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30V N-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY
V
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure
that combines the benefits of low on-resistance with fast switching speed. This
makes them ideal for high efficiency, low voltage, power management applications.
(BR)DSS
=30V; R
=0.12 ID=2.0A
DS(ON)
ZXMN3A01F
FEATURES
Low on-resistance
•
Fast switching speed
•
Low threshold
•
Low gate drive
•
SOT23 package
•
APPLICATIONS
•
DC - DC Converters
•
Power Management Functions
•
Motor control
ORDERING INFORMATION
DEVICE REEL
SIZE
ZXMN3A01FTA 7” 12mm 1000 units
ZXMN3A01FTC 13” 12mm 4000 units
TAPE
WIDTH
QUANTITY
PER REEL
DEVICE MARKING
•
7N3
SOT23
Top View
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ZXMN3A01F
ABSOLUTE MAXIMUM RATINGS.
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage
Gate Source Voltage
Continuous Drain Current V
Pulsed Drain Current (c)
Continuous Source Current (Body Diode) (b)
Pulsed Source Current (Body Diode) (c)
Power Dissipation at T
Linear Derating Factor
Power Dissipation at T
Linear Derating Factor
Operating and Storage Temperature Range
A
A
=10V; TA=25°C (b)
GS
V
=10V; TA=70°C (b)
GS
V
=10V; TA=25°C (a)
GS
=25°C (a)
=25°C (b)
V
DSS
V
GS
I
D
I
DM
I
S
I
SM
P
D
P
D
T
j:Tstg
THERMAL RESISTANCE
PARAMETER SYMBOL VALUE UNIT
Junction to Ambient (a)
Junction to Ambient (b)
R
R
θJA
θJA
30 V
20 V
2.0
1.64
1.81
8A
1.3 A
8A
625
5
806
6.4
-55 to +150 °C
200 °C/W
155 °C/W
mW/°C
mW/°C
A
W
W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t⭐5 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10s - pulse width limited by maximum junction temperature. Refer to
Transient Thermal Impedance graph.
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CHARACTERISTICS
ZXMN3A01F
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ZXMN3A01F
ELECTRICAL CHARACTERISTICS (at T
PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
Static Drain-Source On-State Resistance
(1)
Forward Transconductance (1)(3)
DYNAMIC (3)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
SWITCHING(2) (3)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Gate Charge
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
Reverse Recovery Time (3)
Reverse Recovery Charge (3)
NOTES
(1) Measured under pulsed conditions. Width=300µs. Duty cycle ≤ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
= 25°C unless otherwise stated).
A
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
g
Q
gs
Q
gd
V
SD
t
rr
Q
rr
30 V
0.5
µA
100 nA
1V
0.106 0.12
0.18
3.5 S
190 pF
38 pF
20 pF
1.7 ns
2.3 ns
6.6. ns
2.9 ns
2.3 nC
3.9 nC
0.6 nC
0.9 nC
0.85 0.95 V
17.7 ns
13.0 nC
Ω
Ω
=250µA, VGS=0V
I
D
V
=30V, VGS=0V
DS
V
=⫾20V, VDS=0V
GS
=250µA, VDS=V
I
D
=10V, ID=2.5A
V
GS
V
=4.5V, ID=2.0A
GS
=4.5V,ID=2.5A
V
DS
V
=25V,VGS=0V,
DS
f=1MHz
=15V, ID=2.5A
V
DD
R
=6.0Ω,VGS=10V
G
V
=15V,VGS=5V,
DS
I
=2.5A
D
V
=15V,VGS=10V,
DS
I
=2.5A
D
=25°C, IS=1.7A,
T
J
V
=0V
GS
=25°C, IF=2.5A,
T
J
di/dt= 100A/µs
GS
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TYPICAL CHARACTERISTICS
ZXMN3A01F
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ZXMN3A01F
TYPICAL CHARACTERISTICS
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PACKAGE OUTLINE PAD LAYOUT
PACKAGE DIMENSIONS
ZXMN3A01F
MILLIMETRES
DIM
MILLIMETRES
DIM
MIN MAX MIN MAX
A
2.67 3.05
B
1.20 1.40
C
ᎏ 1.10
D
0.37 0.53
F
0.085 0.15
H
0.33 0.51
K
0.01 0.10
L
2.10 2.50
M
0.45 0.64
N
0.95 NOM
© Zetex plc 2001
Zetex plc
Fields New Road
Chadderton
Oldham, OL9 8NP
United Kingdom
Telephone (44) 161 622 4422
Fax: (44) 161 622 4420
These offices are supported by agents and distributors in major countries world-wide.
This publicationis issued toprovide outline informationonly which (unlessagreed by theCompany in writing)may not beused, applied orreproduced
for any purposeorformpartofanyorderorcontract or be regarded as arepresentationrelatingtotheproductsorservicesconcerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to
Zetex GmbH
Streitfeldstraße 19
D-81673 München
Germany
Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
www.zetex.com
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY11788
USA
Telephone: (631) 360 2222
Fax: (631) 360 8222
Zetex (Asia) Ltd
3701-04 Metroplaza, Tower 1
Hing Fong Road
Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
ISSUE 1 - MARCH 2002
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