Datasheet XCR3384XL-10FG324I, XCR3384XL-10FG324C, XCR3384XL-12FT256I, XCR3384XL-12FT256C, XCR3384XL-12FG324I Datasheet (XILINX)

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DS024 (v1.4) January 8, 2002 www.xilinx.com 1 Advance Product Specification 1-800-255-7778
© 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
Features
Lowest power 384 macrocell CPLD
7.5 ns pin-to-pin logic delays
System frequencies up to 127 MHz
Available in small footprint packages
- 144-pin TQFP (118 user I/O)
- 208-pin PQFP (172 user I/O)
- 256-ball FBGA (212 user I/O)
- 324-ball FBGA (220 user I/O)
Optimized for 3.3V systems
- Ultra low power operation
- 5V tolerant I/O pins with 3.3V core supply
- Advanced 0.35 micron five layer metal EEPROM process
- Fast Zero Power™ (FZP) CMOS design technology
Advanced syste m features
- In-system programming
- Input registers
- Predictable timing model
- Up to 23 clocks available per function block
- Excellent pin retention during design changes
- Full IEEE Standard 1149.1 boundary-scan (JTAG)
- Four global clocks
- Eight product term control term s per function block
Fast ISP programming times
Port Enable pin for additional I/O
2.7V to 3.6V supply voltage at industrial grade voltage range
Programmable slew rate control per output
Security bit prevents unauthorized access
Refer to XPLA3 family data sheet (DS012
) for
architecture description
Description
The XCR3384XL is a 3.3V, 384 macrocell CPLD targeted at power sensitive designs that require leading edge program­mable logic solutions. A total of 24 function blocks provide 9,000 usable gates. Pin-to-pin propagation delays are
7.5 ns with a maximum system frequency of 127 MHz.
TotalCMOS Design Technique for Fast Zero Power
Xilinx offers a TotalCMOS CPLD, both in process technol­ogy and design technique. Xilinx employs a cascade of CMOS gates to implement its sum of products instead of the traditional sense amp approach. This CMOS gate imple­mentation allows Xilinx to offer CPLDs that are both high performance and low power, breaking the paradigm that to have low power, you must have low performance. Refer to
Figure 1 and Table 1 showing t he I
CC
vs. Frequency of our XCR3384XL TotalCMOS CPLD (data taken with 24 resetable up/down, 16-bit counters at 3.3V, 25°C).
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XCR3384XL: 384 Macrocell CPLD
DS024 (v1.4) January 8, 2002
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Advance Product Specification
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Figure 1: XCR3384XL Typical ICC vs. Frequency at
V
CC
= 3.3V, 25°C
0
20
40
60
80
100
120
140
0 20 40 60 80 100 120 140 160
DS024_01_112700
Frequency (MHz)
Typical ICC (mA)
Table 1: Typical ICC vs. Frequency at VCC = 3.3V, 25°C
Frequency (MHz) 0 1 10 20 40 60 80 100 120 140
Typical I
CC
(mA) TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD
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DC Electrical Char acteristics Over Reco mmended Operating Conditions
(1)
Symbol Parameter Test Conditions Min. Max. Unit
V
OH
(2)
Output High voltage VCC = 3.0V to 3.6V, IOH = –8 mA 2.4 - V
V
CC
= 2.7V to 3.0V, IOH = –8 mA 2.0
(3)
-V
I
OH
= –500 µA 90% V
CC
-V
V
OL
Output Low voltage IOL = 8 mA - 0.4 V
I
IL
Input leakage current VIN = GND or V
CC
–10 10 µA
I
IH
I/O High-Z leakage current VIN = GND or V
CC
–10 10 µA
I
CCSB
Standby current VCC = 3.6V - 100 µA
I
CC
Dynamic current
(4,5)
f = 1 MHz - TBD mA f = 50 MHz - TBD mA
C
IN
Input pin capacitance
(6)
f = 1 MHz - 8 pF
C
CLK
Clock input capacitance
(6)
f = 1 MHz 5 12 pF
C
I/O
I/O pin capacitance
(6)
f = 1 MHz - 10 pF
Notes:
1. See XPLA3 family data sheet (
DS012) for recommended operating conditions
2. See Figure 2 for output drive characteristics of the XPLA3 family.
3. This parameter guaranteed by design and characterizati on, not by testing.
4. See T able 1, Figure 1 for typical values.
5. Thi s parameter measu red with a 16-bit, re setabl e up/down counter loaded into e very function b lock, wi th all outputs di sabled and unloaded. Inputs are tied to V
CC
or ground. This parameter guaranteed by design and characterization, not testing.
6. Typical values, not tested.
Figure 2: Typical I/V Curve for the XPLA3 Family
0
0
1
0
2
0
30
4
0
50
60
7
0
80
90
1
00
0.51.52.5.54.5
Volt
s
L
3.3V
)
H
3.3V
)
H
2.7V
)
A
DS012_10_04190
1
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DS024 (v1.4) January 8, 2002 www.xilinx.com 3 Advance Product Specification 1-800-255-7778
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AC Electrical Characteristics Over Recommended Operating Conditions
(1,2)
Symbol Parameter
-7 -10 -12 Unit Min. Max. Min. Max. Min. Max.
T
PD1
Propagation delay time (single p-term) - 7.0 - 9.0 - 10.8 ns
T
PD2
Propagation delay time (OR array)
(3)
- 7.5 - 10.0 - 12.0 ns
T
CO
Clock to output (global synchronous pin clock) - 4.5 - 5.8 - 6.9 ns
T
SUF
Setup time(fast input register) 2.5 - 3.0 - 3.0 - ns
T
SU1
(4)
Setup time (single p-term) 4.3 - 5.5 - 6.7 - ns
T
SU2
Setup time (OR array) 4.8 - 6.5 - 7.9 - ns
T
H
(4)
Hold time 0-0-0-ns
T
WLH
(4)
Global Clock pulse width (High or Low) 3.0 - 4.0 - 5.0 - ns
Tt
PLH
(4)
P-term clock pulse width 4.5 - 6.0 - 7.5 - ns
T
R
(4)
Inpu t r ise ti me - 20 - 20 - 20 ns
T
L
(4)
Input fall time - 20 - 20 - 20 ns
f
SYSTEM
(4)
Maximum system frequency - 127 - 102 - 83 MHz
T
CONFIG
(4)
Configuration time
(5)
- 120 - 120 - 120 µs
T
INIT
(4)
ISP initialization time - 120 - 120 - 120 µs
T
POE
(4)
P-term OE to output enabled - 9.0 - 11.0 - 13.0 ns
T
POD
(4)
P-term OE to output disabled
(6)
- 9.0 - 11.0 - 13.0 ns
T
PCO
(4)
P-term clock to output - 8.0 - 10. 3 - 12.4 ns
T
PAO
(4)
P-term set/reset to output valid - 9.0 - 11.0 - 13.0 ns
Notes:
1. Specifications mea sured with one output sw it ching.
2. See XPLA3 family data sheet (
DS012) for recommended operating conditions.
3. See Figure 4 for derating.
4. These parameters gua ranteed by design and/or characteriz ati on, not testing.
5. Typical current draw during configuration is 10 mA at 3.6V.
6. O utput C
L
= 5 pF.
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Internal Timing Parameters
(1,2)
Symbol Parameter
-7 -10 -12 UnitMin. Max. Min. Max. Min. Max.
Buffer Delays
T
IN
Input buffer delay - 2.5 - 3.3 - 4.0 ns
T
FIN
Fast input buffer delay - 2.7 - 3.3 - 3.3 ns
T
GCK
Global clock buffer delay - 1.0 - 1.3 - 1 .5 ns
T
OUT
Output buffer delay - 2.5 - 3.3 - 3.8 ns
T
EN
Output buffer enable/disable delay - 4.5 - 5.2 - 6 .0 ns
Internal Register and Combinatorial Delays
T
LDI
Latch transparent delay - 1.3 - 1.6 - 2.0 ns
T
SUI
Register setup time 0.8 - 1.0 - 1.2 - ns
T
HI
Register hold time 0.3 - 0.5 - 0.7 - ns
T
ECSU
Register clock enable setup time 2.0 - 2.5 - 3.0 - ns
T
ECHO
Register clock enable hold time 3.0 - 4.5 - 5.5 - ns
T
COI
Register clock to output delay - 1.0 - 1.3 - 1.6 ns
T
AOI
Register async. S/R to output delay - 2.0 - 2.0 - 2.2 ns
T
RAI
Register async. recovery - 5.0 - 7.0 - 8.0 ns
T
LOGI1
Internal logic delay (single p-term) - 2. 0 - 2.5 - 3.0 ns
T
LOGI2
Internal logic delay (PLA OR term) - 2. 5 - 3.5 - 4.2 ns
Feedback Delays
T
F
ZIA delay - 3.6 - 4.0 - 5.0 ns
Time Adders
T
LOGI3
Fold-back NAND delay - 2.0 - 2.5 - 3.0 ns
T
UDA
Universal delay - 2.2 - 2.8 - 3.5 ns
T
SLEW
Slew rate limited delay - 4.0 - 5.0 - 6.0 ns
Notes:
1. These parameters gua ranteed by design and/or characteriz ati on, not testing.
2. See XPLA3 family data sheet (
DS012) for timing model .
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Switching Characteristics
Figure 3: AC Load Circuit
DS023_03_102401
Component Values
R1 390 R2 390 C1 35 pF
Measurement S1 S2
T
POE
(High)
T
POE
(Low)
T
P
Open Closed
Closed Open
Closed
Closed
V
CC
V
OUT
V
IN
C1
R1
R2
S1
S2
Note: For T
POD
, C1 = 5 pF. Delay measured at
output level of V
OL
+ 300 mV, VOH – 300 mV.
Figure 4: Derating Curve for T
PD2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
7.0
7.1
7.2
7.3
7.4
7.5
124816
DS024_04_11800
Number of Adjacent Outputs Switching
(ns)
Figure 5: Voltage Waveform
90%
10%
1.5 ns 1.5 ns
DS017_05_042800
+3.0V
0V
Measurements:
All circuit delays are measured at the +1.5V level of inputs and outputs, unless otherwise specified.
T
R
T
L
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Pin Des cr ip t io ns
Table 2: XCR3384XL User I/O Pins
TQ144 P Q208 FT256 FG324
Total User I/O Pin s
118 172 212 220
Table 3: XCR3384XL I/O Pins
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
1194-E15G22 12--F13H20 13-13E16H21 14-15F14J19 1 5 93 16 F15 J21 16--- ­17--- ­18--- ­19--- ­110- - - ­111- - - ­112- - - ­1139217G12J22 1 14 - 18 G15 K19 1 15 - 19 G13 K21 1169120F16K22 21-12E14G21 2 2 96 11 D16 G19 2 3 97 10 F12 F22 2 4 98 9 C16 F21 25998E13F20 26--- ­27--- ­28--- ­29--- ­210- - - ­211- - - ­212- - - ­2 13 100 - D15 E22 2 141017D14E21 2151026B16F19 2 16 103 - C15 E20 3 1 - 21 G14 L19 3 2 - 22 G16 L20 3 3 - - H13 L21 3490- -M20
3 5 89 24 H12 M19 36--- ­37--- ­38--- ­39--- ­310- - - ­311- - - ­312- - - ­313-25H15M22 3148826H14N22 315-27H16N21 3168728J14N19 4 1 104 4 A16 D22 4 2 106 3 E12 C22 4 3 107 - - B21 4 4 110 - C14 B20 4 5 111 207 D13 C19 46--- ­47--- ­48--- ­49--- ­410- - - ­411- - - ­412- - - ­4 13 112 206 A15 B19 4 14 113 205 B15 A20 4 15 114 204 B14 C18 4 16 116 203 C13 B18 51-29J15P22 5286
(1)
30
(1)
J13
(1)
P20
(1)
53-31J16P19 54--L14R22 5 5 84 - K15 R21 56--- ­57--- ­58--- ­59--- ­510- - - ­511- - - ­512- - - ­513-33K14R20 5148334K16T22
Table 3: XC R3384X L I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
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5158235K13T21 5 16 81 36 L15 T20 6 1 67 62 R13 AA16 62-61M11Y16 63-60T14W16 64-59N12AB17 65-58R14AA17 66--- ­67--- ­68--- ­69--- ­610- - - ­611- - - ­612- - - ­6 13 - 57 P13 AB18 614-56T15AA18 61568-P14W17 61669-T16AA19 7 1 80 37 K12 T19 7 2 79 38 L16 U22 7 3 78 39 M15 U21 7 4 77 40 N15 U20 7 5 - - L13 V22 76--- ­77--- ­78--- ­79--- ­710- - - ­711- - - ­712- - - ­713- -M16U19 7 14 - 42 M14 V21 7157543N16V20 7 16 - 44 L12 W22 8 1 70 55 M12 Y18 8 2 71 51 R15 AA20 8 3 72 - N13 Y19 84---AA21 85-49P16Y20 86--- ­87--- ­88--- -
Table 3: XCR3384XL I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
89--- ­810- - - ­811- - - ­812- - - ­813-48N14Y21 814-47R16W20 815-46M13W21 8167445P15Y22 9 1 122 187 D9 C13 9 2 - 188 A9 D13 9 3 121
(1)
189
(1)
C10
(1)
B14 9 4 - 190 A10 C14 9 5 120 - D10 D14 96--- ­97--- ­98--- ­99--- ­910- - - ­911- - - ­912- - - ­913- -B11A15 9 14 - 192 C11 B15 9 15 - 193 B12 C15 9 16 - 194 E10 A16
10 1 - 178 B8 B11 10 2 - 177 D8 C11 10 3 131
(1)
176
(1)
A7
(1)
D11
(1)
10 4 132 175 C8 A10 10 5 - - - B10 10 6 - - - ­10 7 - - - ­10 8 - - - ­10 9 - - - ­10 10 - - - ­10 11 - - - ­10 12 - - ­10 13 - - C7 C10 10 14 - 173 B7 D10 10 15 133 172 D7 A9 10 16 134 171 A6 B9 11 1 - - A14 A19 11 2 - 202 E11 D17
Table 3: XC R3384X L I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
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11 3 - 201 A13 A18 11 4 - - D12 C17 11 5 117 199 B13 B17 11 6 - - - ­11 7 - - - ­11 8 - - - ­11 9 - - - ­11 10 - - - ­11 11 - - - ­11 12 - - - ­11 13 - 1 98 C12 A 17 11 14 - 1 97 A12 D16 11 15 118 196 D11 C16 11 16 119 195 A11 B 16 12 1 139 163 E6 D7 12 2 - 164 A4 C7 12 3 138 - C5 B7 12 4 137 - B5 A7 12 5 - 166 D6 C8 12 6 - - - ­12 7 - - - ­12 8 - - - ­12 9 - - - ­12 10 - - - ­12 11 - - - ­12 12 - - - ­12 13 136 167 A5 B8 12 14 - 168 C6 A8 12 15 - 169 B6 D9 12 16 - 170 E7 C9 13 1 61 70 N10 W13 13 2 - 69 P11 AB14 13 3 62 68 M10 AA14 13 4 63 67 R11 Y14 13 5 - 66 T12 W14 13 6 - - - ­13 7 - - - ­13 8 - - - ­13 9 - - - ­13 10 - - - ­13 11 - - - ­13 12 - - - -
Table 3: XCR3384XL I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
13 13 - 65 R12 AB15 13 14 65 64 N11 AA15 13 15 - - T13 Y15 13 16 66 - P12 AB16 14 1 - 91 R6 AA8 14 2 47 92 M 7 Y8 14 34693T5AB7 14 4 - - T6 AA7 14 5 - - R5 Y7 14 6 - - - ­14 7 - - - ­14 8 - - - ­14 9 - - - ­14 10 - - - ­14 11 - - - ­14 12 - - - ­14 13 45 95 N6 W7 14 14 44 96 T4 AB6 14 15 - 97 P5 AA6 14 16 43 98 R4 Y6 15 1 - - T11 Y13 15 2 - - - AA13 15 3 60 71 R10 A B13 15 4 - 73 P10 W12 15 5 56 76 T10 AA12 15 6 - - - ­15 7 - - - ­15 8 - - - ­15 9 - - - ­15 10 - - - ­15 11 - - - ­15 12 - - - ­15 13 55 77 N9 AB12 15 14 - 78 R9 Y11 15 15 - 79 P9 AA11 15 16 54 80 T9 W11 16 1 - 90 N7 AB8 16 24889T7W9 16 3 - 88 P6 Y9 16 4 49 8 7 R7 AA9 16 5 - 86 P7 AB9 16 6 - - - -
Table 3: XC R3384X L I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
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16 7 - - - ­16 8 - - - ­16 9 - - - ­16 10 - - - ­16 11 - - - ­16 12 - - - ­16 13 - - T8 W10 16 14 - - N8 Y10 16 15 - 84 R8 AA10 16 16 53 81 P8 AB11 17 1 - 147 E4 E2 17 2 - 148 D1 F3 17 3 6 149 F5 F4 17 4 5 150 C2 D1 17 5 4 151 D3 D2 17 6 - - - ­17 7 - - - ­17 8 - - - ­17 9 - - - ­17 10 - - - ­17 11 - - - ­17 12 - - - ­17 13 - - C1 E3 17 14 - - - C2 17 15 2 153 B1 B 2 17 16 1 154 B2 D3 18 1 7 146 D2 E1 18 2 8 145 E3 F2 18 3 9 144 E1 G4 18 4 10 - F4 G3 18 5 - - F1 G2 18 6 - - - ­18 7 - - - ­18 8 - - - ­18 9 - - - ­18 10 - - - ­18 11 - - - ­18 12 - - - ­18 13 - 142 G5 H3 18 14 - 141 E2 H2 18 15 11 140 F3 H1 18 16 12 139 F2 J4
Table 3: XCR3384XL I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
19 1 - 155 C3 C4 19 2 143 156 D4 B4 19 3 - - A2 C5 19 4 142 - A1 B5 19 5 141 158 B3 A4 19 6 - - - ­19 7 - - - ­19 8 - - - ­19 9 - - - ­19 10 - - - ­19 11 - - - ­19 12 - - - ­19 13 - 159 C4 D6 19 14 - 160 A3 A5 19 15 140 161 D5 C6 19 16 - 162 B4 B6 20 1 14 138 G4 J3 20 2 - 137 G1 J2 20 3 - 136 G3 K4 20 4 15 135 H1 K3 20 5 - - H4 K2 20 6 - - - ­20 7 - - - ­20 8 - - - ­20 9 - - - ­20 10 - - - ­20 11 - - - ­20 12 - - - ­20 13 - - G2 K1 20 14 16 133 H3 L4 20 15 - 132 J1 L3 20 16 18 131 J3 L2 21 1 - 99 M6 AB5 21 2 - 100 T3 W6 21 3 42 101 N5 AB 4 21 4 41 102 R3 AA 5 21 5 - 103 P4 Y5 21 6 - - - ­21 7 - - - ­21 8 - - - ­21 9 - - - ­21 10 - - - -
Table 3: XC R3384X L I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
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21 11 - - - ­21 12 - - - ­21 13 40 104 T2 AA4 21 14 39 - - AB3 21 15 38 - R2 Y4 21 16 37 106 N4 AA3 22 1 19 - H2 M2 22 2 - 130 J5 M3 22 3 20 129 J2 M4 22 4 21 128 J4 N1 22 5 22
(1)
127
(1)
K1
(1)
N2
(1)
22 6 - - - ­22 7 - - - ­22 8 - - - ­22 9 - - - ­22 10 - - - ­22 11 - - - ­22 12 - - - ­22 13 23 126 K3 N3 22 14 - - - N4 22 15 - 1 24 K2 P1 22 16 25 123 L1 P2 23 1 36 108 M5 AA2 23 2 - 109 P2 Y3 23 3 - 110 P3 Y2 23 4 - 111 T1 W3 23 5 - - N3 W2 23 6 - - - ­23 7 - - - ­23 8 - - - ­23 9 - - - ­23 10 - - - ­23 11 - - - ­23 12 - - - ­23 13 - - R1 W1 23 14 35 112 M4 V3 23 15 - 113 P1 U4 23 16 - 1 14 L5 V2 24 1 26 122 K4 P3 24 2 27 121 L3 P4 24 3 28 120 K5 R1 24 4 29 119 M1 R2
Table 3: XCR3384XL I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
24 5 30 - L2 R3 24 6 - - - ­24 7 - - - ­24 8 - - - ­24 9 - - - ­24 10 - - - ­24 11 - - - ­24 12 - - - ­24 13 31 118 M2 T 2 24 14 32 117 L4 T3 24 15 - - M3 U2 24 16 34 115 N2 U3
Notes:
1. JTAG pins.
Table 3: XC R3384X L I/O Pins (Continued)
Function
Block
Macro-
cell TQ144 PQ208 FT256 FG324
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Table 4: XCR3384XL Global, JT AG, Port Enable, Power, and No Connect Pins
Pin Type TQ144 PQ208 FT256 FG324
IN0 / CLK0 128 181 B9 C12 IN1 / CLK1
127 182 A8 B12
IN2 / CLK2
126 183 C9 D12
IN3 / CLK3
125 184 B10 A12
TCK
86 30 J13 P20
TDI
131 176 A7 D11
TDO
121 189 C10 B14
TMS
22 127 K1 N2
PORT_EN
33 116
(1)
N1
(1)
T4
(1)
V
CC
24, 50, 51, 58, 73, 76, 95,
115, 123, 130, 144
5, 23, 41, 63, 74, 83, 85,
107, 125,143, 165, 179,
186, 191
E8, E9 , F 7 , F 8 , F9, F10,
G6, G11, H5, H6, H11,
J6, J11, J12, K6, K11, L7,
L8, L9, L10, M8, M9
A11, A13, D8, D15, H4, H19, J10, J11, J12, J13,
K9, K14, L9, L14, M1,
M9, M14, N9, N14, N20,
P10, P11, P12, P13, R4,
R19, W8, W15, Y12,
AB10
GND
3, 13, 17, 52, 57, 59, 64,
85, 105, 124, 129, 135,
14, 32, 50, 72, 75, 82, 94,
134, 152, 174, 180, 185,
200
E5, F6, F11, G7, G8, G9,
G10, H7, H8, H9, H10,
J7, J8, J9, J10, K7, K8,
K9, K10, L6, L11
D4, D5, D18, D19, E4,
E19, J9, J14, K10, K11,
K12, K13, L10, L11, L12,
L13, M10, M11, M12, M13, N10, N11, N12,
N13, P9, P14, V4, V19,
W4, W5, W18, W19
No
Connects
108, 109 1, 2, 52, 53, 54, 105, 157,
208
- A1, A2, A3, A6, A14, A21, A22, B1, B3, B13, B22,
C1, C3, C20, C21, D20, D21, F1, G1, G20, H22,
J1, J20, K20, L1, L22,
M21, P21, T1, U1, V1,
Y1, Y17, AA1, AA22,
AB1, AB2, AB19, AB20,
AB21, AB22
Notes:
1. Port Enable is brought High to enable JTAG pins when JTAG pins ar e used as I/O. See family data sheet (
DS012) for full
explanation.
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Ordering Information
Revision History
The following table shows the revision history for this document
Component Availability
Pins 144 208 256 324
Type Plastic TQFP Plastic PQFP Plastic FBGA Plastic FBGA
Code TQ144 PQ208 FT256 FG324
XCR3384XL
-7CCCC
-10 C, I C, I C, I C, I
-12 C, I C, I C, I C, I
Date Version Revision
02/08 /01 1.0 Initia l X ilin x re lea s e. 04/11/01 1.1 Update TSUF spec to meet UMC characterization data. Added Typical I/V curve, Figure 2;
added Table 2: T otal User I/O; changed V
OH
spec. Added 324-ball Fineline BGA pinouts and
package. 04/19/01 1.2 Upda ted Typical I/V curve, Figure 2: added voltage levels. 08/10/01 1.3 Updated AC Electrical Characterisitics; Internal Timing Parameters; added TQ144 package
and pinouts. 01/08/02 1.4 Updated T
SUF
spec to match software timing. Added single p-term setup time (T
SU1
) to AC
Table, renamed T
SU
to T
SU2
for setup time through the OR array. Updated T
INIT
spec and
T
CONFIG
spec. Updated THI spec to correct a typo. Updated AC Load Circuit diagram to
more closely resemble true test conditions, added note for T
POD
delay measurement.
Changed TQ144 pinout for pins 34 and 35.
XCR3384XL -7 PQ 208 C
Example:
Temperature Range Number of Pins Package Type
Device Type Speed Grade
Device Ordering Options
Speed Package Temperature
-12 12 ns pin-to-pin delay TQ144 144-pin Thin Quad Flat Package C = Commercial T
A
= 0°C to +70°C
V
CC
= 3.0V to 3.6V
-10 10 ns pin-to-pin del ay PQ208 208-pin Plastic Quad Flat Package I = Industrial T
A
= –40°C to +85°C
V
CC
= 2.7V to 3.6V
-7 7.5 ns pin-to-pin delay FT256 256-ball Fineline BGA Package
FG324 324-ball Fineline BGA Package
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