Datasheet X24C01MM-3, X24C01MM-2,7, X24C01MM, X24C01MI-3,5, X24C01MI-3 Datasheet (XICOR)

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Page 1
X24C01
1
Serial E2PROM
© Xicor, 1991 Patents Pending Characteristics subject to change without notice
Preliminary Information
DESCRIPTION
The X24C01 is a CMOS 1024 bit serial E2PROM, internally organized as 128 x 8. The X24C01 features a serial interface and software protocol allowing operation on a simple two wire bus.
Xicor E2PROMs are designed and tested for applica­tions requiring extended endurance. Inherent data re­tention is greater than 100 years.
FEATURES
2.7V to 5.5V Power Supply
Low Power CMOS
—Active Current Less Than 1 mA —Standby Current Less Than 50 µA
Internally Organized 128 x 8
2 Wire Serial Interface
—Bidirectional Data Transfer Protocol
Four Byte Page Write Mode
Self Timed Write Cycle
—Typical Write Cycle Time of 5 ms
High Reliability
—Endurance: 100,000 Cycles —Data Retention: 100 Years
8-Pin Mini-DIP, 8-PIN MSOP, and 8-PIN SOIC
Packages
1K X24C01 128 x 8 Bit
3837 FHD F01
FUNCTIONAL DIAGRAM
START
STOP
LOGIC
CONTROL
LOGIC
H.V. GENERATION
TIMING
& CONTROL
WORD ADDRESS COUNTER
XDEC
YDEC
D
OUT
ACK
E
2
PROM
32 X 32
DATA REGISTER
START CYCLE
(8) V
CC
R/W
PIN
(4) V
SS
(5) SDA
(6) SCL
D
OUT
LOAD INC
CK
8
3837-1.2 7/28/97 T1/C0/D0 SH
Page 2
2
X24C01
NC NC NC
V
SS
1 2 3 4
8 7 6 5
V
CC
NC SCL SDA
X24C01
PLASTIC
PIN CONFIGURATIONPIN DESCRIPTIONS
Serial Clock (SCL)
The SCL input is used to clock all data into and out of the device.
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and out of the device. It is an open drain output and may be wire-ORed with any number of open drain or open collector outputs.
An open drain output requires the use of a pull-up resistor. For selecting typical values, refer to the Guide­lines for Calculating Typical Values of Bus Pull-Up Resistors graph.
PIN NAMES
Symbol Description
NC No Connect V
SS
Ground
V
CC
Supply Voltage SDA Serial Data SCL Serial Clock
3837 PGM T01
A.C. CONDITIONS OF TEST
Input Pulse Levels VCC x 0.1 to VCC x 0.9 Input Rise and
Fall Times 10 ns Input and Output
Timing Levels VCC x 0.5
3837 PGM T02
3837 FHD F02
3837 FHD F03
EQUIVALENT A.C. LOAD CIRCUIT
3837 FHD F16
2190
100pF
OUTPUT
5V
DIP
NC NC NC
V
SS
1 2 3 4
8 7 6 5
V
CC
NC SCL SDA
X24C01
SOIC/MSOP
Page 3
X24C01
3
DEVICE OPERATION
The X24C01 supports a bidirectional bus oriented pro­tocol. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master will always initiate data transfers and provide the clock for both transmit and receive operations. There­fore, the X24C01 will be considered a slave in all applications.
Clock and Data Conventions
Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are re­served for indicating start and stop conditions. Refer to Figures 1 and 2.
Start Condition
All commands are preceded by the start condition, which is a HIGH to LOW transition of SDA when SCL is HIGH. The X24C01 continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met.
Figure 1. Data Validity
SCL
SDA
DATA STABLE DATA
CHANGE
3837 FHD F06
Page 4
4
X24C01
Stop Condition
All communications must be terminated by a stop con­dition, which is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition is also used by the X24C01 to place the device in the standby power mode after a read sequence. A stop condition can only be issued after the transmitting device has released the bus.
Acknowledge
Acknowledge is a software convention used to indicate successful data transfers. The transmitting device will release the bus after transmitting eight bits. During the ninth clock cycle the receiver will pull the SDA line LOW to acknowledge that it received the eight bits of data. Refer to Figure 3.
The X24C01 will respond with an acknowledge after recognition of a start condition, a seven bit word address and a R/W bit. If a write operation has been selected, the X24C01 will respond with an acknowledge after each byte of data is received.
In the read mode the X24C01 will transmit eight bits of data, release the SDA line and monitor the line for an acknowledge. If an acknowledge is detected and no stop condition is generated by the master, the X24C01 will continue to transmit data. If an acknowledge is not detected, the X24C01 will terminate further data trans­missions. The master must then issue a stop condition to return the X24C01 to the standby power mode and place the device into a known state.
Figure 2. Definition of Start and Stop
3837 FHD F07
Figure 3. Acknowledge Response From Receiver
SCL FROM
MASTER
DATA
OUTPUT
FROM
TRANSMITTER
1
89
DATA
OUTPUT
FROM
RECEIVER
START
ACKNOWLEDGE
3837 FHD F08
SCL
SDA
START CONDITION STOP CONDITION
Page 5
X24C01
5
WRITE OPERATIONS Byte Write
To initiate a write operation, the master sends a start condition followed by a seven bit word address and a write bit. The X24C01 responds with an acknowledge, then waits for eight bits of data and then responds with an acknowledge. The master then terminates the transfer by generating a stop condition, at which time the X24C01 begins the internal write cycle to the nonvolatile memory. While the internal write cycle is in progress, the X24C01 inputs are disabled, and the device will not respond to any requests from the master. Refer to Figure 4 for the address, acknowledge and data transfer sequence.
Page Write
The most significant five bits of the word address define
the page address. The X24C01 is capable of a four byte page write operation. It is initiated in the same manner as the byte write operation, but instead of terminating the transfer of data after the first data byte, the master can transmit up to three more bytes. After the receipt of each data byte, the X24C01 will respond with an acknowledge.
After the receipt of each data byte, the two low order address bits are internally incremented by one. The high order five bits of the address remain constant. If the master should transmit more than four data bytes prior to generating the stop condition, the address counter will “roll over” and the previously transmitted data will be overwritten. As with the byte write operation, all inputs are disabled until completion of the internal write cycle. Refer to Figure 5 for the address, acknowledge and data transfer sequence.
Figure 4. Byte Write
BUS ACTIVITY:
SDA LINE
BUS ACTIVITY: X24C01
S T A R T
WORD
ADDRESS (n)
S
T O P
P
A C K
DATA n
R
/
W
L S B
S
M S B
A C K
3837 FHD F09
Figure 5. Page Write
BUS ACTIVITY:
SDA LINE
BUS ACTIVITY: X24C01
S T A
R
T S
S T O P
P
A C K
A C K
A C K
M S B
WORD
ADDRESS (n) DATA n DATA n+1 DATA n+3
A C K
R
/
W
L S B
3837 FHD F10
Page 6
6
X24C01
Figure 6. ACK Polling SequenceAcknowledge Polling
The disabling of the inputs can be used to take advan­tage of the typical 5 ms write cycle time. Once the stop condition is issued to indicate the end of the host’s write operation the X24C01 initiates the internal write cycle. ACK polling can be initiated immediately. This involves issuing the start condition followed by the word address for a write operation. If the X24C01 is still busy with the write operation no ACK will be returned. If the X24C01 has completed the write operation an ACK will be returned and the controller can then proceed with the next read or write operation.
READ OPERATIONS
Read operations are initiated in the same manner as write operations with exception that the R/W bit of the word address is set to a one. There are two basic read operations: byte read and sequential read.
It should be noted that the ninth clock cycle of the read operation is not a “don’t care.” To terminate a read operation, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during the ninth clock cycle and then issue a stop condition.
Byte Read
To initiate a read operation, the master sends a start condition followed by a seven bit word address and a read bit. The X24C01 responds with an acknowledge and then transmits the eight bits of data. The read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition. Refer to Figure 7 for the start, word address, read bit, acknowledge and data transfer sequence.
WRITE OPERATION
COMPLETED
ENTER ACK POLLING
ISSUE
STAR T
ISSUE SLAVE
ADDRESS AND R/W = 0
ACK
RETURNED?
NEXT
OPERATION
A WRITE?
PROCEED
ISSUE STOP
NO
YES
YES
PROCEED
ISSUE STOP
NO
3837 FHD F11
Figure 7. Byte Read
3837 FHD F12
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24C01
S T A R T
WORD
ADDRESS n
S T O P
P
A C K
DATA n
R
/
W
L S B
S
M S B
Page 7
X24C01
7
Sequential Read
Sequential read is initiated in the same manner as the byte read. The first data byte is transmitted as with the byte read mode, however, the master now responds with an acknowledge, indicating it requires additional data. The X24C01 continues to output data for each acknowledge received. The read operation is termi­nated by the master; by not responding with an acknowl­edge and by issuing a stop condition.
The data output is sequential, with the data from address n followed by the data from n + 1. The address counter for read operations increments all address bits, allowing the entire memory contents to be serially read during one operation. At the end of the address space (address
127) the counter “rolls over” to zero and the X24C01 continues to output data for each acknowledge re­ceived. Refer to Figure 8 for the address, acknowledge and data transfer sequence.
Figure 8. Sequential Read
3837 FHD F13
Figure 9. Typical System Configuration
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
PULL-UP RESISTORS
SDA
SCL
V
CC
3837 FHD F14
BUS ACTIVITY:
SDA LINE
BUS ACTIVITY: X24C01
ADDRESS
A C K
A C K
DATA n+x
S T O P
P
DATA n
A C K
DATA n+1
A
C
K
DATA n+2
R
/
W
Page 8
8
X24C01
Supply Voltage Limits
X24C01 4.5V to 5.5V X24C01-3.5 3.5V to 5.5V X24C01-3 3.0V to 5.5V X24C01-2.7 2.7V to 5.5V
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias.................. –65°C to +135°C
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to VSS............................ –1.0V to +7.0V
D.C. Output Current ............................................5 mA
Lead Temperature
(Soldering, 10 Seconds) ............................. 300°C
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature Min. Max.
Commercial 0°C70°C
Industrial –40°C +85°C
Military –55°C +125°C
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)
Limits
Symbol Parameter Min. Max. Units Test Conditions
I
CC
(1)
VCC Supply Current (Read) 1 mA SCL = V
CC
x 0.1/V
CC
x 0.9 Levels
I
CC
(2)
VCC Supply Current (Write) 2 @ 100 KHz, SDA = Open
I
SB1
(1)
VCC Standby Current 100 µA SCL = SDA = VCC,
VCC = 5V ± 10%
I
SB2
(1)
VCC Standby Current 50 µA SCL = SDA = VCC, VCC = 2.7V
I
LI
Input Leakage Current 10 µAVIN = GND to V
CC
I
LO
Output Leakage Current 10 µAV
OUT
= GND to V
CC
V
lL
(2)
Input Low Voltage –1.0 VCC x 0.3 V
V
IH
(2)
Input High Voltage VCC x 0.7 VCC + 0.5 V
V
OL
Output Low Voltage 0.4 V IOL = 2.1 mA
3837 PGM T03
CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V
Symbol Parameter Max. Units Test Conditions
C
I/O
(3)
Input/Output Capacitance (SDA) 8 pF V
I/O
= 0V
C
IN
(3)
Input Capacitance (SCL) 6 pF V
IN
= 0V
3837 PGM T05
Notes: (1) Must perform a stop command prior to measurement.
(2) VIL min. and VIH max. are for reference only and are not tested. (3) This parameter is periodically sampled and not 100% tested.
Page 9
X24C01
9
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Read & Write Cycle Limits
Symbol Parameter Min. Max. Units
f
SCL
SCL Clock Frequency 0 100 KHz
T
I
Noise Suppression Time 100 ns Constant at SCL, SDA Inputs
t
AA
SCL Low to SDA Data Out Valid 0.3 3.5 µs
t
BUF
Time the Bus Must Be Free Before a 4.7 µs New Transmission Can Start
t
HD:STA
Start Condition Hold Time 4.0 µs
t
LOW
Clock Low Period 4.7 µs
t
HIGH
Clock High Period 4.0 µs
t
SU:STA
Start Condition Setup Time 4.7 µs
t
HD:DAT
Data In Hold Time 0 µs
t
SU:DAT
Data In Setup Time 250 ns
t
R
SDA and SCL Rise Time 1 µs
t
F
SDA and SCL Fall Time 300 ns
t
SU:STO
Stop Condition Setup Time 4.7 µs
t
DH
Data Out Hold Time 300 ns
3837 PGM T06
POWER-UP TIMING
Symbol Parameter Max. Units
t
PUR
(4)
Power-up to Read Operation 1 ms
t
PUW
(4)
Power-up to Write Operation 5 ms
3837 PGM T07
Bus Timing
t
SU:STA
t
HD:STAtHD:DAT
t
SU:DAT
t
LOW
t
SU:STO
t
R
t
BUF
SCL
SDA IN
SDA OUT
t
DH
t
AA
t
F
t
HIGH
3837 FHD F04
Note: (4) t
PUR
and t
PUW
are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters
are periodically sampled and not 100% tested.
Page 10
10
X24C01
WRITE CYCLE LIMITS
Symbol Parameter Min. Typ.
(5)
Max. Units
t
WR
(6)
Write Cycle Time 5 10 ms
3837 PGM T08
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/program cycle. During the write cycle, the X24C01
Write Cycle Timing
bus interface circuits are disabled, SDA is allowed to remain high, and the device does not respond to its word address.
SDA 8th BIT
WORD n
ACK
t
WR
STOP
CONDITION
START
CONDITION
X24C01
ADDRESS
SCL
3837 FHD F05
Guidelines for Calculating Typical Values of Bus Pull-Up Resistors
SYMBOL TABLE
Must be steady
Will be steady
May change from Low to High
Will change from Low to High
May change from High to Low
Will change from High to Low
Don’t Care: Changes Allowed
Changing: State Not Known
N/A
Center Line is High Impedance
OUTPUTSINPUTSWAVEFORM
3837 FHD F15
120 100
80
40
60
20
20 40 60 80
100
120
0
0
RESISTANCE (K)
BUS CAPACITANCE (pF)
MIN. RESISTANCE
MAX. RESISTANCE
R
MAX
=
C
BUS
t
R
R
MIN
=
I
OL MIN
V
CC MAX
=2.6K
Notes: (5) Typical values are for TA = 25°C and nominal supply voltage (5V).
(6) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
Page 11
X24C01
11
0.020 (0.51)
0.016 (0.41)
0.150 (3.81)
0.125 (3.18)
0.325 (8.25)
0.300 (7.62)
0.110 (2.79)
0.090 (2.29)
0.430 (10.92)
0.360 (9.14)
0.300
(7.62) REF.
PIN 1 INDEX
0.140 (3.56)
0.130 (3.30)
0.020 (0.51)
0.015 (0.38)
PIN 1
SEATING
PLANE
0.062 (1.57)
0.058 (1.47)
0.255 (6.47)
0.245 (6.22)
0.060 (1.52)
0.020 (0.51)
TYP. 0.010 (0.25)
0°
15°
0.092 (2.34) DIA. NOM.
HALF SHOULDER WIDTH ON
ALL END PINS OPTIONAL
0.015 (0.38) MAX.
PACKAGING INFORMATION
8-LEAD PLASTIC IN-LINE PACKAGE TYPE P
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
Page 12
12
X24C01
PACKAGING INFORMATION
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
PIN 1
PIN 1 INDEX
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7°
0.027 (0.683)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0° – 8°
X 45°
3926 FHD F22
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)
Page 13
X24C01
13
0.118 ± 0.002 (3.00 ± 0.05)
0.040 ± 0.002 (1.02 ± 0.05)
0.150 (3.81) REF.
0.193 (4.90) REF.
0.030 (0.76)
0.036 (0.91)
0.032 (0.81)
0.007 (0.18)
0.005 (0.13)
0.008 (0.20)
0.004 (0.10)
0.0216 (0.55)
7° TYP
R 0.014 (0.36)
0.118 ± 0.002 (3.00 ± 0.05)
0.012 + 0.006 / -0.002 (0.30 + 0.15 / -0.05)
0.0256 (0.65) TYP
8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M
NOTE:
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
3003 ILL 01
PACKAGING INFORMATION
Page 14
14
X24C01
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
Device
ORDERING INFORMATION
VCC Limits
Blank = 4.5V to 5.5V
3.5 = 3.5V to 5.5V 3 = 3.0V to 5.5V
2.7 = 2.7V to 5.5V
Temperature Range
Blank = Commercial = 0°C to +70°C I = Industrial = –40°C to +85°C M = Military = –55°C to +125°C
Package
P = 8-Lead Plastic DIP S = 8-Lead SOIC M = 8-Lead MSOP
X24C01 X X -X
X24C01 X
X
Blank = 8-Lead SOIC P = 8-Lead Plastic DIP M = 8-Lead MSOP
Blank = 4.5V to 5.5V, 0°C to +70°C F = 2.7V to 5.5V, 0°C to +70°C G = 2.7V to 5.5V, –40°C to +85°C I = 4.5V to 5.5V, –40°C to +85°C B = 3.5V to 5.5V, 0°C to +70°C C = 3.5V to 5.5V, –40°C to +85°C D = 3.0V to 5.5V, 0°C to +70°C E = 3.0V to 5.5V, –40°C to +85°C M = 4.5V to 5.5V, –55°C to +125°C
Part Mark Convention
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