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ZXMP7A17G
70V P-channel enhancement mode MOSFET
Summary
V
=70V : R
DSS
I
=3.7A
D
Description
This new generation of trench MOSFETs from Zetex utilizes a unique
structure that combines the benefits of low on-resistance with fast
switching speed. This makes them ideal for high efficiency, low voltage
power management applications.
DS(on)
=0.16⍀
Features
• Low on-resistance
• Fast switching speed
• Low threshold
• Low gate drive
• SOT223 package
Applications
• DC-DC converters
• Power management functions
• Disconnect switches
• Motor control
• Class D audio output stages
Ordering information
Device Reel size
(inches)
Tape width
(mm)
D
G
S
Quantity per reel
ZXMP7A17GTA 7 12 1,000
ZXMP7A17GTC 13 12 4,000
Device marking
ZXMP
7A17
Issue 1 - March 2006 1 www.zetex.com
© Zetex Semiconductors plc 2006
Page 2
ZXMP7A17G
Absolute maximum ratings
Parameter Symbol Limit Unit
Drain-source voltage V
Gate-source voltage V
Continuous drain current @ V
@ V
@ V
Pulsed drain current
(c)
=10V; TA=25°C
GS
=10V; TA=25°C
GS
=10V; TA=25°C
GS
Continuous source current (body diode)
Pulsed source current (body diode)
Power dissipation at T
=25°C
A
(c)
(a)
(b)
(b)
(b)
(a)
Linear derating factor
Power dissipation at T
=25°C
A
(b)
Linear derating factor
Operating and storage temperature range T
Thermal resistance
I
I
j
P
P
, T
DSS
GS
I
D
DM
I
S
SM
D
D
stg
-70 V
⫾20 V
-3.7 A
-2.9
-2.6
-9.6 A
-4.8 A
-9.6 A
2
16
3.9
31
W
mW/°C
W
mW/°C
-55 to +150 °C
Parameter Symbol Limit Unit
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air
conditions.
(b) For a device surface mounted on FR4 PCB measured at t
(c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10
temperature.
(a)
(b)
ⱕ5 sec.
s - pulse width limited by maximum junction
R
R
⍜JA
⍜JA
62.5 °C/W
32 °C/W
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Page 3
Characteristics
ZXMP7A17G
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© Zetex Semiconductors plc 2006
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ZXMP7A17G
ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated)
Parameter Symbol Min. Typ. Max. Unit Conditions
Static
Drain-source breakdown
voltage
Zero gate voltage drain
current
Gate-body leakage I
Gate-source threshold voltage V
Static drain-source on-state
resistance
(*)
Forward transconductance
Dynamic
(‡)
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Switching
(†) (‡)
Turn-on-delay time t
Rise time t
Turn-off delay time t
Fall time t
Total gate charge Q
Total gate charge Q
Gate-source charge Q
Gate drain charge Q
Source-drain diode
Diode forward voltage
Reverse recovery time
Reverse recovery charge
(*)
(‡)
(‡)
(*)(‡)
V
I
DSS
GSS
R
g
d(on)
r
d(off)
f
V
t
rr
Q
(BR)DSS
GS(th)
DS(on)
fs
iss
oss
rss
g
g
gs
gd
SD
rr
-70 V ID= -250A, VGS=0V
-1 AVDS= -70V, VGS=0V
100 nA VGS=±20V, VDS=0V
-1.0 V ID= -250A, VDS=V
0.16 ⍀ VGS= -10V, ID= -2.1A
0.25 ⍀ V
= -4.5V, ID = -1.7A
GS
4.4 S VDS= -15V, ID= -2.1A
635 pF
V
= -40V, VGS=0V
52 pF
DS
f=1MHz
42.5 pF
2.5 ns
3.4 ns
27.9 ns
= -35V, ID= -1A
V
DD
≅6.0⍀, VGS= -10V
R
G
8ns
9.6 nC VDS= -35V, VGS= -5V
= -2.1A
I
D
18 nC
V
= -35V, VGS= -10V
1.77 nC
DS
I
= -2.1A
D
3.66 nC
-0.85 -0.95 V Tj=25°C, IS= -2.0A,
=0V
V
GS
29.8 ns Tj=25°C, IS= -2.1A,
38.5 nC
di/dt=100A/s
GS
NOTES:
(*) Measured under pulsed conditions. Pulse width
(†) Switching characteristics are independent of operating junction temperature.
(‡) For design aid only, not subject to production testing.
ⱕ 300s; duty cycle ⱕ 2%.
Issue 1 - March 2006 4 www.zetex.com
© Zetex Semiconductors plc 2006
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Typical characteristics
ZXMP7A17G
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© Zetex Semiconductors plc 2006
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Typical characteristics
ZXMP7A17G
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© Zetex Semiconductors plc 2006
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ZXMP7A17G
Intentionally left blank
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Package outline - SOT223
ZXMP7A17G
DIM Millimeters Inches DIM Millimeters Inches
Min Max Min Max Min Max Min Max
A - 1.80 - 0.071 e 2.30 BSC 0.0905 BSC
A1 0.02 0.10 0.0008 0.004 e1 4.60 BSC 0.181 BSC
b 0.66 0.84 0.026 0.033 E 6.70 7.30 0.264 0.287
b2 2.90 3.10 0.114 0.122 E1 3.30 3.70 0.130 0.146
C 0.23 0.33 0.009 0.013 L 0.90 - 0.355 -
D 6.30 6.70 0.248 0.264 - - - - -
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Europe
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Americas
Zetex Inc
700 Veterans Memorial Highway
Hauppauge, NY 11788
USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
Asia Pacific
Zetex (Asia Ltd)
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park, Chadderton
Oldham, OL9 9LL
United Kingdom
Telephone: (44) 161 622 4444
Fax: (44) 161 622 4446
hq@zetex.com
For international sales offices visit www.zetex.com/offices
Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 1 - March 2006 8 www.zetex.com
© Zetex Semiconductors plc 2006
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