DATASHEETS tda8051 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8051

QPSK receiver

Product specification
Supersedes data of 1998 Jan 08
File under Integrated Circuits, IC02

1999 Aug 20

Philips Semiconductors Product specification

QPSK receiver TDA8051

FEATURES

• High operating input sensitivity

• Gain controlled amplifier

• PLL controlled carrier frequency

• Low crosstalk between I and Q channel outputs

• 3-wire transmission bus

• 5 V supply voltage.

APPLICATIONS

• BPSK/QPSK demodulation.

GENERAL DESCRIPTION

This TDA8051 is a monolithic bipolar IC intended for
Quadrature Phase Shift Key (QPSK) demodulation. It
includes:

• Low noise RF and gain controlled amplifier

• Two matched mixers

• Symmetrical Voltage Controlled Oscillator (VCO) with

0to90°signal generator whosefrequency is controlled
by an integrated Phase Lock Loop (PLL) circuit.

• Two matched amplifiers for output base-band active
filtering and output buffers

The gain control is produced by output level detection
compared with an external pre-fixed reference. The PLL
consists of:

• Divide by four preamplifier

• 12-bit programmable main divider

• Crystal oscillator with 8-bit programmable reference

divider

• Phase/frequency detector combined with charge pump
to drive tuning amplifier

• 30 V output

QUICK REFERENCE DATA

All AC units are RMS values unless otherwise specified.

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

CC

f

I(LNA)

V

I(LNA)

∆Φ

I-Q

∆G

I-Q

α

CT(I-Q)

IM3 3rd-order intermodulation distortion in

supply voltage range 4.75 5.00 5.25 V
input carrier frequency at LNA input 44 − 130 MHz
input level at LNA input −30 − 0 dBmV
phase error between I and Q channels −±3−deg
gain error between I and Q channels −±1−dB
crosstalk between I and Q channels −−30 − dBc

−−−45 dBc

I and Q channels (0 dBmV at LNA_IN)
V
f

step

f

xtal

T

o

amb

voltage output on pin I_OUT and Q_OUT − 48 − dBmV

step at output 50 − 250 kHz

crystal frequency 1 − 4 MHz

operating ambient temperature 0 − 70 °C

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA8751T SO32 plastic small outline package; 32 leads; body width 7.5 mm SOT287-1

1999 Aug 20 2

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1999 Aug 20 3

BLOCK DIAGRAM

Philips Semiconductors Product specification

QPSK receiver TDA8051

LNA_IN

LNA_OUT

DEMOD_IN

CLK

DATA

EN

TUNE

CP

9
8

7

14
15
16

19
18

A1VCC

CHARGE

A2VCC

6

A3VCC

23

3-WIRE BUS TRANSCEIVER

DIGITAL

PHASE

COMPARATOR

DVCC

25

OUTVCC

13

27

PROGRAMMABLE

MAIN DIVIDER

PROGRAMMABLE

REF DIVIDER

AGC_IN

11

TDA8051

1/2

17

TEST

n.c.

Q_OUT1

I_OUT1

5

×

×

90¡ 0¡

1/2

1/4

10

A1GND24A2GND26OUTGND20DGND

Q_IN1

28

I_IN1

29 4

32
31

30

21
22

12

FCE112

3

1
2

I_OUT2
I_OUT

I_OUTC
Q_OUT

Q_OUTC
Q_OUT2

TKB
TKA

OSC_IN

Fig.1 Block diagram.

handbook, full pagewidth

Philips Semiconductors Product specification

QPSK receiver TDA8051

PINNING

SYMBOL PIN DESCRIPTION

I_OUT 1 I data buffered balanced output
I_OUTC 2 I data buffered balanced output
I_OUT2 3 I data filtered output
I_IN1 4 input to active filter amplifier for

I data
I_OUT1 5 I data raw output
A1VCC 6 analog supply voltage 1
DEMOD_IN 7 demodulator RF input
LNA_OUT 8 low noise amplifier RF output
LNA_IN 9 low noise amplifier RF input
A1GND 10 analog ground 1
AGC_IN 11 AGC control voltage input
OSC_IN 12 oscillator input
DVCC 13 digital supply voltage
CLK 14 3-wire bus serial control clock
DATA 15 3-wire bus serial control data
EN 16 3-wire bus serial control enable

(active LOW)
TEST 17 not connected
CP 18 charge pump output for PLL loop

filter
TUNE 19 tuning voltage output
DGND 20 digital ground
TKB 21 VCO tank circuit input
TKA 22 VCO tank circuit input
A2VCC 23 analog supply voltage 2
A2GND 24 analog ground 2
A3VCC 25 analog supply voltage 3
OUTGND 26 output amplifiers ground
OUTVCC 27 output amplifiers supply voltage
Q_OUT1 28 Q data raw output
Q_IN1 29 input to active filter amplifier for

Q data
Q_OUT2 30 Q data filtered output
Q_OUTC 31 Q data buffered balanced output
Q_OUT 32 Q data buffered balanced output

handbook, halfpage

DEMOD_IN

I_OUT

1

I_OUTC

I_OUT2

I_OUT1

A1VCC

LNA_OUT

LNA_IN

A1GND
AGC_IN
OSC_IN

I_IN1

DVCC

CLK

DATA

EN

2
3
4
5
6
7
8
9

10

11
12
13
14
15
16

TDA8051

Fig.2 Pin configuration.

FCE171

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

Q_OUT
Q_OUTC
Q_OUT2
Q_IN1
Q_OUT1
OUTVCC
OUTGND
A3VCC
A2GND
A2VCC
TKA
TKB
DGND
TUNE
CP
TEST

1999 Aug 20 4

Philips Semiconductors Product specification

QPSK receiver TDA8051

FUNCTIONAL DESCRIPTION

The QPSK modulated signal is applied to the input as an
asymmetrical RF signal in the bandwidth 44 to 130 MHz.
The spectrum extension to this waveform must be limited
by a band-pass filter superseding the IC.

The RF input is either the LNA input, if the level is

−30 to 0 dBmVrms, or the DEMOD input if the level is

−20 to +10 dBmVrms. The amplified RF signal is then

mixed with two clocks in quadrature to provide the
base-band demodulated In-phase (I) and Quad-phase (Q)
signals.

The VCO operates at twice the RF carrier frequency in the
bandwidth 88 - 260 MHz (one octave), therefore the
0to90° clocks are generated by a divider by 2.

The VCO frequency can be programmed by an integrated
PLL that tunes the external LC tank circuit.

The raw I and Q generated signals contain spurious
spikes, therefore each signal is passed through a third
order active low-pass filter (RC cell + Sallen-Key
structure), whose cut-off frequency is set by external
components. The filtered I and Q data signals are then
amplified to provide balanced buffer outputs.

The data sent to the PLL is loaded in bursts, framed by
signal EN. Programming clock edges, together with their
relevant data bits, are ignored until EN becomes active
(LOW). The internal latches are updated with the latest
programming data when EN returns to inactive (HIGH).
The last 14 bits only are retained within the programming
register. No check is made on the number of clock pulses
received while programming is enabled. An active clock
edge causing a shift of the data bits is generated when
EN goesHIGHwhileCLOCKisstillLOW. The main divider
ratio and the reference divider ratio are provided via the
serial bus (see Table 1).

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

(max)

t

sc

T

stg

T

j(max)

T

amb

V

CC(tune)

supply voltage −0.3 6.0 V
maximum voltage on all pins except pin 9 (5 V) −0.3 V

CC

V
maximum short circuit duration on outputs − 10 s
storage temperature −40 +150 °C
maximum junction temperature − 150 °C
operating ambient temperature 0 70 °C
tuning voltage supply −0.3 30 V

HANDLING

HBM ESD: The IC pins withstand 2 kV except pin 26 (1750 V).
MM ESD: The IC pins withstand 100 V except pins 2 and 31 (75 V).

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 65 K/W

1999 Aug 20 5

Philips Semiconductors Product specification

QPSK receiver TDA8051

CHARACTERISTICS

Measured in application circuit with the following conditions: VCC=5V; T
unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CCA1

I

CCA1

V

CCA2

I

CCA2

V

CCA3

I

CCA3

V

cc(o)

I

cc(o)

V

CCD

I

CCD

V

CC(tune)

analog supply voltage 4.75 5 5.25 V
analog supply current − 23 − mA
analog supply voltage 4.75 5 5.25 V
analog supply current − 18 − mA
analog supply voltage 4.75 5 5.25 V
analog supply current − 29 − mA
output supply voltage 4.75 5 5.25 V
output supply current − 17 − mA
digital supply voltage 4.75 5 5.25 V
digital supply current − 13 − mA
tuning supply voltage −−30 V

Low noise amplifier: Rs=75Ω/Ri=75Ω unless otherwise specified

=25°C. All AC units are RMS values,

amb

V

I(DC)

V

i

f

i

R

i

C

i

R

LLNA

NF

LNA

V

leak(LO)

DC input level internally set − 0.85 − V
input level −30 − 0 dBmV
input carrier frequency 44 − 130 MHz
input resistance − 75 −Ω
input capacitance − 2.5 − pF
input return loss −−15 − dB
noise figure − 711 dB
LO leakage on pin at LNA_IN f

= 140 − 860 MHz;

N × LO

−−−15 dBmV
pin LNA_OUT connected to
DEMOD_IN

=70−130 MHz;

f

LO/2

−−35 −30 dBmV
pin LNA_OUT connected to
DEMOD_IN

G

V
∆V

LNA

o

LNA gain f = 100 MHz;

V

= 0 dBmV

I(LNA)

output level −−20 − +10 dBmV

o

output flatness in 1 MHz bandwidth;

V

= 0 dBmV

I(LNA)

44 to 70 MHz;
V

= 0 dBmV

I(LNA)

70 to 130 MHz;
V

= 0 dBmV

I(LNA)

810−dB

− 0.25 0.5 dB

− 0.50 − dB

− 1.3 1.5 dB

IM3 3rd-order intermodulation 2 carriers at +10 dBmV each −−−60 dBc

at pin LNA_IN
at 103 to 105 MHz

1999 Aug 20 6

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

o(DC)

R

o

Quadrature demodulator: Rs=75Ω/Ri=20kΩ unless otherwise specified

DC output level − 1.3 − V
output resistance − 75 −Ω

V

I(DC)

V

i

f

i

R

i

C

i

RL

I

V

o(I-Q)

DC input level internally set − 1 − V
input level −20 − +10 dBmV
input carrier frequency 44 − 130 MHz
input resistance − 75 −Ω
input capacitance − 2.5 − pF
input Return Loss −−12 − dB
output level on pin I_OUT1 or

Q_OUT1

B

o(I-Q)

output 3 dB bandwidth LO = 200 MHz;

C/N carrier to noise ratio at

500 kHz on pin at I_OUT1 or
Q_OUT1

V

leak(LO)

LO leakage on pin
DEMOD_IN

V

AGC(r)

V

AGC(s)

V

AGC

AGC range fLO= 200 MHz;

AGC slope maximum fLO= 200 MHz;

gain control voltage at
AGC_IN

G

G

∆Φ

max

min

I-Q

max. conversion gain fLO= 260 MHz;

min. conversion gain fLO= 140 MHz;

phase error between I and Q
channels

∆G

I-Q

gain error between I and Q
channels

RF = 100 to 130 MHz
V

= −20 dBmV;

I

V

o(I and Q)

V

I

V

o(I and Q)

= 22 dBmV

= 10 dBmV;

= 22 dBmV

fLO= 140 to 260 MHz;
f

= 70 to 130 MHz

LO/2

fRF= 100.25 MHz at

−20 to +10 dBmV;
fBF= 250 kHz at 22 dBmV

fRF= 100.25 MHz at

−20 to +10 dBmV;
fBF= 250 kHz at 22 dBmV

fRF= 130.25 MHz at

−20 dBmV; V

AGC

= 4.5 V

fRF= 70.25 MHz at
10 dBmV V

AGC

= 0.5 V

fLO= 140 to 260 MHz;
fRF= 70.25 to 130.25 MHz;
fBF= 250 kHz at 22 dBmV
over specified input range

fLO= 140 to 260 MHz;
fRF= 70.25 to 130.25 MHz;
fBF= 250 kHz at 22 dBmV
over specified input range

− 22 − dBmV

− 35 38 MHz

− 88 − dBc/Hz

− 93 − dBc/Hz

−−−15 dBmV

30 −− dB

− 30 − dB/V

10% V

CCA

− 90% V

CCA

V

42 −− dB

−−12 dB

−±3−deg

−±1−dB

1999 Aug 20 7

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆Φ

I-Q

∆G

I-Q

IM3 3rd-order intermodulation in

IM2 2nd-order intermodulation in

AMREJ AM rejection at I and Q

∆V

o(I/Q)

V

o(DC)

R

o

Output section: Rs= 400 Ω/Ri=4kΩ/R on pin I_OUT2 or Q_OUT2 = 20 kΩ unless otherwise specified

phase error between I and Q
channels

fLO= 88 to 140 MHz;
fRF= 44.25 to 70.25 MHz;

−±3−deg

fBF= 250 kHz at 22 dBmV
over specified input range

gain error between I and Q
channels

fLO= 88 to 140 MHz;
fRF= 44.25 to 70.25 MHz;

−±1−dB

fBF= 250 kHz at 22 dBmV
over specified input range

see Fig.3 −−−45 dBc

I and Q channels

see Fig.3 −−−40 dBc

I and Q channels

channels
output flatness at I and Q

outputs

guaranteed by design;
see Fig.4

in 1 MHz bandwidth − 0.25 − dB
f = 40 to 70 MHz − 3 − dB

−−−38 dBc

f = 70 to 130 MHz − 3 − dB

DC output level − 2.5 − V
output resistance − 400 −Ω

V
V
R
C
G

I(DC)
i
i
i

O

DC input voltage − 3.6 − V
input level − 22 − dBmV
input resistance − 17.5 − kΩ
input capacitance − 0.4 − pF
gain from

I-Q_IN1 to I-Q_OUT2

∆V

o(I-Q_out2)

output flatness on
pins I_OUT2 and Q_OUT2

V

o(flt)

R

o

H

2

H

3

DC output level at filter output − 2.6 − V
output resistance f < 20 MHz − 250 −Ω
2nd harmonic fBF= 1 MHz at 48 dBmV

3rd harmonic

IM3 3rd-order intermodulation at

pins I_OUTand Q_OUT

α

CT(I-Q)

crosstalk between I and Q
channels

N

o

output noise power at
500 kHz from carrier

G

I-Q

gain from
I-Q_IN1 to I-Q_OUT

fBF= 1 MHz at 22 dBmV − 3.8 − dB

fBF= 0 to 1.5 MHz − 0.25 − dB
f

= 0 to 6 MHzat 22 dBmV

BF

− 1 − dB
input

−−40 −35 dBc
output

f

= 1 MHz at 48 dBmV

BF

−−45 −40 dBc
output
see Fig.5 −−50 −45 dBc

f = 5 MHz; see Fig.6 −−40 −30 dBc

see Fig.7 −−56 − dBmv/Hz

fBF= 1 MHz at 22 dBmV

− 27 − dB
input

1999 Aug 20 8

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

1(I-Q)

R

o(dif)

Overall: Rs=75Ω/Ri=4kΩ unless otherwise specified

DC output level on

− 3.1 − V

pin I-Q_OUT
output differential resistance − 460 −Ω

V

o

voltage output on

see Fig.8 − 48 − dBmV

pins I_OUTand Q_OUT

LO

lev

LO level on

see Fig.8 −−−45 dBc

pins I_OUTand Q_OUT

S

o

spurious emission on

f = 0 to 5 MHz; see Fig.8 −−40 − dBc

pins I_OUTand Q_OUT

∆G

I-Q

gain error on

see Fig.8 −±1−dB

pins I_OUTand Q_OUT

AMR AM rejection in I and Q

channels

IM3 3rd-order intermodulation guaranteed by design; see

guaranteed by design; see
Fig.9

−−−40 dBc

−−−45 dBc

Fig.10

Voltage Controlled Oscillator (VCO)

f

vco(min)

f

vco(max)

αN

(osc)

min. oscillation frequency note 1 − 88 − MHz
max. oscillation frequency note 1 − 260 − MHz
oscillator phase noise at 10 kHz −−75 − dBc/Hz

at 100 kHz −−95 − dBc/Hz

Phase Locked Loop (PLL)

Step frequency step size at pin VCO output 100 − 500 kHz
RD fixed reference divider ratio − 2 −−
RDR programmable reference

2 − 80 −

divider ratio

ND programmablefix maindivider

− 4 −−

ratio
NDR main divider ratio 128 − 2600 −
I

(CP)

charge pump current − 300 −µA

Crystal oscillator

f
Z

xtal

i

crystal frequency r

crystal oscillator input

= 25 to 200 Ω 1 − 4 MHz

xtal

f

= 4 MHz 600 1200−Ω

xtal

impedance (absolute value)
V

I(DC)

V

i

DC input level − 2.9 − V

input level − 30 − mVrms

1999 Aug 20 9

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

3-wire bus

V

IL

V

IH

f

clk

t

su

t

h

t

d(strt)

t

d(stp)

Notes

1. The frequency range of the receiver is 44 to 130 MHz. The local oscillator (LO) operates at twice the output
frequency (88 to 260 MHz). Frequency control by varicap diodes allows a variation over one octave.

2. Crystal oscillator. The crystal oscillator uses a 4, 2 or 1 MHz crystal in series with a capacitor. The crystal is parallel
resonant with load capacitance of 18 to 20 pF. Connection to VCC is preferred but can also be to GND.

input Low level guaranteed by design −−0.8 V
input High level guaranteed by design 2.4 −− V
clock frequency guaranteed by design − 330 − kHz
input data to CLK set-up time guaranteed by design − 2 −µs
input data to CLK hold time guaranteed by design − 1 −µs
delay to rising clock edge guaranteed by design − 3 −µs
delay from last clock edge guaranteed by design − 3 −µs

Note to characteristics

handbook, full pagewidth

10 dB above max. input level

= 20 dBmVrms each tone

maximum

input
level

103

105 MHz

105

DEMOD_IN

103 MHz

f (MHz)

+5 V

nominal

output level

= 22 dBmVrms

each tone

×

0¡ 90¡

VCO 200 MHz

×

+10 dB = 32 dBmVrms each tone

IM3

IM2

1

2 75

I_OUT1

Q_OUT1

3

f (MHz)

FCE172

Fig.3 IM2 and IM3 measurement of the demodulator.

1999 Aug 20 10

Philips Semiconductors Product specification

QPSK receiver TDA8051

handbook, full pagewidth

maximum

input
level

105 MHz

10 dB above max. input level

= 20 dBmVrms

105103

DEMOD_IN

103 MHz

f (MHz)

×

0¡ 90¡

+5 V

×

baseband
demodulated AM
(15 KHz spacing)

Fig.4 AM rejection test.

+ 22 dBmVrms

AM_REJ

I_OUT1

VCO 200 MHz

Q_OUT1

3

(15 KHz offset)

f (MHz)

AM sidebands

FCE173

handbook, full pagewidth

22 dBmV

300 kHz

22 dBmV
500 kHz

Fig.5 IM3 measurement of the output section.

1999 Aug 20 11

I_OUT2

Q_OUT2

I_OUT

I_OUTC
Q_OUT

Q_OUTC

FCE174

Philips Semiconductors Product specification

QPSK receiver TDA8051

handbook, halfpage

22 dBmV
5 MHz

(1) Measure I and Q, α is the difference between the two carriers.

Fig.6 Crosstalk measurement.

handbook, halfpage

RS
2 kΩ

I_OUT2

Q_OUT2

Q_OUT2

I_OUT

I_OUTC
Q_OUT

Q_OUTC

FCE175

Q_OUT

Q_OUTC

FCE176

Fig.7 Noise measurement.

handbook, full pagewidth

Q_OUT1

LNA input: −15 dBmV; AGC set in order to have a 250 kHz output sine wave at 48 dBmV; f

10 nF

1.2 kΩ

100 pF

Q_OUT2

Fig.8 LO level, spurious, I/Q gain error and Vomeasurements.

1999 Aug 20 12

Q_OUT

Q_OUTC

FCE177

= 70 to 130 MHz; flo= 140 to 260 MHz.

ref

Philips Semiconductors Product specification

QPSK receiver TDA8051

handbook, full pagewidth

0 dBmV

LNA_IN

100.3 MHz

100 % AM modulation

square wave 15 kHz

input signals at LNA_IN I_OUT or Q_OUT

+10 dBmV

100.3

102

102 MHz

f (MHz)

+5 V

×

0¡ 90¡

×

+42 dBm(Vrms)

AM_REJ

baseband
demodulated AM
(15 KHz spacing)

Fig.9 Overall AM rejection measurement.

I_OUT1

VCO 200 MHz

Q_OUT1

300

AM sidebands

(15 KHz offset)

f (MHz)

FCE178

handbook, full pagewidth

LNA_IN

+5 V

100.5 MHz

100.3 MHz

100.5100.3

f (MHz)

Fig.10 Overall IM3 measurement.

1999 Aug 20 13

×

0° 90°

×

+42 dB dBm(Vrms) each tone0 dB dBm(Vrms) each tone

IM3

100

VCO 200 MHz

IM2

200 700500

300

I_OUT1

Q_OUT1

f (kHz)

FCE179

Philips Semiconductors Product specification

QPSK receiver TDA8051

TIMING CHARACTERISTICS

handbook, full pagewidth

CLK

DATA

EN

t

sup

t

strt

t

H

t

xtal

t

stp

FCE180

Fig.11 Logic interface signals.

DATA FORMAT
Table 1

FIRST LAST
Data

D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 AD1 AD0

Reference ratio

XXXXR7R6R5R4R3R2R1R001

Principal ratio

P11 P10 P9 P8 P7 P6 P5 P4 P3 P2 P1 P0 1 1

1999 Aug 20 14

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1999 Aug 20 15

APPLICATION INFORMATION

Philips Semiconductors Product specification

QPSK receiver TDA8051

I CHANNEL
FILTERING

RF INPUT

I DATA BUFFERED

BALANCED OUTPUT

I_OUTC

I_OUT2

I_OUT1

A1VCC

DEMOD_IN

LNA_OUT

LNA_IN

A1GND

AGC_IN

OSC_IN

DVCC

CLK

DATA

EN

3-WIRE BUS

I_OUT

I_IN1

Q DATA BUFFERED

BALANCED OUTPUT

1
2
3

4

5

6

7

8

9
10
11

12
13

14
15

BUS

16

1/RDR1/2

TDA8051

×

×

0¡ 90¡

1/2

1/4

1/NDRCMP

CHARGE

PUMP

32

31

30
29

28
27
26
25
24
23

22

21

20

19

18
17

FCE113

Q_OUT
Q_OUTC
Q_OUT2

Q_IN1

Q_OUT1

TKA

TKB

TUNE

CP

OUTVCC
OUTGND
A3VCC
A2GND
A2VCC

Controlled

Oscillator

DGND

TEST
n.c.

Q CHANNEL
FILTERING

Voltage

+30 V

Fig.12 Application diagram.

handbook, full pagewidth

Philips Semiconductors Product specification

QPSK receiver TDA8051

INTERNAL PIN CONFIGURATIONS

SYMBOL PIN DESCRIPTION DC VOLTAGE

I_OUT

1

3.1 V

I_OUTC

2

2

OUTGND

1

FCE025

3.1 V

I_OUT2 3 2.6 V

3

OUTGND

FCE026

I_IN1 4 3.6 V

4

OUTGND

FCE027

I_OUT1 2.5 V

5

OUTGND

FCE028

A1VCC 6 Analog supply voltage 1 5 V

1999 Aug 20 16

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PIN DESCRIPTION DC VOLTAGE

DEMOD_IN 7 1 V

7

FCE127

A1GND

LNA_OUT 8 1.3 V

8

A1GND

FCE128

LNA_IN 9 0.9 V

9

A1GND

FCE129

A1GND 10 analog ground 1 0. V
AGC_IN 11 −

11

FCE030

A2GND

1999 Aug 20 17

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PIN DESCRIPTION DC VOLTAGE

OSC_IN 12 3.0 V

DVCC

12

FCE031

DVCC 13 digital supply voltage 5 V
CLK 14 n.a.

14

FCE032

DATA 15 n.a.

15

FCE033

EN 16 n.a.

16

FCE034

TEST 17 not connected n.a.
CP 18 1.9 V

DOWN

DVCC

UP

1999 Aug 20 18

18

FCE035

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PIN DESCRIPTION DC VOLTAGE

TUNE 19 V

19

FCE036

DGND 20 0 V

SUB

20

FCE037

VT

TKB
TKA

21
22

2.4 V

2.4 V

21

A2GND

22

FCE038

A2VCC 23 analog DC supply voltage 2 5V
A2GND 24 analog ground 2 0 V
A3VCC 25 analog supply voltage 3 5 V
OUTGND 26 0 V

26

FCE040

DGND

OUTVCC 27 output amplifiers supply voltage 5 V
Q_OUT1 28 2.5 V

28

OUTGND

FCE041

1999 Aug 20 19

Philips Semiconductors Product specification

QPSK receiver TDA8051

SYMBOL PIN DESCRIPTION DC VOLTAGE

Q_IN1 29 3.6 V

29

OUTGND

FCE042

Q_OUT2 30 2.6 V

30

FCE043

OUTGND

3.1 V

3.1 V

32

FCE044

Q_OUTC
Q_OUT

OUTGND

31
32

31

OUTGND

1999 Aug 20 20

Philips Semiconductors Product specification

QPSK receiver TDA8051

PACKAGE OUTLINE

SO32: plastic small outline package; 32 leads; body width 7.5 mm

SOT287-1

D

c

y

Z

32

pin 1 index

1

e

17

A

2

A

16

w M

b

p

E

H

E

1

L

detail X

A

X

v M

A

Q

(A )

L

p

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT287-1

A

max.

2.65

0.10

A1A

0.3

0.1

0.012

0.004

A3b

0.49

0.36

0.02

0.01

p

0.27

0.18

0.011

0.007

2

2.45

0.25

2.25

0.096

0.01

0.086

IEC JEDEC EIAJ

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1)

cD

20.7

20.3

0.81

0.80

REFERENCES

7.6

7.4

0.30

0.29

1.27

0.050

1999 Aug 20 21

eHELLpQZywv θ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.2

1.0

0.047

0.039

0.25 0.1

0.25

0.010.01

EUROPEAN

PROJECTION

0.004

(1)

0.95

0.55

0.037

0.022

ISSUE DATE

95-01-25
97-05-22

o

8

o

0

Philips Semiconductors Product specification

QPSK receiver TDA8051

SOLDERING
Introduction to soldering surface mount packages

Thistext gives a very brief insight to acomplextechnology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides,thefootprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) or printed-circuitboards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Aug 20 22

Philips Semiconductors Product specification

QPSK receiver TDA8051

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

HLQFP, HSQFP, HSOP, SMS not suitable

(3)

PLCC

, SO suitable suitable

(2)

LQFP, QFP, TQFP not recommended

(3)(4)

suitable

suitable

(1)

SQFP not suitable suitable

SOLDERING METHOD

SSOP, TSSOP, VSO not recommended

(5)

suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Aug 20 23

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips DevelopmentCorporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

1999

Internet: http://www.semiconductors.philips.com

67

Printed in The Netherlands 545004/25/02/pp24 Date of release: 1999 Aug 20 Document order number: 9397750 04691