Datasheet xEV Datasheet (RENESAS)

RENESAS

MCU, Analog & Power Device Portfolio for

xEV Applications

MARCH 2021

AUTOMOTIVE SOLUTIONS BUSINESS UNIT

SAM GOLD

PETER HOGENKAMP

AGENDA

▪ Introduction

▪ Renesas xEV Solutions: Semiconductor for Traction Inverters

− Microcontroller

− Analog & Power

− PMIC

− High-Voltage Gate Driver

− IGBT & FRD

− Inductive Position Sensor

▪ BMS – Battery Management Solution

▪ Other Sessions

INTRODUCTION

Name: Peter Hogenkamp

Renesas affiliation: Joint Renesas in 1997

Position: Principle Engineer

Automotive Technical Marketing

Power Semiconductor Solutions

Name: Sam Gold

Renesas affiliation: Joint Renesas in 2008

Position: Senior Manager

Automotive Digital Marketing Powertrain & xEV MCUs

Page 4

INVERTER SOLUTION

Page 5

xEV SYSTEM OVERVIEW - INVERTER -

MCU

MOSFET

Cell

Monitor

Controller

Gate

driver

IGBT

MOS Diode

Inverter

IGBT

BMSOn-Board Charger

MCU

Gate

driver

IGBT

MOS

Diode

RH850/

F1x,U2Ax

ISL78226

R2A25110

ISL78434

RH850/

P1x, U2Ax

RH850/

F1x, U2Ax

R2A25110

RAJ28000x

uPD16603x

IPD

AE3/4 IGBT

AE4 IGBT

ANM2 MOS

ISL78714

MCU

Gate

driver

R2A25110

ISL78434

Position

sensor

IPS2xxx

PMIC

RAA270000

RH850/

C1M-A

PMIC

RAA270005

DC/DC

Photocoupler

RV1S2752Q

Page 6

XEV INVERTER SOLUTION SYSTEM CONFIGURATION

IGBT + FRD

Driver

IC

MCU

Driver

IC

Driver

IC

Driver

IC

Driver

IC

Driver

IC

RDC

PMIC

RAA270000KFT

RH850/C1M-A2

Temperature sensor diode

Power Management IC

R2A25110KSP

Current Sensor

Inverter

Photocoupler

External I/F

RV1S2752Q

U

V

W

IPS2550

Inductive Position Sensor

or optional Resolver

3.9L,

100kW

400V/800A

(500A

RMS

)

Power module

Page 7

MICROCONTROLLER

Page 8

FUTURE HEV/EV  INCREASE ELECTRICAL ANGLE VELOCITY

▪ Increased RPM level will be

required for full HEV and PHEV/EV in future to achieve

smaller form factors of xEV

components, like the e-motor

▪ Higher RPMs require high

speed processing as the Inverter control feedback cycle becomes shorter

PHEV

Full HEV

Mild HEV

Electrical angle (rpm)

120,000

60,000

0

2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025

Year

Renesas is providing system control solutions to achieve high speed RPM ➔ cost down due to smaller system components

Page 9

RH850/C1M-A – HIGHLIGHTS & KEY FEATURES

Performance → Ideal Solution for Traction Motor Control

▪ Ideal for E-drive → control of 2 traction motors with 1 MCU

▪ 320MHz lock-step cores

▪ HW accelerator for E-Motor control Unit (EMU)

▪ Optimized system configuration with extremely fast memory access (flash, RAM)

Scalability & Flexibility

▪ C1M-Ax is the successor of C1H. Two memory/performance options available (2MB single core + 4MB dual core)

▪ Seamless upgrade to successor products : same architecture for motor control and re-use of SW

Technologies

▪ E-Motor position sensing → integrated Resolver-to-Digital-Converter (RDC) interface. Supporting as well REN inductive position sensor IPS2550

▪ FMONOS → extremely fast flash technology, reliable, proven, scalable

Safety & Security → ASIL-C and EVITA-light

▪ Motor-control error detection concept, lock-step cores, Self-diagnosis implemented ▪ SHE supporting

System Development Environment

▪ Comprehensive solution menu incl. all relevant 3rd-party tools, User Manual, various AppNotes, MCAL QM

Starter kit + MCAL ASIL-C under preparation

Page 10

MCU CONCEPT FOR EV/HEV

- INTEGRATION CONCEPT -

1. High performance & Safety

▪ Multi-core, 240/320 MHz ▪ Enhanced diagnostic functions ▪ Functional Safety

2. Integrated Resolver to Digital Converter (RDC3A)

▪ Reduce System Cost with integrated RDC3A ▪ Improvement of failure diagnosis

3. Integrated Motor Control Support (EMU3)

▪ Built-in flexible, optional Hardware Logic for Motor Control

▪ Able to control up to 2 motors independently in conjunction with the TSG3 timer

Gate

Driver

Unit

Power Stage

MCU RH850/C1M-A

ADC

Timer

(TSG3)

EMU3

Hi-Z ctrl

(TAPA)

RDC3A

Motor control

features

Memories

Timers

ADC

System

Position

Sensor

Motor

Cores

Page 11

2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024

RH850/E1x-FCC1

320MHz x (1+1), 4MB

BGA304/252/QFP176/144

RH850/E1L

160/240MHz x (1+1), 2MB

BGA252/QFP176/144

RH850/E1M-S

240/320MHz x (1+1), 4MB

BGA304/252

RH850/E1M-S2

240/320MHz x (1+1), 4MB

BGA304/252

RH850/E1x-FCC2

320MHz x (2+1), 8MB

BGA304/252

RH850/E2x-FCC1

400MHz x (2+2), 8MB

BGA373/292/QFP176

Gen 2

Gen 1.5

Gen 1

Gen 3

Mass Production

FCC chip(Eval dev)

Under Development

Preliminary

POWERTRAIN & XEV MCU ROADMAP

28nm

RH850/E2x-FCC2

400MHz x (6+4), 16MB

BGA468/373

RH850/E2UH

400MHz x (6+4), 16MB

BGA468/373

RH850/E2H

400MHz x (4+2), 12MB

BGA468/373

RH850/E2M

400MHz x (2+2), 8MB

BGA373/292

RH850/C1M-A1

240MHz x (1+1), 2MB

2xTSG3, 1 RDC, EMU

RH850/C1M-A2

320MHz x (2+1), 4MB

3xTSG3, 2 RDC, EMU

Next Generation

Page 12

RH850/C1M-A MICROCONTROLLER

➢Ideal solution for E-drive to control traction & generator motors with 1 MCU

▪ Control 2 motors with 1 MCU based on high performance multi core CPU ▪ Reduce CPU load with H/W-accelerator (EMU3) for high-speed motor control ▪ Reduce ECU BOM cost by an embedded Position sensor interface to connect either

resolver-or inductive position sensors

▪ ISO-26262 ASIL-C compliant

Integrated RDC solution

EMU3 solution

Page 13

Interfaces

Analog

Memory

Package &

Power Supply

4 MB Code Flash

64KB Data Flash

4 x RSENT

3 x RLIN3

4 x RSCAN-FD

3 x ADC

max. 48 ch (12-bit)

6+6+4 T/H

Total: 320 KB RAM

Local: 64 KB / core

Global RAM: 128 KB

3 x CSIH

Motor Control IP

EMU3 2ch

BGA252

(0.8 mm pitch)

Debug System

NEXUS, AUD

Page 13

Dual voltage supply:

I/O: 4.5 .. 5.5 V /

Core: 1.15 .. 1.35 V

2 x RDC3A

Generic Timers

4 x TAUD

3 x TSG3

6 x TAPA

2 x ENCA

4 x OSTM

2 x TPBA

RH850/C1M-A2

32-bit CPU

MPU: 16 regions, FPU: 2

System, Safety & Security

ICU-S

Security Module

Error Control Module

2 x DCRA

16ch DMA + 128 DTS

Boundary scan

2 + 1 RH850 G3MH Core

@ 320 MHz, Tj = -40 ~ +150 °C

2 x TAUJ

Clock Monitor

3 x SCI3

MISG

RH850 G3MH Core

1+0 @ 320 MHz

2 x WDTA

2 x SWDT

Device Package Order code RH850/C1M-A2 BGA252-17x17-0.8 R7F701275EABG

Page 14

Analog

Memory

2 MB Code Flash

64KB Data Flash

3 x ADC

max. 30 ch (12-bit)

6+6+4 T/H

Total: 192 KB RAM

Local: 64 KB / core

Global RAM: 64 KB

Generic Timers

2 x TAUD

2 x TSG3

4 x TAPA

2 x ENCA

3 x OSTM

1 x TPBA

RH850/C1M-A1

32-bit CPU

MPU: 16 regions, FPU: 1

1 + 1 RH850 G3MH Core

@ 240 MHz, Tj = -40 ~ +150 °C

1 x TAUJ

Motor Control IP

EMU3 1ch

1 x RDC3A

RH850 G3MH Core

1+0 @ 240 MHz

1 x WDTA 1 x SWDT

Interfaces

4 x RSENT

3 x RLIN3

4 x RSCAN-FD

3 x CSIH

3 x SCI3

Package &

Power Supply

QFP176

(0.5 mm pitch)

Dual voltage supply:

I/O: 4.5 .. 5.5 V /

Core: 1.15 .. 1.35 V

Debug System

NEXUS, AUD

System, Safety & Security

ICU-S

Security Module

Error Control Module

2 x DCRA

16ch DMA + 128 DTS

Boundary scan

Clock Monitor

MISG

Device Package Order code RH850/C1M-A1 QFP176-24x24-0.5 R7F701278EAFP

Page 15

ANALOG & POWER

Page 16

PMIC FOR RH850/C1M-AX MCU

◼RAA27000x PMIC for RH850

✓Optimized power supply for RH850 and integrate

monitor and diagnosis functions

⇒ Easy to develop and reduce external BOM cost and

PCB area

◼Planning RH850 Next PMIC

✓Support ISO26262 ASIL D

✓Support wide current supply range by changing external FET

Ext. BOM: 43% Reduction

PCB area: 22% Reduction

C1x

RAA270000

Competitor

PMIC

REL PMIC

RAA270000

*Under development **under planning

2014 2015 2016 2017 2018 2019 2020 2021 2022 2023

RAA270000

For RH850/E1x, C1x

64QFP (10x10*)

RAA270005

For RH850/P1x

40QFP(7x7*)

RH850 Next

PMIC

ASIL D support

MP

Planning

Cut-down

Boost DCDC

Highly efficient

Buck/Boost

Solution example

Product roadmap

Page 17

HV GDU - R2A25110KSP -

Page 17

Gate Control

Safety

Isolation

Base Function

A key analog component associated with the controller in these HV traction motor systems is an isolated HV

gate driver (HV GDU). HV GDUs connected to the controller drives the power switches such as IGBTs. They convert PWM signals from the controller into gate pulses for the power switches to turn and off.

Mon./Diag.

Logic

Control

Logic

Error

handling

MCU

Primary side

Power Supply

Sequencer

• Soft Turn off

• Active miller

clump

Secondary side

Power Supply

Control

Logic

Safety

Monitoring

& Diagnosis

OC (DESAT,

Sense Emitter),

IGBT Temp.

OV, LV

Gate Drive

Power Supply

Gate

Driver

Gate

Driver

Monitor output

w/PWM

Error

notification

Domain Isolation

Direct Control

Typical Functional Block Diagram with HV GDU (R2A25110)

IGBTs

Page 18

100 600 900120040060

40

1

10

100

HEV, EV Inverter control

Provide high performance/robust IGBT for xEVs

IGBT

◆ W/W Top switching loss performance

◆ High quality Bare chip

◆ 600~1200V、~500A

750V 400A Class

AE4

Sw-loss

20% less

Company A

1.2

1.3

1.4

1.5

1.6

0 5 10 15 20 25 30

V

CE(sat)

[V]

Total switching loss EON+E

OFF

[mJ]

Better Performance

AEnext

On-loss 10% less

Company B

Benchmark at the same current

density

AE3

Sw: Switching

Emitter

Gate

AL

Floating

P

Floating

P

N-

Floating

P

0.7

★HiGT Structure

miniaturization of the cell

AEnext

➢ AEnext（Under dev.）： Reduce -10%Vce(sat) against AE4

Improve conductivity modulation by fine pitch cell design

IGBTs and FRDs

Page 19

INDUCTIVE POSITION SENSOR - IPS2550 -

◼ Detect the position of a target metal based on electromagnetic induction of a coil ◼ Thinner, Lighter, High magnetic field immune ◼ Flexible multiplier, flexible mounting

Easy-to-Use

PCB coil

Layout design tool

Thin, Light

High magnetic

field immune

Flexibility

１pole pair

２ pole pair

４ pole pair

On-axis

(end of shaft)

Off-axis

(through shaft)

Off-axis

(side shaft)

Flexible mounting

Flexible to different pole pairs

Page 20

xEV Inverter Reference Solution

System Benefits

RH850/C1M-A2 32bit Microcontroller RAA270000 Power management IC R2A25110 Gate driver IC RJKxxxx/RJUxxxx IGBT / FRD RV1S2752Q Photo Coupler IPS2550 Inductive Position Sensor

◼ Practical inverter specification for xEV 100kW class motor ◼ Reference solution kit including Inverter reference design, software,

model base design and calibration tool

◼ Function and performance verified in Renesas motor bench ◼ 3.9L compact volume by highly integrate products and temperature

management

◼ Superior power efficiency, achieved 99% maximum inverter efficiency

◼ Function is already proven in real car demo

Reference

Design

Block Diagram

BOM List

Reference Board

MCU

RH850/C1M-A2

PMIC

RAA270000

Gate driver IC

R2A251100

IGBT

X6

ResolverI/F

Position sensor

Photo

coupler

RV1S27

52Q

External I/F

On ECU

IGBT IGBT

IGBT

PR-INV06500780-FB

Page 21

BMS SOLUTION

Page 22

xEV SYSTEM OVERVIEW

MCU

MOSFET

Cell

Monitor

Controller

Gate

driver

IGBT

MOS Diode

Inverter

IGBT

BMS

On-Board Charger

MCU

Gate

driver

IGBT MOS

Diode

RH850/

F1x,U2Ax

ISL78226

R2A25110

ISL78434

RH850/

P1x, U2Ax

RH850/

F1x, U2Ax

R2A25110

RAJ28000x uPD16603x

IPD

AE3/4 IGBT

AE4 IGBT

ANM2 MOS

ISL78714

MCU

Gate

driver

R2A25110

ISL78434

Position

sensor

IPS2xxx

PMIC

RAA270000

RH850/

C1M-A

PMIC

RAA270005

DC/DC

Photocoupler

RV1S2752Q

Page 23

Scalability

Pin-compatible product family (8cell,

12cell, 14cell, 16cell) supports battery

packs with various number of cell

Li-ion

Cell

Battery Capacity

Usable Capacity

Li-ion

Cell

Worse

Accuracy

BMS

Fine

Accuracy

BMS

Margin for

Error

Margin for

Error

Maximize Battery Capability

Best Voltage Measurement Accuracy

RH850

/P1M

SPI

ISL78714

Up to 70

Li-ion

Cells

(CAN)

ISL78714

Safety

ASIL D system support with BMIC

and MCU

Battery PACKA

Battery PACK B

Battery PACK C

Contribute to maximizing battery capability, Safety and system cost reduction with high

accurate voltage measurement, FUSA support and scalability of H/W & S/W.

RENESAS BATTERY MANAGEMENT SYSTEM SOLUTION

ASIL-D

Page 24

SUMMARY

✓ xEV Inverter

• Renesas Inverter solution covers all major semiconductor for BOM optimized

high performance traction inverter

• Available Hardware and Software solutions support customer’s development

• Advanced, BOM cost optimized motor position detection by Inductive Position Sensor

✓ Battery Management System

• Reference solution using Renesas MCU + PMIC + BMIC

• Accurate voltage measurement, functional safety support, and H/W and S/W scalability to

maximize battery performance, safety, and reduce system development costs

OTHER SESSIONS AT EMBEDDED WORLD

Session:

• Power Management and Timing Solutions for Microprocessor/SoCs

• Winning Combinations, Analog & Digital

• Analog & Power portfolio overview

Flyer:

• IPS2550 - Inductive Position Sensor

• R-Car SoC V3x Camera Solutions

• R-Car SoC Gateway Solutions

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