Dave Embedded Systems AXEL LITE Hardware Manual
AXEL LITE
Solo / Dual / Quad
ARM Cortex-A9 MPCore
CPU Module
LITE LINE
HARDWARE
MANUAL
DAVE Embedded Systems
www.dave.eu
info@dave.eu
AXEL LITE Hardware Manual v. 0.9.5
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Table of Contents
1 Preface.....................................................................................................................................6
1.1 About this manual.............................................................................................................6
1.2 Copyrights/Trademarks....................................................................................................6
1.3 Standards..........................................................................................................................6
1.4 Disclaimers.......................................................................................................................6
1.5 Warranty...........................................................................................................................6
1.6 Technical Support.............................................................................................................7
1.7 Related documents...........................................................................................................8
1.8 Conventions, Abbreviations, Acronyms............................................................................8
2 Introduction............................................................................................................................10
2.1 Product Highlights...........................................................................................................12
2.2 Block Diagram................................................................................................................13
2.3 Feature Summary...........................................................................................................14
3 Design overview.....................................................................................................................16
3.1 Freescale i.MX6 application processor..........................................................................16
3.2 DDR3 memory bank.......................................................................................................18
3.3 NOR flash bank..............................................................................................................18
3.4 NAND flash bank............................................................................................................19
3.5 Memory Map...................................................................................................................19
3.6 Power supply unit...........................................................................................................20
3.7 CPU module connectors.................................................................................................20
4 Mechanical specifications......................................................................................................21
4.1 Board Layout..................................................................................................................21
4.2 Connectors.....................................................................................................................22
5 Power, reset and control........................................................................................................23
5.1 Power Supply Unit (PSU) and recommended power-up sequence...............................23
5.1.1 Power-up sequence................................................................................................24
5.1.2 Power rails and related signals...............................................................................25
5.2 Reset scheme and control signals.................................................................................26
5.2.1 CPU_PORn.............................................................................................................26
5.3 System boot....................................................................................................................27
5.3.1 Boot options............................................................................................................27
5.3.1.1SPI NOR / SD option........................................................................................27
5.3.1.2NAND / SD option.............................................................................................28
5.4 Clock scheme.................................................................................................................28
5.5 Recovery.........................................................................................................................28
5.5.1 JTAG Recovery.......................................................................................................28
5.5.2 USB Recovery.........................................................................................................29
5.5.3 SD/MMC Recovery..................................................................................................29
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5.6 Multiplexing.....................................................................................................................29
6 Pinout table............................................................................................................................30
6.1 Carrier board mating connector J2.................................................................................31
7 Peripheral interfaces..............................................................................................................39
7.1 Notes on pin assignment................................................................................................39
7.2 Gigabit Ethernet..............................................................................................................39
7.3 USB.................................................................................................................................40
7.3.1 USB Host.................................................................................................................40
7.3.2 USB OTG................................................................................................................40
7.4 Video Output ports..........................................................................................................41
7.4.1 LVDS........................................................................................................................41
7.4.1.1LVDS0...............................................................................................................42
7.4.1.2LVDS1...............................................................................................................42
7.4.2 HDMI........................................................................................................................43
7.4.3 Parallel RGB............................................................................................................44
7.5 Video Input ports.............................................................................................................45
7.5.1 Parallel RGB............................................................................................................45
7.5.2 MIPI CSI..................................................................................................................45
7.6 UARTs.............................................................................................................................45
7.6.1 UART1.....................................................................................................................46
7.6.2 UART2.....................................................................................................................46
7.6.3 UART3.....................................................................................................................47
7.6.4 UART4.....................................................................................................................47
7.6.5 UART5.....................................................................................................................47
7.7 SPI..................................................................................................................................48
7.7.1 ECSPI1....................................................................................................................48
7.7.2 ECSPI2....................................................................................................................49
7.7.3 ECSPI3....................................................................................................................49
7.7.4 ECSPI4....................................................................................................................50
7.7.5 ECSPI5....................................................................................................................50
7.8 I²C...................................................................................................................................51
7.8.1 I²C1..........................................................................................................................51
7.8.2 I²C2..........................................................................................................................51
7.8.3 I²C3..........................................................................................................................51
7.9 CAN................................................................................................................................52
7.9.1 FLEXCAN1..............................................................................................................52
7.9.2 FLEXCAN2..............................................................................................................53
7.10 JTAG.............................................................................................................................53
7.11 SD/SDIO/MMC..............................................................................................................54
7.11.1 MMC/SD/SDIO1....................................................................................................54
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7.11.2 MMC/SD/SDIO2....................................................................................................55
7.11.3 MMC/SD/SDIO3....................................................................................................56
7.12 PCI Express..................................................................................................................57
7.13 Audio interface..............................................................................................................57
7.14 Keypad..........................................................................................................................57
7.15 GPIO.............................................................................................................................58
8 Operational characteristics....................................................................................................59
8.1 Maximum ratings............................................................................................................59
8.2 Recommended ratings...................................................................................................59
8.3 Power consumption........................................................................................................59
8.3.1 Set 1........................................................................................................................59
8.3.2 Set 2........................................................................................................................60
8.4 Heat Dissipation..............................................................................................................60
9 Application notes....................................................................................................................63
Index of Tables
Tab. 1: Related documents........................................................................................................8
Tab. 2: Abbreviations and acronyms used in this manual.........................................................8
Tab. 3: CPU, Memories, Busses..............................................................................................14
Tab. 4: Peripherals...................................................................................................................15
Tab. 5: Electrical, Mechanical and Environmental Specifications...........................................15
Tab. 6: i.MX6 comparison........................................................................................................18
Tab. 7: DDR3 specifications.....................................................................................................18
Tab. 8: NOR flash specifications..............................................................................................19
Tab. 9: eCSPI1 pin mapping....................................................................................................19
Tab. 10: NAND flash specifications..........................................................................................19
Tab. 11: Power dissipation Vs.Thermal Resistance.................................................................61
Tab. 12: Ambient Temperature Vs.Thermal Resistance...........................................................61
Illustration Index
Fig. 1: AXEL-LITE- Powered by I.MX6 processor....................................................................10
Fig. 2: AXEL-LITE – Solo / Dual / Quad core ARM Cortex A9.................................................10
Fig. 3: AXEL LITE SOM (top view)............................................................................................12
Fig. 4: Board layout - Top view..................................................................................................21
Fig. 5: Board layout - Bottom view............................................................................................22
Fig. 6: On board JTAG connector J7........................................................................................53
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1 Preface
1.1 About this manual
This Hardware Manual describes the AXEL LITE CPU module design
and functions.
Precise specifications for the Freescale i.MX6 processor can be found in
the CPU datasheets and/or reference manuals.
1.2 Copyrights/Trademarks
Ethernet® is a registered trademark of XEROX Corporation.
All other products and trademarks mentioned in this manual are property
of their respective owners.
All rights reserved. Specifications may change any time without
notification.
1.3 Standards
DAVE Embedded Systems is certified to ISO 9001 standards.
1.4 Disclaimers
DAVE Embedded Systems does not assume any responsibility about
availability, supplying and support regarding all the products mentioned in
this manual that are not strictly part of the AXEL LITE CPU module.
AXEL LITE CPU Modules are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. DAVE Embedded
Systems customers who are using or selling these products for use in
such applications do so at their own risk and agree to fully indemnify
DAVE Embedded Systems for any damage resulting from such
improper use or sale.
1.5 Warranty
AXEL LITE is warranted against defects in material and workmanship for
the warranty period from the date of shipment. During the warranty
period, DAVE Embedded Systems will at its discretion decide to repair
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or replace defective products. Within the warranty period, the repair of
products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or
inadequate maintenance or handling by the buyer, unauthorized
modification or misuse, operation outside of the product’s environmental
specifications or improper installation or maintenance.
DAVE Embedded Systems will not be responsible for any defects or
damages to other products not supplied by DAVE Embedded Systems
that are caused by a faulty AXEL LITE module.
1.6 Technical Support
We are committed to making our product easy to use and will help
customers use our CPU modules in their systems. Technical support is
delivered through email to our valued customers. Support requests can
be sent to support- a xel@dave.eu.
Software upgrades are available for download in the restricted access
download area of DAVE Embedded Systems web site:
http://www.dave.eu/reserved-area. An account is required to access this
area and is provided to customers who purchase the development kit
(please contact support- a xel@dave.eu for account requests)..
Please refer to our Web site to http://www.dave.eu/products/axel-lite for
the latest product documentation, utilities, drivers, Product Change
Notifications, Board Support Packages, Application Notes, mechanical
drawings and additional tools and software.
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1.7 Related documents
Document Location
DAVE Embedded Systems
Developers Wiki
NXP i.MX 6Dual/6Quad
Applications
Processor Reference Manual
http://wiki.dave.eu/index.php/Main_
Page
http://cache.freescale.com/files/32
bit/doc/ref_manual/IMX6DQRM.pdf
?fpsp=1&WT_TYPE=Reference
%20Manuals&WT_VENDOR=FRE
ESCALE&WT_FILE_FORMAT=pdf
&WT_ASSET=Documentation
Tab. 1: Related documents
1.8 Conventions, Abbreviations, Acronyms
Abbreviation Definition
i.MX 6 APRM i.MX 6 Application Processor Reference
Manual
IPU Image Processing Unit
GPI General purpose input
GPIO General purpose input and output
GPO General purpose output
PCB Printed circuit board
RTC Real time clock
SOM System on module
TRM Technical Reference Manual
XELK Axel Embedded Linux Kit
Tab. 2: Abbreviations and acronyms used in this manual
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Revision History
Version Date Notes
0.8.0 February 2014 First Draft
0.8.5 February 2014 First Revision
0.9.0 February 2014 First Release
0.9.1 May 2014 Minor fixes
Added J7 pinout
Completed Section 5
Added UART4 interface
0.9.2 August 2014 Fixed PGOOD signal description
0.9.3 November 2014 Minor fixes
0.9.4 October 2016 Minor fixes
0.9.5 October 2016 Minor fixes
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2 Introduction
AXEL LITE is the new top-class Single - Dual - Quad Core ARM Cortex-
A9 CPU module by DAVE Embedded
Systems, based on the recent NXP i.MX6
application processor. Thanks to AXEL
LITE, customers have the chance to save
time and resources by using a compact
solution that permits to reach scalable
performances that perfectly fits the
application requirements avoiding
complexities on the carrier board. The use
of this processor enables extensive
system-level differentiation of new
applications in many industry fields, where
high-performance and extremely compact
form factor (67,5 mm x 43 mm) are key
factors. Smarter system designs are made possible, following the trends
Fig. 1: AXEL-LITE- Powered
by I.MX6 processor
in functionalities and
interfaces of the new, stateof-the-art embedded
products.
AXEL LITE enables
designers to create smart
products suitable for harsh
mechanical and thermal
environments, allowing the
development of high
Fig. 2: AXEL-LITE – Solo / Dual / Quad
core ARM Cortex A9
processing system, designers are able to share the application through
the multi-core platform and/or to divide the task on different cores in
order to match with specific application requirements (thanks to AMP is
possible to create application where RTOS and Linux works together on
different cores). AXEL LITE is designed in order to keep full compatibility
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computing and reliable
solutions. Thanks to the
tight integration between the
ARM Core-based
AXEL LITE Hardware Manual v. 0.9.5
with the LITE Line CPU modules where quality and reliability are
important factors.
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2.1 Product Highlights
● Unmatched performances thanks to Solo / Dual / Quad Core @ 1.2
GHz
● All memories you need on-board
● Boot from NOR for safe applications
● Enabling massive computing applications thanks to wide range DDR3
RAM memory up to 2GB
● Single 3V3 Power Supply
● Reduced carrier complexity: SDIO, dual CAN, USB, Ethernet with on-
board PHY, GPIOs
● Multiple video outputs available
● H264 Video encoding and decoding
● Multiple video inputs available
Fig. 3: AXEL LITE SOM (top view)
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2.2 Block Diagram
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2.3 Feature Summary
Feature Specifications Options
CPU NXP i.MX6 S/D/Q ARM Cortex A9 MPCore @
1.2 GHz
Cache L1: 32Kbyte instruction, 32Kbyte data
L2: Unified data/instruction, 1 MByte
RAM Default: up to 2GB DDR3 (for 4GB support
please contact our sales department)
x64 data bus width @ 533 MHz
Storage Bootable SPI NOR 16, 32, 64 MB
Flash NAND: all sizes, on request
Expansion bus One PCI Express 2.0 lane with integrated PHY
(5.0 GT/s Endpoint/Root Complex operations)
Tab. 3: CPU, Memories, Busses
Feature Specifications Options
Graphics
Controller
2D/3D Engines GPU2D cores for raster (R2D, Vivante GC320)
Video capture 1x RGB Parallel port 12 bit 1x MIPI CSI port
Video
processing
Coprocessors Media Processing Engine with NEON™ &
USB 1x 2.0 OTG port (PHY on board)
UARTs 5x UART ports (up to 1x full, up to 4x four-
GPIO Available lines, shared with other functions
16-/24-bit HD Display Port
1x HDMI 1.4 channel + DDC
1x TFT/RGB output port
2x LVDS output ports
and vector (V2D, Vivante GC355) graphics
acceleration
GPU3D core (Vivante GC2000) for
OpenGL/OpenGL ES/OpenVG/OpenCL API
acceleration
High performance, multi-standard VPU
Up to 1080p60 H264 decode
Up to 1080p30 H264 encode
VFPv3-D32 Floating-Point Unit
1x 2.0 Host port (PHY on board)
wires)
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Feature Specifications Options
(interrupts available)
Networks Default: Fast Ethernet 10/100 Mbps with
integrated PHY (for Gigabit support please
contact our sales department)
CAN 2x CAN 2.0B ports (1x with integrated PHY)
SD/MMC up to 3x SD 3.0 /SDIO 3.0/MMC 4.x compliant
controllers
Serial buses
Audio
Timers Enhanced Periodic Interrupt Timer
Debug JTAG IEEE 1149.1 Test Access Port
5x full-duplex SPI ports with four peripheral
chip selects
3x master and slave I²C interfaces
up to 3x I²S / SSI / AC97
General Purpose Timer
CoreSight™ and Program Trace Macrocell
(PTM)
Tab. 4: Peripherals
Feature Specifications Options
Supply Voltage Single 3.3V input, voltage regulation on board
Active power
consumption
Dimensions 67.5mm x 43mm
Operating
temperature
range
Connectors SODIMM 204 pins
See section 8.3 - Power consumption
Commercial: 0°C / +70°C
Industrial: -40°C / +85°C
Tab. 5: Electrical, Mechanical and Environmental Specifications
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3 Design overview
The heart of AXEL LITE module is composed by the following
components:
● NXP i.MX6 Solo / Dual / Quad core SoC application
processor
● Power supply unit
● DDR memory banks
● NOR and NAND flash banks
● 1x 204 pin SODIMM connector with interfaces signals
This chapter shortly describes the main AXEL LITE components.
3.1 Freescale i.MX6 application processor
The i.MX6 Solo/Dual/Quad processors feature NXP's advanced
implementation of the ARM® Cortex®-A9 MPCore, which operates at
speeds up to 1.2 GHz. They include 2D and 3D graphics processors,
1080p video processing, and integrated power management. As a result,
the i.MX6 devices are able to serve a wide range of applications
including:
● Automotive driver assistance, driver information, and
infotainment
● Multimedia-centric smart mobile devices
● Instrument clusters, and portable medical devices.
● E-Readers, smartbooks, tablets
● Intelligent industrial motor control, industrial networking, and
machine vision
● IP and Smart camera
● Human-machine interfaces
● Medical diagnostics and imaging
● Digital signage
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● Video and night vision equipment
● Multimedia-focused products
● Entertainment and gaming appliances
The i.MX6 application processor is composed of the following major
functional blocks:
● ARM Cortex-A9 MPCore 2x/4x CPU Processor, featuring:
1 Megabyte unified L2 cache shared by all CPU cores
NEON MPE co-processor
General Interrupt Controller (GIC) with 128 interrupt
support
Snoop Control Unit (SCU)
External memories interconnect
● Hardware accelerators, including:
VPU -Video Processing Unit
Two IPUv3H -Image Processing Unit (version 3H)
2D/3D/Vector graphics accelerators
● Connectivity peripherals, including
PCIe
SATA
SD/SDIO/MMC
Serial buses: USB, UART, I²C, SPI, ...
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AXEL LITE can mount three versions of the i.MX6 processor. The
following table shows a comparison between the processor models,
highlighting the differences:
Processor #
core
Clock L2
cach
s
i.MX6 Solo 1 800 MHz
1 GHz
i.MX6 Dual 2 850 MHz
1 GHz
1.2 GHz
i.MX6 Quad 4 850 MHz
1 GHz
1.2 GHz
512 KB 32 bit @
1 MB 64 bit @
1MB 64 bit @
3.2 DDR3 memory bank
DDR3 SDRAM memory bank is composed by 4x 16-bit width chips
resulting in a 64-bit combined width bank.
The following table reports the SDRAM specifications:
CPU connection
Size min
Size max
Multi-mode DDR controller (MMDC)
512 MB
2 GB (for 4GB support please contact
our sales department)
DDR3 Graphics
acceleration
e
400 MHz
533 MHz
533 MHz
3D: Vivante GC880
2D: Vivante GC320
Vector: N.A.
3D: Vivante GC2000
2D: Vivante GC320
Vector: Vivante GC335
3D: Vivante GC2000
2D: Vivante GC320
Vector: Vivante GC335
Tab. 6: i.MX6 comparison
IPU VPUSATA
-II
1x 1x N.A.
2x 2x Yes
2x 2x Yes
Width
Speed
3.3 NOR flash bank
NOR flash is a Serial Peripheral Interface (SPI) device. This device is
connected to the eCSPI channel 1. Specific models of the AXEL LITE
SOM provide the SPI NOR as boot memory.
The following table reports the NOR flash specifications:
CPU connection
64 bit
533 MHz
Tab. 7: DDR3 specifications
eCSPI channel 1
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Size min
Size max
Chip select
Bootable
For AXEL LITE models that have the NOR flash bank populated, the
eCSPI channel 1 is mapped by design on the following multiplexed pins:
NOR signal Function I.MX6 signal I.MX6 ball #
NOR_CS0n Chip select EIM_EB2 E22
NOR_DQ0/MOSI Serial Input EIM_D18 D24
NOR_DQ1/MISO Serial Output EIM_D17 F21
NOR_SCLQ Serial clock EIM_D16 C25
3.4 NAND flash bank
On board main storage memory is a 8-bit wide NAND flash connected to
the CPU's Raw NAND flash controller. Optionally, it can act as boot
peripheral.
The following table reports the NAND flash specifications:
CPU connection
16 MByte
64 MByte
ECSPI1_SS0
Yes
Tab. 8: NOR flash specifications
Tab. 9: eCSPI1 pin mapping
Raw NAND flash controller
Page size
Size min
Size max
Width
Chip select
Bootable
3.5 Memory Map
For detailed information, please refer to chapter 2 “Memory Maps” of the
i.MX Applications Processor Reference Manual.
512 byte, 2 kbyte or 4 kbyte
128 MByte
2 GByte
8 bit
NANDF_CS0
Yes
Tab. 10: NAND flash specifications
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3.6 Power supply unit
AXEL LITE, as the other LITE Line CPU modules, embeds all the
elements required for powering the unit, therefore power sequencing is
self-contained and simplified. Nevertheless, power must be provided
from carrier board, and therefore users should be aware of the ranges
power supply can assume as well as all other parameters. For detailed
information, please refer to Section 5.1 Power Supply Unit (PSU) and
recommended power-up sequence.
3.7 CPU module connectors
All interface signals AXEL LITE provides are routed through SODIMM
DDR3 204 pin (named J2). The dedicated carrier board must mount the
mating connector and connect the desired peripheral interfaces
according to AXEL LITE pinout specifications.
For mechanical information, please refer to Section 4 (Mechanical
specifications). For pinout and peripherals information, please refer to
Sections 6 (Pinout table) and 7 (Peripheral interfaces).
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