Datasheet X24645VM-2,7, X24645VM, X24645VI-2,7, X24645S8I, X24645S8-2,7 Datasheet (XICOR)

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Page 1
Advanced 2-Wire Serial E
2
PROM with Block Lock
TM
Protection
64K
8192 x 8 Bit
Preliminary Information
Xicor, 1995, 1996 Patents Pending Characteristics subject to change without notice
2783-3.5 5/13/96 T1/C0/D0 NS
1
X24645
FUNCTIONAL DIAGRAM
FEATURES
2.7V to 5.5V Power Supply
Low Power CMOS —Active Read Current Less Than 1mA —Active Write Current Less Than 3mA —Standby Current Less Than 1 µ A
Internally Organized 8192 x 8
New Programmable Block Lock Protection —Software Write Protection —Programmable hardware Write Protect
Block Lock (0, 1/4, 1/2, or all of the E
2
PROM
array)
2 Wire Serial Interface
Bidirectional Data Transfer Protocol
32 Byte Page Write Mode —Minimizes T otal Write Time Per Byte
Self Timed Write Cycle —Typical Write Cycle Time of 5ms
High Reliability —Endurance: 100,000 Cycles —Data Retention: 100 Years
Available Packages —8-Lead PDIP —8-Lead SOIC (JEDEC) —14-Lead SOIC (JEDEC) —20-Lead TSSOP
DESCRIPTION
The X24645 is a CMOS 65,536-bit serial E
2
PROM, internally organized 8192 x 8. The X24645 features a serial interface and software protocol allowing opera­tion on a simple two wire bus.
Two device select inputs (S
1
, S
2
) allow up to four
devices to share a common two wire bus . A Write Protect Register at the highest address loca-
tion, 1FFFh, provides three new write protection features: Software Write Protect, Block Write Protect, and Hardware Write Protect. The Software Write Protect feature prevents any nonvolatile writes to the X24645 until the WEL bit in the write protect register is set. The Block Write Protection feature allows the user to individually write protect four blocks of the array by programming two bits in the write protect register. The Programmable Hardware Write Protect feature allows the user to install the X24645 with WP tied to V
CC
, program the entire memory array in place, and then enable the hardware write protection by programming a WPEN bit in the write protect register. After this, selected blocks of the array, including the write protect register itself, are permanently write protected, as long as WP remains HIGH.
START
STOP
LOGIC
CONTROL
LOGIC
SLAVE ADDRESS
REGISTER
+COMPARA TOR
H.V. GENERATION
TIMING &
CONTROL
WORD ADDRESS COUNTER
XDEC
YDEC
D
OUT
ACK
E
2
PROM
256 X 256
DATA REGISTER
START CYCLE
V
CC
R/W
PIN
V
SS
SDA
SCL
S
2
S
1
D
OUT
LOAD INC
CK
8
2783 ILL F01
WRITE PROTECT
REGISTER AND
LOGIC
WP
Page 2
X24645
2
Xicor E
2
PROMs are designed and tested for applica­tions requiring extended endurance. Inherent data retention is greater than 100 years.
PIN DESCRIPTIONS Serial Clock (SCL)
The SCL input is used to clock all data into and out of the device.
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and out of the device. It is an open drain output and may be wire-ORed with any number of open drain or open collector outputs.
An open drain output requires the use of a pull-up resistor. For selecting typical values, refer to the Pull­up resistor selection graph at the end of this data sheet.
Device Select (S
1
, S
2
)
The device select inputs (S
1
, S
2
) are used to set the first and second bits of the 8-bit slave address. This allows up to four X24645 devices to share a common bus. These inputs can be static or actively driven. If used statically they must be tied to V
SS
or V
CC
as appropriate. If actively driven, they must be driven with CMOS levels (driven to V
CC
or V
SS
).
Write Protect (WP)
The write protect input controls the hardware write protect feature. When held LOW, hardware write protection is disabled and the X24645 can be written normally. When this input is held HIGH, and the WPEN bit in the write protect register is set HIGH, write protection is enabled, and nonvolatile writes are disabled to the selected blocks as well as the write protect register itself.
PIN NAMES
2783 FRM T01.1
Symbol Description
S
1
, S
2
Device Select Inputs
SDA Serial Data SCL Serial Clock WP Write Protect V
SS
Ground
V
CC
Supply Voltage
NC No Connect
PIN CONFIGURATIONS
VCC WP SCL SDA
NC
S
1
S
2
VSS
1 2 3 4
8 7 6 5
X24645
8-LEAD DIP & SOIC
NC NC NC
S1 S2
V
SS
NC
1 2 3 4 5 6 7
14 13 12 11 10
9 8
NC NC VCC WP SCL SDA NC
X24645
14-LEAD SOIC
NC VCC WP NC NC NC SCL SDA NC NC
2783 ILL F02.4
NC NC
S
1
NC NC NC
S
2
V
SS
NC NC
1 2 3 4 5 6 7 8 9 10
20 19 18 17 16 15 14 13 12 11
X24645
20-LEAD TSSOP
Page 3
X24645
3
Figure 1. Data Validity
Figure 2. Definition of Start and Stop
DEVICE OPERATION
The X24645 supports a bidirectional bus oriented pro­tocol. The protocol defines any device that sends data onto the bus as a transmitter, and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master will always initiate data transfers, and pro­vide the clock for both transmit and receive operations. Therefore, the X24645 will be considered a slave in all applications.
Clock and Data Conventions
Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are reserved for indicating start and stop conditions. Refer to Figures 1 and 2.
Start Condition
All commands are preceded by the start condition, which is a HIGH to LOW transition of SDA when SCL is HIGH. The X24645 continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met.
SCL
SDA
DATA STABLE DATA
CHANGE
2783 ILL F04
SCL
SDA
START BIT STOP BIT
2783 ILL F05
Notes: (5) Typical values are for T
A
= 25 ° C and nominal supply voltage (5V)
(6) t
WR
is the minimum cycle time from the system perspective when polling techniques are not used. It is the maximum time the
device requires to perform the internal write operation.
Page 4
X24645
4
Figure 3. Acknowledge Response From Receiver
Stop Condition
All communications must be terminated by a stop condition, which is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition is also used to place the device into the standby power mode after a read sequence. A stop condition can only be issued after the transmitting device has released the bus .
Acknowledge
Acknowledge is a software con v ention used to indicate successful data transfer. The transmitting device, either master or slave, will release the bus after trans­mitting eight bits. During the ninth clock cycle the receiver will pull the SDA line LOW to acknowledge that it received the eight bits of data. Ref er to Figure 3.
The X24645 will respond with an acknowledge after recognition of a start condition and its slave address. If both the device and a write operation have been selected, the X24645 will respond with an acknowl­edge after the receipt of each subsequent 8-bit word.
In the read mode the X24645 will transmit eight bits of data, release the SDA line and monitor the line for an acknowledge. If an acknowledge is detected and no stop condition is generated by the master, the X24645 will continue to transmit data. If an acknowledge is not detected, the X24645 will terminate further data trans­missions. The master must then issue a stop condition to return the X24645 to the standby power mode and place the device into a known state.
2783 ILL F06
SCL FROM
MASTER
DATA OUTPUT
FROM
TRANSMITTER
1
8 9
DATA
OUTPUT
FROM
RECEIVER
START
ACKNOWLEDGE
Page 5
X24645
5
Figure 5. Byte Write
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24645
S T A
R
T
SLAVE
ADDRESS
S
S T O P
P
A C K
A C
K
A C K
BYTE
ADDRESS DATA
2783 ILL F08.1
DEVICE ADDRESSING
Following a start condition the master must output the address of the slave it is accessing (see Figure 4). The next two bits are the device select bits. A system could have up to four X24645’s on the bus. The four addresses are defined by the state of the S
1
and S
2
inputs. S
2
of the slave address must be the inverse of
the S
2
input pin.
Figure 4. Slave Address
The next five bits of the slave address are an exten­sion of the array’s address and are concatenated with the eight bits of address in the byte address field, providing direct access to the whole 8192 x 8 array.
2783 ILL F07.1
S
2
A9 A8 R/W
DEVICE
SELECT
S1A12
HIGH ORDER
ADDRESS
BITS
A11
A10
The last bit of the slave address defines the operation to be performed. When set HIGH a read operation is selected, when set LOW, a write operation is selected.
Following the start condition, the X24645 monitors the SDA bus comparing the slave address being transmitted with its slave address device type identifier. Upon a correct compare the X24645 outputs an acknowledge on the SDA line. Depending on the state of the R/W
bit, the
X24645 will execute a read or write operation.
WRITE OPERATIONS Byte Write
For a write operation, the X24645 requires a second ad­dress field. This address field is the byte address, com­prised of eight bits, providing access to any one of 8192 words in the array. Upon receipt of the byte address, the X24645 responds with an acknowledge and awaits the next eight bits of data, again responding with an acknowl­edge. The master then terminates the transfer by gener­ating a stop condition, at which time the X24645 begins the internal write cycle to the nonvolatile memory. While the internal write cycle is in progress the X24645 inputs are disabled, and the device will not respond to any re­quests from the master. Refer to Figure 5 for the address, acknowledge and data transfer sequence.
Page 6
X24645
6
Figure 6. Page Write
Page Write
The X24645 is capable of a 32-byte page write opera­tion. It is initiated in the same manner as the byte write operation, but instead of terminating the write cycle af­ter the first data word is transferred, the master can transmit up to thirty-one more bytes. After the receipt of each byte, the X24645 will respond with an acknowl­edge.
After the receipt of each byte, the five low order ad­dress bits are internally incremented by one. The high order eight bits of the address remain constant. If the master should transmit more than 32 bytes prior to gen­erating the stop condition, the address counter will “roll over” and the previously written data will be overwrit­ten. As with the byte write operation, all inputs are dis­abled until completion of the internal write cycle. Refer to Figure 6 for the address, acknowledge, and data transfer sequence.
Acknowledge Polling
The Max Write Cycle Time can be significantly reduced using Acknowledge Polling. To initiate Acknowledge Polling, the master issues a start condition followed by the Slave Address Byte for a write or read operation. If the device is still busy with the high voltage cycle, then no ACK will be returned. If the device has completed the write operation, an ACK will be returned and the host can then proceed with the read or write operation. Refer to Flow 1.
Flow 1. ACK Polling Sequence
2783 ILL F09
WRITE OPERATION
COMPLETED
ENTER ACK POLLING
ISSUE
START
ISSUE SLAVE
ADDRESS AND R/W = 0
ACK
RETURNED?
NEXT
OPERATION
A WRITE?
ISSUE BYTE
ADDRESS
PROCEED
ISSUE STOP
NO
YES
YES
PROCEED
ISSUE STOP
NO
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24645
S T A R T
SLAVE
ADDRESS
S
S T O P
P
A C K
A C K
A
C
K
A C K
A C K
BYTE ADDRESS (n) DATA n DATA n+1 DATA n+31
2783 ILL F10.2
Page 7
X24645
7
Figure 7. Current Address Read
Figure 8. Random Read
READ OPERATIONS
Read operations are initiated in the same manner as write operations with the exception that the R/ W bit of the slave address is set HIGH. There are three basic read operations: current address read, random read and sequential read.
It should be noted that the ninth clock cycle of the read operation is not a “don’t care.” To terminate a read op­eration, the master must either issue a stop condition during the ninth cycle or hold SDA HIGH during the ninth clock cycle and then issue a stop condition.
Current Address Read
Internally the X24645 contains an address counter that maintains the address of the last byte read, increment­ed by one or the exact address of the last byte written. Therefore, if the last access read was to address n, the next read operation would access data from address n + 1. Upon receipt of the slave address with the R/W set HIGH, the X24645 issues an acknowledge and
transmits the byte. The read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition. Refer to Figure 7 for the sequence of address, acknowledge and data transfer.
Random Read
Random read operations allow the master to access any memory location in a random manner. Prior to issu­ing the slave address with the R/W bit set HIGH, the master must first perform a “dummy” write operation. The master issues the start condition, and the slave ad­dress with the R/W bit set LOW, followed by the byte address it is to read. After the word address acknowl­edge, the master immediately reissues the start condi­tion and the slave address with the R/W
bit set HIGH. This will be followed by an acknowledge from the X24645 and then by the data byte. The read operation is terminated by the master; by not responding with an acknowledge and by issuing a stop condition. Refer to Figure 8 for the address, acknowledge and data trans­fer sequence.
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24645
S T A R T
SLAVE
ADDRESS
S
S T O P
P
A C K
DATA
2783 ILL F11
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24645
S T A R T
SLAVE
ADDRESS
S
A C K
2783 ILL F12.1
S T A R T
S
BYTE
ADDRESS n
A C K
SLAVE
ADDRESS
DATA n
A C K
S T O P
P
Page 8
X24645
8
Figure 10. Typical System Configuration
Sequential Read
Sequential reads can be initiated as either a current address read or random access read. The first byte is transmitted as with the other modes, however, the master now responds with an acknowledge, indicating it requires additional data. The X24645 continues to output data for each acknowledge received. The read operation is terminated by the master; by not responding with an acknowledge and then issuing a stop condition.
The data output is sequential, with the data from address n followed by the data from n + 1. The address counter for read operations increments all address bits, allowing the entire memory contents to be serially read during one operation. At the end of the address space (address 8191), the counter “rolls over” to 0 and the X24645 continues to output data for each acknowledge received. Refer to Figure 9 for the address, acknowledge and data transfer sequence.
BUS ACTIVITY: MASTER
SDA LINE
BUS ACTIVITY: X24645
SLAVE
ADDRESS
A C K
2783 ILL F13
A C K
DATA n+x
S T O P
P
DATA n
A C K
DATA n+1
A C K
DATA n+2
MASTER
TRANSMITTER/
RECEIVER
SLAVE
RECEIVER
SLAVE
TRANSMITTER/
RECEIVER
MASTER
TRANSMITTER
MASTER
TRANSMITTER/
RECEIVER
PULL-UP RESISTORS
SDA SCL
V
CC
2783 ILL F14
Figure 9. Sequential Read
Page 9
X24645
9
WRITE PROTECT REGISTER
The Write Protect Register (WPR) is located at the highest address, 1FFFh.
Figure 11. Write Protect Register
WPR.1 = WEL – “Write Enable” Latch (Volatile)
0 = Write enable latch reset, writes disabled
1 = Write enable latch set, writes enabled If WEL = “0” then “no A CK” after first byte of input data. WPR.2 = RWEL
– “Register Write Enable” Latch (Volatile)
0 = Register write enable latch reset, writes dis-
abled
1 = Register write enable latch set, writes enabled WPR.3, WPR.4 = BP0, BP1
– Block Protect Bits (Nonvolatile) (See Block Protect section for definition)
WPR.7 = WPEN – Write Protect Enable Bit (Nonvolatile) (See Hardware Write Protect section for definition)
Writing to the Write Protect Register
The Write Protect Register is written by performing a random write of one byte directly to address, 1FFFh. If a page write is performed starting with any address other than 1FFF, the byte in the array at address 1FFFh will be written instead of the Write Protect Register (assuming writes are not disabled by the block protect register).
The state of the Write Protect Register can be read by performing a random read at address 1FFFh at any time. If a sequential read starting at any other address than 1FFFh is performed, the contents of the byte in the array at 1FFFh is read out instead of the Write Protect Register.
7 6 5 4 3
2
1
0
WPEN 0 0 BP1 BP0
RWEL
WEL
0
2783 ILL F15.1
WPR (ADDR = 1FFFh)
WEL and RWEL are volatile latches that power-up in the LOW (disabled) state. A write to any address other than 1FFFh, where the Write Protect Register is located, will be ignored (no ack) until the WEL bit is set HIGH. The WEL bit is set by writing 0000001x to address 1FFFh. Once set, WEL remains HIGH until either reset (by writing 00000000 to 1FFFh) or until the part powers-up again. The RWEL bit controls writes to the block protect bits. RWEL is set by first setting WEL to “1” and then writing 0000011x to address 1FFFh. RWEL must be set in order to change the bloc k protect bits, BP0 and BP1, or the WPEN bit. RWEL is reset when the block protect or WPEN bits are changed, or when the part powers-up again.
Programming the BP or WPEN Bits
A three step sequence is required to change the nonvolatile Block Protect or Write Protect Enable:
1) Set WEL = 1 (write 00000010 to address 1FFFh, volatile write cycle)
(Start)
2) Set RWEL = 1 (write 00000110 to address 1FFFh, volatile write cycle)
(Start)
3) Set BP1, BP0, and/or WPEN bits (Write w00yz010 to address 1FFFh)
w = WPEN, y = BP1, Z = BP0, (Stop) Step 3 is a nonvolatile write cycle, requiring 10ms to
complete. RWEL is reset to “0” by this write cycle, requiring another write cycle to set RWEL again before the block protect bits can be changed. RWEL must be “0” in step 3; if w00yz110 is written to address 1FFFh, RWEL is set but WPEN, BP1 and BP0 are not changed (the device remains at step 2).
Page 10
X24645
10
Block Protect Bits
The Block Protect Bits BP0 and BP1 determine which blocks of the memory are write-protected:
Programmable Hardware Write Protect
The Write Protect (WP) pin and the Write Protect Enable (WPEN) bit in the Write Protect Register control the programmable hardware write protect feature. Hardware write protection is enabled when the WP pin is HIGH and the WPEN bit is “1”, and disabled when either the WP pin is LOW or the WPEN bit is “0”. When the chip is hardware write-protected, nonvolatile writes are disabled to the Write Protect Register, including the BP bits and the WPEN bit itself, as well as to block-protected sections in the memory array. Only the sections of the memory array that are not block-protected can be written. Note that since the WPEN bit is write-protected, it cannot be changed back to a LOW state, and write protection is disabled as long as the the WP pin is held HIGH. Table 2 defines the write protection status for each state of WPEN and WP.
Table 1. Block Protect Bits
2783 FRM T02
BP1 BP0
Protected Addresses
0 0 None 0 1 1800h–1FFFh Upper 1/4 1 0 1000h–1FFFh Upper 1/2
1 1 0000h–1FFFh
Full Array (WPR not included)
Table 2. Write Protect Status Table
2783 FRM T03.1
WP WPEN
Memory Array
(Not Block Protected)
Memory Array
(Block Protected) BP Bits WPEN Bit
L X Writable Protected Writable Writable X 0 Writable Protected Writable Writable H 1 Writable Protected Protected Protected
Page 11
X24645
11
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias
X24645.......................................–65 ° C to +135 ° C
Storage Temperature........................–65 ° C to +150 ° C
Voltage on any Pin with
Respect to V
SS
....................................–1V to +7V
D.C. Output Current..............................................5mA
Lead Temperature
(Soldering, 10 seconds) ..............................300 ° C
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
D.C. OPERATING CHARACTERISTICS
2783 FRM T06.2
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
2783 FRM T07.1
Notes: (1) Must perform a stop command prior to measurement.
(2) VIL min. and VIH max. are f or ref erence only and are not 100% tested. (3) This par ameter is periodically sampled and not 100% tested.
Limits
Symbol Parameter Min. Max. Units Test Conditions
I
CC1
VCC Supply Current (Read) 1 mA SCL = VCC X 0.1/VCC X 0.9 Levels
@ 100KHz, SDA = Open, All Other Inputs =
V
SS
or VCC – 0.3V
I
CC2
VCC Supply Current (Write) 3 mA
I
SB1
(1)
VCC Standby Current 50 µA SCL = SDA = VCC, All Other
Inputs =
V
SS
or VCC – 0.3V,
V
CC
= 5V ± 10%
I
SB2
(1)
VCC Standby Current 1 µA SCL = SDA = VCC, All Other
Inputs =
V
SS
or VCC – 0.3V,
V
CC
= 2.7V
I
LI
Input Leakage Current 10 µA
V
IN
= VSS to V
CC
I
LO
Output Leakage Current 10 µA
V
OUT
= VSS to V
CC
V
lL
(2)
Input LOW Voltage –1 VCC x 0.3 V
V
IH
(2)
Input HIGH Voltage VCC x 0.7 VCC + 0.5 V
V
OL
Output LOW Voltage 0.4 V IOL = 3mA, VCC = 4.5V
Symbol Parameter Max. Units Test Conditions
C
I/O
(3)
Input/Output Capacitance (SDA) 8 pF V
I/O
= 0V
C
IN
(3)
Input Capacitance (S1, S2, SCL)
6 pF V
IN
= 0V
RECOMMENDED OPERATING CONDITIONS
2783 FRM T04
Temperature Min. Max.
Commercial 0°C +70°C
Industrial –40°C +85°C
Military –55°C +125°C
2783 FRM T05
Supply Voltage Limits
X24645 4.5V to 5.5V
X24645-2.7 2.7V to 5.5V
Page 12
X24645
12
A.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.) Read & Write Cycle Limits
2783 FRM T09.2
POWER-UP TIMING
(4)
2783 FRM T10
Notes: (4) t
PUR
and t
PUW
are the delays required from the time VCC is stable until the specified operation can be initiated. These par ameters
are periodically sampled and not 100% tested.
Symbol Parameter Min. Max. Units
f
SCL
SCL Clock Frequency 0 100 KHz
T
I
Noise Suppression Time Constant at SCL, SDA Inputs
100 ns
t
AA
SCL LOW to SDA Data Out Valid 0.3 3.5 µs
t
BUF
Time the Bus Must Be Free Before a New Transmission Can Start
4.7 µs
t
HD:STA
Start Condition Hold Time 4 µs
t
LOW
Clock LOW Period 4.7 µs
t
HIGH
Clock HIGH Period 4 µs
t
SU:STA
Start Condition Setup Time (for a Repeated Start Condition)
4.7 µs
t
HD:DAT
Data In Hold Time 0 µs
t
SU:DAT
Data In Setup Time 250 ns
t
R
SDA and SCL Rise Time 1 µs
t
F
SDA and SCL Fall Time 300 ns
t
SU:STO
Stop Condition Setup Time 4.7 µs
t
DH
Data Out Hold Time 300 ns
Symbol Parameter Max. Units
t
PUR
Power-up to Read Operation 1 ms
t
PUW
Power-up to Write Operation 5 ms
A.C. CONDITIONS OF TEST
2783 FRM T08
Input Pulse Levels VCC x 0.1 to VCC x 0.9 Input Rise and
Fall Times 10ns Input and Output
Timing Levels
V
CC
X 0.5
EQUIVALENT A.C. LOAD CIRCUIT
2783 ILL F16.1
5V
1.53K
100pF
OUTPUT
Page 13
X24645
13
SYMBOL TABLE
WAVEFORM
INPUTS
OUTPUTS
Must be steady
Will be steady
May change from LOW to HIGH
Will change from LOW to HIGH
May change from HIGH to LOW
Will change from HIGH to LOW
Don’t Care: Changes Allowed
Changing: State Not Known
N/A
Center Line is High Impedance
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/program cycle. During the write cycle, the
X24645 bus interface circuits are disabled, SDA is allowed to remain HIGH, and the device does not respond to its slave address.
Bus Timing
2783 ILL F17
t
SU:STA
t
HD:STAtHD:DAT
t
SU:DAT
t
LOW
t
SU:STO
t
R
t
BUF
SCL
SDA IN
SDA OUT
t
DH
t
AA
t
F
t
HIGH
Write Cycle Limits
2783 FRM T11
Symbol Parameter Min. Typ.
(5)
Max. Units
T
WR
(6)
Write Cycle Time 5 10 ms
Bus Timing
2783 ILL F18
SCL
SDA 8th BIT
WORD n
ACK
t
WR
STOP
CONDITION
START
CONDITION
Notes: (5) Typical values are for TA = 25°C and nominal supply voltage (5V).
(6) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
Guidelines for Calculating Typical Values of Bus Pull-Up Resistors
2783 ILL F19
120 100
80
40
60
20
20 40 60 80
100
120
0
0
RESISTANCE (K)
BUS CAPACITANCE (pF)
MIN. RESISTANCE
MAX. RESISTANCE
R
MAX
=
C
BUS
t
R
R
MIN
=
I
OL MIN
V
CC MAX
=1.8K
Page 14
X24645
14
PACKAGING INFORMATION
3926 FHD F01
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
0.020 (0.51)
0.016 (0.41)
0.150 (3.81)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
0.430 (10.92)
0.360 (9.14)
0.300
(7.62) REF.
PIN 1 INDEX
0.145 (3.68)
0.128 (3.25)
0.025 (0.64)
0.015 (0.38)
PIN 1
SEATING
PLANE
0.065 (1.65)
0.045 (1.14)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.020 (0.51)
TYP. 0.010 (0.25)
0°
15°
8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
HALF SHOULDER WIDTH ON
ALL END PINS OPTIONAL
0.015 (0.38) MAX.
0.325 (8.25)
0.300 (7.62)
Page 15
X24645
15
PACKAGING INFORMATION
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
PIN 1
PIN 1 INDEX
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7°
0.016 (0.410)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0° – 8°
X 45°
3926 FHD F22.1
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050" TYPICAL
0.050" TYPICAL
0.030"
TYPICAL
8 PLACES
FOOTPRINT
Page 16
X24645
16
PACKAGING INFORMATION
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.020 (0.51)
PIN 1
PIN 1 INDEX
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.336 (8.55)
0.345 (8.75)
0.004 (0.10)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7°
0.016 (0.41)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0° – 8°
X 45°
3926 FHD F10.1
14-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050" Typical
0.050" Typical
0.030" Typical 14 Places
FOOTPRINT
Page 17
X24645
17
PACKAGING INFORMATION
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
20-LEAD PLASTIC, TSSOP PACKAGE TYPE V
See Detail “A”
.031 (.80)
.041 (1.05)
.169 (4.3) .177 (4.5)
.252 (6.4) BSC
.025 (.65) BSC
.252 (6.4) .300 (6.6)
.002 (.05) .006 (.15)
.047 (1.20)
.0075 (.19) .0118 (.30)
0° – 8°
.010 (.25)
.019 (.50) .029 (.75)
Gage Plane Seating Plane
Detail A (20X)
3926 FHD F45
Page 18
X24645
18
ORDERING INFORMATION
Part Mark Convention
Device
X24645 X X -X
V
CC
Range
Blank = 5V ±10%
2.7 = 2.7V to 5.5V
Temperature Range
Blank = 0°C to +70°C I = –40°C to +85°C M = –55°C to +125°C
Package
P = 8-Lead Plastic DIP S8 = 8-Lead SOIC (JEDEC)
P = 8-Lead Plastic DIP S = 14-Lead SOIC
Blank = 4.5V to 5.5V, 0°C to +70°C I = 4.5V to 5.5V, –40°C to +85°C F = 2.7V to 5.5V, 0°C to +70°C G = 2.7V to 5.5V, –40°C to +85°C
X24645 X
X
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. mak es no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending.
LIFE RELA TED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prev ent such an occurence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) suppor t or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its saf ety or eff ectiv eness .
S = 14-Lead SOIC
Blank = 8-Lead SOIC (JEDEC) V = 20-Lead TSSOP
V = 20-Lead TSSOP
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