Datasheet XQR1701LCC44V, XQ1701LSO20N, XQ1701LCC44M Datasheet (XILINX)

DS062 (v3.1) November 5, 2001 www.xilinx.com 1
Preliminary Product Specification 1-800-255-7778

© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

Features

• XQ1701L/XQR1701L

• QML Certifie d

• Configuration one-time programmable (OTP) read-only
memory designed to store configuration bitstreams of
Xilinx FPGA d evice s

• Simple interface to the FPGA; requires only one user
I/O pin

• Cascadable for storing longer or multiple bitstreams

• Programmable reset polarity (active High or active
Low) for compatibility with different FPGA solutions

• Supports XQ4000X L/V irtex fast configuration mode
(15.0 MHz)

• Available in 44-pin ceramic LCC (M grade) package

• Available in 20-pin SOIC package (XQ1701L only)

• Programming support by leading programmer
manufacturers.

• Design support using the Xilinx Allianc™ and
Foundation™ series software packages.

• XQR1701L (only)

• Fabricated on Epitaxial Silicon to improve latch
performance (parts are immune to Single Event
Latch-up)

• Single Event Bit Upset immune

• Tota l Dose tolerance in excess of 50 krad(Si)

• All lots subjected to TID Lot Qualification in accordance

with method 1019 (dose rate ~9.0 rad(Si)/sec)

• XQ1701L (only)

• Also available under the following Standard Microcircuit

Drawing (SMD): 5962-9951401. For more information
contact hte Defense Supply Center Columbus (DSCC):

http://www.dscc.dla.mil/Programs/Smcr/

Description

The QPro™ ser ies XQ1701L are Xilinx 3.3V high-density
configuration PROMs. The XQR1701L are radiation hard­ened. These devices are manufactured on Xilinx QML certi­fied manufacturing lines utilizing epitaxial substrates and
TID lot qualification (per method 1019).

When the F PGA is in Master S erial mode, it generates a
configuration clock that drives the PROM. A short access
time after the rising clock edge, data appears on the PROM
DATA output pin that is connected to the FPGA D

IN

pin. The
FPGA generates the appropri ate number of clock pulses to
complete the configuration. Once configured, it disables the
PROM. When the FPGA is in Slave Serial mode, the PROM
and the FPGA must both be clocked by an incoming signal.

Figure 1 shows a simplied block diagram.

Multiple devices can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all PROMs in this
chain are interconnected. All devices are compatible and
can be cascaded with other members of the family.

For device programming, either the Xilinx Alliance or Foun­dation series development system compiles the FPGA
design file into a stan dard Hex format, which is then trans­ferred to most commercial PROM programmers.

0

QPro Series Configuration PROMs
(XQ) including
Radiation-Hardened Series (XQR)

DS062 (v3.1) November 5, 2001

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Preliminary Product Specification

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QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)

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1-800-255-7778 Preliminary Product Specification

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Pin Description

DA T A

Data output is in a high-impedance state when either CE or
OE

are inactive. During programming, the DATA pin is I/O.

Note that OE

can be programmed to be either active High or

active Low.

CLK

Each rising edge on the CLK input inc rements the internal
address counter, if both CE

and OE are active.

RESET/OE

When High, this input hol ds the ad dress counter res et and
puts the DATA output in a high-impedance state. The polar­ity of this input pin is programmable as either RESET/OE

or

OE/RESET

. To avoid confusion, this document describes

the pin as RESET/OE

, although the opposite polarity is pos­sible on all devices. When RESET is active, the address
counter is held at "0", and puts the DATA output in a
high-impedance state. The polarity of this input is program­mable. T he default is active High RESET, but the preferred
option is active Low RESET

, because it can be driven by the

FPGAs INIT

pin.

The polarity of this pin is controlled in the programmer inter­face. This input pin is easily inverted using the Xilinx
HW-130 Programmer . Third-party programmers have differ­ent methods to invert this pin.

CE

When High, this pin disables the internal address counter,
puts the DATA output in a high-impedance state, and forces
the device into low-I

CC

standby mode.

CEO

Chip Enable output, to be connected to the CE input of the
next PROM in the daisy chain. This output is Low when the
CE

and OE inputs are both active AND the internal address
counter has been incremented beyond its Terminal Count
(TC) value. In other words: when the PROM has been read,
CEO

will follow CE as lon g as OE is active. When OE goes

inac tive, CEO

stays High until the PROM is reset. Note that

OE

can be programmed to be either active High or active

Low.

V

PP

Programming voltage. No overshoot above the specified
max voltage is permit ted on this pin. For normal read oper­ation, this pin must be conne cted to V

CC

. Failure to do s o
may lead to unpredictable, temperature-dependent opera­tion and severe problems in circuit debugging. Do not leave
V

PP

floating!

VCC and GND

Positive supply and ground pins.

Figure 1: Simplified Block Diagram (does not show pro gr amm ing circuit)

EPROM

Cell

Matrix

Address Counter

CE

DATA

OE

Output

CLK

V

CC

V

PP

GND

DS027_01_021500

TC

OE

RESET/

OE/

RESET

or

CEO

QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)

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Preliminary Product Specification 1-800-255-7778

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PROM Pinouts

Capacity

Xilinx FPGAs and Compatible PROMs.

Controlling PROMs

Connecting the FPGA device with the PROM.

• The DATA output(s) of the of the PROM(s) drives the
D

IN

input of the lead FPGA device.

• The Master FPGA CCLK output drives the CLK input(s)
of the PROM(s).

• The CEO

output of a PROM drives the CE input of the

next PROM in a daisy chain (if any).

• The RESET

/OE input of all PROMs is best driven by

the INIT

output of the lead FPGA device. This
connection assures that the PROM address counter is
reset before the start of any (re)configuration, even
when a reconfiguration is initiated by a V

CC

glitch.

Other methods—such as driving RESET

/OE from LDC
or system reset—assume the PROM internal
power-on-reset is always in step with the FPGAs
internal power-on-reset. This may not be a safe
assumption.

• The PROM CE

input can be driven from either the LDC

or DONE pins. Using LDC

avoids potential contention

on the D

IN

pin.

• The CE

input of the lead (or only) PROM is driven by
the DONE output of the lead FPGA device, provided
that DONE is not permanently grounded. Otherwise,
LDC

can be used to drive CE, but must then be

unconditionally High during user operation. CE

can
also be permanentl y tied Low, but this keeps the DATA
output active and causes an unnecessary supp ly
current of 10 mA maximum.

FPGA Master Serial Mode Summary

The I/O and logic func tions of the Configurable Log ic Block
(CLB) and their associated interconnections are established
by a configuration program. The program is loaded either
automatically upon power up, or on command, depending
on the state of the three FPGA mode pins. In Master Serial
mode, the FPGA automatically loads the configuration pro­gram from an external memory. The Xilinx PROMs have
been designed for compatibility with the Master Serial
mode.

Upon power-up or reconfiguration, an FPGA enters the
Master Serial mode whenever all three of the FPGA
mode-select pins are Low (M0=0, M1=0, M2=0). Data is
read from the PROM sequentially on a single data line. Syn­chronization is provided by the rising edge of the temporary
signal CCLK, which is generated during configuration.

Master Serial Mode provides a simple configuration inter­face. Only a serial data line and two control lines are
required to configure an FPGA. Data from the PROM is
read sequentially, accessed via the internal address and bit
counters which a re incremented on every valid rising ed ge
of CCLK.

If the user-programmable, dual-function D

IN

pin on the
FPGA is used only for configuration, it must still be held at a
defined level during normal operation. The Xilinx FPGA
families take care of this automatically with an on-chip
default pull-up resistor.

Pin Name 44-Pin CLCC

DATA 2
CLK 5
RESET/OE

(OE/RESET)19

CE

21
GND 3, 24
CEO

27
V

PP

41
V

CC

44

Devices Configu ra ti on B i ts

XQR1701L 1,048,576

XQ1701L 1,048,576

Device Configuration Bits

XQ(R)1701L

PROMs

XQ(R)4013XL 393,632 1
XQ(R)4036XL 832,528 1
XQ(R)4062XL 1,433,864 2
XQ(R)4013XL 393,632 1
XQ(R)4036XL 832,528 1
XQ(R)4062XL 1,433,864 2

XQV(R)300 1,751,840 2
XQV(R)600 3,608,000 4

XQV(R)1000 6,127,776 6

QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)

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Programming the FPGA With Counters
Unchanged Upon Completion

When multiple FPGA-configurations for a single FPGA are
stored in a PROM, the OE

pin should be tied Low. Upon
power-up, the internal address counters are reset and con­figuration begins with the first program stored in memory.
Since the OE

pin is held Low, the address counters are left
unchanged after configuration is complete. Therefore, to
reprogram the FPGA with another program, the DONE line
is pulled Low and configuration begins at the last value of
the address counters.

This method fails if a user applies RESET

during the FPGA
configuration process. The FPGA abor ts the configuration
and then restar ts a new configuration, as intended , but the
PROM does not reset its address counter, since it never
saw a High level on its OE

input. The new configuration,
therefore, reads the remaining data in the PROM and inter­prets it as preamble, length count etc. Since the FPGA is
the master, it issues the necessary number of CCLK pulses,
up to 16 mi llion (2

24

) and DONE goes High. However, the

FPGA configuration will be completely wrong, with potential

contentions inside the FPGA and on its output pins. This
method must, therefore, never be used when there is any
chance of external reset during configuration.

Cascading Configuration PROMs

For multiple FPGAs configured as a daisy-chain, or for
future FPGAs requiring larger configuration memories, cas­caded PROMs provide additional memory. After the last bit
from the first PROM is read, the next clock signal to the
PROM asserts its CEO

output Low and disables its DATA
line. The second PROM recognizes the Low level on its CE
input and enables its DATA output. See Figure 2.

After configuration is complete, the address counters of all
cascaded PROMs are re set if the FPGA RESET

pin goes
Low, assuming the PROM reset polarity option has been
inverted.

To reprogram the FPGA with another program, the DONE
line goes Low and c onfiguration begins where the address
counters had stopped. In this case, avoid contention
between DATA and the configu red I/O use of D

IN

.

QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)

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Figure 2: Master Serial Mode. The one-time-programmable PROM supports automatic loading of configuration programs.

Multiple devices can be cascaded to support additional FPGAs. An early DONE inhibits the PROM data output one CCLK

cycle before the FPGA I/Os become a ctive.

DIN

DOUT

CCLK

INIT

DONE

PROM

DATA
CLK

CE CE

FPGA

(Low Resets the Address Pointer)

* For mode pin connections,
refer to the appropriate FPGA data sheet.

Vcc

V

CC

V

CC

OPTIONAL
Daisy-chained
FPGAs with
Different
configurations

OPTIONAL
Slave FPGAs
with Identical
Configurations

RESET RESET

DS027_02_060100

CCLK

(Output)

D

IN

D

OUT

(Output)

OE/RESET

MODES*

V

PP

V

PP

Cascaded

Serial

Memory

DATA

CLK

CEO

OE/RESET

3.3V

4.7K

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Standby Mode

The PROM enters a low-power standby mode whenever CE
is asserted High. The out put remains in a high-impedance
state regardless of the state of the OE

input.

Programming

The devices can be programmed on programmers supplied
by Xilinx or qualified third-party vendors. The user must
ensure that the appropriate programming algorithm and the
latest version of the programmer software are used. The
wrong choice can permanently dam age the device.

Radiation Characteristics (XQR1701L only)

Table 1: Truth Table for Control Inputs

Control In put s

Internal Address

Outputs

RESET CE

DAT A CEO I

CC

Inactive Low If address < TC

(1)

: increment

If address > TC

(1)

: don’t change

Active

High-Z

High

Low

Active

Reduced

Active Low Held reset High-Z High Active

Inactive High Not changing High-Z High Standby

Active High Held reset High-Z High Standby

Notes:

1. The XC1700 RESET input has program mable polarity

2. TC = Terminal Count = highest add ress value. TC + 1 = address 0.

Symbol Description Min Max Units

TID Total ionizing dose, Method 1019 50 - krad(Si)

SEL Single event latch-up.

Heavy ion saturation cro ss section, LET

1

> 120 MeV cm2/mg

-0(cm

2

/Device)

SEU Single event bit upset.

Heavy ion saturation cro ss se cti o n

LET > 120 MeV cm

2

/mg

-0(cm

2

/Bit)

SEFI

2

Single event functional interupt,

Heavy ion saturation cross section,

10% saturated intercept at LET = 6.0 MeV cm

2

/mg

-1.2e

–5

(cm2/Device)

Notes:

1. Single Event Effects testing was performed with heavy ion to a maximum LET of 120 MeV cm

2

/mg.

QPro Series Configuration PROMs (XQ) including Radiation-Hardened Series (XQR)

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Preliminary Product Specification 1-800-255-7778

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Absolute Maximum Ratings

Operating Conditions

DC Characte ri sti cs Ove r Op er at ing Con ditio n

Symbol Description Conditions Units

V

CC

Supply voltage relative to GND –0.5 to +4.0 V

V

PP

Supply voltage relative to GND –0.5 to +12.5 V

V

IN

Input voltage relative to GND –0.5 to VCC +0.5 V

V

TS

Voltage applied to High-Z output –0.5 to VCC +0.5 V

T

STG

Storage temperature (ambient) –65 to +150 °C

Notes:

1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and fu nctional operat ion of the d evice at these or any other conditions beyon d those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.

Symbol Description Min Max Units

V

CC

(1)

Supply voltage relative to GND
ceramic pac ka ge (T

C

= –55°C to +125°C)

plastic package (T

J

= –55°C to +125°C)

Military 3.0 3.6 V

Notes:

1. During normal read operation V

PP

MUST be connected to V

CC.

Symbol Description Min Max Units

V

IH

High-level input voltage 2 V

CC

V

V

IL

Low-level input voltage 0 0.8 V

V

OH

High-level output voltage (IOH = –3 mA) 2.4 - V

V

OL

Low-lev el output voltage (IOL = +3 mA) - 0.4 V

I

CCA

Supply current, active mode (at maximum frequency) - 10 mA

I

CCS

Supply current, standby mode (XQ1701L) - 100 µA

I

CCS

(1)

Supply current, standby mode
(XQR1701L )

Pre-rad (TID) - 300 µA
Post-rad (TID) - 3 mA

I

L

Input or output leakage current –10 10 µA

C

IN

Input capacitance (VIN = GND, f = 1.0 MHz) - 10 pF

C

OUT

Output capacitance (VIN = GND, f = 1.0 MHz) - 10 pF

Notes:

1. I

CCS

, Standby Current is measured at +125°C for pre-ra diation specifications and at room temperat ure for post-r adiation

specifications.

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AC Characteristics Over Operating Condition

Symbol Description

XQ(R)1701L

UnitsMin Max

T

OE

OE to data delay - 30 ns

T

CE

CE to data delay - 45 ns

T

CAC

CLK to data delay - 45 ns

T

DF

CE or OE to data float delay

(2,3)

-50ns

T

OH

Data hold from CE, OE, or CLK

(3)

0-ns

T

CYC

Clock periods 67 - ns

T

LC

CLK Low time

(3)

25 - ns

T

HC

CLK High time

(3)

25 - ns

T

SCE

CE setup time to CLK (to guarantee proper counting) 25 - ns

T

HCE

CE hold time to CLK (to guarantee proper counting) 0 - ns

T

HOE

OE hold time (guarantees counters are reset) 25 - ns

Notes:

1. AC test load = 50 pF

2. Float dela ys are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels.

3. Guaranteed by design, not tested.

4. All AC parameters are measured with V

IL

= 0.0V and VIH = 3.0V.

RESET/OE

CE

CLK

DATA

T

CE

T

OE

T

LC

T

SCE

T

SCE

T

HCE

T

HOE

T

CAC

T

OH

T

DF

T

OH

T

HC

DS027_03_021500

T

CYC

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Preliminary Product Specification 1-800-255-7778

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AC Characteristics Over Operating Condition When Cascading

Symbol Description Min Max Units

T

CDF

CLK to data float delay

(2,3)

-50 ns

T

OCK

CLK to CEO delay

(3)

-30 ns

T

OCE

CE to CEO delay

(3)

-35 ns

T

OOE

RESET/OE to CEO delay

(3)

-30 ns

Notes:

1. AC test load = 50 pF

2. Float dela ys are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels.

3. Guaranteed by design, not tested.

4. All AC parameters are measured with V

IL

= 0.0V and VIH = 3.0V.

RESET/OE

CLK

DATA

CE

T

OOE

CEO

First Bit Last Bit

T

OCE

T

OCK

T

CDF

DS027_04_021500

T

OCE

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Ordering Information

XQR1701L CC44 V

Grade (Manufacturing Flow/ Temperature
Range)

Device Number

Package Type

Device Ordering Options

Device Type Pack age Grade

XQ1701L

CC44 44-pin Ceramic Chip Carrier Packag e

M

Military Ceramic TC = –55°C to +125°C

XQR1701L

(1)

SO20 20-column Plastic Small Outline Package

N

Military Plastic TJ = –55°C to +125°C

V

QPro-Plus TC = –55°C to +125°C

Notes:

1. Radiation Hardened.

5962 9951401 Q Y A

Lead Finish

Generic Standard Microcir­cuit Drawing (SMD)

Device Type

Package Type

QML Certified MIL-PRF-3 8535

SMD Ordering Options

Device Type QML

Package

Lead Finish

9951401 XQ1701L QYA 44-pin Ceramic Chip Carrier Packa ge

Solder Dip

- XQR1701L NXB 20-column Plastic Small Outline Package

Solder Plate

Valid Ordering Combinations

Mil-Std SMD Rad Hard SMD

XQ1701LCC44M 5962-9951401QYA

XQR1701LCC44M

-

XQ1701LSO20N 5962-9951401NXB XQR1701LCC44V

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Revision History

The following table shows the revision history for this document.

Date Version Revision

04/20/00 1.0 Initial Release
06/01/00 2.0 Com bined XQR17 00L Rad-Hard and XQ1701L devices, added XQ1704L and updated

format.
02/08/01 3.0 Rem oved the XQ1704L and XQR170 4L
11/05/01 3.1 Added V Grade to ordering combina tions for Rad Hard version.