DATASHEETS tda8012m DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA8012M

Low power PLL FM demodulator
for satellite TV receivers

Product specification
Supersedes data of 1995 Feb 02
File under Integrated Circuits, IC02

1996 Mar 26

Philips Semiconductors Product specification

Low power PLL FM demodulator

TDA8012M

for satellite TV receivers

FEATURES

• High input sensitivity

• Fully balanced two-pin Voltage Controlled Oscillator

(VCO)

• Low input impedance (50 Ω)

• Low impedance video baseband output

• Internal voltage stabilizer

• Keyed AFC or peak-to-peak AFC

• Carrier detector

• AGC output

• Suitable for High Definition TV (HDTV).

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITION MIN. TYP. MAX. UNIT

V

CC

I

CC

V

i

V

o(p-p)

f

i

supply voltage 4.5 5.0 5.5 V
supply current VCC=5V; T
input signal voltage level 53 57 61 dBµV
video output signal voltage

amplitude (peak-to-peak value)
operating input frequency − 480 − MHz

APPLICATIONS

• Direct Broadcast Satellite (DBS) receivers.

GENERAL DESCRIPTION

The TDA8012M is a sensitive PLL FM demodulator which
is used for the second IF in satellite receivers. It provides
Automatic Gain Control (AGC) and Automatic Frequency
Control (AFC) outputs that can be used to optimize the
level and frequency of the input signal. During the
searching procedure, the AFC output provides a signal
which is used for carrier detection.

=25°C506070mA

amb

∆fo= 25 MHz (p-p) − 1 − V

ORDERING INFORMATION

TYPE

NUMBER

TDA8012M SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm SOT266-1

NAME DESCRIPTION VERSION

PACKAGES

1996 Mar 26 2

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

BLOCK DIAGRAM

handbook, full pagewidth

IFI1
IFI2

GND
V

CC

1

2

3

4

5

6

7

STABILIZER

8

AGC

9

10

th

CDF1
CDF2

PD(pos)

PD(neg)

AGCO

AGC

CARRIER

DETECTOR

AFC

TDA8012M

VCO

VIDEO BUFFER

20

19
18

17

16

15
14

13

12

11

TDA8012M

AFC

os

AFC

CDO

KEY
NF

VCO2
VCO1

OSCGND

LF2
LF1

VIDEO

MBE251

1996 Mar 26 3

Fig.1 Block diagram.

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

PINNING

SYMBOL PIN DESCRIPTION

CDF1 1 carrier detector filter 1 input
CDF2 2 carrier detector filter 2 input
PD(pos) 3 positive peak detector output
PD(neg) 4 negative peak detector output
IFI1 5 IF input 1
IFI2 6 IF input 2
GND 7 ground
V

CC

AGCO 9 AGC output
AGC

th

VIDEO 11 baseband signal output
LF1 12 loop filter 1 input
LF2 13 loop filter 2 input
OSCGND 14 oscillator ground
VCO1 15 oscillator tank circuit 1 input
VCO2 16 oscillator tank circuit 2 input
NF 17 noise filter input
KEY 18 key pulse input
AFC

CDO

AFC

os

8 supply voltage

10 AGC threshold voltage input

19 AFC and carrier detector output
20 AFC offset input

dbook, halfpage

CDF1

1
2

CDF2

PD(pos)
PD(neg)

IFI1

3
4
5

TDA8012M

6

IFI2

7

GND

V

8

CC

AGCO

AGC

9

10

th

Fig.2 Pin configuration.

MBE250

TDA8012M

AFC

20
19
18
17
16
15
14
13
12
11

os

AFC

CDO
KEY
NF
VCO2

VCO1
OSCGND
LF2
LF1
VIDEO

FUNCTIONAL DESCRIPTION

The TDA8012M is a low power PLL FM demodulator
designed for use in satellite TV reception systems.

The demodulator is based on a Phase-Locked Loop (PLL)
structure including a fully balanced two-pin VCO. A high
gain IF amplifier ensures a high input sensitivity. The video
output voltage is supplied via a highly linear video buffer
which has a low output impedance. The centre frequency
of the VCO and the loop characteristics can be set using
external components.

The circuit provides an AGC signal which is used to drive
a gain-controlled IF amplifier (TDA8011T or TDA8010M)
to ensure a stable PLL demodulation characteristic.

An analog AFC voltage is also made available. This signal
can be suitably applied to the input of the ADC port of the
PLL frequency synthesizer (TSA5055). The AFC function
may be keyed to address D2MAC and MUSE systems.

The TDA8012M includes a Carrier Detector (CD) which is
used for channel detection during search procedures.

1996 Mar 26 4

Philips Semiconductors Product specification

Low power PLL FM demodulator

TDA8012M

for satellite TV receivers

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

CC

V

i(max)

I

source(max)

t

sc

Z

L

T

stg

T

j

T

amb

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe it is
desirable to take normal precautions appropriate to handling MOS devices.

supply voltage −0.3 6.0 V
maximum input voltage on all pins −0.3 V

CC

V
maximum output source current − 10 mA
maximum short-circuit time on all outputs − 10 s
AC load impedance at video output 600 −Ω
storage temperature −55 +150 °C
junction temperature − +150 °C
operating ambient temperature −10 +80 °C

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 120 K/W

CHARACTERISTICS

=5V; fi= 480 MHz; Vi=57dBµV; T

V

CC

=25°C; measured in application circuit of Fig.4;

amb

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CC

I

CC

supply voltage 4.75 5.0 5.25 V
supply current note 1 50 60 70 mA

Voltage controlled oscillator

K

VCO

δf

/δT voltage controlled oscillator drift note 2 −−70 × 10−6−°C

o

∆f

o

voltage controlled oscillator constant VCC= 4.75 to 5.25 V;

T

= −10 το +80 °C

amb

22.5 25 27.5 MHz/V

voltage controlled oscillator shift VCC= 4.75 to 5.25 V −− ±750 kHz

Frequency demodulator

V

i

Z

i

input signal voltage level note 3 53 57 61 dBµV
input impedance real part; note 4 − 50 −Ω

parallel inductive part;

− 130 − nH

note 4

K

PD

G

v

phase detector constant Vi=57dBµV − 0.37 − V/rad
phase-lock loop gain drift; note 5 − 2 − dB

shift; note 5 − 2 − dB

−1

1996 Mar 26 5

Philips Semiconductors Product specification

Low power PLL FM demodulator

TDA8012M

for satellite TV receivers

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Z

o(diff)

CR

PLL

G

diff

Φ

diff

IM3 third-order intermodulation distortion note 8 50 −−dB

Video output

V

o(p-p)

V

O(DC)

Z

o

Automatic gain control (note 9)
AGC

th

LD level detector shift;

V

sat(AGC)

differential output impedance of the

1.6 2 2.4 kΩ

phase detector
phase-lock loop capture range note 6 −±17 − MHz
differential gain note 7 −±2 −%
differential phase note 7 −±2 −deg

baseband output signal amplitude

∆fo= 25 MHz 0.9 1.0 1.1 V

(peak-to-peak value)
DC voltage level of video output 2.1 2.35 2.6 V
output impedance − 10 50 Ω

AGC threshold as a function of the
voltage applied to pin 10

I

= 0.5 mA; 0.1V

AGC

= 0.5 mA; 0.9V

I

AGC

−− 53 dBµV

CC

61 −−dBµV

CC

− 1 − dB

= 4.75 to 5.25 V

V

CC

− 1 − dB

AGC steepness I
low level AGC output saturation

drift;

= −10 to +80 °C

T

amb

= 0.5 mA; note 10 − 8 − mA/dB

AGC

I

=1mA − 200 500 mV

AGC

voltage

Keying pulse

t

key

t

W(key)

V

IL

V

IH

Z

i

input keyed pulse time period − 64 −µs
keyed pulse width 8 −−µs
LOW level input keyed pulse voltage key on −− 0.8 V
HIGH level input keyed pulse voltage key off 2.7 −−V
input impedance 1 −−kΩ

AFC and carrier detector output (note 11)
δV

AFC

AFC/δf

shift

AFC steepness 4.9 5.5 6.1 V/MHz
shift of AFC voltage in relation to

VCO shift with unmodulated
480 MHz input signal

AFC

drift

drift of AFC voltage in relation to the
VCO

∆VCC= ±5% −±180 ±500 kHz

T

=80°C; note 12 −−400 − kHz

amb

1996 Mar 26 6

Philips Semiconductors Product specification

Low power PLL FM demodulator

TDA8012M

for satellite TV receivers

Notes

1. The DC supply current is defined for VCC=5V.

2. This typical value of −70 ppm/°C or −70 × 10−6°C−1 can be found in the reference measuring set-up shown in Fig.3.
The temperature drift may be adjusted by the temperature coefficient of the external capacitor in the tank circuit.

3. The circuit is designed for an input level of 57 dBµV. The maximum allowable input level is 61 dBµV. However, for
levels other than 57 dBµV the optimum loop filter values will be different from those given for the 57 dBµV input level
in the reference measuring set-up.

4. The input impedance is reduced to a resistor with a parallel reactance. The values are given at 480 MHz. In order to
reduce the radiation from the oscillator to the RF input, it is recommended to use a symmetrical drive.

5. The PLL loop gain shift and drift are given without loop filter shift and drift (non-temperature compensated external
components).

6. The capture range or lock-in range is defined as the PLL normal operating range. This value depends strongly on
the loop filter characteristics.

7. Measurements with test signals in accordance with CCIR recommendation 473-3. FM modulated signal with
DBS parameters:

a) 625 lines PAL TV system
b) 25 MHz/V modulator sensitivity
c) 1 V (p-p) video signal
d) No SAW filter is used.

8. No SAW filter is used at the input:
a) 16 MHz/V modulator sensitivity
b) 4.43 MHz sine wave colour signal [660 mV (p-p)]
c) 3.25 MHz sine wave luminance signal [700 mV (p-p)]
d) Two Wegner sound sub-carriers at 7.02 and 7.2 MHz (100 mV)
e) Intermodulation distance is defined as the distance between the luminance signal and the intermodulation

products.

9. The characteristics of the AGC function are measured in the application circuit of Fig.4. The circuit illustrated in Fig.4
has been designed to set the maximum AGC current of 1 mA. The output of the AGC function is capable of handling
up to 5 mA. The maximum AGC current can be increased to 5 mA by decreasing the value of the resistor connected
between pins 8 and 9.

10. In the application circuit (see Fig.4) the voltage at the AGC output decreases when the IF input level increases above
the adjusted AGC threshold.

11. The outputs from the AFC and carrier detector are combined at pin 19 (see Fig.3). During search tuning, when the
input frequency is outside the capture range, the combined output (carrier detector function) is at a LOW level
(any voltage below 0.6VCC). When the PLL becomes locked, the voltage at pin 19 rises to a HIGH level
(V19= 0.8VCCto VCC). When the input channel is close to the centre frequency, V19 falls to the LOW level. As shown
in Fig.3, the voltage at pin 19 is now a function of the centre frequency (AFC function). This information may be read
by a microcontroller via the ADC of the satellite frequency synthesizer (TSA5055) and the I2C-bus.

12. The drift of the AFC voltage is measured in accordance with the following method:
a) At room temperature (T

pin 20 must be adjusted to obtain a 1.5 V output at the AFC output (pin 19).

b) At T

therefore, be adjusted to obtain 1.5 V at the AFC output. The drift of the AFC voltage will then be equal to the
difference between the new input frequency and 480 MHz.

=80°C, due to its temperature drift, the AFC output voltage differs from 1.5V. The input frequency must,

amb

=25°C) the TDA8012M is driven by a 480 MHz unmodulated signal. The voltage at

amb

1996 Mar 26 7

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

V19/V

CC

1

0.8

0.6

0.45

0.3

0.15
0

carrier detect on

500 kHz

TDA8012M

MBE253

AFC DATA

f

o

frequency

Fig.3 AFC and carrier detector output.

1996 Mar 26 8

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

APPLICATION INFORMATION

book, full pagewidth

IF input

V

CC

AGCO

1 µF

82 kΩ

2.7 MΩ

22 µF

330 nF

10 MΩ

330 nF

10 MΩ

47
kΩ

10 nF

10 nF

4.7
kΩ

1

2

3

4

5

6

7
8

9

10

STABILIZER

AGC

CARRIER

DETECTOR

AFC

TDA8012M

VCO

VIDEO BUFFER

MBE252

TDA8012M

V

CC

36 kΩ

2.2 kΩ

20

13 kΩ

19
18

17

16

15

14

13

12

11

10

kΩ

180 pF

2

kΩ

VIDEO

KEY

10 pF

1.3
kΩ

1 µF

1.2 pF30 nH

AFC

CDO

1996 Mar 26 9

Fig.4 Application circuit.

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

PACKAGE OUTLINE

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

D

c

20

y

Z

11

H

TDA8012M

SOT266-1

E

E

A

X

v M

A

pin 1 index

110

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

1.5

0.1501.4

1.2

0.25

b

3

p

0.32

0.20

UNIT A1A2A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

6.6

0.13

6.4

0 2.5 5 mm

scale

(1)E(1)

eHELLpQZywv θ

4.5

0.65 1.0 0.2

4.3

6.6

6.2

Q

A

2

A

1

detail X

0.65

0.75

0.45

0.45

(A )

L

p

L

A

3

θ

0.13 0.1

0.48

0.18

(1)

o

10

o

0

OUTLINE
VERSION

SOT266-1

1996 Mar 26 10

REFERENCES

IEC JEDEC EIAJ

EUROPEAN

PROJECTION

ISSUE DATE

90-04-05
95-02-25

Philips Semiconductors Product specification

Low power PLL FM demodulator
for satellite TV receivers

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Reflow soldering

Reflow soldering techniques are suitable for all SSOP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering isnot recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

TDA8012M

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The longitudinal axis of the package footprint must

be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of

4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Mar 26 11

Philips Semiconductors Product specification

Low power PLL FM demodulator

TDA8012M

for satellite TV receivers

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Mar 26 12