DATASHEETS tja1010 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TJA1010

Octal Low Side Driver (OLSD)

Preliminary specification
File under Integrated Circuits, IC18

1998 Feb 09

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

FEATURES

• Eight independent low side drivers

• Small outline/medium power package for surface

mounting, SO28 (20 + 4 + 4)

• Serial input control by writing to internal shift register

• Overvoltage clamping for each driver

• Each driver protected against short-circuited load

• Undervoltage shutdown

• All logic pins CMOS microcontroller compatible

• Standby mode for minimum current consumption

• Two status outputs indicating short-circuited load and

open load respectively at any driver stage

• Channel selective diagnostic information available by
reading from internal shift register

• Serial output allows cascading of several OLSDs

• Outputs can be used in parallel

• Two-stage thermal protection

• Power-on reset.

QUICK REFERENCE DATA

GENERAL DESCRIPTION

The TJA1010 is an octal low side driver for relays in
automotive applications.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

DD

supply voltage operating 5.5 − 25 V

load dump −−50 V

V

o(clamp)

R

o(on)

I

o

drain-to-source clamp voltage Io=20mA 506070V
on resistance Io= 0.2 A −−3Ω
output current continuous at all outputs;

T

=85°C

amb

−−0.2 A

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TJA1010T SO28 plastic small outline package; 28 leads; body width 7.5 mm SOT136-1

1998 Feb 09 2

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1998 Feb 09 3

handbook, full pagewidth

STBY

25

serial input

parallel
outputs

8-BIT

SHIFT

REGISTER

parallel

inputs

V

DD

SUPPLY

AND

REFERENCE

master

reset

8-BIT

LATCH

data

inputs

clock

24

UV
power-on

data

outputs

0 V

TEMPERATURE

PROTECTION

CURRENT

LIMITING

TJA1010

1

OUT1

3

OUT2

12

OUT3

14

OUT4

15

OUT5

17

OUT6

26

V

ref

OUT7

28

OUT8

BLOCK DIAGRAM

Octal Low Side Driver (OLSD) TJA1010

Philips Semiconductors Preliminary specification

latch

DQ

clock

&

serial clock

&

parallel

load

serial input

&

DELAY

T

stat

115410

Fig.1 Block diagram.

OL SC

1 1

&

6 to 9
20 to 23

2, 13

16, 27

GND1
to
GND4

&

19

MBH994

18

STATSCSTATOLGNDSIESISCLSO

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

PINNING

SYMBOL PIN DESCRIPTION

OUT1 1 output 1
GND1 2 ground 1
OUT2 3 output 2
SCL 4 serial clock input
SI 5 serial input
GND 6 ground
GND 7 ground
GND 8 ground
GND 9 ground
SO 10 serial output
SIE 11 serial input enable
OUT3 12 output 3
GND2 13 ground 2
OUT4 14 output 4
OUT5 15 output 5
GND3 16 ground 3
OUT6 17 output 6
STATSC 18 status output short-circuited load
STATOL 19 status output open load
GND 20 ground
GND 21 ground
GND 22 ground
GND 23 ground
V

DD

24 supply voltage
STBY 25 standby input
OUT7 26 output 7
GND4 27 ground 4
OUT8 28 output 8

handbook, halfpage

OUT1

1

GND1

2

OUT2

3

SCL

4

SI

5

GND

6

GND

7

TJA1010

8

GND
GND

9

SO

10

SIE

11

OUT3

12

GND2

13

OUT4

MBH990

Fig.2 Pin configuration.

28
27
26
25
24
23
22
21

20
19
18
17
16
1514

OUT8
GND4
OUT7
STBY
V

DD

GND
GND
GND
GND
STATOL
STATSC
OUT6
GND3
OUT5

1998 Feb 09 4

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

FUNCTIONAL DESCRIPTION (see Figs 1, 3 and 4) This octal low side driver is intended to drive relays in

automotive applications. It is optimized to withstand the
wide temperature and supply voltage range that is typical
for this application area. It consists of 8 protected outputs,
including diagnostic functions, controlled by a serial
interface. These outputs can be used in parallel without the
need for additional components.

Serial control interface

Serial control of the drivers is provided by an 8-bit shift
register with parallel outputs and an 8-bit latch which
controls the DMOS output stages. Using this configuration
the number of pins needed for control of the eight drivers
is reduced to three; Serial Input (SI), Serial CLock (SCL)
and Serial Input Enable (SIE). When pin SIE is LOW, serial
data at pin SI is shifted into the shift register at each
HIGH-to-LOW transition at the SCL pin and serial data is
shifted out at the Serial Output (SO) pin at a LOW-to-HIGH
transition on the SCL pin. The last bit read in before a
LOW-to-HIGH transition at the SIE pin is bit D8. A HIGH
level at the SI pin causes a driver to switch-on. With a
LOW-to-HIGH transition at the SIE pin, parallel output data
in the shift register is written to the 8-bit latch, which
controls the DMOS outputs. When SIE is HIGH, signals at
pins SI, SCL and SO are disabled. For pin SO this results
in a HIGH level because pin SO is an open-collector
output.

Diagnostic interface

The OLSD detects open loads and short-circuited loads at
each driver stage by comparing its output voltages (V
a reference voltage (V

). To allow distinction between

ref

o

) to

short-circuit and open load conditions, a short-circuit is
detected for Vo>V
detected for Vo<V

in the on-state, while an open load is

ref

in the off-state of a driver stage.

ref

In both cases the corresponding status pin is set to a LOW
level and the respective bit in the shift register is inverted
on a HIGH-to-LOW transition of SIE.

By writing a following byte into the shift register, its actual
contents (the control byte eventually modified by errors)
can be read out via pin SO. Comparing this byte with the
original control byte previously written, faults can be
localized and identified (e.g. open load at driver stage
number 5).

Protection of DMOS outputs

Each driver contains a DMOS power FET. The drivers are
protected against overvoltage, short-circuit and
overtemperature conditions.

An overvoltage clamp circuit at each driver causes the
respective DMOS power FET to turn partially on, if its
drain-to-source voltage level exceeds the clamp level
[V

]. Consequently each driver can withstand

o(clamp)

voltage peaks caused by turning off inductive loads, such
as relays coils without freewheel diodes. It should be noted
that if outputs are used in parallel the amount of inductive
energy which can be handled will not increase but will
remain equal to that of a single output.

Each driver is protected against a short-circuited load by
current limiting. In the event of a short-circuited load at a
driver stage, the current will be limited and the HIGH level
of its drain-to-source voltage will force the comparator
output to go HIGH. This in turn will set the STATSC pin to
a LOW level.

A two-stage temperature protection circuit is included to
protect the device against overheating caused by high
dissipation in the output transistors.

When the temperature exceeds the overtemperature
threshold level, it will switch-off those outputs with a
short-circuit condition for the duration of the
overtemperature condition. The status and diagnostic
function will not be influenced.

If the chip temperature still rises and exceeds the
emergency threshold level, the emergency shutdown will
become active and shut down all of the outputs until the
temperature drops below the overtemperature threshold.

The outputs are fully protected against short-circuit to
battery conditions for the whole supply voltage range.

To protect the outputs against device threatening
dissipation peaks, the overtemperature control is extended
with local power dissipation sensors. If one or more
outputs dissipate too much power all outputs with a
short-circuit condition will be switched off for the duration
of the local overtemperature condition.

To protect the outputs against high dissipation during load
dump, an overvoltage protection is included. This will
switch-off those outputs with a short-circuit condition if the
supply voltage exceeds the overvoltage threshold V

DD(0 V)

for the duration of the overvoltage condition.
The diagnostic and status information will not change due

to the interference of the overvoltage and overtemperature
protections.

To avoid a false LOW signal at the SC pin due to switching
transients at the DMOS outputs, the SC pin is disabled for
a sufficient delay time whenever a new input control byte
has been written into the 8-bit latch with a LOW-to-HIGH
transition of SIE.

1998 Feb 09 5

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

Other features

When using several OLSDs, input control and diagnostics
can be provided, as described above, without spending
further microcontroller pins by cascading, i.e. connecting

A power-on reset ensures a defined off state for all drivers
when the device is switched on i.e. by switching on the
power supply or by activating the device via the STBY pin.
Thus the STBY input can also be used as a reset pin.

the SO pin of one OLSD to the SI pin of the following
OLSD.

A standby input (STBY) pin allows the off state current
consumption in the OLSD to be minimized. Thus the OLSD
can be connected permanently to a battery.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DD

supply voltage continuous 0 25 V

transient 0 50 V

V

n

V

I(STBY)

V

o(STAT

input voltage at pins SI, SCL and SIE 0 5.5 V
input voltage at pin STBY 0 7 V

) output voltage at pins STATOL and

018V

STATSC

V

o(SO)

I

o

I

o(con)

I

clamp(rep)

output voltage at pin SO 0 18 V
output current internally limited
continuous output current Tj= 135 °C −0.2 +0.2 A

T

=95°C −0.3 +0.3 A

j

repetitive inductive turn-off current per

Tj= 135 °C; note 1 see Fig.5 A

output

E

clamp(rep)

repetitive inductive turn-off energy per

Tj=95°C; notes 1 and 2 − 5mJ

output

E

clamp(nrep)

non-repetitive inductive turn-off

Tj=95°C; notes 1 and 3 − 60 mJ

energy per output

T

vj

T

stg

V

esd

virtual junction temperature −40 +135 °C
storage temperature −55 +150 °C
electrostatic handling human body model − 3kV

machine model − 300 V

Notes

1. The amount of E
used in parallel it can handle the E

2. Defined for t

3. Defined for t

clamp
clamp

per output can NOT be added if outputs are used in parallel. Thus, if two or more outputs are

clamp

of one output.

clamp

= 1 ms.
= 5 ms.

1998 Feb 09 6

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th (j-amb)

R

th (j-sp)

Notes

1. Printed on an FR-4 board with minimum foot print.

2. Power uniformly divided over all outputs.

CHARACTERISTICS

= −40 to +135 °C; VDD= 11 to 13.5 V; V

T

j

Positive currents flow into the IC. All parameters are guaranteed over the temperature range by design, but only 100%
tested at T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DD

V

DD(UV)

V

DD(0V)

V

o(clamp)

I

LO

I

o(lim)

R

o

V

ref

δI

/δt maximum rise and fall time of

o

V

IH

V

i(hys)

V

IL

V

IL(STBY)

from junction to ambient in free air note 1 55 K/W
from junction to soldering point of ground pins

note 2 17 K/W

6 to 9 and 20 to 23

bat(max)=VDD

=25°C; unless otherwise specified.

amb

supply current Io= 0 mA; V

+ 1.5 V. All voltages are defined with respect to ground.

>3V −−5mA

STBY

<1V; VDD=13V;

V

STBY

−−10 µA

Tj=−40 to +85 °C
undervoltage shutdown threshold 2 − 4.3 V
overvoltage protection threshold 25 − 33 V
output clamp voltage Io=20mA 506070V
output leakage current

(one output)

off-state, Vo= 13 V; standby − 10 µA

off-state, V

=13V;

o

70 − 210 µA

operational

off-state, V

=1V;

o

40 − 180 µA

operational
output current limit (one output) on-state 0.3 − 0.55 A
output resistance (one output) Io= 0.2 A; VDD=13V;

−−3Ω

Tj= 135 °C

I

= 0.2 A; VDD=13V;

o

−−2.5 Ω

Tj=25°C

I

= 0.1 A; VDD= 5.5 V;

o

−−10 Ω

see Fig.6
open load/short-circuit reference

note 1 1 − 1.9 V
voltage

output current
HIGH-level input voltage at pins

VDD=13V; RL= 100 Ω;

note 2

−−100 mA/µs

3 −−V

SI, SCL, SIE and STBY
input voltage hysteresis at pins

note 2 0.2 − 1.2 V
SI, SCL and SIE

LOW-level input voltage at pins

−−0.8 V

SI, SCL and SIE
LOW-level input voltage at pin

−−1V

STBY

1998 Feb 09 7

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

SYMBOL P ARAMETER CONDITIONS MIN. TYP . MAX. UNIT

I

i

I

LI

R

i(STBY)

I

i(STBY)

V

STAT(L)

V

SO(L)

I

LO(SO)

f

clk

t

W(SCL)

t

d(SIE-SCL)

t

su(SIE-SCL)

t

d(SCL-SO)

t

su(SI-SCL)

t

h(SCL-SI)

t

h(SCL-SIE)

t

su(STBY)

t

h(STBY)

t

d(STAT)

T

th(otc)

T

th(ets)

input current at pins SCL and SIE Vi=3V 20 − 60 µA
input leakage current at pins SI,

SIE and SCl

off-state; Vi=3V;

Tj=85°C; V

STBY

−−5µA

<1V
input resistance at pin STBY Vi=1V; Tj<85°C40−150 kΩ
input current at pin STBY Vi=3V 20 − 60 µA
status LOW voltage I

= 1.6 mA −−0.4 V

STAT(L)

serial output LOW voltage ISO= 1.6 mA −−0.4 V
output leakage current at pin SO

and status outputs

off-state; Vo=5V;
V

<1V; Tj<85°C

STBY

−−10 µA

clock frequency −−1 MHz
SCL positive pulse width HIGH-to-LOW transition 500 −−ns
delay time from SIE HIGH to SCL

100 −−ns

LOW
set-up time from SIE LOW to SCL

250 −−ns

HIGH
delay time from SCL HIGH to SO

note 3 −−250 ns

valid
set-up time from SI to falling edge

150 −−ns

of SCL
hold time from falling edge of SCL

150 −−ns

to SI
hold time from SCL LOW to SIE

250 −−ns

HIGH
STBY set-up time from STBY

100 −−µs

HIGH to SIE LOW
STBY hold time from SIE HIGH to

10 −−µs

STBY LOW
delay time for status pin enable 40 100 250 µs
threshold overtemperature control − 170 −°C
threshold emergency temperature

− 190 −°C

shutdown

Notes

1. Open load is indicated for Vo<V

in the off-state, short-circuited load is indicated for Vo>V

ref

2. Guaranteed by design.

3. Delay caused by load excluded.

1998 Feb 09 8

in the on-state.

ref

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

handbook, full pagewidth

(1) Inverting only when error (open load/short-circuit).

SIE

SCL

shift

register

bit n

SI

SO

OUT2 corresponding to D8 old

previous

D8

B

(1)

n+1

D1

new

D1
old

D2

new

D2
old

D3

D4

new

newD5newD6newD7newD8new

D3

D4

old

oldD5oldD6oldD7oldD8old

corresponding to D1 oldOUT1

corresponding to D1 new

corresponding to D8 new

MBH992

Fig.3 Serial interface timing.

1998 Feb 09 9

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

ndbook, full pagewidth

STBY

SIE

SCL

SI

SO

t

su(STBY)

t

d(SIE-SCL)

don't care

t

h(STBY)

previous

t

d(SCL-SO)

t

w(SCL)

t

su(SI-SCL)

valid

valid

t

d(SCL-SIE)

t

h(SCL-SI)

Fig.4 Input and output waveform timing.

70%
16%

70%
16%

70%
16%

70%
16%

5 V

0 V
5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

MBH993

0.16

handbook, full pagewidth

I

clamp

(A)

0.14

0.12

0.10

0.08

0.06

0.04

0.02

0

0

The curve is based on behaviour of relays; Siemens A4001-X40.

100 200 300 400 500

Fig.5 Maximum current during inductive turn-off (T

amb

=85°C).

t (µs)

MGL379

600

1998 Feb 09 10

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

12

handbook, full pagewidth

R

on

(Ω)

10

8

6

4

2

0

56

MGL380

789 11121314

10

V

(V)

DD

Fig.6 Maximum on-resistance as a function of supply voltage.

15

handbook, full pagewidth

MICROCONTROLLER

+

5 V

REGULATOR

+

5 V

R1

STBY

SIE

SCL

SI

R3R2

SO

STATSC

OL

Fig.7 Application example.

1998 Feb 09 11

V

DD

TJA1010

GND

100 nF 100 µF

C2 C1

OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8

D1

load
load
load
load
load
load
load
load

MBH991

V

bat

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

PACKAGE OUTLINE

SO28: plastic small outline package; 28 leads; body width 7.5 mm

D

c

y

Z

28

pin 1 index

1

e

15

14

w M

b

p

SOT136-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

A

max.

2.65

0.10

OUTLINE
VERSION

SOT136-1

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

IEC JEDEC EIAJ

075E06 MS-013AE

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

(1)E(1) (1)

cD

18.1

7.6

7.4

0.30

0.29

1.27

0.050

17.7

0.71

0.69

REFERENCES

1998 Feb 09 12

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

0.035

0.004

0.016

ISSUE DATE

95-01-24
97-05-22

o

8

o

0

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Feb 09 13

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Feb 09 14

Philips Semiconductors Preliminary specification

Octal Low Side Driver (OLSD) TJA1010

NOTES

1998 Feb 09 15

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Tel. [phone], Fax.[phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax.[phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC,MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax.[phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax.[phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax.[phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax.[phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax.[phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 615102/00/01/pp16 Date of release: 1998 Feb 09 Document order number: 9397 750 01763