Perform the following steps to prevent ESD damage:
•Use a wired anti-static wrist strap that is properly grounded. The use of wireless anti-static wrist straps is no longer allowed because
they do not provide adequate protection. Touching the chassis before handling parts does not ensure adequate ESD protection on
parts with increased sensitivity to ESD damage.
•Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
•When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing
material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static
electricity from your body.
•Before transporting a static-sensitive component, place it in an anti-static container or packaging.
Working on your thin client
6
ESD field service kit
The unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: antistatic mat, anti-static wrist strap, and bonding wire.
Components of an ESD field service kit
The components of an ESD field service kit are:
•Anti-static mat—The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-static
mat, your anti-static wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the
system being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat.
ESD-sensitive items are safe in your hand, on the ESD mat, in the system, or inside a bag.
•Anti-static wrist strap and bonding wire—The anti-static wrist strap and bonding wire can be either directly connected between
your wrist and bare metal on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware
that is temporarily placed on the mat. The physical connection of the anti-staticwrist strap and bonding wire between your skin, the
ESD mat, and the hardware is known as bonding. Use only Field Service kits with an anti-static wrist strap, mat, and bonding wire.
Never use wireless anti-static wrist straps. Always be aware that the internal wires of a anti-static wrist strap are prone to damage
from normal wear and tear, and must be checked regularly with a anti-static wrist strap tester in order to avoid accidental ESD
hardware damage. It is recommended to test the anti-static wrist strap and bonding wire at least once per week.
•ESD wrist strap tester—The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a
best practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the
best method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out if they have
one. To perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to
test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.
•Insulator Elements —It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are
insulators and often highly charged.
•Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example,
deploying the kit for a server environment is different than for a desktop or portable environment. Servers are typically installed in a
rack within a data center; desktops or portables are typically placed on office desks or cubicles. Always look for a large open flat work
area that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is
being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as
Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically
handling any hardware components
•ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are
preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.
The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the
new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts
should never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the
ESD mat, in the system, or inside an anti-static bag.
•Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be
returned to Dell, it is critical to place these parts in anti-static bags for safe transport.
ESD protection summary
It is recommended that all field service technicians use the traditional wired ESD grounding anti-static wrist strap and protective antistatic mat at all times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator
parts while performing service and that they use anti-static bags for transporting sensitive components.
Transporting sensitive components
When transporting ESD sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in
anti-static bags for safe transport.
Lifting equipment
Adhere to the following guidelines when lifting heavy weight equipment:
CAUTION:
1. Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.
2. Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
3. Lift with your legs, not your back.
Do not lift greater than 50 pounds. Always obtain additional resources or use a mechanical lifting device.
Working on your thin client
7
4. Keep the load close. The closer it is to your spine, the less force it exerts on your back.
5. Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your
body and back.
6. Follow the same techniques in reverse to set the load down.
After working on your thin client
About this task
CAUTION: You must not leave any stray or loose screws inside your thin client. This may damage your thin client.
Steps
1. Replace all screws and ensure that no stray screws remain inside your thin client.
2. Connect any external devices, peripherals, or cables you removed before working on your thin client.
3. Connect your thin client and all attached devices to their electrical outlets.
4. Turn on your thin client.
8Working on your thin client
Removing and installing components
Recommended tools
The procedures in this document require the following tools:
•Phillips head screwdrivers: #0, #1, and #2
•Plastic scribe
Screw list
Table 1. Wyse 5470 All-in-One
ComponentScrew typeQuantityScrew image
Cable coverM3x91
System board shieldM3x55
2
Solid-state drive/Intel Optane
card
WLAN card shieldM2x2.52
WLAN cardM2x2.51
System fanM3 x53
Pop-up camera assemblyM3x52
Pop-up camera bezelM3x55
Base coverM3x54
PSU cableM3x51
Power supply unit—PSUM3x51
M2x2.51
Power supply unit fan—PSU fan M3x52
Removing and installing components9
ComponentScrew typeQuantityScrew image
Input and Output bracketM3x53
System boardM3x59
SpeakersM3 4+7.1 XZN4
Power button boardM3x51
MicrophoneM2x2.52
Input and Output board shieldM3x52
Input and Output boardM2.5x3.52
Headset portM3x51
AntennasM2x2.52
Display panelM3x58
Middle frameM3x511
Stand
Removing the easel stand
Prerequisites
Follow the procedure in Before working on your thin client.
About this task
The following image indicates the location of the stand and provides a visual representation of the removal procedure.
Removing and installing components
10
Removing and installing components11
Steps
1. Pry up the stand cover off the back cover using a plastic scribe.
2. Slide and remove the stand cover from the back cover.
3. Remove the two screws (M4x8) that secure the easel stand to the stand bracket and lift the stand off the back cover.
Installing the easel stand
Prerequisites
If you are replacing a component, remove the existing component before performing the installation procedure.
About this task
The following image indicates the location of the easel stand and provides a visual representation of the installation procedure.
Removing and installing components
12
Removing and installing components13
Steps
1. Align the screw holes on the stand bracket to the screw holes on the easel stand.
2. Tighten the two screws (M4x8) that secure the easel stand to the chassis.
3. Slide and place the stand cover on the stand bracket.
Back cover
Removing the back cover
Prerequisites
1. Follow the procedure in Before working on your thin client.
2. Remove the stand.
About this task
The following image indicates the location of the back cover and provides a visual representation of the removal procedure.
Removing and installing components
14
Steps
1. Using a scribe, pry the back cover from the chassis.
2. Ensure all the notches are unlocked using the scribe around the thin client.
3. Lift the back cover away from the chassis of the thin client.
Installing the back cover
Prerequisites
If you are replacing a component, remove the existing component before performing the installation procedure.
About this task
The following image indicates the location of the back cover and provides a visual representation of the installation procedure:
Removing and installing components
15
Steps
1. Place the back cover on to the system chassis.
2. Align the notches on the back cover with the slots on the chassis.
3. Press the back cover to the system chassis and ensure all the locks are secured in position.
Next steps
1. Install the stand.
2. Follow the procedure in After working on your thin client.
Vesa-mount bracket
Removing the VESA-mount bracket
Prerequisites
1. Follow the procedure in Before working on your thin client.
2. Remove the stand.
3. Remove the back cover.
About this task
The following image indicates the location of VESA-mount bracket and provides a visual representation of the removal procedure.
Removing and installing components
16
Steps
1. Remove the four screws (M3x5) that secure the VESA-mount bracket to the middle cover.
2. Lift the VESA-mount bracket off the middle cover.
3. Note the speaker cable routing on the VESA-mount bracket and remove it from the routing guides.
Installing the VESA-mount bracket
Prerequisites
If you are replacing a component, remove the existing component before performing the installation procedure.
About this task
The following image indicates the location of the VESA-mount bracket and provides a visual representation of the installation procedure.
Removing and installing components
17
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