Product specification
File under Integrated Circuits, IC01
July 1994
Philips SemiconductorsProduct specification
24 W BTL car radio power amplifierTDA1516CQ
FEATURES
• Requires very few external components for Bridge-TiedLoad (BTL)
• High output power (without bootstrap)
• Low offset voltage at output (important for BTL)
• Fixed gain
• Capability to handle high energy on outputs (V
• Protected against electrostatic discharge
• No switch-on/switch-off plop
• Flexible leads
• Low thermal resistance
• Identical inputs (inverting and non-inverting).
= 0)
P
• Good ripple rejection
• Mute/stand-by switch
• Load dump protection
• AC and DC short-circuit-safe to ground and V
• Thermally protected
P
GENERAL DESCRIPTION
The TDA1516CQ is a monolithic integrated class-B output
amplifier in a 13-lead single-in-line (SIL) plastic power
package. The device is primarily developed for car radio
applications.
−INV11non-inverting input 1
INV2inverting input
GND13ground (signal)
V
ref
4reference voltage
OUT15output 1
BS16bootstrap 1
GND27ground (substrate)
BS28bootstrap 2
OUT29output 2
V
P
10supply voltage
M/SB11mute/stand-by switch
RR12supply voltage ripple rejection
−INV213non-inverting input 2
handbook, halfpage
INV1
1
FUNCTIONAL DESCRIPTION
The TDA1516CQ contains two identical amplifiers with
differential input stages. It can be used for bridge
applications. The gain of each amplifier is fixed at 20 dB.
A special feature of this device is the mute/stand-by
switch, which has the following features:
• low stand-by current (< 100 µA)
• low mute/stand-by switching current (low cost supply
switch)
• mute condition.
2
INV
3
GND1
V
4
ref
5
OUT1
6
BS1
7
V
P
TDA1516CQ
8
9
10
11
12
13
MLA704
GND2
BS2
OUT2
M/SS
RR
INV2
Fig.2 Pin configuration.
July 19944
Philips SemiconductorsProduct specification
24 W BTL car radio power amplifierTDA1516CQ
LIMITING VALUES
In accordance with the Absolute maximum System (IEC 134).
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT141-6
A2bpcD
17.0
4.6
4.2
0.75
0.60
15.5
1
e
(1)
0.48
24.0
23.6
20.0
19.6
0.38
IEC JEDEC EIAJ
w M
b
p
0510 mm
(1)
deD
E
h
12.2
103.4
11.8
REFERENCES
scale
1
1.7
e
5.08
L
3
L
E
2
h
6
Q
c
m
LL3m
3.4
12.4
3.1
11.0
e
2
2.4
1.6
PROJECTION
Qj
2.1
4.3
1.8
EUROPEAN
v M
v
0.8
x
0.25w0.03
ISSUE DATE
92-11-17
95-03-11
(1)
Z
2.00
1.45
July 19949
Philips SemiconductorsProduct specification
24 W BTL car radio power amplifierTDA1516CQ
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 199410
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