Objective specification
File under Integrated Circuits, IC02
Philips Semiconductors
June 1994
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
FEATURES
• Digital data slicer
• Acquisition and decoding of VPS data
(EBU PDC System A)
• Acquisition and decoding of Teletext packet 8/30/2 data
(EBU PDC System B)
• Separate storage of VPS data and packet 8/30/2
allowing dual standard PDC decoders
• I2C-bus interface with automatic word address
increment
• Programmable interrupt for data received
• Programmable error level detection
• Single +5 V power supply.
GENERAL DESCRIPTION
The SAA5233 is a dual standard Program Delivery Control
(PDC) decoder, allowing the reception and decoding of
both VPS data (EBU PDC System A) and Teletext packet
8/30/2 data (EBU PDC System B). It is intended for use in
European video recorders which are manually
programmed, so that they receive broadcast real time
switching signals for accurate timing of program recording.
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
V
DD
I
DD
f
clk
V
sync
V
vid(p-p)
supply voltage4.55.05.5V
supply current−3045mA
crystal input frequency−27−MHz
CVBS sync voltage amplitude0.10.30.6V
CVBS video voltage amplitude
SCL1215serial clock open-drain input for I
SDA1316serial data open-drain input/output for I
1114connect to V
in normal operation
SS1
2
C-bus
2
C-bus
i.c.−17internally connected; do not connect in normal operation
AD1418programmable I2C-bus address bit input
INT1519interrupt open-drain output
V
SS5
1620connect to V
in normal operation
SS1
handbook, halfpage
CVBS
BLACK
IREF
V
DD
V
SS1
OSCOUT
OSCIN
OSCGND
1
2
3
4
SAA5233
5
6
7
8
MLB726
V
16
SS5
15
INT
14
AD
13
SDA
12
SCL
V
11
SS4
V
10
SS3
V
9
SS2
Fig.2 Pin configuration; DIP16.
June 19944
handbook, halfpage
OSCOUT
OSCGND
1
CVBS
BLACK
OSCIN
2
3
n.c.
4
V
5
DD
V
SS1
n.c.n.c.
SAA5233
6
7
8
9
10
MLB727
20
19
18
17
16
15
14
13
12
11
V
SS5
INT
AD
i.c.IREF
SDA
SCL
V
SS4
V
SS3
V
SS2
Fig.3 Pin configuration; SO20L.
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
DD
V
Imax
V
Omax
I
IOmax
I
Omax
T
amb
T
stg
supply voltage−0.3+6.5V
maximum input voltage (any input)−0.3VDD+ 0.3V
maximum output voltage (any output)−0.3VDD+ 0.3V
maximum DC input or output diode current−±20mA
maximum output current (any output)−±10mA
operating ambient temperature−20+70°C
storage temperature−55+125°C
June 19945
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
QUALITY AND RELIABILITY
This device will meet the requirements of the
accordance with
“Quality Reference Pocketbook (order number 9398 510 34011)”
“Philips Semiconductors General Quality Specification SNW-FQ-611E”
Group C
Table 3 Reliability tests (by process family).
TESTCONDITIONSREQUIREMENTS
(1)
Operational life168 hours at Tj= 150 °C<1500 FPM; equivalent to <100 FITS
at Tj=70°C
Humidity lifetemperature, humidity, bias
<2000 FPM
(1000 hours, 85 °C, 85% RH or
equivalent test)
Temperature cycling performanceT
stg(min)
to T
stg(max)
<2000 FPM
in
Table 4 Reliability tests (by device type).
TESTCONDITIONSREQUIREMENTS
ESD and latch-upESD Human body model
2000 V; 100 pF; 1.5 kΩ
ESD Machine model
200 V; 200 pF; 0 Ω
latch-up 100 mA; 1.5 × V
DD
(absolute maximum)
Note to Tables 1 to 4.
1. ppm = fraction of defective devices, in parts per million.
LTPD = Lot Tolerance Percent Defective.
FPM = fraction of devices failing at test condition, in Failures Per Million.
FITS = Failures In Time Standard.
June 19946
(1)
<15% LTPD
<15% LTPD
<15% LTPD
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
CHARACTERISTICS
V
= 4.5 to 5.5 V; VSS=0V; T
DD
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DD
I
DD
supply voltage4.55.05.5V
supply current−3045mA
Inputs
CVBS
V
sync
V
vid(p-p)
sync voltage amplitude0.10.30.6V
video voltage amplitude
(peak-to-peak value)
V
dat(text)
Teletext data voltage
amplitude
V
dat(vps)
Z
source
Z
I
C
I
VPS data voltage amplitude0.300.500.70V
source impedance−−250Ω
input impedance2.55.0−kΩ
input capacitance−−10pF
IREF
R
V
gnd
IREF
resistor to ground−27−kΩ
input reference voltage−0.5V
AD
V
IL
V
IH
I
LI
C
I
LOW level input voltage−0.3−+0.3V
HIGH level input voltage0.7V
input leakage currentVI=0toV
input capacitance−−10pF
SCL
V
IL
V
IH
I
LI
C
I
f
clk
t
r
t
f
LOW level input voltage−0.3−+0.3V
HIGH level input voltage0.7V
input leakage currentVI=0toV
input capacitance−−10pF
clock frequency0−100kHz
input rise time0.3VDDto 0.7V
input fall time0.7VDDto 0.3V
= −20 to +70 °C; unless otherwise specified.
amb
0.71.01.4V
0.300.460.70V
DD
DD
DD
DD
−10−+10µA
−10−+10µA
−−1000ns
−−300ns
DD
DD
DD
−V
DD
−VDD+ 0.3V
DD
−VDD+ 0.3V
V
V
June 19947
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Outputs
INT (OPEN-DRAIN OUTPUT)
V
PU
V
OL
I
OL
C
L
t
f
Inputs/Outputs
BLACK
C
black
I
LI
SDA (OPEN-DRAIN OUTPUT)
V
IL
V
IH
I
LI
C
I
C
L
t
r
t
f
V
OL
t
f
CRYSTAL OSCILLATOR (OSCIN; OSCOUT)
V
osc
G
v
C
I
C
fb
pull-up voltage at pin−−V
DD
LOW level output voltageIOL= 3 mA0−0.4V
LOW level output current−−4.0mA
load capacitance−−400pF
output fall timeCL= 100 pF;
0.7VDDto 0.3V
DD
−−100ns
storage capacitor to ground−100−nF
input leakage currentVI=0toV
DD
LOW level input voltage−0.3−+0.3V
HIGH level input voltage0.7V
input leakage currentVI=0toV
DD
−10−+10µA
V
DD
DD
−VDD+ 0.3V
−10−+10µA
input capacitance−−10pF
load capacitance−−400pF
input rise time0.3VDDto 0.7V
input fall time0.7VDDto 0.3V
DD
DD
−−1000ns
−−300ns
LOW level output voltageIOL= 3 mA0−0.4V
output fall timeCL= 400 pF;
0.7VDDto 0.3V
oscillator voltage amplitude
DD
−−200ns
−1.0−V
(peak-to-peak value)
small signal voltage gain−1.0−
input capacitance−−10pF
feedback capacitance−1−pF
June 19948
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
2
C-bus timing (see Fig.4)
I
f
clk
t
BUF
t
HD;STA
t
LOW
t
HIGH
t
SU;STA
t
HD;DAT
t
SU;DAT
t
r
t
f
t
SU;STO
Note
1. After this time the first clock pulse is generated.
SCL clock frequency0−100kHz
bus free time between a
4.7−−µs
STOP and START
repeated START hold timenote 14.0−−µs
SCL clock LOW time4.7−−µs
SCL clock HIGH time4.0−−µs
set-up time for a repeated
4.7−−µs
START
data hold time0−−ns
data set-up time250−−ns
SDA, SCL input rise time0.3VDDto 0.7V
SDA, SCL input fall time0.7VDDto 0.3V
DD
DD
−−1000ns
−−300ns
set-up time for STOP4.0−−µs
ndbook, full pagewidth
SDA
SCL
SDA
MBC764
t
BUF
t
HD;STA
t
LOW
t
r
t
HD;DAT
t
SU;STA
Fig.4 I2C-bus timing diagram.
t
HIGH
t
f
t
SU;DAT
t
SU;STO
June 19949
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
FUNCTIONAL DESCRIPTION
Control of device
The function of the device is controlled via the I
2
C-bus.
Pin AD provides a choice of two alternative addresses.
The PDC acquisition section requires little software control
apart from enabling the interrupts which occur when data
is found. Interrupts can be enabled for either Teletext
packet 8/30/2 or VPS and both can be enabled to allow for
the presence of both standards being transmitted on the
same TV channel. The interrupt register is accessed as
address 01 WRITE, see Section “Register 01: Interrupt
(reset state X00X XXXX)”.
When an interrupt is signalled, a bit is set in the status
register to indicate its source. Information about the
received PDC data is given in the status register D5 and
D6. The microcontroller must service the ‘data received’
interrupts within 40 ms (VPS) or 200 ms
(Teletext packet 8/30/2), since new data may be written
after this period. The status register is accessed as
address 00 READ; see Section
“Register 00:Control/Status (reset state XXX0 XX00)”.
When the status register has been read the data received
flags and interrupt signal are reset.
Data of both types is constantly received and stored, but
can be selectively acquired by setting bits D1 and D0 of the
control register. This allows acquisition of only Teletext
packet 8/30/2 on every VBI line or only VPS data on every
VBI line. The control register is accessed as address
00 WRITE, see Section “Register 00:Control/Status (reset
state XXX0 XX00)”.
Storage of PDC data
The PDC data memory is accessed at address 02 (HEX)
to 31 (HEX). The exact addresses of Teletext packet
8/30/2 and VPS data is shown in Table 5.
T
ELETEXT DATA
The Teletext packet 8/30/2 data is stored after hardware
Hamming correction. There are 4 data bits stored in the
lower nibble of each byte in address 11 (HEX)
to 1D (HEX); see Table 13, in the order shown in Table 5.
The status message, which is odd parity coded, is stored
as a byte which represents a Teletext character in address
1E (HEX) to 31 (HEX); see Table 14.
VPS
DATA
The VPS data from Line 16 is stored in register address
02 (HEX) to 0F (HEX) in the order shown in Table 5. VPS
data is biphase decoded and stored with 4 data bits stored
in the lower nibble of each byte, in the same way as
Teletext packet 8/30/2 data; see Tables 11 and 12. In
addition to the VCR data, Word 4
(Program Source Identification, ASCII sequential) is
stored, which may be useful for future applications.
2
The stored data is read via the I
C-bus in the normal way.
Multiple reception/majority error correction of the data is
the responsibility of the control software, the device simply
stores the data as transmitted after Hamming or biphase
decoding. As both VPS and Teletext packet 8/30/2 signals
are stored separately, it is possible to deal with future
situations where both EBU PDC System A and EBU PDC
System B transmissions may be present on the same TV
channel, the defaults and level of service being chosen by
the software control.
Error indication
Indication of errors in the received data is given in two
ways and is programmable by setting bit D4 in the control
register.
The first is a flag to indicate Hamming or biphase errors
and is stored with the related data in bit 0 of the upper
nibble of the data byte.
The second is no interrupt which is sent to the
microcontroller but the data signal quality bit (D7) is set.
The level of interrupt is controlled by the Interrupt
Error Level bit which is D4 of the control register. If this bit
is not set then an interrupt only occurs if an error free line
of either Teletext packet 8/30/2 or VPS data is received
and stored in RAM. If this bit is set then an interrupt occurs
if the correct framing code and Teletext packet header
8/30/2 is found, or the correct start code for VPS data is
found. The data is then stored in the RAM with any errors
indicated in the upper nibble. This may be used by more
sophisticated software, which could decide the importance
of an error in a particular nibble.
2
I
C-bus interface
EATURES
F
• Standard I2C-bus slave transceiver
• Operates from 0 to 100 kHz
• Acknowledge function is performed
• Auto-increment between registers and direct addressing
• Selectable I2C-bus slave address dependent on
address pin AD.
June 199410
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
Register map
The data received when address locations 00 (HEX) to 31 (HEX) are read or written is shown in Table 5.
Table 5 Register map.
ADDRESS (HEX)DATA
00control/statusdirect
01interruptdirect
02VPS B5direct/auto-increments to 03
03VPS B5direct/auto-increments to 04
04VPS B11direct/auto-increments to 05
05VPS B11direct/auto-increments to 06
06VPS B12direct/auto-increments to 07
07VPS B12direct/auto-increments to 08
08VPS B13direct/auto-increments to 09
09VPS B13direct/auto-increments to 0A
0AVPS B14direct/auto-increments to 0B
0BVPS B14direct/auto-increments to 0C
0CVPS B15direct/auto-increments to 0D
0DVPS B15direct/auto-increments to 0E
0EVPS B4direct/auto-increments to 0F
0FVPS B4stop value
10−direct
118/30/2 B13direct/auto-increments to 12
128/30/2 B14direct/auto-increments to 13
138/30/2 B15direct/auto-increments to 14
148/30/2 B16direct/auto-increments to 15
158/30/2 B17direct/auto-increments to 16
168/30/2 B18direct/auto-increments to 17
178/30/2 B19direct/auto-increments to 18
188/30/2 B20direct/auto-increments to 19
198/30/2 B21direct/auto-increments to 1A
1A8/30/2 B22direct/auto-increments to 1B
1B8/30/2 B23direct/auto-increments to 1C
1C8/30/2 B24direct/auto-increments to 1D
1D8/30/2 B25direct/auto-increments to 1E
1Estatus messagedirect/auto-increments to 1F
::direct/auto-increments
31status messagestop value
(1)
ADDRESSING
Note
1. For the address range 02H to 0FH, even addresses hold the least significant nibble and odd addresses hold the most
significant nibble. BXX refers to byte definitions, EBU specification of the domestic video PDC system.
June 199411
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
Register 00:Control/Status (reset state XXX0 XX00)
Register 00 is split into two parts. The control part (WRITE only) consisting of bits D4, D1 and D0 and status part (READ
only) consisting of bits D7 to D5.
Table 6 Register 00.
D7D6D5D4D3D2D1D0
−−−IEL−−ACQ 8/30/2ACQ VPS
DSQ8/30/2 RFVPS RF−−−−−
Table 7 Register 00 bit description.
SYMBOLBITFUNCTION
IELD4Interrupt Error Level.
When logic 0, signal only completely valid data lines from Teletext packet 8/30/2
received and VPS received flags.
When logic 1, signal valid framing code and Teletext packet header 8/30/2 received or
valid start codeword for VPS received.
ACQ 8/30/2
ACQ VPS
DSQD7Data Signal Quality.
8/30/2 RFD68/30/2 Received Flag.
VPS RFD5VPS Received Flag.
D1
D0
Acquire 8/30/2.
Acquire VPS.
Allows selective decoding of either Teletext packet 8/30/2 data or VPS data. If both are
set to the same value the system automatically selects the format being transmitted
(see Table 8).
When logic 1, good Teletext or VPS data signal is being received.
When logic 0, no Teletext or VPS data signal is being received.
When logic 1, and IEL (D4) = logic 0 an error-free Teletext packet 8/30/2 has been
received, Hamming decoded and stored in the RAM. When logic 1, and IEL(D4) =
logic 1 a Teletext packet with a valid framing code and 8/30/2 header has been
received, Hamming decoded and stored in RAM.
When logic 0 no Teletext packet 8/30/2 data received.
When logic 1, and IEL(D4) = logic 0, an error-free VPS data line has been received,
biphase decoded and stored in the RAM. When logic 1, and IEL(D4) = logic 1 a VPS
data line with valid start code has been received, biphase decoded and stored in RAM.
When logic 0 no VPS data received.
Table 8 Selection of Teletext packet 8/30/2 data or VPS data.
ACQ 8/30/2ACQ VPSFUNCTION
00use automatic selection algorithm for line 16
01acquire only VPS data on every VBI line
10acquire only 8/30/2 data on every line 16
11use automatic selection algorithm for line 16
June 199412
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
Register 01: Interrupt (reset state X00X XXXX)
Register R01 is WRITE only.
Table 9 Register 01.
D7D6D5D4D3D2D1D0
−8/30/2 IEVPS IE−−−−−
Table 10Register 01 bit description.
SYMBOLBITFUNCTION
8/30/2 IED68/30/2 Interrupt Enable.
This allows the reception of Teletext packet 8/30/2 data to be signalled on the INT pin.
When logic 0 reception of Teletext packet 8/30/2 data is not signalled on INT pin.
When logic 1 reception of Teletext packet 8/30/2 data is signalled on INT pin.
VPS IED5VPS Interrupt Enable.
This allows the reception of VPS data to be signalled on the INT pin.
When logic 0 reception of VPS data is not signalled on INT pin.
When logic 1 reception of VPS data is signalled on INT pin.
Register 02 to 0F (HEX): VPS data bytes
A single VPS data bytes is stored as two memory bytes, the least significant nibble of both memory bytes is the data
making up the single VPS data byte. The most significant nibble of each memory byte is used to indicate a biphase error
in the least significant nibble. This is indicated by the least significant bit being set, the top three bits are not used and
are fixed to logic 0 (see Table 11).
Table 11VPS data bytes.
ADDRESS (HEX)REGISTERDATA
02VPS B5 least significant nibble0000 1100
03VPS B5 most significant nibble0000 0101
Note
1. Equivalent to VPS B5 0101 1100 (MSB to LSB).
Table 12Register 02.
D7D6D5D4D3D2D1D0
−−−BIPHASE
ERROR BIT
Register 11 to 1D (HEX): Teletext packet 8/30/2 data bytes
Data is stored as single bytes. The four least significant bits represent the data. The fifth bit if set indicates a Hamming
error in the stored data. The top three bits of the byte are not used and are fixed to logic 0.
DATA BIT 3DATA BIT 2 DATA BIT 1DATA BIT 0
(1)
(1)
Table 13Register 11.
D7D6D5D4D3D2D1D0
−−−HAMMING
ERROR BIT
June 199413
DATA BIT 3DATA BIT 2 DATA BIT 1DATA BIT 0
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
Register 1E to 31D (HEX): Status display message
Data is stored as bytes which represent a Teletext character. The data is odd parity checked, if a parity error occurs this
causes the byte not to be written to the RAM. The MSB is not used and is fixed to logic 0.
Table 14Register 11.
D7D6D5D4D3D2D1D0
−DATA BIT 6DATA BIT 5DATA BIT 4DATA BIT 3DATA BIT 2DATA BIT 1DATA BIT 0
I2C-bus slave address
The slave address for the device can take one of two
values dependent on the state of the input pin AD.
Table 15Device address.
ADSLAVE ADDRESS
00010 001X
10010 000X
(1)
(1)
Note
1. Where X is the R/
2
C-bus increment
I
W bit.
The I2C-bus will also increment between registers as listed
in Table 16
Table 16Increment between registers.
ADDRESSCONTENTS
02 to 0F (HEX) VPS data bytes
11 to 31 (HEX) Teletext packet 8/30/2 data bytes and
Status display message
Addressing any register in either of these ranges will
initialize an increment until the final stop value provided
each byte is acknowledged by the receiver.
Initialization during power-up
The device has an internal power-on reset unit which is
used to reset the I
2
C-bus interface to be a slave
transceiver. It also initializes the device to receive only
completely valid Teletext packet 8/30/2 and VPS data. The
interrupt signals for both Teletext packet 8/30/2 and VPS
are disabled.
June 199414
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
APPLICATION INFORMATION
handbook, full pagewidth
3.3
kΩ
video
input
15 pF
4.7 µH
27 MHz 3rd
overtone
5 V
100
nF
100 nF
27 kΩ
33
µF
10
pF
100 nF
100
nF
1
2
3
4
5
6
7
8
CVBS
BLACK
IREF
V
DD
SAA5233
V
SS1
OSCOUT
OSCIN
OSCGND
V
SS5
INT
AD
SDA
SCL
V
SS4
V
SS3
V
SS2
MLB728
16
220 Ω
15
14
13
(1)
12
11
10
9
5 V
4.7
kΩ
INT to
microcontroller
2
I C bus
to microcontroller
(1) I2C-bus address 0010 001R/W.
Fig.5 Application diagram; DIL16.
Table 17Crystal characteristics.
SYMBOLPARAMETERTYP.MAX.UNIT
Crystal (27 MHz, 3rd overtone)
C1series capacitance1.7−pF
C0parallel capacitance5.2−pF
C
L
R
r
load capacitance20−pF
resonance resistance−50Ω
R1series resistance20−Ω
X
Fig.7 Plastic small outline package; 20 leads; large body; SO20L, SOT163-1.
June 199417
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
SOLDERING
Plastic dual in-line packages
Y DIP OR WAVE
B
The maximum permissible temperature of the solder is
260 °C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low-voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 °C, it must not be in contact for more than 10 s;
if between 300 and 400 °C, for not more than 5 s.
Plastic small-outline packages
BYWAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Y SOLDER PASTE REFLOW
B
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
R
EPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE
-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
June 199418
Philips SemiconductorsObjective specification
Dual standard PDC decoderSAA5233
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2
PURCHASE OF PHILIPS I
C COMPONENTS
2
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
C components conveys a license under the Philips’ I2C patent to use the
June 199419
Philips Semiconductors – a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428)
BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. (02)805 4455, Fax. (02)805 4466
Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213,
Tel. (01)60 101-1236, Fax. (01)60 101-1211
Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands,
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
Printed in The Netherlands
533061/01/1500/pp20Date of release: June 1994
Document order number:9397 736 20011
Philips Semiconductors
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