Datasheet X24001SM-3, X24001SM-2,7, X24001SM, X24001SI-3, X24001SI-2,7 Datasheet (XICOR)

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Page 1
X24001
1
128 Bit X24001 16 x 8 Bit
Identi
PROM
© Xicor, Inc. 1991, 1995, 1996 Patents Pending Characteristics subject to change without notice 3830-1.5 6/10/96 T2/C1/D0 NS
2.7V to 5.5V Power Supply
128 Bit Serial E
2
PROM
Low Power CMOS
—Active Current Less Than 1mA —Standby Current Less Than 50µA
Internally Organized 16 x 8
2 Wire Serial Interface
High Voltage Programmable Only
—V
PGM
, 12V to 15V
Push/Pull Output
High Reliability
—Data Retention: 100 Years
Available Packages
—8-Lead MSOP —8-Lead PDIP —8-Lead SOIC
DESCRIPTION
The X24001 is a CMOS 128 bit serial E2PROM, inter­nally organized as 16 x 8. The X24001 features a serial interface and software protocol allowing operation on a simple two wire bus.
The X24001 is ideally suited for identification applica­tions such as serial numbers or device revision numbers which need to be stored and retrieved electronically.
V
PGM
is used to enable writes to the device. This provides full protection of the data in the user’s environ­ment where V
PGM
is not available.
Xicor E2PROMs are designed and tested for applica­tions requiring extended endurance. Inherent data re­tention is greater than 100 years.
The X24001 is fabricated with Xicor’s Advanced CMOS Floating Gate technology.
IDENTI™ PROM is a trademark of Xicor, Inc.
FUNCTIONAL DIAGRAM
CONTROL
LOGIC
INPUT/ OUTPUT BUFFER
SCL
SDA
COMMAND/ADDRESS
REGISTER
SHIFT REGISTER
MEMORY ARRA Y
3830 FHD F01
PIN CONFIGURATION
V
CC
NC SCL SDA
3830 FHD F02.1
NC NC
NC
V
SS
1 2 3 4
8 7 6 5
X24001
MSOP/DIP/SOIC
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2
X24001
PIN DESCRIPTIONS Serial Clock (SCL)
The SCL input is used to clock all data into and out of the device.
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and out of the device. It is a push/pull output and does not require the use of a pull-up resistor. During the program­ming operation, SDA is an input.
PIN NAMES
Symbol Description
NC No Connect V
SS
Ground
V
CC
Supply Voltage SDA Serial Data SCL Serial Clock
3830 PGM T01
DEVICE OPERATION
The X24001 supports a bidirectional bus oriented proto­col. The protocol defines any device that sends data onto the bus as a transmitter and the receiving device as the receiver. The device controlling the transfer is a master and the device being controlled is the slave. The master will always initiate data transfers and provide the clock for both transmit and receive operations. There­fore, the X24001 will be considered a slave in all appli­cations.
Clock and Data Conventions
Data states on the SDA line can change only during SCL LOW. SDA state changes during SCL HIGH are re­served for indicating start and stop conditions. Refer to Figures 1 and 2.
Start Condition
All commands are preceded by the start condition, which is a HIGH to LOW transition of SDA when SCL is HIGH. The X24001 continuously monitors the SDA and SCL lines for the start condition and will not respond to any command until this condition has been met.
A start may be issued to terminate the input of a control word or the input of data to be written. This will reset the device and leave it ready to begin a new read or write command. Because of the push/pull output, a start cannot be generated while the part is outputting data. Starts are also inhibited while a write is in progress.
Stop Condition
The stop condition is a LOW to HIGH transition of SDA when SCL is HIGH. The stop condition is used to reset the device during a command or data input sequence and will leave the device in the standby mode. As with starts, stops are inhibited when outputting data and while a write is in progress.
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X24001
3
Figure 1. Data Validity
SCL
SDA
DATA STABLE DATA
CHANGE
3830 FHD F03
Figure 2. Definition of Start and Stop Conditions
SCL
SDA
START CONDITION STOP CONDITION
3830 FHD F04
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4
X24001
Programming Operation
Programming of the X24001 is performed one byte at a time. After each byte is written, a delay equal to the write cycle time of 5ms must be observed before initiating the next write cycle.
The sequence of operations is: first raise the SCL pin to V
PGM
and generate a HIGH to LOW transition of SDA (programming mode start). This is followed by eight bits of data containing the program command bits, four address bits and two don’t care bits, immediately fol­lowed by the 8-bit data byte.
The timing of the operation conforms to the standard A.C. timing requirements and follows the sequence shown below. After generating the Programming Mode start condition the SCL HIGH level can be either V
IH
or V
PGM
.
Factory Programming Service
The X24001 can be programmed with customer specific data prior to shipment. The data programmed can be in two forms: static data pattern where there is no change in the data in a group of devices or sequential data, such as a base number incremented by one for each device tested and shipped.
Customers requiring one of these services should con­tact their local sales office for ordering procedures and service charges.
Figure 3. Programming Sequence
V
PGM
V
IH
SDA
0 1 A3 A2 A1 A0 XX XX D7 D6 D5 D4 D3 D2 D1 D0
S T A R T
SCL
3830 FHD F05.1
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X24001
5
Read Operation
The byte read operation is initiated with a start condition. The start condition is followed by an eight-bit control byte which consists of a two-bit read command (1,0), four address bits, and two “don’t care” bits. After receipt of the control byte, the X24001 will enter the read mode and transfer data into the shift register from the array. This data is shifted out of the device on the next eight SCL clocks. At the end of the read, all counters are reset
and the X24001 will enter the standby mode. As with a write, the read operation can be interrupted by a start or stop condition while the command or address is being clocked in. While clocking data out, starts or stops cannot be generated.
During the second don’t care clock cycle, starts and stops are ignored. The master must free the bus prior to the end of this clock cycle to allow the X24001 to begin outputting data (Figures 4 and 5).
3830 FHD F07
Figure 4. Read Sequence
3830 FHD F06
Figure 5. Read Cycle Timing
6781
SDA IN
SCK
SDA OUT
A0 XX XX
D7 D6
START
1
0 A3 A2 A1 A0 XX XX D7 D6 D5 D4 D3 D2 D1 D0
SYMBOL TABLE
WAVEFORM
INPUTS
OUTPUTS
Must be steady
Will be steady
May change from LOW to HIGH
Will change from LOW to HIGH
May change from HIGH to LOW
Will change from HIGH to LOW
Don’t Care: Changes Allowed
Changing: State Not Known
N/A
Center Line is High Impedance
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6
X24001
*COMMENT
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability.
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol Parameter Max. Units Test Conditions
C
I/O
(2)
Input/Output Capacitance (SDA) 8 pF V
I/O
= 0V
C
IN
(2)
Input Capacitance (SCL) 6 pF V
IN
= 0V
3830 PGM T05.1
Notes: (1) VIL min. and VIH max. are for reference only and are not tested.
(2) This parameter is periodically sampled and not 100% tested.
ABSOLUTE MAXIMUM RATINGS*
Temperature under Bias
X24001 ...................................... –65°C to +135°C
Storage Temperature ....................... –65°C to +150°C
Voltage on any Pin with
Respect to V
SS
............................................ –1V to +7V
Voltage on SCL with
Respect to V
SS
..........................................–1V to +17V
D.C. Output Current ............................................. 5mA
Lead Temperature
(Soldering, 10 seconds).............................. 300°C
D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions unless otherwise specified.)
Limits
Symbol Parameter Min. Max. Units Test Conditions
l
CC1
VCC Supply Current Read 1 mA SCL = VCC x 0.1/VCC x 0.9 Levels
@ 1MHz, SDA = Open
I
SB1
V
CC
Standby Current 100 µA SCL = SDA = V
CC
VCC = 5V ±10%
I
SB2
VCC Standby Current 50 µA SCL = SDA = V
CC
VCC = 3V
I
LI
Input Leakage Current 10 µAV
IN
= VSS to V
CC
I
LO
Output Leakage Current 10 µAV
OUT
= VSS to V
CC
V
lL
(1)
Input LOW Voltage –1.0 VCC x 0.3 V
V
IH
(1)
Input HIGH Voltage VCC x 0.7 VCC + 0.5 V
V
OL
Output LOW Voltage 0.4 V IOL = 2.1mA
V
OH
Output HIGH Voltage VCC – 0.8 V IOH = 1mA
V
PGM
Program Enable Voltage 12 15 V
3830 PGM T04.3
Supply Voltage Limits
X24001 5V ±10%
X24001-3 3V to 5.5V
X24001-2.7 2.7V to 5.5V
3830 PGM T03.1
RECOMMENDED OPERATING CONDITIONS
Temperature Min. Max.
Commercial 0°C +70°C
Industrial –40°C +85°C
Military –55°C +125°C
3830 PGM T02.1
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X24001
7
POWER-UP TIMING
Symbol Parameter Max. Units
t
PUR
(3)
Power-up to Read Operation 2 ms
t
PUW
(3)
Power-up to Write Operation 5 ms
3830 PGM T06
A.C. CONDITIONS OF TEST
Input Pulse Levels VCC x 0.1 to VCC x 0.9 Input Rise and
Fall Times 10ns Input and Output
Timing Levels VCC x 0.5
3830 PGM T07.1
EQUIVALENT A.C. LOAD CIRCUIT
Symbol Parameter Min. Max. Units
f
SCL
SCL Clock Frequency 0 1 MHz
t
AA
SCL LOW to SDA Data Out Valid 350 ns
t
BUF
Time the Bus Must Be Free Before a 500 ns New Transmission Can Start
t
HD:STA
Start Condition Hold Time 250 ns
t
LOW
Clock LOW Period 500 ns
t
HIGH
Clock HIGH Period 500 ns
t
SU:STA
Start Condition Setup Time 250 ns
t
HD:DAT
Data In Hold Time 0 µs
t
SU:DAT
Data in Setup Time 250 ns
t
R
SDA and SCL Rise Time 1 µs
t
F
SDA and SCL Fall Time 300 ns
t
SU:STO
Stop Condition Setup Time 250 ns
t
DH
Data Out Hold Time 50 ns
3830 PGM T08.1
A.C. CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.) Read & Write Cycle Limits
3830 FHD F08.2
5V
2.16K
100pF
OUTPUT
3.07K
Page 8
8
X24001
Bus Timing
t
SU:STA
t
HD:STAtHD:DAT
t
SU:DAT
t
LOW
t
SU:STO
t
R
t
BUF
SCL
SDA IN
SDA OUT
t
DH
t
AA
t
F
t
HIGH
3830 FHD F09
WRITE CYCLE LIMITS
Symbol Parameter Min. Max. Units
t
WR
(4)
Write Cycle Time 5 ms
3830 PGM T09
Write Cycle Timing
Note: (3) t
PUR
and t
PUW
are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters
are periodically sampled and not 100% tested.
(4) The write cycle time is the time from the initiation of a write sequence to the end of the internal erase/program cycle. During the
write cycle, the X24001 bus interface circuits are disabled, SDA is high impedance, and the device does not respond to start conditions.
3830 ILL F10.1
SDA
t
WR
SCL
D0
START CONDTION
X24001 ADDRESS
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X24001
9
PACKAGING INFORMATION
0.118 ± 0.002 (3.00 ± 0.05)
0.040 ± 0.002 (1.02 ± 0.05)
0.150 (3.81) REF.
0.193 (4.90) REF.
0.030 (0.76)
0.036 (0.91)
0.032 (0.81)
0.007 (0.18)
0.005 (0.13)
0.008 (0.20)
0.004 (0.10)
0.0216 (0.55)
7° TYP
R 0.014 (0.36)
0.118 ± 0.002 (3.00 ± 0.05)
0.012 + 0.006 / -0.002 (0.30 + 0.15 / -0.05)
0.0256 (0.65) TYP
8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M
NOTE:
1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
3926 ILL F49
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10
X24001
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
0.020 (0.51)
0.016 (0.41)
0.150 (3.81)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
0.430 (10.92)
0.360 (9.14)
0.300
(7.62) REF.
PIN 1 INDEX
0.145 (3.68)
0.128 (3.25)
0.025 (0.64)
0.015 (0.38)
PIN 1
SEATING
PLANE
0.065 (1.65)
0.045 (1.14)
0.260 (6.60)
0.240 (6.10)
0.060 (1.52)
0.020 (0.51)
TYP. 0.010 (0.25)
0°
15°
8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
HALF SHOULDER WIDTH ON
ALL END PINS OPTIONAL
0.015 (0.38) MAX.
0.325 (8.25)
0.300 (7.62)
PACKAGING INFORMATION
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X24001
11
PACKAGING INFORMATION
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
0.014 (0.35)
0.019 (0.49)
PIN 1
PIN 1 INDEX
0.010 (0.25)
0.020 (0.50)
0.050 (1.27)
0.188 (4.78)
0.197 (5.00)
0.004 (0.19)
0.010 (0.25)
0.053 (1.35)
0.069 (1.75)
(4X) 7°
0.016 (0.410)
0.037 (0.937)
0.0075 (0.19)
0.010 (0.25)
0° – 8°
X 45°
3926 FHD F22.1
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.250"
0.050" TYPICAL
0.050" TYPICAL
0.030"
TYPICAL
8 PLACES
FOOTPRINT
Page 12
12
X24001
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness tor any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied.
US. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use as critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its satety or effectiveness.
X24001 X
X
Blank = 8-Lead SOIC P = 8-Lead Plastic DIP
Blank = 5V ±10%, 0°C to +70°C I = 5V ±10%, –40°C to +85°C M = 5V ±10%, –55°C to +85°C D = 3V to 5.5V, 0°C to +70°C E = 3V to 5.5V, –40°C to +85°C F = 2.7V to 5.5V, 0°C to +70°C G = 2.7V to 5.5V, –40°C to +85°C
ORDERING INFORMATION
Device
X24001 X X -X
VCC Range
Blank = 5V ±10% 3 = 3V to 5.5V
2.7 = 2.7V to 5.5V
Temperature Range
Blank = 0°C to +70°C I = –40°C to +85°C M = –55°C to +125°C
Package
M = 8-Lead MSOP P = 8-Lead Plastic DIP S = 8-Lead SOIC
Part Mark Convention
Page 13
X24001
13
X24001 PROGRAMMING ORDER INFORMATION
Address
Data Pattern MSB First
6
7 543210 0 1 2 3 4 5 6 7 8 9
A B C D E F
Matrix A
Address
Data Pattern MSB First
6
7 543210 0 1 2 3 4 5 6 7 8 9
A B C D E
F
Matrix B
Customer Name: ......................................................
Address: ...................................................................
..............................................................................
..............................................................................
Complete Device Part Number: .................................
Static Pattern Fill in matrix A below
Incrementing Pattern Indicate in Matix A any static pattern and indicate in Matrix B beginning sequence value to be incremented.
Totally Random Pattern
AUTHORIZATION
Programming Information Supplied By
Print or Type Clearly Full Name
Title
Signature Date
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