Datasheet X9400 Datasheet (intersil)

Page 1
®
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X9400
Low Noise/Low Power/SPI Bus
Data Sheet FN8189.3July 28, 2006
Quad Digitally Controlled Potentiometers (XDCP™)
FEATURES
• Four potentiometers per package
• SPI serial interface for write, read, and transfer operations of the potentiometer
• Wiper resistance, 40 typical at 5V.
• Four non-volatile data registers for each potentiometer
• Non-volatile storage of multiple wiper position
• Power-on recall. Loads saved wiper position on power-up.
• Standby current < 1µA max
•System V
•Analog V
•10kΩ, 2.5kΩ end to end resistance
• 100 yr. data retention
• Endurance: 100,000 data changes per bit per register
• Low power CMOS
• 24 Ld SOIC and 24 Ld TSSOP
• Pb-free plus anneal available (RoHS compliant)
: 2.7V to 5.5V operation
CC
+/V–
: -5V to +5V
DESCRIPTION
The X9400 integrates four digitally controlled potentiometers (XDCPs) on a monolithic CMOS integrated circuit.
The digitally controlled potentiometer is implemented using 63 resistive elements in a series array. Between each element are tap points connected to the wiper terminal through switches. The position of the wiper on the array is controlled by the user through the SPI serial bus interface. Each potentiometer has associated with it a volatile Wiper Counter Register (WCR) and four nonvolatile Data Registers (DR0-3) that can be directly written to and read by the user. The contents of the WCR controls the position of the wiper on the resistor array through the switches. Power-up recalls the contents of DR0 to the WCR.
The XDCP can be used as a three-terminal potentiometer or as a two-terminal variable resistor in a wide variety of applications including control, parameter adjustments, and signal processing.
BLOCK DIAGRAM
V
CC
V
SS
V+
V-
HOLD
CS
SCK
WP
SO
SI A0 A1
Interface
and
Control
Circuitry
Data
Pot 0
R0 R1
R2 R3
8
R0 R1
R2 R3
Wiper Counter Register
(WCR)
Wiper Counter
Register
(WCR)
Resistor
Array Pot 1
VH0/R
VL0/R
VW0/R
VW1/R
V
H1/RH1
VL1/R
L0
W0
W1
L1
H0
R0 R1
R2 R3
R0 R1
R2 R3
Wiper Counter Register
(WCR)
Wiper Counter Register
(WCR)
Resistor
Array Pot 2
Resistor
Array Pot 3
V
H2/RH2
VL2/R
VW2/R
VW3/R
V
H3/RH3
VL3/R
L2
W2
W3
L3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
XDCP is a trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2005-2006. All Rights Reserved
| Intersil (and design) is a registered trademark of Intersil Americas Inc.
All other trademarks mentioned are the property of their respective owners.
Page 2
Ordering Information
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X9400
POTENTIOMETER
PART
PART NUMBER
X9400WS24* X9400WS 5 ±10% 10 0 to +70 24 Ld SOIC (300 mil) M24.3 X9400WS24ZT1
(Note) X9400WS24I* X9400WS I -40 to +85 24 Ld SOIC (300 mil) M24.3 X9400WS24IZ*
(Note) X9400WV24* X9400WV 0 to +70 24 Ld TSSOP (4.4mm) MDP0044 X9400WV24I* X9400WV I -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9400WV24IZ*
(Note) X9400WV24Z*
(Note) X9400YS24* X9400YS 2.5 0 to +70 24 Ld SOIC (300 mil) M24.3 X9400YS24I* X9400YS I -40 to +85 24 Ld SOIC (300 mil) M24.3 X9400YV24* X9400YV 0 to +70 24 Ld TSSOP (4.4mm) MDP0044 X9400YV24I* X9400YV I -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9400YV24IZ*
(Note) X9400YV24Z*
(Note) X9400WS24-2.7* X9400WS F 2.7 to 5.5 10 0 to +70 24 Ld SOIC (300 mil) M24.3 X9400WS24I-2.7* X9400WS G -40 to +85 24 Ld SOIC (300 mil) M24.3 X9400WS24IZ-2.7*
(Note) X9400WV24-2.7* X9400WV F 0 to +70 24 Ld TSSOP (4.4mm) MDP0044 X9400WV24I-2.7* X9400WV G -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9400WV24IZ-2.7*
(Note) X9400WV24Z-2.7*
(Note) X9400YS24-2.7* X9400YS F 2.5 0 to +70 24 Ld SOIC (300 mil) M24.3 X9400YS24I-2.7* X9400YS G -40 to +85 24 Ld SOIC (300 mil) M24.3 X9400YV24-2.7* X9400YV F 0 to +70 24 Ld TSSOP (4.4mm) MDP0044 X9400YV24I-2.7* X9400YV G -40 to +85 24 Ld TSSOP (4.4mm) MDP0044 X9400YV24IZ-2.7*
(Note) X9400YV24Z-2.7*
(Note)
*Add "T1" suffix for tape and reel. NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
MARKING
X9400WS Z 0 to +70 24 Ld SOIC (300 mil) (Pb-free)
X9400WS ZI -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3
X9400WV ZI -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400WV Z 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400YV ZI -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400YV Z 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400WS ZG -40 to +85 24 Ld SOIC (300 mil) (Pb-free) M24.3
X9400WV ZG -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400WV ZF 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400YV ZG -40 to +85 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
X9400YV ZF 0 to +70 24 Ld TSSOP (4.4mm) (Pb-free) MDP0044
V
CC
LIMITS
(V)
ORGANIZATION
(kΩ)
TEMPERATURE
RANGE
(°C) PACKAGE PKG. DWG. #
M24.3
Tape and Reel
2
FN8189.3
July 28, 2006
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X9400
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PIN DESCRIPTIONS
Host Interface Pins
Serial Output (SO)
SO is a push/pull serial data output pin. During a read cycle, data is shifted out on this pin. Data is clocked out by the falling edge of the serial clock.
Serial Input
SI is the serial data input pin. All opcodes, byte addresses and data to be written to the pots and pot registers are input on this pin. Data is latched by the rising edge of the serial clock.
Serial Clock (SCK)
The SCK input is used to clock data into and out of the X9400.
Chip Select (CS
When CS
is HIGH, the X9400 is deselected and the
)
SO pin is at high impedance, and (unless an internal write cycle is underway) the device will be in the standby state. CS
LOW enables the X9400, placing it in the active power mode. It should be noted that after a power-up, a HIGH to LOW transition on CS
is
required prior to the start of any operation.
Hold (HOLD
HOLD
)
is used in conjunction with the CS pin to select the device. Once the part is selected and a serial sequence is underway, HOLD
may be used to pause the serial communication with the controller without resetting the serial sequence. To pause, HOLD
must
be brought LOW while SCK is LOW. To resume communication, HOLD
is brought HIGH, again while SCK is LOW. If the pause feature is not used, HOLD should be held HIGH at all times.
Device Address (A
0
- A1)
The address inputs are used to set the least significant 2 bits of the 8-bit slave address. A match in the slave address serial data stream must be made with the address input in order to initiate communication with the X9400. A maximum of 4 devices may occupy the SPI serial bus.
Potentiometer Pins
V
H/RH
V
L3/RL3
The V
(VH0/R
)
H/RH
- VH3/RH3), VL/RL (VL0/R
H0
L0
-
and VL/RL inputs are equivalent to the terminal connections on either end of a mechanical potentiometer.
V
W/RW
(VW0/R
- VW3/RW3)
W0
The wiper outputs are equivalent to the wiper output of a mechanical potentiometer.
Hardware Write Protect Input (WP
The WP
pin when LOW prevents nonvolatile writes to
)
the Data Registers.
Analog Supplies (V+, V-)
The analog Supplies V+, V- are the supply voltages for the XDCP analog section.
PIN CONFIGURATION
V
CC
VL0/R
L0
VH0/R
H0
VW0/R
W0
CS
WP
SI
A
1
VL1/R
L1
VH1/R
H1
VW1/R
W1
V
SS
10
1
2
3
4
5
6
7
8
9
11
12
SOIC
X9400
3
13
24
23
22
21
20
19
18
17
16
15
14
V+
V
L3/RL3
VH3/R
VW3/R
A
0
SO
HOLD
SCK
V
L2/RL2
VH2/R
VW2/R
V-
H3
H2
W3
W2
VL1/R
VH1/R
VW1/R
VW2/R
VH2/R
V
L2/RL2
HOLD
A
H1
W1
V
SS
W2
H2
SCK
L1
V-
TSSOP
13
24
23
22
21
20
19
18
17
16
15
14
WP
CS
VW0/R
V
H0/RH0
VL0/R
V
CC
V+
V
L3/RL3
VH3/R
VW3/R
A
0
SO
L0
H3
W0
W3
FN8189.3
July 28, 2006
SI
1
2
1
3
4
5
6
X9400
7
8
9
10
11
12
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X9400
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PIN NAMES
Symbol Description
SCK Serial Clock
SI, SO Serial Data
A
- A
0
1
V
H0/RH0
V
L0/RL0
V
W0/RW0
WP
V
CC
V
SS
NC No Connection
- VH3/RH3,
- VL3/R
L3
- VW1/R
Device Address
Potentiometer Pins (terminal equivalent)
Potentiometer Pins (wiper
W1
equivalent)
Hardware Write Protection
System Supply Voltage
System Ground
DEVICE DESCRIPTION
The X9400 is a highly integrated microcircuit incorporating four resistor arrays and their associated registers and counters and the serial interface logic providing direct communication between the host and the XDCP potentiometers.
Serial Interface
The X9400 supports the SPI interface hardware conventions. The device is accessed via the SI input with data clocked in on the rising SCK. CS LOW and the HOLD
and WP pins must be HIGH
must be
during the entire operation.
Wiper Counter Register (WCR)
The X9400 contains four Wiper Counter Registers, one for each XDCP potentiometer. The WCR is equivalent to a serial-in, parallel-out register/counter with its outputs decoded to select one of sixty-four switches along its resistor array. The contents of the WCR can be altered in four ways: it may be written directly by the host via the write Wiper Counter Register instruction (serial load); it may be written indirectly by transferring the contents of one of four associated data registers via the XFR Data Register or global XFR data register instructions (parallel load); it can be modified one step at a time by the increment/decrement instruction. Finally, it is loaded with the contents of its Data Register zero (DR0) upon power-up.
The Wiper Counter Register is a volatile register; that is, its contents are lost when the X9400 is powered­down. Although the register is automatically loaded with the value in DR0 upon power-up, this may be different from the value present at power-down.
Data Registers
Each potentiometer has four 6-bit nonvolatile Data Registers. These can be read or written directly by the host. Data can also be transferred between any of the four Data Registers and the associated Wiper Counter Register. All operations changing data in one of the data registers is a nonvolatile operation and will take a maximum of 10ms.
The SO and SI pins can be connected together, since they have three state outputs. This can help to reduce system pin count.
Array Description
The X9400 is comprised of four resistor arrays. Each array contains 63 discrete resistive segments that are connected in series. The physical ends of each array are equivalent to the fixed terminals of a mechanical potentiometer (V
and VL/RL inputs).
H/RH
At both ends of each array and between each resistor segment is a CMOS switch connected to the wiper (V
) output. Within each individual array only one
W/RW
switch may be turned on at a time.
These switches are controlled by a wiper counter register (WCR). The six bits of the WCR are decoded to select, and enable, one of sixty-four switches.
If the application does not require storage of multiple settings for the potentiometer, the Data Registers can be used as regular memory locations for system parameters or user preference data.
Data Register Detail
(MSB) (LSB)
D5 D4 D3 D2 D1 D0
NV NV NV NV NV NV
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Figure 1. Detailed Potentiometer Block Diagram
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(One of Four Arrays)
X9400
Serial Data Path
From Interface
Circuitry
Register 0 Register 1
Register 2 Register 3
If WCR = 00[H] then VW/RW = VL/R
If WCR = 3F[H] then VW/RW = VH/R
Serial Bus
Input
8 6
L
H
UP/DN
Modified SCL
Parallel Bus
Input
Wiper Counter Register
(WCR)
INC/DEC
Logic
UP/DN
CLK
C o
u n
t
e
r
D
e c
o d e
VH/R
VL/R
VW/R
H
L
W
Write in Process
The contents of the Data Registers are saved to nonvolatile memory when the CS pin goes from LOW to HIGH after a complete write sequence is received by the device. The progress of this internal write operation can be monitored by a write in process bit (WIP). The WIP bit is read with a read status command.
INSTRUCTIONS
Identification (ID) Byte
The first byte sent to the X9400 from the host, following a CS
going HIGH to LOW, is called the Identification byte. The most significant four bits of the slave address are a device type identifier, for the X9400 this is fixed as 0101[B] (refer to Figure 2).
The two least significant bits in the ID byte select one of four devices on the bus. The physical device address is defined by the state of the A
- A1 input
0
pins. The X9400 compares the serial data stream with the address input state; a successful compare of both address bits is required for the X9400 to successfully
continue the command sequence. The A
- A1 inputs
0
can be actively driven by CMOS input signals or tied to
or VSS.
V
CC
The remaining two bits in the slave byte must be set to 0.
Figure 2. Identification Byte Format
Device Type
Identifier
100
1
0 0 A1 A0
Device Address
Instruction Byte
The next byte sent to the X9400 contains the instruction and register pointer information. The four most significant bits are the instruction. The next four bits point to one of the four pots and, when applicable, they point to one of four associated registers. The format is shown below in Figure 3.
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Figure 3. Instruction Byte Format
Register
Select
I1I2I3 I0 R1 R0 P1 P0
Instructions
The four high order bits of the instruction byte specify the operation. The next two bits (R one of the four registers that is to be acted upon when a register oriented instruction is issued. The last two bits (P potentiometers is to be affected by the instruction.
Four of the ten instructions are two bytes in length and end with the transmission of the instruction byte. These instructions are:
– XFR Data Register to Wiper Counter Register
– XFR Wiper Counter Register to Data Register
– Global XFR Data Register to Wiper Counter Register
– Global XFR Wiper Counter Register to Data Register
The basic sequence of the two byte instructions is illustrated in Figure 4. These two-byte instructions exchange data between the WCR and one of the data registers. A transfer from a Data Register to a WCR is essentially a write to a static RAM, with the static RAM controlling the wiper position. The response of the wiper to this action will be delayed by t from the WCR (current wiper position), to a data register is a write to nonvolatile memory and takes a minimum of t between one of the four potentiometers and one of its associated registers; or it may occur globally, where the transfer occurs between all potentiometers and one associated register.
and P0) selects which one of the four
1
transfers the contents of one specified Data Register to the associated Wiper Counter Register.
This transfers the contents of the specified Wiper Counter Register to the specified associated Data Register.
—This transfers the contents of all specified Data Registers to the associated Wiper Counter Registers.
—This transfers the contents of all Wiper Counter Registers to the specified associated Data Registers.
to complete. The transfer can occur
WR
Pot Select
and R0) select
1
—This
. A transfer
WRL
Five instructions require a three-byte sequence to complete. These instructions transfer data between the host and the X9400; either between the host and one of the data registers or directly between the host and the Wiper Counter Register. These instructions are:
– Read Wiper Counter Register
wiper position of the selected pot,
– Write Wiper Counter Register
wiper position of the selected pot,
– Read Data Register
selected data register;
– Write Data Register
selected data register.
– Read Status
of the WIP bit which indicates if the internal write cycle is in progress.
The sequence of these operations is shown in Figure 5 and Figure 6.
The final command is Increment/Decrement. It is different from the other commands, because it’s length is indeterminate. Once the command is issued, the master can clock the selected wiper up and/or down in one resistor segment steps; thereby, providing a fine tuning capability to the host. For each SCK clock pulse
) while SI is HIGH, the selected wiper will move
(t
HIGH
one resistor segment towards the V Similarly, for each SCK clock pulse while SI is LOW, the selected wiper will move one resistor segment towards the V
L/RL
sequence and timing for this operation are shown in Figure 7 and Figure 8.
—This command returns the contents
terminal. A detailed illustration of the
—read the contents of the
—write a new value to the
—read the current
—change current
terminal.
H/RH
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Figure 4. Two-Byte Instruction Sequence
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CS
SCK
SI
010100A1A0 I3 I2 I1 I0 R1 R0 P1 P0
Figure 5. Three-Byte Instruction Sequence (Write)
CS
SCK
SI
X9400
0 1 0 1 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0
00
Figure 6. Three-Byte Instruction Sequence (Read)
CS
SCK
SI
0 1 0 1 A1 A0 I3 I2 I1 I0 R1 R0 P1 P0
S0
00
Figure 7. Increment/Decrement Instruction Sequence
CS
SCK
SI
0 0 D5 D4 D3 D2 D1 D0
Don’t Care
0 0 D5 D4 D3 D2 D1 D0
010100A1A0 I3 I2 I1 I0 0
0
P1
7
P0
I
I
N
N
C
C
1
2
D
I
E
N
C
C
1
n
D E C
n
FN8189.3
July 28, 2006
Page 8
Figure 8. Increment/Decrement Timing Limits
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SCK
SI
X9400
t
WRID
VW/R
W
INC/DEC CMD Issued
Voltage Out
Table 1. Instruction Set
Instruction Set
Instruction
3I2I1I0R1R0P1P0
OperationI
Read Wiper Counter Register 1 0 0 1 0 0 P1P0Read the contents of the Wiper Counter Register
pointed to by P
- P
1
0
Write Wiper Counter Register 1 0 1 0 0 0 P1P0Write new value to the Wiper Counter Register
pointed to by P
- P
1
0
Read Data Register 1 0 1 1 R1R0P1P0Read the contents of the Data Register pointed to
- P0 and R1 - R
by P
1
0
Write Data Register 1 1 0 0 R1R0P1P0Write new value to the Data Register pointed to by
- P0 and R1 - R
P
XFR Data Register to Wiper Counter Register
XFR Wiper Counter Register to Data Register
Global XFR Data Register to Wiper Counter Register
1
1101R1R0P1P0Transfer the contents of the Data Register pointed to
- R0 to the Wiper Counter Register pointed to by
by R
1
- P
P
1
0
1110R1R0P1P0Transfer the contents of the Wiper Counter
Register pointed to by P pointed to by R
0001R1R00 0 Transfer the contents of the Data Registers pointed
to by R
- R0 of all four pots to their respective Wiper
1
0
- P0 to the Register
1
- R
1
0
Counter Register
Global XFR Wiper Counter Register to Data Register
Increment/Decrement Wiper Counter Register
1000R
1R0
001000P
0 0 Transfer the contents of all Wiper Counter
Registers to their respective data Registers
- R0 of all four pots
1
- P
1
0
1P0
pointed to by R Enable Increment/decrement of the Wiper Counter
Register pointed to by P
Read Status (WIP bit) 0 1 0 1 0 0 0 1 Read the status of the internal write cycle, by
checking the WIP bit.
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X9400
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Instruction Format
Notes: (1) “A1 ~ A0”: stands for the device addresses sent by the master.
(2) WPx refers to wiper position data in the Counter Register (3) “I”: stands for the increment operation, SI held HIGH during active SCK phase (high). (4) “D”: stands for the decrement operation, SI held LOW during active SCK phase (high).
Read Wiper Counter Register (WCR)
device type
CS
Falling
Edge
identifier
010100
Write Wiper Counter Register (WCR)
device type
identifier
CS
Falling
Edge
010100
Read Data Register (DR)
device type
identifier
CS
Falling
Edge
010100
device
addresses
A1A
device
addresses
A1A
device
addresses
A1A
instruction
opcode
100100
0
instruction
opcode
101000
0
instruction
opcode
1011
0
WCR
addresses
P1P
WCR
addresses
P1P
DR and WCR
addresses
R1R0P1P
(sent by X9400 on SO)
00WP
0
00WP
0
(sent by X9400 on SO)
00WP
0
wiper position
W
W
W
W
P
P
P
P
5
4
3
2
1
Data Byte
(sent by Host on SI)
W
W
W
W
P
P
P
P
5
4
3
2
1
Data Byte
W
W
W
W
P
P
P
P
5
4
3
2
1
W
P 0
W
P 0
W
P 0
CS
Rising
Edge
CS
Rising
Edge
CS
Rising
Edge
Write Data Register (DR)
CS
Falling
Edge
device type
identifier
010100
device
addresses
A1A
instruction
opcode
1100
0
DR and WCR
addresses
R1R0P1P
(sent by host on SI)
00WP
0
Transfer Data Register (DR) to Wiper Counter Register (WCR)
CS
Falling
Edge
device type
identifier
010100
device
addresses
A1A
instruction
opcode
1101
0
DR and WCR
addresses
R1R0P1P
CS
Rising
Edge
0
Transfer Wiper Counter Register (WCR) to Data Register (DR)
CS
Falling
Edge
device type
identifier
010100
device
addresses
A1A
instruction
opcode
1110
0
DR and WCR
addresses
R1R0P1P
CS
Rising
Edge
0
Data Byte
W
W
P
P
5
4
3
HIGH-VOLTAGE
WRITE CYCLE
W P
CS
Rising
W
W
Edge
P
P
2
1
0
HIGH-VOLTAGE
WRITE CYCLE
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Increment/Decrement Wiper Counter Register (WCR)
device type
CS
Falling
Edge
identifier
010100
Global Transfer Data Register (DR) to Wiper Counter Register (WCR)
device type
CS
Falling
Edge
identifier
010100
Global Transfer Wiper Counter Register (WCR) to Data Register (DR)
device type
CS
Falling
Edge
identifier
010100
Read Status
device type
CS
Falling
Edge
identifier
010100
device
addresses
A1A
device
addresses
A1A
device
addresses
A1A
device
addresses
A1A
instruction
opcode
0010XX
0
instruction
opcode
0001
0
instruction
opcodeDRaddresses
1000
0
instruction
opcode
010100010000000WI
0
WCR
addresses
DR
addresses
R1R
0
R1R
00
0
wiper
addresses
increment/decrement
(sent by master on SDA)
P1P0I/DI/
Rising
00
CS
Rising
Edge
(sent by X9400 on SO)
....
D
CS
Edge
HIGH-VOLTAGE
WRITE CYCLE
Data Byte
I/DI/
P
Rising
D
CS
Rising
Edge
CS
Edge
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www.BDTIC.com/Intersil
ABSOLUTE MAXIMUM RATINGS
Temperature under bias .................... -65°C to +135°C
Storage temperature ......................... -65°C to +150°C
Voltage on SCK, SCL or any address
input with respect to V Voltage on V+ (referenced to V Voltage on V- (referenced to V
......................... -1V to +7V
SS
)........................ 10V
SS
)........................-10V
SS
(V+) - (V-) .............................................................. 12V
Any V Any V
.................................................................... V+
H
...................................................................... V-
L
COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only; functional operation of the device (at these or any other conditions above those listed in the operational sections of this specification) is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Lead temperature (soldering, 10 seconds)........ 300°C
(10 seconds)................................................ ±12mA
I
W
RECOMMENDED OPERATING CONDITIONS
Temp Min. Max.
Commercial 0°C+70°C
Industrial -40°C+85°C
Device Supply Voltage (VCC) Limits
X9400 5V ± 10%
X9400-2.7 2.7V to 5.5V
ANALOG CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.)
Limits
Symbol Parameter
R
TOTAL
I
W
R
W
Vv+ Voltage on V+ Pin X9400 +4.5 +5.5 V
Vv- Voltage on V- Pin X9400 -5.5 -4.5 V
V
TERM
C
H/CL/CW
I
AL
End to end resistance ±20 %
Power rating 50 mW 25°C, each pot
Wiper current ±6 mA
Wiper resistance 150 250 Wiper Current = ± 1mA,
40 100 Wiper Current = ± 1mA,
X9400-2.7 +2.7 +5.5
X9400-2.7 -5.5 -2.7
Voltage on any VH/RH or VL/RL Pin V- V+ V
Noise -120 dBV Ref: 1kHz
Resolution 1.6 %
Absolute linearity
Relative linearity
Temperature coefficient of R
Ratiometric temp. coefficient ±20 ppm/°C
Potentiometer capacitances 10/10/25 pF See Spice Macromodel
RH, RL, RW leakage current 0.1 10 µA VIN = VSS to VCC. Device is in
(1)
(2)
TOTAL
-1 +1 MI
-0.2 +0.2 MI
±300 ppm/°C
(3)
(3)
Test ConditionsMin. Typ. Max. Unit
=3V
V
CC
=5V
V
CC
R
w(n)(actual)
R
w(n + 1)
stand-by mode.
- [R
- R
w(n)(expected)
w(n) + MI
]
Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when
used as a potentiometer.
(2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a
potentiometer. It is a measure of the error in step size.
(3) MI = RTOT/63 or (R
- RL)/63, single pot
H
11
FN8189.3
July 28, 2006
Page 12
X9400
www.BDTIC.com/Intersil
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Limits
Symbol Parameter
I
CC1
I
CC2
I
SB
I
I
LO
V
V
V
LI
IH
IL
OL
VCC supply current (Active) 400 µA f
VCC supply current (Nonvolatile Write)
VCC current (standby) 1 µA SCK = SI = VSS, Addr. = V
Input leakage current 10 µA VIN = VSS to V
Output leakage current 10 µA V
Input HIGH voltage VCC x 0.7 VCC + 0.5 V
Input LOW voltage -0.5 VCC x 0.1 V
Output LOW voltage 0.4 V IOL = 3mA
ENDURANCE AND DATA RETENTION
Parameter Min. Unit
Minimum endurance 100,000 Data changes per bit per register
Data retention 100 years
SCK
Other Inputs = V
1mAf
SCK
Other Inputs = V
Test ConditionsMin. Typ. Max. Units
= 2MHz, SO = Open,
SS
= 2MHz, SO = Open,
SS
CC
= VSS to V
OUT
CC
SS
CAPACITANCE
Symbol Test Max. Unit Test Conditions
(4)
C
OUT
C
IN
(4)
Output capacitance (SO) 8 pF V
Input capacitance (A0, A1, SI, and SCK) 6 pF VIN = 0V
OUT
= 0V
POWER-UP TIMING
Symbol Parameter Min. Max. Unit
(5)
t
PUR
(5)
t
PUW
(4)
t
R VCC
POWER-UP REQUIREMENTS (Power-up sequencing
Power-up to initiation of read operation 1 ms
Power-up to initiation of write operation 5 ms
VCC Power-up ramp 0.2 50 V/msec
EQUIVALENT A.C. LOAD CIRCUIT
can affect correct recall of the wiper registers)
The preferred power-on sequence is as follows: First
, then the potentiometer pins, RH, RL, and RW.
V
CC
Voltage should not be applied to the potentiometer pins before V+ or V- is applied. The V
ramp rate
CC
specifi-cation should be met, and any glitches or slope changes in the V possible. If V
CC
line should be held to <100mV if
CC
powers down, it should be held below
SDA Output
5V
1533
100pF
0.1V for more than 1 second before powering up again in order for proper wiper register recall. Also, V
CC
should not reverse polarity by more than 0.5V. Recall of wiper position will not be complete until V
CC
, V+
and V-reach their final value.
12
FN8189.3
July 28, 2006
Page 13
X9400
www.BDTIC.com/Intersil
A.C. TEST CONDITIONS
nput pulse levels VCC x 0.1 to VCC x 0.9
I
Input rise and fall times 10ns
Input and output timing level V
Notes: (4) This parameter is periodically sampled and not 100% tested
(5) t
and t
PUR
third (last) power supply (V specific instruction can be issued. These parameters are periodically sampled and not 100% tested.
are the delays required from the time the
PUW
x 0.5
CC
, V+ or V-) is stable until the
CC
SPICE Macro Model
R
R
H
10pF
TOTAL
C
H
C
W
25pF
R
W
C
L
10pF
R
L
SYMBOL TABLE
WAVEFORM INPUTS OUTPUTS
Must be steady
May change from Low to High
May change from High to Low
Don’t Care: Changes Allowed
N/A Center Line
Will be steady
Will change from Low to High
Will change from High to Low
Changing: State Not Known
is High Impedance
AC TIMING
Symbol Parameter Min. Max. Unit
f
SCK
t
CYC
t
WH
t
WL
t
LEAD
t
LAG
t
SU
t
H
t
RI
t
FI
t
DIS
t
V
t
HO
t
RO
t
FO
t
HOLD
t
HSU
t
HH
t
HZ
t
LZ
T
I
t
CS
t
WPASU
t
WPAH
SSI/SPI clock frequency 2.0 MHz
SSI/SPI clock cycle time 500 ns
SSI/SPI clock high time 200 ns
SSI/SPI clock low time 200 ns
Lead time 250 ns
Lag time 250 ns
SI, SCK, HOLD and CS input setup time 50 ns
SI, SCK, HOLD and CS input hold time 50 ns
SI, SCK, HOLD and CS input rise time 2 µs
SI, SCK, HOLD and CS input fall time 2 µs
SO output disable time 0 500 ns
SO output valid time 100 ns
SO output hold time 0 ns
SO output rise time 50 ns
SO output fall time 50 ns
HOLD time 400 ns
HOLD setup time 100 ns
HOLD hold time 100 ns
HOLD low to output in High Z 100 ns
HOLD high to output in Low Z 100 ns
Noise suppression time constant at SI, SCK, HOLD and CS inputs 20 ns
CS deselect time 2 µs
WP, A0 and A1 setup time 0 ns
WP, A0 and A1 hold time 0 ns
13
FN8189.3
July 28, 2006
Page 14
X9400
www.BDTIC.com/Intersil
HIGH-VOLTAGE WRITE CYCLE TIMING
Symbol Parameter Typ. Max. Unit
t
WR
XDCP TIMING
Symbol Parameter Min. Max. Unit
t
WRPO
t
WRL
t
WRID
TIMING DIAGRAMS
Input Timing
CS
High-voltage write cycle time (store instructions) 5 10 ms
Wiper response time after the third (last) power supply is stable 10 µs
Wiper response time after instruction issued (all load instructions) 10 µs
Wiper response time from an active SCL/SCK edge (increment/decrement instruction) 450 ns
t
CS
t
LEAD
t
CYC
t
LAG
SCK
SI
SO
Output Timing
CS
SCK
SO
SI
t
SU
MSB LSB
High Impedance
ADDR
t
H
t
WL
t
WH
...
t
FI
t
RI
...
...
t
V
MSB LSB
t
HO
...
t
DIS
14
FN8189.3
July 28, 2006
Page 15
Hold Timing
www.BDTIC.com/Intersil
CS
SCK
t
RO
SO
SI
HOLD
XDCP Timing (for All Load Instructions)
CS
t
HSU
t
FO
t
HOLD
X9400
t
HH
...
t
HZ
t
LZ
SCK
MSB LSB
VW/R
SI
W
SO
High Impedance
XDCP Timing (for Increment/Decrement Instruction)
CS
SCK
V
W/RW
ADDR
SI
Inc/Dec
Inc/Dec
...
t
WRID
...
...
...
...
t
WRL
High Impedance
SO
15
FN8189.3
July 28, 2006
Page 16
Write Protect and Device Address Pins Timing
www.BDTIC.com/Intersil
X9400
CS
t
WP
A0
A1
WPASU
APPLICATIONS INFORMATION
Basic Configurations of Electronic Potentiometers
V
R
VW/R
W
Three terminal Potentiometer; Variable voltage divider
Application Circuits
Noninverting Amplifier Voltage Regulator
(Any Instruction)
t
WPAH
+V
R
I
Two terminal Variable Resistor; Variable current
V
S
VO = (1+R2/R1)V
Offset Voltage Adjustment Comparator with Hysteresis
V
S
10k
R
R
1
100k
-12V+12V
+
R
1
S
+
TL072
10k10k
V
O
2
R
2
V
O
IN
VO (REG) = 1.25V (1+R2/R1)+I
V
S
VUL = {R1/(R1+R2)} VO(max) V
= {R1/(R1+R2)} VO(min)
LL
317
I
adj
R
2
+
}
}
R
R
2
1
R
1
adj R2
VO (REG)V
V
O
16
FN8189.3
July 28, 2006
Page 17
Application Circuits (continued)
www.BDTIC.com/Intersil
Attenuator Filter
R
1
V
S
V
R
3
R
VO = G V
-1/2 G +1/2
Inverting Amplifier Equivalent L-R Circuit
R
R
1
S
}
4
All RS = 10k
S
2
}
+
+
X9400
C
V
R
2
V
O
V
O
S
R
G
O
fc = 1/(2πRC)
C
1
V
S
R
= 1 + R2/R
+
R
1
1
R
2
+
V
O
2
VO = G V G = - R2/R
R
Z
S
1
Function Generator
R
+
R
}
A
R
}
B
frequency R1, R2, C amplitude R
2
, R
A
IN
ZIN = R2 + s R2 (R1 + R3) C1 = R2 + s Leq (R
R
1
B
1
+
1
R
3
+ R3) >> R
C
2
17
FN8189.3
July 28, 2006
Page 18
Small Outline Plastic Packages (SOIC)
www.BDTIC.com/Intersil
X9400
N
INDEX AREA
123
-A-
E
-B-
SEATING PLANE
D
A
-C-
0.25(0.010) BM M
H
L
h x 45°
α
e
B
0.25(0.010) C AM BS
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter­lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
M
A1
C
0.10(0.004)
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 ­D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC ­H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6 N24 247
α
-
NOTESMIN MAX MIN MAX
Rev. 1 4/06
18
FN8189.3
July 28, 2006
Page 19
X9400
www.BDTIC.com/Intersil
Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING PLANE
N LEADS
0.25 CAB
M
E
E1
B
0.10 C
N
1
TOP VIEW
e
b
SEE DETAIL “X”
(N/2)+1
SIDE VIEW
(N/2)
0.10 CABM
AD
PIN #1 I.D.
0.20 C2XB A
N/2 LEAD TIPS
0.05
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
A 1.20 1.20 1.20 1.20 1.20 Max
A1 0.10 0.10 0.10 0.10 0.10 ±0.05
A2 0.90 0.90 0.90 0.90 0.90 ±0.05
b 0.25 0.25 0.25 0.25 0.25 +0.05/-0.06
c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06
D 5.00 5.00 6.50 7.80 9.70 ±0.10
E 6.40 6.40 6.40 6.40 6.40 Basic
E1 4.40 4.40 4.40 4.40 4.40 ±0.10
e 0.65 0.65 0.65 0.65 0.65 Basic
H
L 0.60 0.60 0.60 0.60 0.60 ±0.15
L1 1.00 1.00 1.00 1.00 1.00 Reference
Rev. E 12/02
NOTES:
1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm per side.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
c
A2
A
A1
END VIEW
DETAIL X
L1
GAUGE PLANE
0.25
L
0° - 8°
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implic atio n or other wise u nde r any p a tent or patent rights of Intersil or i t s sub sidi aries.
For information regarding Intersil Corporation and its products, see www.intersil.com
19
FN8189.3
July 28, 2006
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