DATASHEETS tda9820 DATASHEETS (Philips)

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INTEGRATED CIRCUITS

DATA SH EET

TDA9820

Multistandard/dual channel TV FM intercarrier sound demodulator

Product speciﬁcation Supersedes data of March 1991 File under Integrated Circuits, IC02

1996 Nov 20

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

FEATURES

• Multistandard application for sound standards M, B/G, I and D/K

• Two alignment-free PLL FM demodulators

• Four-input source selector for one of the two FM

demodulators

• Automatic second sound carrier mute

• Mono and dual channel application

• Low power consumption

• Few external components required.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

i(rms)

o(rms)

SN+

-------------N

8/7

supply voltage (pin 14) 4.5 5.0 8.8 V supply current (pin 14) 23 30 37 mA AC peak current (pins 7 and 8) −−1.5 mA input signal (RMS value) − 150 250 µV

output signal (pins 7 and 8; RMS value) ∆fi= ±50 kHz 0.4 0.5 0.6 V signal plus noise-to-noise ratio

(pins 7 and 8) crosstalk attenuation f = 50 to 12500 Hz 60 70 − dB

RR supply voltage ripple rejection

(pins 7 and 8)

amb

operating ambient temperature 0 − 70 °C

GENERAL DESCRIPTION

The TDA9820 is a monolithic, integrated, multistandard TV FM intercarrier sound demodulator for all FM standards. The circuit contains two separate FM demodulators using Phase Locked Loop (PLL) reference frequency generation. The circuit requires a minimum number of external components.

SN+

--------------

in accordance with

40 dB=

64 68 − dB

“CCIR 468-3”

< 200 mV; f = 70 Hz 16 20 − dB

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA9820 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SOT38-1 TDA9820T SO16 plastic small outline package; 16 leads; body width 7.5 mm SOT162-1

1996 Nov 20 2

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

BLOCK DIAGRAM

handbook, full pagewidth

intercarrier

4.5 MHz (M)

5.5 MHz (B/G)

6.0 MHz (I)

6.5 MHz (D/K)

4.72 MHz (M) or

5.74 MHz (B/G) or

6.74 MHz (D/K)

1 16

SUPPLY

V =

4.5 to 8.8 V

TDA9820

7-STAGE

LIMITER

AMPLIFIER 1

7-STAGE

LIMITER

AMPLIFIER 2

11121413

VCO

ref

mute

VCO 1

VCO 2

optional stereo channel separation adjustment

(1)

pot

CONTROL

UNIT

−

− +

MHA420

TDA9820

AF1

AF2

standard switch

(1) Resistor and potentiometer between capacitor and earth are inserted if adjustment of stereo channel separation is required.

1996 Nov 20 3

Fig.1 Block diagram.

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

PINNING

SYMBOL PIN DESCRIPTION

1(B/G)

1(D/K)

1(M)

n.c. 4 not connected S

AF2

AF1

VCO

ref

STAB

GND 13 ground V

1(I)

1 intercarrier input 1 at 5.5 MHz 2 intercarrier input 1 at 6.5 MHz 3 intercarrier input 1 at 4.5 MHz

5 standard switch bit 1 input 6 standard switch bit 2 input 7 audio output voltage 2 8 audio output voltage 1

9 decoupling capacitor 1 10 decoupling capacitor 2 11 VCO reference 12 supply voltage stabilization

14 supply voltage 15 intercarrier input 2 16 intercarrier input 1 at 6.0 MHz

handbook, halfpage

IN IN

1(B/G) 1(D/K)

1(M)

n.c.

AF2

AF1

1 2 3

4 1

TDA9820

MHA529

Fig.2 Pin configuration.

TDA9820

1(I)

GND C

STAB

VCO

ref

1996 Nov 20 4

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

FUNCTIONAL DESCRIPTION

The complete circuit consists of two separate channels, each consisting of a limiter-amplifier, FM demodulator and AF amplifier. Circuit operation is also described in Fig.1.

Source selector

The intercarrier signal is fed through external ceramic band-pass filters which are tuned to the sound carrier frequencies.

One of the four filtered sound carriers from pins 1, 2, 3 or 16 is fed to limiter-amplifier 1 via the appropriate electronic switch in the source selector. The electronic switch of the sound carrier is selected by the control unit (see Table 1).

The second sound carrier of the intercarrier signal is directly fed from pin 15 to limiter-amplifier 2.

FM demodulators

TDA9820

Stereo channel separation adjustment (optional)

Optimal stereo channel separation is achieved by adjusting V

1. V

AF1

capacitor at pin 9

2. V

AF2

DC decoupling capacitor on pin 10 to the same voltage as V

Second sound carrier mute

The output of the second FM demodulator is muted when the signal level (signal and/or noise) at pin 15 is less than typically 0.5 mV (RMS value). This avoids an incorrect stereo or dual sound identification when a mono signal is transmitted. Therefore, with a mono transmission, there is no audio output at pin 7. When the signal level at pin 15 is greater than typically 1.0 mV (RMS value) mute is switched off.

(pin 8) and V

AF1

by a resistor in series with the DC decoupling

by a variable resistor in series with the

AF1

(pin 7) as follows:

AF2

Each limiter-amplifier is AC-coupled into a FM demodulator. The integrated FM demodulator PLLs are alignment-free. The FM demodulator outputs are amplified to 500 mV (RMS value). High amplification and DC error signals of the PLLs, which are superimposed on the FM demodulator outputs, require DC decoupling at pins 9 and 10 of the AF amplifier inputs.

Table 1 Logic table; note 1

STANDARD

B/G 1 1 5.5 5.74 pin 1 M 1 0 4.5 4.72 pin 3 I 0 1 6.0 off pin 16 D/K 0 0 6.5 6.74 pin 2

Note

1. In columns S1 and S2: 0 = LOW and 1 = HIGH.

(PIN 5)S2(PIN 6)

FREQUENCY VCO1

(MHz)

Control unit

The control unit selects the required sound standard according to the voltages on pin 5 and pin 6. The control unit performs the following:

1. selects the free-running frequencies of VCO1 and VCO2

2. switches the source selector (the four possible combinations are shown in Table 1).

FREQUENCY VCO2

(MHz)

SOURCE SELECTOR

CONNECTION

1996 Nov 20 5

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

stg

amb

Notes

1. Equivalent to discharging a 200 pF capacitor via a 0 Ω series resistor.

2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

supply voltage (pin 14) −0.5 +9.0 V input signal (pins 1, 2, 3, 15 and 16) −0.5 +5.0 V switching voltage (pins 5 and 6) −0.5 VP+ 0.5 V short-circuit time (each pin except pins 13 and 14 to

− 10 s

be tested; one at the time) storage temperature

device −25 +125 °C

device in packing −25 +85 °C junction temperature − 150 °C operating ambient temperature 0 70 °C electrostatic handling for all pins note 1 −500 +500 V

note 2 −4000 +4000 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

th j-a

thermal resistance from junction to ambient in free air

TDA9820 (DIP16) 74 K/W

TDA9820T (SO16) 104 K/W

1996 Nov 20 6

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

CHARACTERISTICS

All voltages are measured to GND (pin 13); VP=5V; T V

1, 2,3, 16/15

= 10 mV (RMS value); measurements taken in Fig.5; unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply (pin 14)

supply voltage 4.5 5.0 8.8 V supply current 23 30 37 mA

Source selector and limiter-ampliﬁer 1 (pins 1, 2, 3 and 16)

i(rms)

DC input voltage activated input 2.25 2.5 2.75 V

input resistance activated input 480 600 720 Ω

input signal (RMS value) − 150 250 µV

allowed input signal (RMS value) 200 −−mV

crosstalk attenuation not activated input to

=25°C; ∆fi= ±50 kHz; f

amb

mod

= 1 kHz;

not activated input −−0.1 V

not activated input −−600 Ω

SN+

-------------N

40 dB=

40 50 − dB

activated input

Limiter-ampliﬁer 2

15(rms)

DC input voltage 2.25 2.5 2.75 V input signal (RMS value)

SN+

-------------N

40 dB=

; note 1

− 150 250 µV

input signal for mute off (RMS value) 0.7 1.0 1.5 mV allowed input signal (RMS value) 200 −−mV

input resistance 480 600 720 Ω

δ hysteresis of level detector 8 12 16 dB

PLL FM demodulators VCO1 and VCO2

VCO1

free-running frequencies R11=27kΩ;

see Table 1

− 4.5 − MHz

− 5.5 − MHz

− 6.0 − MHz

− 6.5 − MHz

VCO2

free-running frequencies R11=27kΩ;

see Table 1

− 4.7 − MHz

− 5.7 − MHz

− 6.7 − MHz

∆f

negative/positive free-running

−−10 %

frequency spread D/∆f ∆f

fr(shift)

∆f

fr(ar)

drift of free-running frequencies T

= 0 to 70 °C − 500 750 kHz

amb

shift of free-running frequencies 4.5 V < VP< 8.8 V − 200 300 kHz

negative/positive adjustment range of

R11=22kΩ 1 −−MHz

free-running frequencies R

adjustment resistance for free-running

15 − 29 kΩ

frequencies (pin 11)

1996 Nov 20 7

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

S negative slope of free-running frequency

adjustment

∆f1 negative/positive catching range of PLLs 1.4 1.9 − MHz ∆f2 negative/positive holding range of PLLs 2.0 3.0 − MHz

Output ampliﬁers AF1 (pin 8) and AF2 (pin 7)

o(rms)

∆V

o/Vo

/∆Vo2relative drift of AF output signals T

∆V

AF(1-2)

DC output voltage 1.8 2.1 2.5 V

output signal (RMS value) 0.4 0.5 0.6 V

AC peak current −−1.5 mA

DC source current −−2.0 mA

absolute drift of AF output signals T

negative/positive difference between

output signals R

cs(ar)

output resistance − 100 150 Ω

adjustment range of channel separation Rs= 1.1 kΩ;

THD total harmonic distortion 50 µs de-emphasis

SN+

-------------N

resp

AM suppression of AF(1-2) 50 µs de-emphasis;

signal plus noise-to-noise ratio 50 µs de-emphasis;

LOW-level AF frequency response ∆V HIGH-level AF frequency response 200 −−kHz

res(rms)

residual sound carrier signal and harmonics (RMS value)

8/7

crosstalk attenuation between AF outputs

RR supply voltage ripple rejection V

RR supply voltage ripple rejection with

improved application for V

=5V

R11=22kΩ−200 − kHz/kΩ

clipping level 1.2 −−V

= 0 to 70 °C − 0.7 − dB

amb

= 0 to 70 °C − 0.2 − dB

amb

50 µs de-emphasis − 0.3 1.0 dB

1.5 −−dB

= 2.2 kΩ

pot

pin 8 − 0.1 0.3 % pin 7 − 0.25 0.5 %

46 66 − dB

m = 0.3; fAM= 1 kHz

64 68 − dB

in accordance with

“CCIR 468-3”

= −3dB −−20 Hz

AF(1-2)

− 50 80 mV

f = 50 to 12500 Hz 60 70 − dB

< 200 mV;

fr=20Hzto200kHz

=5V 16 20 − dB

=8V 24 28 − dB

fr= 20 Hz to 3 kHz; see Fig.3 and note 2

= 4.5 V 18 24 − dB

= 4.75 V 21 27 − dB

= 5.0 V 24 30 − dB

= 5.5 V 21 27 − dB

1996 Nov 20 8

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Control unit; see Table 1

5,6

Notes

1. The output signal at pin 7 can only be measured when mute is disabled. This is achieved by inserting a resistor of

2.7 kΩ between pin 15 and ground. In this event the input impedance is 490 Ω.

2. Improvement of ripple rejection is possible by connecting series RC between pin 11 and pin 14 (15 kΩ + 2.2 µF; see Fig.5) for a supply voltage of 4.5 to 5.5 V. The rejection of ripple frequencies up to 3 kHz is improved, but up to 200 kHz is worse; see Fig.3.

3. An open pin (n.c.) is interpreted as HIGH.

voltage for LOW level 0 − 0.8 V source current for LOW level 0 < V allowed resistance to ground 0 < V

< 0.8 − 180 250 µA

5,6 5,6

< 0.8

−−3.0 kΩ

(LOW-level) voltage for HIGH level note 3 2.2 − V voltage for HIGH level note 3 1.8 − V sink current for HIGH level V

5, 6=VP

−−10 µA

P P

V V

handbook, full pagewidth

RR

(dB)

45678

The curves are typical and valid for ripple frequencies between 50 Hz and 3kHz. Conditions: input signal: f =5.5 MHz, 10mV (RMS value); ripple on VP= 100mV (RMSvalue), fr= 1kHz;

ripple rejection measurement: unweighted RMS. (1) Without RC. (2) With R = 15 kΩ and C = 2.2 µF.

MHA530

(1)

(2)

9VP (V)

1996 Nov 20 9

Fig.3 Typical improvement.

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

INTERNAL CIRCUITRY

handbook, full pagewidth

3.5 V

620

5.5 k

620

5.5 k

3.5 V

Ω

670

5.5 k

Ω

10 kΩ

Ω

TDA9820

3.5 V

Ω

620

5.5 k

Ω

3.5 V

620

5.5 k

Ω

n.c.

TDA9820

6

Ω

30

Ω

3.6 V

3 k

300 µA

1

Ω

6

Ω

3

Ω

13 k

23 k

Ω

3.6 V

Ω

3.6 V

AF2

5

Ω

50

Ω

2.54 V

2 mA

Ω

100

5 k

Ω

100

AF1

50 k

Ω

2.54 V

2 mA

MHA421

Fig.4 Internal circuitry.

1996 Nov 20 10

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

600 Ω 600 Ω

600 Ω 600 Ω 600 Ω

intercarrier

4.72 MHz, or

6.0 MHz

2.2 nF

5.74 MHz, or

6.74 MHz

2.2 nF

12163

2.2 nF

10 µF

10 nF

15 kΩ

TDA9820

n.c.

2.2 µF

(1)

TDA9820

optional stereo

channel separation

adjustment

2.2 µF

2.2 kΩ

22 nF

27 kΩ

2.2 µF

(1)

pot

2.2 kΩ 1.1 kΩ

2.2 µF

2.2 kΩ

5.5 MHz

(1) See note 2 of Chapter “Characteristics”.

6.5 MHz 4.5 MHz

intercarrier

S1 S2

Fig.5 Test circuit.

AF2

without

de-emphasis



AF1

AF2VAF1

with 50 µs

de-emphasis

MHA422

1996 Nov 20 11

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

handbook, full pagewidth

intercarrier

(1) (1)

R16 R15

6.0

MHz

5.5

MHz

R1 R2 R3

5.74

MHz



12163

6.5

MHz

(1) (1) (1)

4.5

MHz

TDA9820

10 µF

10 nF

2.2 µF 2.2 µF

TDA9820

n.c.

27 kΩ

S1 S2

2.2 µF

MHA423

AF1

AF2

(1) Resistor value depends on filter.

Fig.6 Application circuit.

1996 Nov 20 12

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

PACKAGE OUTLINES

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

seating plane

w M

TDA9820

SOT38-1

(e )

pin 1 index

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

4.7 0.51 3.7

OUTLINE VERSION

SOT38-1

min.

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

1.40

1.14

0.055

0.045

0.53

0.38

0.021

0.015

cEe M

0.32

0.23

0.013

0.009

REFERENCES

21.8

21.4

0.86

0.84

scale

(1) (1)

6.48

6.20

0.26

0.24

(1)

0.30

0.15

0.13

3.9

3.4

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02 95-01-19

max.

2.2

0.087

1996 Nov 20 13

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

SO16: plastic small outline package; 16 leads; body width 7.5 mm

TDA9820

SOT162-1

v M

pin 1 index

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

max.

2.65

0.10

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

0.49

0.36

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

w M

0 5 10 mm

scale

(1)E(1) (1)

0.32

10.5

0.23

10.1

0.41

0.40

0.30

0.29

eHELLpQ

7.6

1.27

7.4

0.050

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

0.25 0.1

0.01

ywv θ

0.004

0.9

0.4

0.035

0.016

(A )

0.25

0.01

OUTLINE VERSION

SOT162-1

1996 Nov 20 14

REFERENCES

IEC JEDEC EIAJ

075E03 MS-013AA

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17

95-01-24

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM intercarrier sound demodulator

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

DIP

OLDERING BY DIPPING OR BY WA VE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TDA9820

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

1996 Nov 20 15

Philips Semiconductors Product speciﬁcation

Multistandard/dual channel TV FM

TDA9820

intercarrier sound demodulator

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Nov 20 16

DATASHEETS tda9820 DATASHEETS (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual