Datasheet ZICM357SP0-1, ZICM357SP2-1 Datasheet (CEL)

DATA SHEET

ect

™

MeshConnect™ EM357 Mini Modules

ZICM357SP0-1, ZICM357SP2-1

EmberTM EM357 Transceiver Based Modules

Integrated Transceiver Modules for ZigBee/IEEE 802.15.4

Development Kit available: ZICM-EM35X-DEV-KIT-2

DESCRIPTION

CEL’s MeshConnect™ EM357 Mini Modules combine high

performance RF solutions with the market's premier ZigBee

®

stack. Available in low and high output power options

(+8dBm and +20dBm), these modules can accommodate

variable range and performance requirements. The tiny

module footprint makes them suitable for a wide range

of ZigBee applications. The MeshConnect EM357 Mini

Modules are certied and qualied, enabling customers to

accelerate time to market by greatly reducing the design

and certication phases of development.

CEL's MeshConnect EM357 Mini Modules (ZICM357SP0,

ZICM357SP2) are based on the Ember EM357 Zigbee

compliant SOC radio IC. The IC is a single-chip solution,

compliant with ZigBee specications and IEEE 802.15.4,

a complete wireless solution for all ZigBee applications.

The IC consists of an RF transceiver with the baseband

modem, a hardwired MAC and an embedded 32-bit ARM®

Cortex™-M3 microcontroller with internal RAM (12kB) and

Flash (192kB) memory. The device provides numerous

general-purpose I/O pins and peripheral functions such as

timers and UARTs.

ORDERING INFORMATION

MeshConn

ZICM357SP0 ZICM357SP2

+8dBm +20dBm

-100dBm -103dBm

Link Budget:

+108dB +123dB

FEATURES

• High RF Performance:

Up to 123 dB RF Link Budget

RX Sensitivity:

-100 dBm (ZICM357SP0)

-103 dBm (ZICM357SP2)

• Data Rate: 250 kbps

• Advanced Cortex-M3 Processor

•

Advanced Power Management

• 16 RF Channels

• Industry's Premier ZigBee Pro
Stack: EmberZNet PRO™

APPLICATIONS

• Smart Energy / Grid Markets

Thermostats
In-Home-Displays
Smart Plugs

•

Building Automation and

Control

• Lighting: Fixture and Control

Tx:

Rx:

EM357 Mini Modules

• 192 kB FLASH

• 12 kB SRAM

• 32-bit ARM® Cortex™-M3

• Up to 23 GPIO Pins

• SPI (Master/Slave), TWI, UART

• Timers, Serial Wire/JTAG Interface

• 5-channel 14-bit ADC

• Mini Footprint: (23.9mm x 16.6mm)

0.940" x 0.655"

• Antenna Options:

1) Integrated PCB Trace Antenna
or

2) RF Port for External Antenna

• Supports Mesh Networks

• AES Encryption

• FCC, CE and IC Certifications

• ROHS Compliant

• Solar Inverter and Control

• Home Automation and Control

Energy Management
Security Devices
HVAC Control

•

General ZigBee Wireless Sensor

Networking

Part Number Order Number Description Min./Multiple

ZICM357SP0-1 +8 dBm Output Power, PCB Trace antenna 330 / 330

MeshConnect™

EM357 Mini Modules

MeshConnect™ EM357

Development Kit

The information in this document is subject to change without notice.

Document No: 0011-00-07-00-000 (Issue E)

Date Published: June 20, 2013

ZICM357SP0-1C +8 dBm Output Power, with Castellation pin for external antenna 330 / 330

ZICM357SP2-1 +20 dBm Output Power, PCB Trace antenna 330 / 330

ZICM357SP2-1C +20 dBm Output Power, with Castellation pin for external antenna 330 / 330

ZICM-EM35X-DEV-KIT-2

MeshConnect EM35x Ember Companion Kit for Ember EM35x
Development Kit

1 / 1

MODULE BLOCK DIAGRAMS

Radio

Micro

Balun

LPF

Castellation

Edge Connector

Ember EM357

24MHz

XTAL

Block Diagram

EM357 Mini Module (ZICM357SP0)

Radio

Micro

PA

LNA

LPF

TX/RX
Switch

Castellation

Edge Connector

Ember EM357

24MHz

XTAL

Block Diagram

EM357 Mini Module (ZICM357SP2)

DEVELOPMENT KIT

CEL's Development Kit assist users in both evaluation and
development.

Ember Companion Kit:

CEL's MeshConnect EM35x Ember Companion Kit is
designed to work with the Ember development kit [EM35X­DEV and EM35X-DEV-IAR]. Each module in this CEL kit is
soldered on a carrier board making it pin-for-pin compatible
with the Ember development board.

For more information regarding the MeshConnect
Development Kit, refer to the respective development
kit user guides documents. (Available at CEL’s website

www.cel.com/MeshConnect)

MeshConnect™ EM357 Mini Modules

™

MeshConnect

EM35x Ember Companion Kit

Kit Contents:

• ZICM357SP2-1 modules (2)

• ZICM357SP2-1C module (1)

• ZICM357SP0-1 modules (2)

• ZICM357SP0-1C module (1)

• Online Documentation

DEVELOPMENT KIT ORDERING INFORMATION

Part Number Order Number Description

MeshConnect™

EM35x Ember Companion Kit

ZICM-EM35X-DEV-KIT-2 MeshConnect EM35x Ember Companion Kit for Ember EM35x Dev Kits

Page 2

Introduction and Overview

Description..............................................................................................................................................................................................

1

Features

Applications

Ordering Information.............................................................................................................................................................................

1

Module Block Diagram...........................................................................................................................................................................

2

Development Kit

System Level Function

Transceiver IC

Antenna...................................................................................................................................................................................................

4

Power Amplier......................................................................................................................................................................................

4

Software/Firmware..................................................................................................................................................................................

4

Electrical Specication

Absolute Maximum Ratings...................................................................................................................................................................

4

Recommended (Operating Condition)..................................................................................................................................................

5

DC Characteristics

RF Characteristics

Pin Signal and Interfaces

Pin Signals I/O Conguration................................................................................................................................................................

6

I/O Pin Assignment

Module Dimensions

Module Footprint

Processing

Agency Certications

Shipment, Storage and Handling

Quality

Revision History

TABLE OF CONTENTS

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MeshConnect™ EM357 Mini Modules

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11

14

14

15

Page 3

MeshConnect™ EM357 Mini Modules

TRANSCEIVER IC

CEL’s MeshConnect EM357 Mini Modules use the Ember EM357 transceiver IC. This IC incorporates the RF transceiver
with the baseband modem, a hardwired MAC, and an embedded ARM® Cortex™-M3 microcontroller, offering an excellent

low cost high performance solution for all IEEE 802.15.4 / ZigBee applications.

For more information about the Ember EM357 IC, visit www.ember.com

ANTENNA

CEL’s MeshConnect EM357 Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna. An optional

conguration which uses a castellation pin on the module allows the user to connect an external antenna. The ZICM357SP0
has been certied with the PCB trace antenna only while the ZICM357SP2 has been certied with the PCB trace antenna and
a Nearson half-wave dipole antenna (part number: S181SA-2405S) on a 4 inch cable using the castellation pin of the module.
Please refer to the document "ZICM357SP2-1C External Antenna Implementation" for details describing the requirements that
must be followed to take advantage of the CEL certication. See Ordering Information on Page 1.

The PCB antenna employs a topology that is compact and highly efcient. To maximize range, an adequate ground plane
must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute signicantly to the

antenna performance (it should not be directly under the module PCB Antenna). The position of the module on the host board
and overall design of the product enclosure contribute to antenna performance. Poor design affects radiation patterns and can

result in reection, diffraction and/or scattering of the transmitted signal.

For optimum antenna performance, the MeshConnect modules should be mounted with the PCB trace antenna overhanging the
edge of the host board. To further improve performance, a ground plane may be placed on the host board under the module, up

to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of an uninterrupted ground plane on a layer directly

beneath the module will also allow you to run traces under this layer. CEL can provide assistance with your PCB layout.

Here are some design guidelines to help ensure antenna performance:

• Never place the ground plane or route copper traces directly underneath the antenna portion of the module.

• Never place the antenna close to metallic objects.

• In the overall design, ensure that wiring and other components are not placed near the antenna.

• Do not place the antenna in a metallic or metalized plastic enclosure.

• Keep plastic enclosures 1cm or more from the antenna in any direction.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or
lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna
type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary
for successful communication.

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.

POWER AMPLIFIER

CEL’s MeshConnect EM357 High Power Module (ZICM357SP2) includes a Power Amplier (PA). This PA delivers high
efciency, high gain, and high output power (Pout = +20.0 dBm TYP) to provide an extended range and reliable transmission

for fewer nodes in a network. For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for

FCC compliance. Operating in power mode 3 at higher power settings may damage the power amplier.

SOFTWARE/ FIRMWARE

CEL’s MeshConnect EM357 Mini Modules are ideal platforms for the EmberZNet PRO™, the industry’s most deployed and

eld proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNET PRO is a complete ZigBee
protocol software package containing all the elements required for mesh networking applications. For more information
regarding the software development for this IC, visit www.ember.com

CEL provides reference software that runs multiple functions and executes various commands. The rmware allows the
execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example, users can setup a simple

ZigBee Point-to-Point network to perform Range and Packet Error Rate (PER) tests. The software can also place the
module in various operating modes, which allows for setting and/or testing various parameters.

The ZICM357SP0 uses the transceiver's Primary RF ports for transmitting and should use power mode 1.

The ZICM357SP2 uses the transceiver's Alternate RF ports for transmitting and should use power mode 2.

Page 4

ABSOLUTE MAXIMUM RATINGS

MeshConnect™ EM357 Mini Modules

Description

Power Supply Voltage (V

Voltage on any I/O Line -0.3 V

RF Input Power

Storage Temperature Range -40 125 °C

Reow Soldering Temperature – 260 °C

Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.

RECOMMENDED (OPERATING CONDITIONS)

Description

Power Supply Voltage (V

Input Frequency 2405 – 2480 MHz

Ambient Temperature Range -40 25 85 °C

DD) -0.3 3.6 VDC

ZICM357SP0
ZICM357SP2

DD) 2.1 3.3 3.6 VDC

MeshConnect™ ZICM357SPx Module

Min Max

DD + 0.3 VDC

–
–

MeshConnect™ ZICM357SPx Module

Min Typ Max

+15

+5

Unit

dBm

Unit

DC CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2)

Description

Transmit Mode Current @ 8dBm

Transmit Mode Current @ 0dBm – 31 – mA

Receive Mode Current – 30 – mA

Transmit Mode Current @ 20dBm

Transmit Mode Current @ 0dBm – 58 – mA

Receive Mode Current – 34 – mA

Sleep Mode Current – 1 – µA

ZICM357SP0

ZICM357SP2

MeshConnect™ ZICM357SPx Module

Min Typ Max

– 44 – mA

– 150 – mA

Unit

RF CHARACTERISTICS (@ 25⁰ C, VDD = 3.3V, ZICM357SP0 TX power mode 1, ZICM357SP2 TX power mode 2)

Description

General Characteristics

RF Frequency Range 2405 – 2480 MHz

RF Channels 11 – 26 –

Frequency Error Tolerance -96.2 – 96.2 kHz

Transmitter

Maximum Output Power

Minimum Output Power – -40 – dBm

Offset Error Vector Magnitude – 5 35 %

Maximum Output Power

(using power mode 2, power setting -2)

Minimum Output Power – -40 – dBm

Offset Error Vector Magnitude – 5 35 %

Receiver

Sensitivity (1% PER, boost mode)

Saturation (maximum input level) 0 – – dBm

Sensitivity (1% PER, normal mode)

Saturation (maximum input level) -10 – – dBm

Note: For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for FCC compliance. Operating in power
mode 3 at higher power settings may damage the power amplier.

ZICM357SP0

ZICM357SP2

ZICM357SP0

ZICM357SP2

MeshConnect™ ZICM357SPx Module

Min Typ Max

– 8 – dBm

– 20 21 dBm

– -100 -94 dBm

– -103 -97 dBm

Unit

Page 5

MeshConnect™ EM357 Mini Modules

PIN SIGNALS I/O PORT CONFIGURATION

CEL’s MeshConnect module has 33 edge I/O interfaces for connection to the user’s host board. The MeshConnect Module
Dimensions shows the layout of the 33 edge castellations.

MeshConnect I/O PIN ASSIGNMENTS

CEL MeshConnect

ZICM357SPx Module

Pin Number

1, 2, 12, 31, 33 49 GROUND

3 11 PC5

4 12 RESET Acve Low chip reset (Input)

5 13 PC6

6 14 PC7

7 18 PA7

8 19 PB3

9 20 PB4

10 21 PA0

11 22 PA1

13 16, 23, 28, 37 VCC

14 24 PA2

15 25 PA3

16 26 PA4

17 27 PA5

18 29 PA6

Ember EM357

IC Pin Number

Name Notes

Digital I/O
TX_ACTIVE - Logic-level control for PA. The EM35x baseband controls TX_
ACTIVE and drives it high when in TX mode

Applies only to the ZICM357SP0. PC5 is a NC on the ZICM357SP2

Digital I/O
OSC32B - 32.768 kHz crystal oscillator
nTX_ACTIVE - Inverted TX_ACTIVE signal

Digital I/O
OSC32A - 32.768 kHz crystal oscillator

OSC32_EXT - Digital 32.768 kHz clock input source

Digital I/O

TIM1C4 - Timer 1 Channel 4 input/output
REG_EN - External regulator open drain output

Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC1nCTS - UART CTS handshake of Serial Controller 1
SC1SCLK - SPI master/slave clock of Serial Controller 1

Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC1nRTS - UART RTS handshake of Serial Controller 1
SC1nSSEL - SPI slave select of Serial Controller 1

Digital I/O

TIM2C1 - Timer 2 Channel 1 input/output
SC2MOSI - SPI master data out/slave data in of Serial Controller 2

Digital I/O
TIM2C3 - Timer 2 Channel 3 input/output
SC2SDA - TWI data of Serial Controller 2

SC2MISO - SPI master data in/slave data out of Serial Controller 2

Digital I/O
TIM2C4 - Timer 2 Channel 4 input/output
SC2SCL - TWI clock of Serial Controller 2
SC2SCLK - SPI master/slave clock of Serial Controller 2

Digital I/O
TIM2C2 - Timer 2 channel 2 input/output
SC2nSSEL - SPI slave select of Serial Controller 2

TRACECLK - Synchronous CPU trace clock

Digital I/O

ADC4 - ADC Input 4
PTI_EN - Frame signal of Packet Trace Interface (PTI)
TRACEDATA2 - Synchronous CPU trace data bit 2

Digital I/O

ADC5 - ADC Input 5
PTI_DATA - Data signal of Packet Trace Interface (PTI)
nBOOTMODE - Embedded serial bootloader acvaon out of reset
TRACEDATA3 - Synchronous CPU trace data bit 3

Digital I/O

TIM1C3 - Timer 1 channel 3 input/output

Page 6

MeshConnect I/O PIN ASSIGNMENTS (Continued)

MeshConnect™ EM357 Mini Modules

CEL MeshConnect

ZICM357SPx

Module PIN Number

19 30 PB1

20 31 PB2

21 32 JTCK

22 33 PC2

23 34 PC3

24 35 PC4

25 36 PB0

26 38 PC1

27 40 PC0

28 41 PB7

29 42 PB6

30 43 PB5

32 NC RF Out Castellaon Pin for external Antenna

Ember EM357
IC Pin Number

Name Notes

Digital I/O

SC1MISO - SPI slave data out of Serial Controller 1
SC1MOSI - SPI master data out of Serial Controller 1

SC1SDA - TWI data of Serial Controller 1
SC1TXD - UART transmit data of Serial Controller 1

TIM2C1 - Timer 2 channel 1 input/output

Digital I/O
SC1MISO - SPI master data in of Serial Controller 1
SC1MOSI - SPI slave data in of Serial Controller 1
SC1SCL - TWI clock of Serial Controller 1
SC1RXD - UART receive data of Serial Controller 1

TIM2C2 - Timer 2 channel 2 input/output

JTAG clock input from debugger
SWCLK - Serial Wire clock input/output with debugger

Digital I/O

JTD0 - JTAG data out to debugger
SWO - Serial Wire Output asynchronous trace output to debugger

Digital I/O

JTDI - JTAG data in from debugger

Digital I/O

JTMS - JTAG mode select from debugger
SWDIO - Serial Wire bidireconal data to/from debugger

Digital I/O

VREF - ADC reference input/output
IRQA - External interrupt source A
TRACECLK - Synchronous CPU trace clock
TIM1CLK - Timer 1 external clock input
TIM2MSK - Timer 2 external clock mask input

Digital I/O

ADC3 - ADC Input 3
SWO - Serial Wire Output asynchronous trace output to debugger
TRACEDATA0 - Synchronous CPU trace data bit 0

Digital I/O

JRST - JTAG reset input from debugger
IRQD - Default external interrupt source D
TRACEDATA1 - Synchronous CPU trace data bit 1

Digital I/O

ADC2 - ADC Input 2
IRQC - Default external interrupt source C
TIM1C2 - Timer 1 channel 2 input/output

Digital I/O

ADC1 - ADC Input 1
IRQB - External interrupt source B
TIM1C1 - Timer 1 channel 1 input/output

Digital I/O

ADC0 - ADC Input 0
TIM2CLK - Timer 2 external clock input
TIM1MSK - Timer 1 external clock mask input

Note: PC5 Applies only to the ZICM357SP0; PC5 is a NC on the ZICM357SP2.

Page 7

MODULE DIMENSIONS

P

P

MeshConnect™ EM357 Mini Modules

EM300 Series Module

ZICM35xSPx

0000-00-00-00-000

MeshConnect™ EM357 Mini Modules

C21

C21

C20

C20

C23

R11

C6A

C6A

L6

L6
C6B

C6B

C23

R11

C22

C22

L5

L5

R8

R8

C1

C1

C2

C2

R5

R5

R4

R4

C16

C16

C7

C7

C7B

in 1

C7B

R1

R1

C14

R7

C14

R7

U1

U1

R2

C9

R2

C9

ARM

ARM

C10

C10

R6

R6

in 11 Pin 22

C11

C11

L3

L3

C13

C13

L4

L4

L2

L2

Series

Series

EM357

R9

R9

R10

R10

C24

C24

C5B

C5B

C6

C6

C4A

C4A

EM357

C17

C17

XTAL1

XTAL1

C15

C15

Pin 33

0.655”

Note: All dimensions are +/- 0.005" unless otherwise specied.

0.940”

0.062”

0.152” MAX

Page 8

MODULE LAND FOOTPRINT

MeshConnect™ EM357 Mini Modules

Note: For layout recommendation for optimum antenna performance, refer to the Antenna section in this document.

Page 9

MeshConnect™ EM357 Mini Modules

PROCESSING

Recommended Reow Prole

Parameters Values

Ramp up rate (from Tsoakmax to Tpeak) 3º/sec max

Minimum Soak Temperature 150ºC

Maximum Soak Temperature 200ºC

Soak Time 60-120 sec

TLiquidus 217ºC

Time above TL 60-150 sec

Tpeak 250ºC

Time within 5º of Tpeak 20-30 sec

Time from 25º to Tpeak 8 min max

Ramp down rate 6ºC/sec max

Pb-Free Solder Paste

Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.

Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC

Specication. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.

• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and

the module. The combination of soldering ux residuals and encapsulated water could lead to short circuits between

neighboring pads. Water could also damage any stickers or labels.

• Cleaning with alcohol or a similar organic solvent will likely ood soldering ux residuals into the two housings, which

is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.

• Ultrasonic cleaning could damage the module permanently.

The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.

Optical Inspection

After soldering the Module to the host board, consider optical inspection to check the following:

• Proper alignment and centering of the module over the pads.

• Proper solder joints on all pads.

• Excessive solder or contacts to neighboring pads, or vias.

Repeating Reow Soldering

Only a single reow soldering process is encouraged for host boards.

Wave Soldering

If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.

Hand Soldering

Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).

Page 10

MeshConnect™ EM357 Mini Modules

PROCESSING (Continued)

Rework

The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be programmable

and the solder joint and module should not exceed the maximum peak reow temperature of 250 ºC.

Caution

If temperature ramps exceed the reow temperature prole, module and component damage may occur due to thermal

shock. Avoid overheating.

Warning

Never attempt a rework on the module itself, (e.g. replacing individual components). Such actions will terminate warranty
coverage.

Additional Grounding

Attempts to improve module or system grounding by soldering braids, wires or cables onto the module RF shield cover is

done at the customer's own risk. The ground pins at the module perimeter should be sufcient for optimum immunity to

external RF interference.

AGENCY CERTIFICATIONS (PCB ANTENNA ONLY)

The following Certications are in effect:
ZICM357SP0-1: FCC, IC, CE
ZICM357SP2-1: FCC, IC

FCC Compliance Statement (Part 15.19) Section 7.15 of RSS-GEN

This device complies with Part 15 of the FCC Rules and with Industry Canada licence-exempt RSS Standards.

Operation is subject to the following two conditions:

1. This device may not cause harmful interference.

2. This device must accept any interference received, including interference that may cause undesired operation.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:

1. l'appareil ne doit pas produire de brouillage, et

2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible
d'en compromettre le fonctionnement.

Warning (Part 15.21)

Changes or modications not expressly approved by CEL could void the user's authority to operate the equipment.

20 cm Separation Distance

To comply with FCC/IC RF exposure limits for general population/uncontrolled exposure, the antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.

OEM Responsibility to the FCC and IC Rules and Regulations

The MeshConnect Module has been certied per FCC Part 15 rules and to Industry Canada license-exempt RSS
Standards for integration into products without further testing or certication. To fulll the FCC and IC certication

requirements, the OEM of the MeshConnect Module must ensure that the information provided on the MeshConnect Label

is placed on the outside of the nal product. The MeshConnect Module is labeled with its own FCC ID Number and IC ID

Number. If the FCC ID and the IC ID are not visible when the module is installed inside another device, then the outside of
the device into which the module is installed must also display a label referring to the enclosed module. This exterior label
can use wording such as the following:
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP0” or “Contains FCC ID: W7Z-ZICM357SP0”

“Contains Transmitter Module IC:8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0”

or
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP2” or “Contains FCC ID: W7Z-ZICM357SP2”
“Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2”

Page 11

MeshConnect™ EM357 Mini Modules

AGENCY CERTIFICATIONS (Continued)

The OEM of the MeshConnect Module may only use the approved antenna, (PCB Trace Antenna) that has been

certied with this module. The OEM of the MeshConnect Module must test their nal product conguration to comply with
Unintentional Radiator Limits before declaring FCC compliance per Part 15 of the FCC rules.

IC Certication — Industry Canada Statement

The term "IC" before the certication/registration number only signies that the Industry Canada technical specications
were met.

Certication IC - Déclaration d'Industrie Canada

Le terme "IC" devant le numéro de certication/d'enregistrement signie seulement que les spécications techniques
Industrie Canada ont été respectées.

Section 14 of RSS-210

The installer of this radio equipment must ensure that the antenna is located or pointed such that it does not emit RF eld

in excess of Health Canada limits for the general population. Consult Safety Code 6, obtainable from Health Canada's
website: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php

L'article 14 du CNR-210

Le programme d'installation de cet équipement radio doit s'assurer que l'antenne est située ou orientée de telle sorte qu'il ne
pas émettre de champ RF au-delà des limites de Santé Canada pour la population générale. Consulter le Code de sécurité 6,

disponible sur le site Web de Santé Canada: http://www.hc-sc.gc.ca/ewh-semt/pubs/radiation/99ehd-dhm237/index-eng.php

CE Certication — Europe

The MeshConnect ZICM357SP0 module has been tested and certied for use in the European Union.

OEM Responsibility to the European Union Compliance Rules

If the MeshConnect module is to be incorporated into a product, the OEM must verify compliance of the nal product to the
European Harmonized EMC and Low-Voltage / Safety Standards. A Declaration of Conformity must be issued for each of
these standards and kept on le as described in Annex II of the R&TTE Directive.

The manufacturer must maintain the user's guide and adhere to the settings described in the manual for maintaining

European Union Compliance. If any of the specications are exceeded in the nal product, the OEM is required to
make a submission to the notied body for compliance testing.

OEM Labeling Requirements

The CE mark must be placed on the OEM product in a visible location.
The CE mark shall consist of the initials “CE” with the following form:

· If the CE marking is reduced or enlarged, the proportions given in the above graduated
drawing must be adhered to.

· The CE mark must be a minimum of 5mm in height

· If the use of the module is subject to restrictions in the end application, the CE
marking on the OEM product should also include the alert sign as shown in the
picture to the right.

Page 12

MeshConnect™ EM357 Mini Modules

AGENCY CERTIFICATIONS (Continued)

Software Compliance

The ZICM357SP2 requires software restrictions to meet agency certication requirements. These restrictions have been

implemented in the sample application included with the software development kit.

If a customer is not starting with CEL's software development kit, they must implement these output power restrictions to

use the ZICM357SP2 FCC or IC certication:

Certication RF Channel

ZICM357SP0-1

ZICM357SP2-1 FCC/IC

ZICM357SP2-1C FCC/IC

Note: For the ZICM357SP2, Power mode 2 with Power Setting "-2" is the maximum setting allowed for FCC compliance.
Operating in power mode 3 at higher power settings may damage the power amplier.

FCC/IC

ETSI 11 - 26 -43 to 8 8 dBm

11 - 25 -43 to 8 8 dBm

26 -43 to 0 1 dBm

11 - 24 -43 to -2 20 dBm

25 -43 to -6 17 dBm

26 -43 to -26 -3 dBm

11 - 24 -43 to -2 20 dBm

25 -43 to -12 9 dBm

26 -43 to -38 -5 dBm

Valid TX

Power Steps

Typical Max

Output Power

Page 13

MeshConnect™ EM357 Mini Modules

SHIPMENT, HANDLING AND STORAGE

Shipment

The MeshConnect Modules have two delivery options:

1. Trays (in bundles) of 330 units. Each tray contains 66 units

2. Tape and Reel for easy assembly in a manufacturing environment. The reel diameter is 330mm (12.992in) and
contains 700 modules.

Tape and Reel Dimensions

Measurements are in inches [mm]

0.079±0.004 [2.00±0.10]

0.957±0.004 [24.30±0.10]

SECTION A-A

4.00 PITCH

0.014±0.002 [0.35±0.05]

0.169±0.004 [4.30±0.10]

A

B B

A

0.945±0.004 [24.00±0.10]

0.071±0.004 [1.75±0.10]

0.795±0.006 [20.20±0.15]

1.732±0.011 [44.00±0.30]

0.669±0.004 [17.00±0.10]

Handling

The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.

Warning

The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
destroy or damage the module permanently.

Warning

The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions are summarized

in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.

Moisture Sensitivity Level (MSL)

MSL 3, per J-STD-033

Storage

Storage/shelf life in sealed bags is 12 months at <40°C and <90% relative humidity.

QUALITY

CEL modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with the IPC-A-610
specication, Class II. Our modules go through JESD22 qualication processes which includes high temperature operating life
tests, mechanical shock, temperature cycling, humidity and reow testing. CEL conducts RF and DC factory testing on 100%

of all production parts.

CEL builds the quality into our products, giving our customers condence when integrating our products into their systems.

Page 14

MeshConnect™ EM357 Mini Modules

REVISION HISTORY

Previous Versions Changes to Current Version Page(s)

0011-00-07-00-000
March 29, 2012

0011-00-07-00-000
(Issue A) April 11, 2012

0011-00-07-00-000
(Issue B) May 4, 2012

0011-00-07-00-000
(Issue C) June 22, 2012

0011-00-07-00-000
(Issue D) July 31, 2012

0011-00-07-00-000
(Issue E) February 28, 2013

0011-00-07-00-000
(Issue E) June 20, 2013

Disclaimer

Initial preliminary datasheet. N/A

Added FCC certication and shipping information; edited "Features" section 1, 13

Updated Min./Multiple values 1, 13

Updated Software Compliance table 13

Updated land pattern; added note about operating in Boost Mode on SP2. 9

Removed "Preliminary" from rst page. 1

Updated Antenna section, Shipment section 4, 14

• The information in this document is current as of the published date. The information is subject to change without
notice. For actual design-in, refer to the latest publications of CEL data sheets or data books, etc., for the most

up-to-date specications of CEL products. Not all products and/or types are available in every country. Please

check with an CEL sales representative for availability and additional information.

• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of CEL. CEL assumes no responsibility for any errors that may appear in this document.

• CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of CEL products listed in this document or any other liability arising from the
use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of CEL or others.

• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software and information in the design of a customer’s equipment shall be done under the full responsibility of the
customer. CEL assumes no responsibility for any losses incurred by customers or third parties arising from the use
of these circuits, software and information.

• While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and

acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to

property or injury (including death) to persons arising from defects in CEL products, customers must incorporate

sufcient safety measures in their design, such as redundancy, re-containment and anti-failure features.

Page 15