DATASHEETS tda1516c DATASHEETS (Philips)

INTEGRATED CIRCUITS
DATA SH EET
TDA1516CQ
24 W BTL car radio power amplifier
Product specification File under Integrated Circuits, IC01
July 1994
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
FEATURES
Requires very few external components for Bridge-Tied­Load (BTL)
High output power (without bootstrap)
Low offset voltage at output (important for BTL)
Fixed gain
Capability to handle high energy on outputs (V
Protected against electrostatic discharge
No switch-on/switch-off plop
Flexible leads
Low thermal resistance
Identical inputs (inverting and non-inverting).
= 0)
P
Good ripple rejection
Mute/stand-by switch
Load dump protection
AC and DC short-circuit-safe to ground and V
Thermally protected
P
GENERAL DESCRIPTION
The TDA1516CQ is a monolithic integrated class-B output amplifier in a 13-lead single-in-line (SIL) plastic power package. The device is primarily developed for car radio applications.
Reverse polarity safe
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
P
positive supply voltage range
operating 6.0 14.4 18 V non-operating −−30 V load dump −−45 V
I
ORM
I
P
I
sb
I
sw
input impedance BTL 25 −−k
Z
I
T
XTAL
P
O
SVRR supply voltage ripple rejection R
repetitive peak output current −−4A total quiescent current 40 80 mA stand-by current 0.1 100 µA switch-on current −−60 µA
crystal temperature −−+150 °C output power THD = 10%; 4 Ω−22 W
= 0; f = 100 Hz 45 −−dB
S
f = 1 to 10 kHz 48 −−dB
V
no
∆V
os
noise output voltage 70 −µV
DC output offset voltage −−100 mV
ORDERING INFORMATION
EXTENDED TYPE
NUMBER
TDA1516CQ 13 DIL plastic SOT141
Note
1. SOT141-6; 1996 August 21.
July 1994 2
PACKAGE
PINS PIN POSITION MATERIAL CODE
(1)
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
handbook, full pagewidth
bootstrap switch
2
60
k
1
2
k
12
mute switch
VA
k
18
stand-by
switch
VA
x1
k
15
k
15
C
m
power stage
V
P
bootstrap switch
mute reference voltage
stand-by reference voltage
mute switch
100
5
6
11
TDA1516CQ
18 k
2
k
13
60 k
4
input
reference
voltage
VA
signal ground
mute switch
C
m
V
Fig.1 Block diagram.
July 1994 3
power stage
9
8
100
P
power ground (substrate)
7103
bootstrap switch
MBC084
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
PINNING
SYMBOL PIN DESCRIPTION
INV1 1 non-inverting input 1 INV 2 inverting input GND1 3 ground (signal) V
ref
4 reference voltage OUT1 5 output 1 BS1 6 bootstrap 1 GND2 7 ground (substrate) BS2 8 bootstrap 2 OUT2 9 output 2 V
P
10 supply voltage M/SB 11 mute/stand-by switch RR 12 supply voltage ripple rejection
INV2 13 non-inverting input 2
handbook, halfpage
INV1
1
FUNCTIONAL DESCRIPTION
The TDA1516CQ contains two identical amplifiers with differential input stages. It can be used for bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by switch, which has the following features:
low stand-by current (< 100 µA)
low mute/stand-by switching current (low cost supply
switch)
mute condition.
2
INV
3
GND1
V
4
ref
5
OUT1
6
BS1
7
V
P
TDA1516CQ
8
9 10 11 12 13
MLA704
GND2
BS2
OUT2
M/SS
RR
INV2
Fig.2 Pin configuration.
July 1994 4
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
P
V
PSC
V
PR
I
OSM
I
ORM
P
tot
T
stg
T
vj
supply voltage
operating 18 V non-operating 30 V load dump protected; during 45 V
50 ms; rise time 2.5 ms AC and DC short-circuit safe voltage 18 V reverse polarity 6V energy handling capability at outputs V
= 0 200 mJ
P
non-repetitive peak output current 6A repetitive peak output current 4A total power dissipation T
< 75 °C; (see Fig.3) 25 W
case
storage temperature range 55 +150 °C virtual junction temperature −+150 °C
Fig.3 Power derating curve.
July 1994 5
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
DC CHARACTERISTICS
= 14.4 V; T
V
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
P
I
P
V
O
DC output offset voltage (pins 5 and 9) −−100 mV
∆V
os
Mute/stand-by switch
V
sw
MUTE CONDITION V
mute
V
O
DC output offset voltage (pins 5 and 9) −−100 mV
∆V
os
STAND-BY CONDITION V
sb
I
sb
I
sw
I
P
= 25 °C; unless otherwise specified. See note 1.
amb
positive supply voltage range note 2 6.0 14.4 18 V quiescent current 40 80 mA DC output voltage note 3 6.8 V
switch-on voltage level 8.5 −−V
mute voltage 3.3 6.4 V output signal in mute position VI = 1 V (max); −−2mV
f = 20 Hz to10 kHz
stand-by voltage 0 2V DC standby current V11≤ 0.5 V −−100 µA
0.5 < V
2 V −−500 µA
11
switch-on current V11≤ V10; note 4 25 60 µA supply current short-circuit to GND; note 5 5.5 mA
July 1994 6
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
AC CHARACTERISTICS
= 14.4 V; RL = 4 ; f = 1 kHz; T
V
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
P
O
output power THD = 0.5% 15 17 W
THD total harmonic distortion P B power bandwidth THD = 0.5%; P
f
low
f
high
G
v
low frequency roll-off 3 dB; note 7 25 Hz high frequency roll-off 1 dB 20 −−kHz closed loop voltage gain 25 26 27 dB
SVRR supply voltage ripple rejection
input impedance 25 30 38 k
Z
I
V
no
noise output voltage
= 25 °C; unless otherwise specified. See note 1.
amb
THD = 10% 20 22 W THD = 10%; note 6 21 24 W
= 13.2 V; THD = 0.5% 13.5 W
V
P
= 13.2 V; THD = 10% 17 W
V
P
= 13.2 V; THD = 10%; 19 W
V
P
note 6
= 1 W 0.05 %
O
= 1 dB 20 to Hz
O
with respect to 15 W 15 000
ON; notes 8 and 9 45 −−dB ON; notes 8 and 10 48 −−dB MUTE; notes 8 to 10 48 −−dB stand-by; notes 8 to 10 80 −−dB
ON; R R
= 0; note 11 70 −µV
S
= 10 k; note 12 100 200 µV
S
MUTE; note 12 60 −µV
Notes
1. All characteristics are measured using the circuit shown in Fig.4
2. The circuit is DC adjusted at V
= 6 to 18 V and AC operating at VP = 8.5 to 18 V
P
3. At 18 V < V < 30 V, the DC output voltage VP/2
4. If V11> V10, then I11 must be 10 mA
5. Conditions: V11 = 0; short-circuit output to GND; switch V11 to mute or on condition (rise time V11> 10 µs)
6. With bootstrap and a resistor of 100 kfrom VP/2 to the positive supply voltage (VP). (Bootstrap capacitor of 47 µF)
7. Frequency response externally fixed
8. Ripple rejection measured at the output with a source-impedance of 0 (max. ripple amplitude of 2 V)
9. Frequency = 100 Hz
10. Frequency = 1 to 10 kHz
11. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz
12. Noise output voltage independent of RS(Vin= 0)
July 1994 7
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
stand - by 
handbook, full pagewidth
to pin 13
412
input
reference
voltage
2
internal 1/2 V
P
TDA1516CQ
60 k
1
376 5 9 8
signal
ground
power
ground
20 dB
to V
20 dB
P
R = 4
L
to V
switch
1011
60 k
13
MBC085
P
100
220 nF
to pin 
2
nF
input 2
2200
µF
V
P
Fig.4 Application diagram.
July 1994 8
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
PACKAGE OUTLINE
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
non-concave
x
D
E
h
view B: mounting base side
d
B
j
A
SOT141-6
D
h
2
E
A
113
e
Z
DIMENSIONS (mm are the original dimensions)
UNIT A e
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE VERSION
SOT141-6
A2bpcD
17.0
4.6
4.2
0.75
0.60
15.5
1
e
(1)
0.48
24.0
23.6
20.0
19.6
0.38
IEC JEDEC EIAJ
w M
b
p
0 5 10 mm
(1)
deD
E
h
12.2
10 3.4
11.8
REFERENCES
scale
1
1.7
e
5.08
L
3
L
E
2
h
6
Q
c
m
LL3m
3.4
12.4
3.1
11.0
e
2
2.4
1.6
PROJECTION
Qj
2.1
4.3
1.8
EUROPEAN
v M
v
0.8
x
0.25w0.03
ISSUE DATE
92-11-17 95-03-11
(1)
Z
2.00
1.45
July 1994 9
Philips Semiconductors Product specification
24 W BTL car radio power amplifier TDA1516CQ
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994 10
Loading...