Stereo BTL audio output amplifier
with DC volume control
Objective specification
Supersedes data of May 1995
File under Integrated Circuits, IC01
1995 Nov 09
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with
TDA7053A
DC volume control
FEATURES
• DC volume control
• Few external components
• Mute mode
• Thermal protection
• Short-circuit proof
• No switch-on and switch-off clicks
• Good overall stability
• Low power consumption
• Low HF radiation
• ESD protected on all pins.
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
P
out
supply voltage4.5−18V
output powerVP=6V
TDA7053AR
TDA7053ATR
G
G
I
q(tot)
v
C
voltage gain39.540.541.5dB
gain control68.073.5−dB
total quiescent currentVP=6V; RL=∞−2225mA
THDtotal harmonic distortion
TDA7053AP
TDA7053ATP
out
out
GENERAL DESCRIPTION
The TDA7053A (2 × 1 W) and TDA7053AT (2 × 0.5 W) are
stereo BTL output amplifiers with DC volume control.
The devices are designed for use in TV and monitors, but
are also suitable for battery-fed portable recorders and
radios.
Missing Current Limiter (MCL)
A MCL protection circuit is built-in. The MCL circuit is
activated when the difference in current between the
output terminal of each amplifier exceeds 100 mA
(typical 300 mA). This level of 100 mA allows for
headphone applications (single-ended).
=8Ω0.851.0−W
L
=16Ω0.50.6−W
L
= 0.5 W−0.31%
= 0.25 W−0.31%
ORDERING INFORMATION
TYPE
NUMBER
TDA7053ADIP16
TDA7053ATSO16
NAMEDESCRIPTIONVERSION
plastic dual in-line package; 16 leads (300 mil); long body
plastic small outline package; 16 leads; body width 7.5 mm
1995 Nov 092
PACKAGE
SOT38-1
SOT162-1
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
BLOCK DIAGRAM
TDA7053A
TDA7053AT
V
ref
STABILIZER
input 1
DC volume
control 1
4
2
V
P
5
I i
Ι
I i
TEMPERATURE
PROTECTION
TDA7053A
positive
16
output 1
negative
13
output 1
input 2
DC volume
control 2
6
8
not
connected
1,3,11,15
I i
ΙΙ
I i
signal
ground
power
ground 1
Fig.1 Block diagram.
12
negative
output 2
9
positive
output 2
14
107
power
ground 2
MSA717 - 2
1995 Nov 093
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
PINNING
SYMBOLPINDESCRIPTION
n.c.1not connected
VC12DC volume control 1
n.c.3not connected
V
4voltage input 1
5positive supply voltage
6voltage input 2
1
n.c.
2
VC1
n.c.
3
V
4
I (1)
V
V
I (2)
SGND
VC2
P
TDA7053A
TDA7053AT
5
6
7
8
MSA719 - 2
Fig.2 Pin configuration.
TDA7053A
16
OUT1
n.c.
15
PGND1
14
13
OUT1
OUT2
12
n.c.
11
PGND2
10
OUT2
9
FUNCTIONAL DESCRIPTION
The TDA7053A and TDA7053AT are stereo output
amplifiers with two DC volume control stages, designed for
TV and monitors, but also suitable for battery-fed portable
recorders and radios.
In conventional DC volume control circuits the control or
input stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
The two DC volume control stages are integrated into the
input stages so that no coupling capacitors are required
and a low offset voltage is still maintained. The minimum
supply voltage also remains low.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Consequently, a reduced power supply with smaller
capacitors can be used which results in cost reductions.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
The maximum gain of the amplifier is fixed at 40.5 dB.
The DC volume control stages have a logarithmic control
characteristic. Therefore, the total gain can be controlled
from +40.5 to −33 dB.
If the DC volume control voltage falls below 0.4 V, the
device will switch to the mute mode.
The amplifier is short-circuit protected to ground, V
and
P
across the load. A thermal protection circuit is also
implemented. If the crystal temperature rises above
150 °C the gain will be reduced, thereby reducing the
output power.
Special attention is given to switch-on and switch-off
clicks, low HF radiation and a good overall stability.
1995 Nov 094
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
TDA7053A
volume control
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
P
I
ORM
I
OSM
P
tot
t
sc
V
n
T
amb
T
stg
T
vj
THERMAL CHARACTERISTICS
supply voltage−18V
repetitive peak output current−1.25A
non-repetitive peak output current−1.5A
total power dissipationT
amb
≤ 25 °C
TDA7053A−2.5W
TDA7053AT−1.32W
short-circuit time−1hr
input voltage pins 2, 4, 6 and 8−5V
operating ambient temperature−40+85°C
storage temperature−55+150°C
virtual junction temperature−+150°C
SYMBOLPARAMETERVALUEUNIT
R
th j-a
thermal resistance from junction to ambient in free air
TDA7053A50K/W
TDA7053AT95K/W
Power dissipation
TDA7053A:
Assume V
= 6 V and RL=8Ω.
P
The maximum sine wave dissipation is 2 × 0.9 W = 1.8 W.
The R
of the package is 50 K/W therefore T
th j-a
amb(max)
= 150 − (50 × 1.8) = 60 °C.
TDA7053AT:
Assume V
= 6 V and RL=16Ω.
P
The maximum sine wave dissipation is 2 × 0.46 W = 0.92 W.
The R
of the package is 95 K/W therefore T
th j-a
amb(max)
= 150 − (95 × 0.92) = 62.6 °C.
1995 Nov 095
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
TDA7053A
volume control
CHARACTERISTICS
VP=6V; T
(see Fig.13).
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
I
q(tot)
Maximum gain; V
P
out
THDtotal harmonic distortion
G
v
V
I(rms)
V
no
Bbandwidthat −1dB−note 3−Hz
SVRRsupply voltage ripple rejectionnote 43438−dB
V
supply voltage4.5−18V
total quiescent currentVP=6V; RL=∞; note 1−2225mA
≥ 1.4 V
2,8
output powerTHD = 10%
TDA7053A1.01.1−W
TDA7053AT0.50.6−W
TDA7053AP
TDA7053ATP
= 0.5 W−0.31%
out
= 0.25 W−0.31%
out
voltage gain39.540.541.5dB
input signal handling (RMS value) Gv= 0 dB; THD < 1%1−−V
noise output voltage fi= 500 kHz; note 2−210−µV
DC output offset voltageV16− V13 and V12− V9−0200mV
input impedance (pins 4 and 6)152025kΩ
channel separationRS=5kΩ40−−dB
= 0 dB; note 6−−1dB
G
1
= 0.4 V ±30 mV
2,8
output voltage in mute positionVi= 1.0 V; note 7−−30µV
gain control68.573.5−dB
volume control currentV2=V8=0V−20−25−30µA
Notes
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage divided by R
2. The noise output voltage (RMS value) at fi= 500 kHz is measured with RS=0Ω and bandwidth = 5 kHz.
3. 20 Hz to 300 kHz (typical).
4. The ripple rejection is measured with RS=0Ω and fi= 100 Hz to 10 kHz. The ripple voltage of 200 mV (RMS value)
is applied to the positive supply rail.
5. The channel unbalance is measured with V
6. The channel unbalance at G1= 0 dB is measured with V
7. The noise output voltage (RMS value) is measured with RS=5kΩ unweighted.
1995 Nov 096
.
L
DC1=VDC2
.
DC1=VDC2
.
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
(1) Gv= 30 dB; Po= 0.1 W.
(2) Gv= 40 dB; Po= 0.1 W.
(2)
(1)
−2
Fig.5 THD as a function of frequency.
MBG669
−1
10
10110
f (kHz)
2
10
2.5
handbook, halfpage
P
out
(W)
2.0
1.5
1.0
0.5
0
0
(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.
(1)(2) (3)
481216
MBG670
VP (V)
Fig.6Output power as a function of supply
voltage.
1995 Nov 097
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
12
V
P
MBG668
(V)
handbook, halfpage
4
P
diss
(W)
3
2
1
0
04816
(1) RL=8Ω.
(2) RL=16Ω.
(3) RL=25Ω.
(2)(3)(1)
80
handbook, halfpage
G
v
(dB)
40
0
−40
−80
−120
0
TDA7053A
0.40.81.21.6
MBG667
VVC (V)
2.0
Fig.7Total worst case power dissipation as a
function of supply voltage.
V
no
(mV)
10
10
1
−1
−2
0
0.40.81.21.6
VVC (V)
handbook, halfpage
MBG664
2.0
Fig.8Voltage gain as a function of volume control
voltage.
10110
MBG663
f (kHz)
10
SVRR
(dB)
−20
−40
−60
−80
0
−2
handbook, halfpage
(1)
(2)
−1
10
2
f = 22 Hz to 22 kHz.
Fig.9Noise voltage as a function of volume
control voltage.
1995 Nov 098
(1) VDC= 1.4 V;V
(2) VDC= 0.4 V; V
ripple
ripple
= 0.2 V.
= 0.2 V.
Fig.10 SVRR as a function of frequency.
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
2.0
handbook, halfpage
V
in
(V)
1.6
1.2
0.8
0.4
0
020
481216
MBG665
V
(V)
P
30
handbook, halfpage
I
VC
(µA)
20
10
0
−10
−20
−30
0
TDA7053A
0.40.81.21.6
MBG666
VVC (V)
2.0
THD = 1 %.
Fig.11 Input signal handling.
APPLICATION INFORMATION
The application diagram is illustrated in Fig.13.
Test conditions
T
=25°C unless otherwise specified; VP=6V;
amb
VDC= 1.4 V; fi= 1 kHz; RL=8Ω.
The quiescent current has been measured without load
impedance.
The output power as a function of the supply voltage has
been measured at THD = 10%. The maximum output
power is limited by the maximum power dissipation and the
maximum available output current.
Fig.12 Volume control current as a function of
volume control voltage.
The maximum input signal voltage is measured at
THD = 1% at the output with a voltage gain of 0 dB.
To avoid instabilities and too high distortion, the input
ground and power ground must be separated as far as
possible and connected as close as possible to the IC.
The DC volume control can be applied in several ways.
Two possible circuits are shown below the main
application diagram. The circuits at the control pin will
influence the switch-on and switch-off behaviour and the
maximum voltage gain.
For single-end applications the output peak current must
not exceed 100 mA. At higher output currents the
short-circuit protection (MCL) will be active.
1995 Nov 099
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
handbook, full pagewidth
TDA7053A
470 nF
input 1
Rs = 5 kΩ
4
2
STABILIZER
TEMPERATURE
PROTECTION
I + 1
I − 1
MCL
TDA7053A
(1)
100 nF
5
VP = 6 V
220 µF
16
(2)
13
input 2
Rs = 5 kΩ
volume
control
470 nF
DC-
volume
1 MΩ1 µF
2, 8
maximum voltage
6
8
gain 34 dB
signal
ground
I − 1
I + 1
10147
power
ground
volume
control
1 µF
56 kΩ
2, 8
22 kΩ
12
9
VCC = 6 V
maximum voltage
gain 40 dB
MBG673
(2)
(1) This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 5.
(2) RL=8Ω.
1995 Nov 0910
Fig.13 Test and application diagram.
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
1
w M
TDA7053A
SOT38-1
M
E
A
2
A
c
(e )
1
M
H
pin 1 index
1
0510 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.70.513.7
OUTLINE
VERSION
SOT38-1
min.
A
12
max.
0.15
IEC JEDEC EIAJ
050G09MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEeM
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1)(1)
6.48
6.20
0.26
0.24
E
(1)
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
H
9.5
0.2542.547.62
8.3
0.37
0.010.100.0200.19
0.33
ISSUE DATE
w
92-10-02
95-01-19
Z
max.
2.2
0.087
1995 Nov 0911
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
SO16: plastic small outline package; 16 leads; body width 7.5 mm
D
c
y
Z
16
9
TDA7053A
SOT162-1
E
H
E
A
X
v
M
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
0.30
0.10
0.012
0.004
1
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
3
p
0.49
0.36
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
8
w
b
p
cD
0.32
0.23
M
0510 mm
scale
(1)E(1)(1)
10.5
10.1
0.41
0.40
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
A
2
10.65
10.00
0.42
0.39
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
0.043
0.039
1.1
1.0
Q
3
0.250.1
0.01
A
θ
ywvθ
0.004
Z
0.9
0.4
0.035
0.016
o
8
o
0
(A )
L
p
L
0.25
0.01
OUTLINE
VERSION
SOT162-1
1995 Nov 0912
REFERENCES
IEC JEDEC EIAJ
075E03 MS-013AA
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-24
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
volume control
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
DIP
OLDERING BY DIPPING OR BY WA VE
S
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
EPAIRING SOLDERED JOINTS
R
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
(order code 9398 652 90011).
). If the
stg max
TDA7053A
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
AVE SOLDERING
W
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
EPAIRING SOLDERED JOINTS
R
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Nov 0913
Philips SemiconductorsObjective specification
Stereo BTL audio output amplifier with DC
TDA7053A
volume control
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Nov 0914
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.