
AOD408
N-Channel Enhancement Mode Field Effect Transistor
Jan 2003
General Description
The AOD408 uses advanced trench technology to
provide excellent R
device is suitable for use as a load switch or in PWM
applications.
O-252
D-PAK
G D S
Absolute Maximum Ratings T
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain
Current
G
Pulsed Drain Current
Avalanche Current
Repetitive avalanche energy L=0.1mH
Power Dissipation
Power Dissipation
B
A
Junction and Storage Temperature Range
and low gate charge. This
DS(ON)
op View
Drain Connected
to Tab
=25°C unless otherwise noted
A
Symbol
V
DS
V
GS
=25°C
T
C
T
=100°C
C
C
C
TC=25°C
=100°C 30
T
A
TC=25°C
T
=70°C
A
I
D
I
DM
I
C
AR
E
AR
P
D
P
DSM
TJ, T
STG
Features
VDS (V) = 30V
I
D
R
R
G
= 18A
< 16mΩ (VGS = 10V)
DS(ON)
< 26mΩ (VGS = 4.5V)
DS(ON)
D
S
Maximum UnitsParameter
30
18
18
40
18
16 mJ
60
2.5
1.6
-55 to 175
V
V±20
A
A
W
W
°C
Thermal Characteristics
Parameter Units
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
Maximum Junction-to-Case
B
t ≤ 10s
Steady-State
Steady-State
Symbol Typ Ma
R
θJA
R
θJC
16.7 25
40 50
1.9 2.5
°C/W
°C/W
°C/W
Alpha & Omega Semiconductor, Ltd.

AOD408
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol Min Typ Max Units
Parameter Conditions
STATIC PARAMETERS
BV
I
DSS
I
GSS
V
GS(th)
I
D(ON)
R
DS(ON)
g
FS
V
SD
I
S
DSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body leakage current
I
=250µA, VGS=0V
D
VDS=24V, VGS=0V
VDS=0V, VGS= ±20V
Gate Threshold Voltage VDS=V
On state drain current
VGS=4.5V, VDS=5V
VGS=10V, ID=11A
Static Drain-Source On-Resistance
VGS=4.5V, ID=10A
Forward Transconductance
Diode Forward Voltage
VDS=5V, ID=11A
IS=1A,VGS=0V
Maximum Body-Diode Continuous Current
GS ID
=250µA
TJ=55°C
TJ=125°C
30 V
1
5
µA
100 nA
1 1.8 3 V
40 A
13.6 16
18 22
20.6 26
mΩ
m
25 S
0.75 1 V
4.3 A
DYNAMIC PARAMETERS
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
VGS=0V, VDS=15V, f=1MHz
Reverse Transfer Capacitance
Gate resistance VGS=0V, VDS=0V, f=1MHz
1040 pF
180 pF
110 pF
0.7 Ω
SWITCHING PARAMETERS
Qg(10V)
Qg(4.5V)
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
A: The value of R
Power dissipation P
on the user's specific board design, and the maximum temperature fo 175°C may be used if the PCB allows it.
B. The power dissipation PD is based on T
dissipation limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature T
D. The R
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These tests are performed with the device mounted on 1 in
curve provides a single pulse rating.
G. The maximum current rating is limited by bond-wires.
Total Gate Charge
Total Gate Charge
V
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
VGS=10V, VDS=15V, RL=0.82Ω,
R
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
is measured with the device mounted on 1in 2 FR-4 board with 2oz. Copper, in a still air environment with T
θJA
is based on R
DSM
is the sum of the thermal impedence from junction to case R
θJA
and the maximum allowed junction temperature of 150°C. The value in any a given application depends
θJA
=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper
J(MAX)
IF=18A, dI/dt=100A/µs
I
F
J(MAX)
2
FR-4 board with 2oz. Copper, in a still air environment with T A=25°C. The SOA
=10V, VDS=15V, ID=18A
GS
=3Ω
GEN
=18A, dI/dt=100A/µs
=175°C.
and case to ambient.
θJC
19.8 nC
9.8 nC
2.5 nC
3.5 nC
4.5 ns
3.9 ns
17.4 ns
3.2 ns
19
ns
8nC
=25°C. The
A
Alpha & Omega Semiconductor, Ltd.

AOD408
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
25
4V
10V
4.5V
20
15
(A)
D
I
10
3.5V
VGS=3V
5
0
012345
V
(Volts)
DS
Fig 1: On-Region Characteristics
24
=4.5V
V
GS
VGS=10V
)
Ω
(m
DS(ON)
R
22
20
18
16
14
12
10
0 5 10 15 20
I
(A)
D
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
20
16
VDS=5V
12
(A)
D
I
8
125°C
25°C
4
0
1.5 2 2.5 3 3.5 4
(Volts)
V
GS
Figure 2: Transfer Characteristics
1.6
VGS=10V
ID=18A
1.4
VGS=4.5V
1.2
1
Normalized On-Resistance
0.8
0 25 50 75 100 125 150 175
Temperature (°C)
Figure 4: On-Resistance vs. Junction
Temperature
50
)
Ω
(m
DS(ON)
R
40
30
ID=18A
125°C
20
25°C
10
246810
V
(Volts)
GS
Figure 5: On-Resistance vs. Gate-Source Voltage
Alpha & Omega Semiconductor, Ltd.
1.0E+01
1.0E+00
1.0E-01
(A)
1.0E-02
S
I
1.0E-03
1.0E-04
1.0E-05
125°C
25°C
0.0 0.2 0.4 0.6 0.8 1.0
(Volts)
V
SD
Figure 6: Body-Diode Characteristics

AOD408
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
8
VDS=15V
ID=18A
6
(Volts)
GS
4
V
2
0
0 4 8 12 16 20
Qg (nC)
Figure 7: Gate-Charge Characteristics
100.0
R
DS(ON)
limited
10.0
10ms
0.1s
(Amps)
D
I
1.0
T
=150°C
J(Max)
TA=25°C
1
10s
DC
10µs
100µs
1500
1250
C
iss
1000
750
500
Capacitance (pF)
C
oss
250
C
rss
0
0 5 10 15 20 25 30
VDS (Volts)
Figure 8: Capacitance Characteristics
50
40
T
=150°C
J(Max)
TA=25°C
30
Power (W)
20
10
0.1
0.1 1 10 100
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area (Note F)
10
D=Ton/T
T
J,PK=TA+PDM.ZθJA.RθJA
R
θJA
1
=40°C/W
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
0
0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 10: Single Pulse Power Rating Junction-to-
Ambient (Note F)
0.1
P
Normalized Transient
0.01
Thermal Resistance
θJA
Z
Single Pulse
D
T
on
T
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance
Alpha & Omega Semiconductor, Ltd.

ALPHA & OMEGA
DPAK Package Data
SEMICONDUCTOR, INC.
21 3
DETAIL 'D'
(JEDEC TO-252)
DIMENSION IN MILLIMETERS
MIN.
2.235
A
0.000
A1
0.889
A2
0.686
b
0.889
b1
5.207
b2
0.483
c1
5.969
D
4.318
D1
6.477
E
4.318
E1
e
e1
9.779
H
1.270
L
0.635
L1
0.889
L2
NOTE
1. PACKAGE BODY SIZES EXCLUDE MOLD FLASH AND
GATE BURRS
2. DIMENSION L IS MEASURED IN GAGE PLANE
3. TOLERANCE 0.10 mm UNLESS OTHERWISE SPECIFIED
4. CONTROLLING DIMENSION IS MILLIMETER. CONVERTED
INCH DIMENSIONS ARE NOT NECESSARILY EXACT.
5. FOLLOWED FROM JEDEC TO-252 (AA)
NOM.
2.286
----- 0.102
----- 1.143
0.762 0.889
----- 1.143
0.508 0.5590.457c
----- 0.584
6.096 6.223
-----
6.604 6.731
-----
2.286 BSC.
4.572 BSC.
----- 10.414
----- 2.032
----- 1.016
----- 1.270
MAX.
2.388
5.4614.45
5.334
-----
DIMENSIONS IN INCHES
0.088
0.000 -----
0.035 -----
0.027 0.030
0.035 -----
0.018 0.020 0.022
0.019 -----
0.235 0.240
0.170 -----
0.255 0.260
0.170 -----
0.385 -----
0.050 -----
0.025 -----
0.035 -----
NOM.MIN.
0.090
-----0.205
0.090 BSC.
0.180 BSC.
MAX.
0.094
0.004
0.045
0.035
0.045
0.215
0.023
0.245
0.210
0.265
-----
0.410
0.080
0.040
0.050
PACKAGE MARKING DESCRIPTION
NOTE:
D 4 0 8
F A Y W L C
21 3
DPAK PART NO. CODE
PART NO. CODE
AOD408
- AOS LOGO
D408 - PART NUMBER CODE.
F - FAB LOCATION
A - ASSEMBLY LOCATION
Y - YEAR CODE
W - WEEK CODE.
L C - ASSEMBLY LOT CODE
D408
RECOMMENDED LAND PATTERN
UNIT: mm
Rev. A