An
IXYS
Directed Energy, Inc.
Company
DE150-501N04A
RF Power MOSFET
N-Channel Enhancement Mode
Avalanche Rated
Low Qg and Rg
High dv/dt
Nanosecond Switching
Symbol Test Conditions Maximum Ratings
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
dv/dt
P
DHS
P
DAMB
T
J
T
JM
T
stg
T
L
Weight
TJ = 25°C to 150°C
TJ = 25°C to 150°C; R
Continuous
Transient
Tc = 25°C
Tc = 25°C, pulse width limited by TJM
Tc = 25°C
Tc = 25°C
I
≤ IDM, di/dt ≤ 100A/µs, VDD ≤ V
S
≤ 150°C, RG = 0.2Ω
T
j
IS = 0
Tc = 25°C
Derate 4.4W/°C above 25°C
Tc = 25°C
1.6mm (0.063 in) from case for 10 s
= 1 MΩ
GS
DSS
,
-55…+150 °C
-55…+150 °C
2 g
Symbol Test Conditions Characteristic Values
TJ = 25°C unless otherwise specified
V
V
I
I
R
g
GSS
DSS
DSS
GS(th)
DS(on)
fs
VGS = 0 V, ID = 3 ma
VDS = VGS, ID = 4 ma
VGS = ±20 VDC, VDS = 0
VDS = 0.8 V
V
GS
VGS = 15 V, ID = 0.5I
Pulse test, t ≤ 300µS, duty cycle d ≤ 2%
VDS = 15 V, ID = 0.5I
DSS TJ
= 0 TJ = 125°C
= 25°C
D25
, pulse test
D25
min. typ. max.
500 V
2 3 4 V
±100 nA
2.7 4.0 S
500 V
500 V
±20 V
±30 V
4.5 A
27 A
4.5 A
- mJ
3.5 V/ns
>200 V/ns
80 W
3.5 W
150 °C
300 °C
25
1.5
250
µA
µA
Ω
Preliminary Data Sheet
V
DSS
I
D25
R
DS(on)
P
DHS
= 500 V
= 4.5 A
=
= 80W
GATE
SG1 SG2
Features
•
Isolated Substrate
−
high isolation voltage (>2500V)
−
excellent thermal transfer
−
Increased temperature and power
cycling capability
•
IXYS advanced low Qg process
•
Low gate charge and capacitances
−
easier to drive
−
faster switching
•
Low R
•
Very low insertion inductance (<2nH)
•
No beryllium oxide (BeO) or other
hazardous materials
Advantages
•
Optimized for RF and high speed
switching at frequencies to >100MHz
•
Easy to mount—no insulators needed
•
High power density
DS(on)
1.5 ΩΩΩΩ
DRAIN
SD1 SD2
Directed Energy, Inc.
An
IXYS
Symbol Test Conditions Characteristic Values
Company
TJ = 25°C unless otherwise specified)
(
DE150-501N04A
RF Power MOSFET
R
C
C
C
T
T
T
T
Q
Q
Q
R
G
iss
oss
rss
d(on)
on
d(off)
off
g(on)
gs
gd
thJHS
600 pF
VGS = 0 V, VDS = 0.8 V
f = 1 MHz
VGS = 15 V, VDS = 0.8 V
ID = 0.5 IDM
= 0.2 Ω (External)
R
G
VGS = 10 V, VDS = 0.5 V
ID = 0.5 I
D25
DSS(max)
DSS
DSS
,
min. typ. max.
50 pF
5 pF
4 ns
4 ns
4 ns
4 ns
16 40 nC
2.0 6.0 nC
8.0 20 nC
1.5 K/W
Source-Drain Diode Characteristic Values
TJ = 25°C unless otherwise specified)
(
5
Ω
Symbol Test Conditions min. typ. max.
I
S
I
SM
V
SD
T
rr
Directed Energy, Inc. reserves the right to change limits, test conditions and dimensions.
DEI MOSFETS are covered by one or more of the following U.S. patents:
4,835,592 4,850,072 4,881,106 4,891,686 4,931,844 5,017,508
5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,486,715
5,381,025 5,640,045
VGS = 0 V
Repetitive; pulse width limited by T
IF = IS, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle ≤ 2%
JM
4.5 A
27 A
1.4 V
900 ns