Datasheet XCR3512XL-7PQ208C, XCR3512XL-7FT324C, XCR3512XL-7FT256C, XCR3512XL-12PQ208I, XCR3512XL-12PQ208C Datasheet (XILINX)

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DS081 (v1.3) January 8, 2002 www.xilinx.com 1 Advance Product Specification 1-800-255-7778
© 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Features
Lowest power 512 macrocell CPLD
7.5 ns pin-to-pin logic delays
System frequencies up to 127 MHz
Available in small footprint packages
- 208-pin PQFP (180 user I/O)
- 256-ball FBGA (212 user I/O)
- 324-ball FBGA (260 user I/O)
Optimized for 3.3V systems
- Ultra low power operation
- 5V tolerant I/O pins with 3.3V core supply
- Advanced 0.35 micron five layer metal EEPROM process
- Fast Zero Power™ (FZP) CMOS design technology
Advanced syste m features
- In-system programming
- Input registers
- Predictable timing model
- Up to 23 clocks available per function block
- Excellent pin retention during design changes
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
- Four global clocks
- Eight product term control term s per function block
Fast ISP programming times
Port Enable pin for additional I/O
2.7V to 3.6V supply voltage at industrial grade voltage range
Programmable slew rate control per output
Security bit prevents unauthorized access
Refer to XPLA3 family data sheet (DS012
) for
architecture description
Description
The XCR3512XL is a 3.3V, 512 macrocell CPLD targeted at power sensitive designs that require leading edge program­mable logic solutions. A total of 32 function blocks provide 12,000 usable gates. Pin-to-pin propagation delays are
7.5 ns with a maximum system frequency of 127 MHz.
TotalCMOS Design Technique for Fast Zero Power
Xilinx offers a TotalCMOS CPLD, both in process technol­ogy and design technique. Xilinx employs a cascade of CMOS gates to implement its sum of products instead of the traditional sense amp approach. This CMOS gate imple­mentation allows Xilinx to offer CPLDs that are both high performance and low power, breaking the paradigm that to have low power, you must have low performance. Refer to
Figure 1 and Table 1 showing t he I
CC
vs. Frequency of our XCR3512XL TotalCMOS CPLD (data taken with 32 resetable up/down, 16-bit counters at 3.3V, 25°C).
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XCR3512XL: 512 Macrocell CPLD
DS081 (v1.3) January 8, 2002
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Advance Product Specification
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Figure 1: XCR3512XL Typical ICC vs. Frequency at
V
CC
= 3.3V, 25°C
0
20
40
60
80
100
120
140
0 20 40 60 80 100 120 140 160
DS024_01_112700
Frequency (MHz)
Typical ICC (mA)
Table 1: Typical ICC vs. Frequency at VCC = 3.3V, 25°C
Frequency (MHz) 0 1 10 20 40 60 80 100 120 140
Typical I
CC
(mA) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
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DC Electrical Char acteristics Over Reco mmended Operating Conditions
(1)
Symbol Parameter Test Conditions Min. Max. Unit
V
OH
(2)
Output High voltage VCC = 3.0V to 3.6V, IOH = –8 mA 2.4 - V
V
CC
= 2.7V to 3.0V, IOH = –8 mA 2.0
(3)
-V
I
OH
= –500 µA 90% V
CC
-V
V
OL
Output Low voltage IOL = 8 mA - 0.4 V
I
IL
Input leakage current VIN = GND or V
CC
–10 10 µA
I
IH
I/O High-Z leakage current VIN = GND or V
CC
–10 10 µA
I
CCSB
Standby current VCC = 3.6V - 100 µA
I
CC
Dynamic current
(4,5)
f = 1 MHz - TBD mA f = 50 MHz - TBD mA
C
IN
Input pin capacitance
(6)
f = 1 MHz - 8 pF
C
CLK
Clock input capacitance
(6)
f = 1 MHz 5 12 pF
C
I/O
I/O pin capacitance
(6)
f = 1 MHz - 10 pF
Notes:
1. See XPLA3 f am il y data sheet (
DS012) for recommended operating conditions
2. See Figure 2 for output drive characteristics of the XPLA3 family.
3. This param eter guaranteed by design and characterization, not by testing.
4. See Table 1, Figure 1 for typical values.
5. This param eter measured with a 16-b it, resetab le up/down coun ter loaded into e very func tion bloc k, with all output s disabl ed and unloaded. Inputs are tied to V
CC
or ground. This parameter guaranteed by design and characterization, not testing.
6. Typical values, not tested.
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AC Electrical Characteristics Over Recommended Operating Conditions
(1,2)
Figure 2: Typical I/V Curve for the XPLA3 Family
Symbol Parameter
-7 -10 -12 Unit Min. Max. Min. Max. Min. Max.
T
PD1
Propagation delay time (single p-term) - 9.0 - 10.8 ns
T
PD2
Propagation delay time (OR array)
(3)
- 10. 0 - 12.0 ns
T
CO
Clock to output (global synchronous pin clock) - 5.8 - 6.9 ns
T
SUF
Setup time (fast input register) 3.5 - 3.5 - ns
T
SU1
(4)
Setup time (single p-term) 5.5 - 6.7 - ns
T
SU2
Setup time (OR array) 6.5 - 7.9 - ns
T
H
(4)
Hold time 0-0-ns
T
WLH
(4)
Global Clock pulse width (High or Low) 4.0 - 5.0 - ns
Tt
PLH
(4)
P-term clock pulse width 6.0 - 7.5 - ns
T
R
(4)
Input rise time - 20 - 20 ns
T
L
(4)
Input fall time - 2 0 - 20 ns
f
SYSTEM
(4)
Maximum system frequency - 97 - 77 MHz
T
CONFIG
(4)
Configuration time
(5)
- 120 - 120 µs
T
INIT
(4)
ISP initialization time - 120 - 120 µs
T
POE
(4)
P-term OE to output enabled - 11.0 - 13.0 ns
T
POD
(4)
P-term OE to output disabled
(6)
- 11. 0 - 13.0 ns
T
PCO
(4)
P-term clock to output - 10. 3 - 12.4 ns
T
PAO
(4)
P-term set/reset to output valid - 11.0 - 13.0 ns
Notes:
1. Specifications measured with one out put switching.
2. See XPLA3 f am il y data sheet (
DS012) for recommended operating conditions.
3. See Figure 4 for derating.
4. These par am eters guaranteed by design and/or characterization, not testing.
5. Typical current draw during con figuration is 12 mA at 3.6V.
6. Output C
L
= 5 pF.
0
0
1
0
2
0
30
4
0
50
60
7
0
80
90
1
00
0.51.52.5.54.5
Volt
s
L
3.3V
)
H
3.3V
)
H
2.7V
)
A
DS012_10_04190
1
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Internal Timing Parameters
(1,2)
Symbol Parameter
-7 -10 -12 UnitMin. Max. Min. Max. Min. Max.
Buffer Delays
T
IN
Input buffer delay - 3.3 - 4.0 ns
T
FIN
Fast input buffer delay - 3. 8 - 3.8 ns
T
GCK
Global clock buffer delay - 1.3 - 1 .5 ns
T
OUT
Output buffer delay - 3.2 - 3 .8 ns
T
EN
Output buffer enable/disable delay - 5.2 - 6 .0 ns
Internal Register and Combinatorial Delays
T
LDI
Latch transparent delay - 1.6 - 2 .0 ns
T
SUI
Register setup time 1.0 - 1.2 - ns
T
HI
Register hold time 0.5 - 0.7 - ns
T
ECSU
Register clock enable setup time 2.5 - 3.0 - ns
T
ECHO
Register clock enable hold time 4.5 - 5.5 - ns
T
COI
Register clock to output delay - 1.3 - 1 .6 ns
T
AOI
Register async. S/R to output delay - 2.0 - 2 .2 ns
T
RAI
Register async. recovery - 7.0 - 8.0 ns
T
LOGI1
Internal logic delay (single p-term) - 2.5 - 3.0 ns
T
LOGI2
Internal logic delay (PLA OR term) - 3.5 - 4 .2 ns
Feedback Delays
T
F
ZIA delay - 4.5 - 6 .0 ns
Time Adders
T
LOGI3
Fold-back NAND delay - 2.5 - 3.0 ns
T
UDA
Universal delay - 2.8 - 3.5 ns
T
SLEW
Slew rate limited delay - 5.0 - 6.0 ns
Notes:
1. These par am eters guaranteed by design and/or characterization, not testing.
2. See XPLA3 f am il y data sheet (
DS012) for timing model .
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Switching Characteristics
Figure 3: AC Load Circuit
DS023_03_102401
Component Values
R1 390 R2 390 C1 35 pF
Measurement S1 S2
T
POE
(High)
T
POE
(Low)
T
P
Open Closed Closed Open Closed
Closed
V
CC
V
OUT
V
IN
C1
R1
R2
S1
S2
Note: For T
POD
, C1 = 5 pF. Delay measured at
output level of V
OL
+ 300 mV, VOH – 300 mV.
Figure 4: Derating Curve for T
PD2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
7.0
7.1
7.2
7.3
7.4
7.5
124816
DS024_04_11800
Number of Adjacent Outputs Switching
(ns)
Figure 5: Voltage Waveform
90%
10%
1.5 ns 1.5 ns
DS017_05_042800
+3.0V
0V
Measurements:
All circuit delays are measured at the +1.5V level of inputs and outputs, unless otherwise specified.
T
R
T
L
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Pin Des cr ip t io ns
Table 2: XCR3512XL User I/O Pins
PQ208 FT256 FG324
Total User I/O Pins 180 212 260
Table 3: XCR3512XL I/O Pins
Function
Block Macrocell PQ208 FT256 FG324
1 1 208 C14 C21 12-D13C20 1 3 207 - B22 1 4 206 A15 B21 1 5--­1 6--­1 7--­1 8--­1 9--­110--­111--­112--­113--A22 1 14 205 B15 A21 115-B14B20 1 16 204 C13 C19 211E12D20 22--C22 232A16D21 24-C15D22 2 5--­2 6--­2 7--­2 8--­2 9--­210--­211--­212--­2133B16E20
2144D14F19 215--E21 2166D15E22 3 1 203 A14 B19 32-E11A20 3 3 202 - C18 3 4 201 A13 B18 35--­36--­37--­38--­39--­310--­311--­312--­313-D12A19 314--D17 3 15 199 B13 A18 3 16 198 C12 C17 417E13F20 42--F21 438C16F22 449F12G19 45--­46--­47--­48--­49--­410--­411--­412--­413--G20 41410D16G21 415-E14G22 41611E15H20
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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5 1 197 A12 B17 52--A17 5 3 196 D11 D16 54--C16 5 5--­5 6--­5 7--­5 8--­5 9--­510--­511--­512--­5 13 195 A11 B16 514-E10A16 5 15 194 B12 C15 5 16 193 C11 B15 6 1 12 F13 H21 62--H22 6 3 13 E16 J19 64--J20 6 5--­6 6--­6 7--­6 8--­6 9--­610--­611--­612--­61315F15J21 61416G12J22 615-F14K19 61617G15K20 7 1 192 B11 A15 72-D10D14 7 3 190 A10 C14
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
7 4 189
(1)
C10
(1)
B14
(1)
75--­76--­77--­78--­79--­710--­711--­712--­7 13 188 - A14 714--D13 715-A9C13 7 16 187 D9 B13 8 1 18 G13 K21 82--K22 8 3 19 F16 L19 8 4 - - L20 85--­86--­87--­88--­89--­810--­811--­812--­8 13 20 G14 L21 8 14 21 G16 L22 81522H13M21 81624H12M20 9 1 51 P16 AA21 9 2 - N14 AB22 9349R16AA22 94--Y20 95--­96---
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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9 7--­9 8--­9 9--­910--­911--­912--­91348M13Y21 91447P15W20 9 15 46 L12 W21
91645N16Y22 10 1 52 N13 AB21 10 2 53 R15 Y19 10 3 54 M12 AA20 10 4 - - AB20 105 --­106 --­107 --­108 --­109 --­1010--­1011--­1012--­10 13 55 T16 Y18 10 14 56 P14 AA19 10 15 - T15 AB19 10 16 57 P13 W17 11 1 44 M14 W 22 11 2 43 M16 V20 11 3 42 L13 V 21 11 4 - N15 U19 115 --­116 --­117 --­118 --­119 ---
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
11 10 - - ­11 11 - - ­11 12 - - ­11 13 - - V22 11 14 40 M15 U20 11 15 39 L16 U21 11 16 38 K12 U22 12 1 58 R 14 Y17 12 2 - N12 AA18 12 3 59 T14 AB18 12 4 - - AA17 12 5 - - ­12 6 - - ­12 7 - - ­12 8 - - ­12 9 - - ­12 10 - - ­12 11 - - ­12 12 - - ­12 13 60 M11 AB17 12 14 - R13 W16 12 15 61 P12 Y16 12 16 62 T13 AA16 13 1 37 L15 T19 13 2 - - T20 13 3 36 K13 T21 13 4 35 K16 T22 13 5 - - ­13 6 - - ­13 7 - - ­13 8 - - ­13 9 - - ­13 10 - - ­13 11 - - ­13 12 - - -
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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13 13 - K14 R20 13 14 34 K15 R21 13 15 33 L14 R22 13 16 31 J16 P19 14 1 64 N11 AB16 14 2 - R12 Y15 14 3 65 T12 AA15 14 4 66 R11 AB15 145 --­146 --­147 --­148 --­149 --­1410--­1411--­1412--­14 13 67 M10 W14 14 14 68 P11 Y14 14 15 - - AA14 14 16 69 N10 AB14 15 1 30
(1)
J13
(1)
P20
(1)
15 2 29 J15 P21 15 3 28 J14 P22 15 4 - - N19 155 --­156 --­157 --­158 --­159 --­1510--­1511--­1512--­15 13 27 H16 N21 15 14 - - N22 15 15 26 H14 M22
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
15 16 25 H15 M19 16 1 70 T11 W13 16 2 71 R 10 Y13 16 3 73 P10 AA13 16 4 - T 10 AB13 16 5 - - ­16 6 - - ­16 7 - - ­16 8 - - ­16 9 - - ­16 10 - - ­16 11 - - ­16 12 - - ­16 13 - - W12 16 14 76 N9 AA12 16 15 77 R9 AB12 16 16 78 P9 Y11 17 1 157 B1 C3 17 2 - B2 A2 17 3 158 C3 B3 17 4 - - C4 17 5 - - ­17 6 - - ­17 7 - - ­17 8 - - ­17 9 - - ­17 10 - - ­17 11 - - ­17 12 - - ­17 13 159 D4 B4 17 14 - A2 C5 17 15 160 A1 B5 17 16 161 B3 A3 18 1 156 C1 D3 18 2 155 D3 B2
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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18 3 154 C2 B1 18 4 153 F5 C2 185 --­186 --­187 --­188 --­189 --­1810--­1811--­1812--­18 13 - - C1 18 14 151 D1 E3 18 15 - - D2 18 16 150 E4 D1 19 1 162 C4 A4 19 2 - - D6 19 3 163 A3 A5 19 4 - D5 C6 195 --­196 --­197 --­198 --­199 --­1910--­1911--­1912--­19 13 164 B4 B6 19 14 - E6 A6 19 15 166 A4 D7 19 16 167 C5 C7 20 1 149 D2 F4 20 2 148 E3 F3 20 3 - - E2 20 4 147 E1 E1 205 ---
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
20 6 - - ­20 7 - - ­20 8 - - ­20 9 - - ­20 10 - - ­20 11 - - ­20 12 - - ­20 13 - - F2 20 14 146 F4 F1 20 15 145 F1 G4 20 16 144 G5 G3 21 1 168 B5 B7 21 2 - D6 A7 21 3 169 A5 C8 21 4 - - B8 21 5 - - ­21 6 - - ­21 7 - - ­21 8 - - ­21 9 - - ­21 10 - - ­21 11 - - ­21 12 - - ­21 13 170 C6 A8 21 14 171 B6 D9 21 15 - E7 C9 21 16 172 A6 B9 22 1 142 E2 G2 22 2 141 F3 G1 22 3 - - H3 22 4 140 F2 H2 22 5 - - ­22 6 - - ­22 7 - - ­22 8 - - -
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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229 --­2210--­2211--­2212--­22 13 - - H1 22 14 139 G4 J4 22 15 - G1 J3 22 16 138 G3 J2 23 1 173 D7 A9 23 2 - B7 D10 23 3 175 C7 C10 23 4 - C8 B10 235 --­236 --­237 --­238 --­239 --­2310--­2311--­2312--­23 13 - - A10 23 14 17 6
(1)
A7
(1)
D11
(1)
23 15 177 D8 C11 23 16 178 B8 B11 24 1 137 H1 J1 24 2 136 H4 K4 24 3 135 G2 K3 24 4 - H3 K2 245 --­246 --­247 --­248 --­249 --­2410--­2411---
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
24 12 - - ­24 13 133 J1 K1 24 14 - - L1 24 15 - - L4 24 16 132 J3 L 3 25 1 105 P2 AA1 25 2 106 P3 Y3 25 3 - - Y2 25 4 108 T1 W3 25 5 - - ­25 6 - - ­25 7 - - ­25 8 - - ­25 9 - - ­25 10 - - ­25 11 - - ­25 12 - - ­25 13 - - Y1 25 14 109 N3 W2 25 15 110 R1 W1 25 16 111 M4 V3 26 1 104 M5 AB1 26 2 - N4 AA2 26 3 103 R2 AB2 26 4 - T2 AA3 26 5 - - ­26 6 - - ­26 7 - - ­26 8 - - ­26 9 - - ­26 10 - - ­26 11 - - ­26 12 - - ­26 13 102 P4 Y4 26 14 - - AB3
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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26 15 101 R3 AA4 26 16 100 N5 Y5 27 1 112 P1 U4 27 2 - - V2 27 3 113 L5 V1 27 4 114 N2 U3 275 --­276 --­277 --­278 --­279 --­2710--­2711--­2712--­27 13 - - U2 27 14 115 M3 U1 27 15 117 L4 T3 27 16 118 M2 T2 28 1 99 T 3 AA5 28 2 98 M6 AB4 28 3 - R4 W6 28 4 97 P5 AB5 285 --­286 --­287 --­288 --­289 --­2810--­2811--­2812--­28 13 - - Y6 28 14 96 T4 AA6 28 15 95 N6 AB6 28 16 93 R5 W7 29 1 119 L2 T1
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
29 2 - - R3 29 3 120 M1 R2 29 4 121 K5 R1 29 5 - - ­29 6 - - ­29 7 - - ­29 8 - - ­29 9 - - ­29 10 - - ­29 11 - - ­29 12 - - ­29 13 122 L3 P4 29 14 123 K4 P3 29 15 - - P2 29 16 124 L1 P1 30 1 92 T6 Y7 30 2 - T5 AA7 30 3 91 M7 AB7 30 4 - - Y8 30 5 - - ­30 6 - - ­30 7 - - ­30 8 - - ­30 9 - - ­30 10 - - ­30 11 - - ­30 12 - - ­30 13 90 R6 AA8 30 14 89 N7 AB8 30 15 88 T7 W9 30 16 87 P6 Y9 31 1 126 K2 N4 31 2 - K 3 N3 31 3 127
(1)
K1
(1)
N2
(1)
31 4 128 J4 N1
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
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315 --­316 --­317 --­318 --­319 --­3110--­3111--­3112--­31 13 - - M4 31 14 129 J2 M 3 31 15 130 J5 M 2 31 16 131 H2 L2 32 1 86 R7 AA9 32 2 - P7 AB9 32 3 84 T 8 W 10 32 4 - N8 Y10 325 --­326 --­327 --­328 --­329 --­3210--­3211--­3212--­32 13 - - AA10 32 14 81 R8 AB11 32 15 80 P8 W 11 32 16 79 T9 AA11
Notes:
1. JTAG pins.
Table 3: XCR3512XL I/O Pins (Continued)
Function
Block Macrocell PQ208 FT256 FG324
Table 4: XCR3512XL Global, JT A G, P ort Enable, Power , and No Co nnect Pins
Pin Type PQ208 FT256 F G324
IN0 / CLK0 181 B9 C12 IN1 / CLK1 182 A8 B12 IN2 / CLK2 183 C9 D12 IN3 / CLK3 184 B10 A12 TCK 30 J13 P20 TDI 176 A7 D11 TDO 189 C10 B14 TMS 127 K1 N2 PORT_EN 116
(1)
N1
(1)
T4
(1)
Vcc 5, 23, 41, 63,
74, 83, 85,
107, 125, 143, 165, 179, 186,
191
E8, E9, F7,
F8, F9, F10,
G6, G1 1, H5,
H6, H11, J6,
J11, J12, K6,
K11, L7, L8, L9, L10, M8,
M9
A11, A13,
D8, D15, H4,
H19, J10,
J11, J12,
J13, K9, K14, L9,
L14, M1, M9,
M14, N9,
N14, N20,
P10, P11, P12, P13,
R4, R19,
W8, W15,
Y12, AB10
GND 14, 32, 50,
72, 75, 82,
94, 134, 152,
174, 180,
185, 200
E5, F6, F11, G7, G8, G9,
G10, H7, H8,
H9, H10, J7,
J8, J9, J10, K7, K8, K9,
K10, L6, L11
D4, D5, D18,
D19, E4,
E19, J9, J14,
K10, K11, K12, K13,
L10, L11,
L12, L13, M10, M11 , M12, M13 ,
N10, N11, N12, N13,
P9, P14, V4,
V19, W4,
W5, W18,
W19
No
Connects
--A1
Notes:
1. Po rt Enable is br ought High t o enabl e JTAG pins when JTAG pins are used as I/O . See f amily data she et (
DS012) f or full
explanation.
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Ordering Information
Revision History
The following table shows the revision history for this document
Component Compatibility
Pins 208 256 324
Type Plastic PQFP Plastic FBGA Plastic FBGA
Code PQ208 FT256 F G324
XCR3512XL
-7 C C C
-10 C, I C, I C, I
-12 C, I C, I C, I
Date Version Revision
04/11 /01 1.0 Initia l X ilin x re lea s e. 04/19/01 1.1 Updated Typical I/V curve, Figure 2: added voltage levels. 09/04/01 1.2 Updated AC Electrical: added T
INIT
spec.; Internal Timing Parameters; added -12 industrial
temperature.
01/08/02 1.3 Updated T
INIT
spec and T
CONFIG
spec. Added single p-term setup time (T
SU1
) to AC Table,
renamed T
SU
to T
SU2
for setup time through the OR array. Updat ed THI spec to correct a typo. Updated AC Load Circuit diagram to more closely resemble true test conditions, added note for T
POD
delay measurement.
XCR3512XL -10 PQ 208 C
Example:
Temperature Range Number of Pins Package Type
Device Type Speed Grade
Device Ordering Options
Speed Package Temperature
-12 12 ns pin-to-pin dela y PQ208 208-pin Plastic Quad Fla t Package C = Commercial T
A
= 0°C to +70°C
V
CC
= 3.0V to 3.6V
-10 10 ns pin-to-pin delay FT256 256-ball Fineline BGA Package I = Industrial T
A
= –40°C to +85°C
V
CC
= 2.7V to 3.6V
-7 7.5 ns pin-to-pin delay FG324 324-ball Finelin e BGA P ackage
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