Product specification
File under Integrated Circuits, IC01
February 1990
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
GENERAL DESCRIPTION
The TEA5591A is a 24-pin integrated radio circuit, derived from the TEA5591 and is designed for use in AM/FM portable
radios and clock radios. The TEA5591A differs from the TEA5591 in that it has:
• Separate IF input pins for AM and FM
• A split-up AM-IF stage (for distributed selectivity)
• An LED driver indicator
The main advantage of the TEA5591A is its ability to operate over a wide range of supply voltages (1.8 to 15 V) without
any loss of performance.
The AM circuit incorporates:
• A double balance mixer
• A ‘one-pin’ oscillator with amplitude control operating in the 0.6 to 30 MHz frequency range
• A split-up IF amplifier
• A detector
• An AGC circuit which controls the IF amplifier and mixer.
The FM circuit incorporates:
• An RF input amplifier
• A double balanced mixer
• A ‘one-pin’ oscillator
• Two IF amplifiers (for distributed selectivity)
• A quadrature demodulator for a ceramic filter
• Internal AFC
Features
• LED AM/FM indicator
• A DC AM/FM switch facility
• Three separate stabilizers to enable operation over a wide range of supply voltages (1.8 to 15 V)
• All pins (except pin 10) are ESD protected
PACKAGE OUTLINE
24-lead shrink DIL; plastic (SOT234); SOT234-1; 1996 September 9.
February 19902
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage (pin 8)V
P
Total current consumption
AM partI
FM partI
P
P
Operating ambient
temperature rangeT
AM performance (pin 1)
SensitivityV
note 1
= 10 mVV
o
(S + N)/N = 26 dBV
Signal-to-noise ratioV
= 1 mV(S + N)/N−48−dB
i
AF output voltageV
amb
i
i
o
Total harmonic distortionTHD−0.7−%
Signal handlingm = 80%; THD = 8%V
FM performance (pin 2)
note 2
Limiting sensitivity−3dBV
Signal-to-noise ratioV
= 2.5 µV(S + N)/N−26−dB
i
V
= 1 mv(S + N)/N−60−dB
i
AF output voltageV
i
i
o
Total harmonic distortionTHD−0.8−%
Signal handlingV
AM suppression100 µV< V
<
i
i
100 mVAMS−40−dB
1.8−15V
−14−mA
−17−mA
−15−+ 60°C
−3.5−µV
−17−µV
−45−mV
−100−mV
−2.3−µV
−90−mV
−100−mV
Notes to the quick reference data
1. All parameters are measured in the application circuit (see Fig.4) at nominal supply voltage V
unless otherwise specified. RF conditions: Input frequency 1 MHz; 30% modulated with f
= 3 V; T
p
= 1 kHz; unless
mod
otherwise specified.
2. All parameters are measured in the application circuit (see Fig.4) at nominal supply voltage VP= 3 V; T
unless otherwise specified. RF conditions: Input frequency 100 MHz; frequency deviation ∆f = 22.5 kHz and f
kHz; unless otherwise specified.
February 19903
amb
amb
= 25 °C;
= 25 °C;
= 1
mod
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February 19904
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
Fig.1 Block diagram.
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February 19905
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
Fig.2 Equivalent circuit diagram.
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
PINNING
Fig.3 Pinning diagram.
February 19906
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERSYMBOLMIN.MAX.UNIT
Supply voltage (pin 8)V
LED current (pin 7)I
Total power dissipationP
Storage temperature rangeT
Operating ambient temperature rangeT
Electrostatic handling
(1)
P
7
tot
stg
amb
V
es
Note
1. Equivalent to discharging a 100 pF capacitor through a 1500 Ω series resistor.
−18V
−tbfmA
see Fig.4
−65+150°C
−15+60°C
−1000+1000V
Fig.4 Power derating curve.
February 19907
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
DC CHARACTERISTICS
All voltages are referenced to pin 3 and pin 9; all input currents are positive; all parameters are measured in test set-up
(see Fig.6) at nominal supply voltage V
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
mm
OUTLINE
VERSION
SOT234-1
max.
4.70.513.8
12
min.
max.
IEC JEDEC EIAJ
1.3
0.8
b
1
0.53
0.40
REFERENCES
cEeM
0.32
0.23
(1)(1)
D
22.3
21.4
February 199013
9.1
8.7
12
(1)
Z
e
1
L
M
E
3.2
10.7
2.8
10.2
EUROPEAN
PROJECTION
12.2
10.5
w
H
0.181.77810.16
ISSUE DATE
92-11-17
95-02-04
max.
1.6
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 199014
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