Datasheet X0202MA Specification

Page 1
X02
1.25 A sensitive gate SCR
Features
on-state rms current: 1.25 A
repetitive peak off-state voltage: 600 V and
gate triggering current:
50 and 200 µA
Applications
ground fault circuit interrupters
overvoltage crowbar protection in power
supplies
capacitive ignition circuits
Description
The X02 SCR can be used as the on/off function in applications where topology does not offer high current for gate triggering.
This device is optimized in forward voltage drop and inrush current capabilities for reduced power losses and high reliability in harsh environments.
A
A
K
SOT-223
X02xxN
G
G
K
G
SMBflat-3L
X0202NUF
A
K
A
G
K
TO-92
X02xxA
A

Table 1. Device summary

Vol tag e
Order code
Sensitivity µA Package
600 V 800 V
X0202MA Y 200 TO-92
X0202MN Y 200 SOT-223
X0202NA Y 200 TO-92
X0202NN Y 200 SOT-223
X0205MA Y 50 TO-92
X0205NA Y 50 TO-92
X0202NUF Y 200 SMBflat-3L
January 2011 Doc ID 7480 Rev 4 1/11
www.st.com
11
Page 2
Characteristics X02

1 Characteristics

Table 2. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified)
Symbol Parameter Value Unit
TO-92 T
I
T(RMS)
On-state rms current (180 °Conduction angle)
SMBflat-3L T
TO-92 T
IT
Average on-state current (180 °Conduction angle)
(AV)
SMBflat-3L T
t
= 8.3 ms
I
TSM
di/dt
I
P
G(AV)
T
Table 3. Electrical characteristics (TJ = 25 °C unless otherwise specified)
Non repetitive surge peak on-state current
²
tI²t Value for fusing tp = 10 ms Tj = 25 °C 2.5 A2s
I
Critical rate of rise of on-state current I
= 2 x IGT , tr 100 ns
G
Peak gate current tp = 20 µs Tj = 125 °C 1.2 A
GM
Average gate power dissipation Tj = 125 °C 0.2 W
Storage junction temperature range
stg
T
Operating junction temperature range
j
p
= 10 ms 22.5
t
p
F = 60 Hz T
= 63 °C
L
= 99 °C
tab
= 111 °C
tab
= 63 °C
L
= 99 °C
tab
= 111 °C
tab
1.25 ASOT-223 T
0.8 ASOT-223 T
25
= 25 °C
T
j
= 125 °C 50 A/µs
j
- 40 to + 150
- 40 to + 125
A
°C
Symbol Test conditions X0202 X0205 Unit
I
GT
VD = 12 V, RL = 140 Ω
V
GT
V
V
dV/dt V

Table 4. Static electrical characteristics

VD = V
GD
RG
I
I
H
L
DRM, RL
IRG = 10 µA Min. 8 V
IT = 50 mA, RGK = 1 kΩ Max. 5 mA
IG = 1 mA, RGK = 1 kΩ Max. 6 mA
= 67% V
D
= 3.3 kΩ , RGK = 1 kΩ Tj = 125 °C Min. 0.1 V
DRM, RGK
= 1 kΩ Tj = 110 °C Min. 10 15 V/µs
Symbol Test conditions X0202 X0205 Unit
V
TM
V
TO
R
I
DRM IRRMVDRM
ITM = 2.5 A, tp = 380 µs Tj = 25 °C
Threshold voltage
Dynamic resistance 200 mΩ
d
= V
RRM, RGK
= 1 kΩ
Min. 20
Max. 200 50
Max. 0.8 V
1.45 V
0.9 V
= 125 °C
T
j
T
= 25 °C 5 µA
j
= 125 °C 500
T
j
Max.
µA
µA
2/11 Doc ID 7480 Rev 4
Page 3
X02 Characteristics

Table 5. Thermal resistances

Symbol Parameter Value Unit
R
R
R
th(j-l)
th(j-t)
th(j-t)
Junction to leads (DC) TO-92
60
Junction to tab (DC) SOT-223 25
Junction to tab (DC) SMBflat-3L 14
Max.
TO-92 150
R
th(j-a)
Junction to ambient (DC)
S = 5 cm
SOT-223 60
2
SMBflat-3L 75
P(W)
dissipation versus average on-state current (full cycle)
360°
α
α = 180°
I (A)
T(AV)
Figure 2. Average and DC on-state current
versus tab (SOT-223, SMBflat-3L) or lead (TO-92) temperature
I (A)
T(AV)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
D.C.(TO-92)
α = 180° (TO-92)
α = 180° (SOT-223)
T or T (°C)
lead tab
0 25 50 75 100 125
D.C.(SOT-223)
α = 180° (SMBflat-3L)
D.C.(SMBflat-3L)
Figure 1. Maximum average power
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
°C/W
Figure 3. Average and DC on-state current
versus ambient temperature
I (A)
T(AV)
1.4
1.2
D.C.(SMBflat-3L)
1.0
0.8
0.6
α = 180° (TO-92)
0.4
0.2
0.0
0 25 50 75 100 125
D.C.(TO-92)
α = 180° (SOT-223)
T (°C)
amb
D.C.(SOT-223)
α = 180° (SMBflat-3L)
Figure 4. Relative variation of thermal
impedance junction to ambient versus pulse duration
K=[Z /R
1.00
th(j-a) th(j-a)
0.10
0.01
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
SOT-223
TO-92
]
SMBflat-3L
t (s)
p
Doc ID 7480 Rev 4 3/11
Page 4
Characteristics X02
Figure 5. Relative variation of triggering,
holding and latching current versus junction temperature
I,I,I[T] /
GT H L j
1.50
1.25
1.00
0.75
0.50
0.25
0.00
-40 -20 0 20 40 60 80 100 120 140
I ,I ,I [T =25°C]
GT H L j
T (°C)
j
Typical values
IH& I
R = 1k
GK
I
GT
L
Ω
Figure 7. Relative variation of dV/dt immunity
versus gate-cathode resistance (typical values)
dV/dt[R ] / dV/dt[ =1k ]GKΩ
10.0
1.0
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
R
GK
R(k)GKΩ
Tj= 125°C
V = 0.67 x V
D DRM
Figure 6. Relative variation of holding
current versus gate-cathode resistance (typical values)
I [R ] / I [ =1k ]
HGK HΩRGK
4.0
3.5
Tj=25
3.0
2.5
2.0
1.5
1.0
0.5
0.0
R(k)GKΩ
1.E-02 1.E-01 1.E+00 1.E+01
Figure 8. Relative variation of dV/dt immunity
versus gate-cathode capacitance (typical values)
dV/dt[C ] / dV/dt[ =1k ]GKΩ
20
V = 0.67 x V
D DRM
18
T
= 125°C
j
Ω
R = 1k
GK
16
14
12
10
8
6
4
2
0
0
24
R
GK
C (nF)
GK
6810
12 14
16 18 20
22
Figure 9. Surge peak on-state current
versus number of cycles
I (A)
TSM
25
20
15
10
Repetitive
T =25°C
5
0
1 10 100 1000
amb
Non repetitive T initial=25°C
j
4/11 Doc ID 7480 Rev 4
t =10ms
p
One cycle
Number of cycles
Figure 10. Non repetitive surge peak on state
current for a sinusoidal pulse and
2
T
T initial = 25°C
j
I
TSM
2
I t
1.00 10.000.100.01
I (A), I t (A s)
TSM
300
dI/dt limitation
100
10
1
corresponding value of I
22
t (ms)
p
Page 5
X02 Ordering information scheme
Figure 11. On-state characteristics (maximum
Figure 12. Thermal resistance junction to
values)
3E+1
1E+1
1E+0
1E-1
I (A)
TM
R =200m
T max.:
j
V =0.9V
t0
d
Tj=max
Ω
T=25°C
j
V (V)
TM
2.0 2.5 3.0 3.5 4.0 4.51.51.00.5
R (°C/W)
170 160 150 140 130 120 110 100
90 80 70 60 50
012345

2 Ordering information scheme

Figure 13. Ordering information scheme

ambient versus copper surface under tab (SOT-223, SMBflat-3L)
th(j-a)
Epoxy printed circuit board FR4, copper thickness 35 µm
SMBF3L (typical)
SOT-223
(maximum)
S(cm²)
X 02 02 M Z
Blank
1BA2
Sensitive SCR series
Current
02 = 1.25 A
Sensitivity
02 = 200 µA 05 = 50 µA
Voltage
M = 600 V N = 800 V
Package
A = TO-92 (A"Blank") N = SOT-223 (N"No Blank”) UF = SMBF3L
Packing mode
1BA2 = Bulk 2BL2 = Ammopack 5BA4 = Tape and reel 7” (SOT-223) Blank = Tape and reel 13” (SMBflat-3L)
Doc ID 7480 Rev 4 5/11
Page 6
Package information X02

3 Package information

Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK specifications, grade definitions and product status are available at: www.st.com ECOPACK

Table 6. TO-92 dimensions

®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
.
Dimensions
Ref
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A
B
C
A1.35 0.053
a
B 4.70 0.185
C2.54 0.100
F
DE
D 4.40 0.173
E 12.70 0.500
F 3.70 0.146
a 0.50 0.019
6/11 Doc ID 7480 Rev 4
Page 7
X02 Package information

Table 7. SOT-223 dimensions

Dimensions
Ref.
A
A1
e1
D
B1
V
B
c
A1.800.071
A1 0.02 0.10 0.001 0.004
B 0.60 0.70 0.85 0.024 0.027 0.033
B1 2.90 3.00 3.15 0.114 0.118 0.124
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
c 0.24 0.26 0.35 0.009 0.010 0.014
(1)
6.30 6.50 6.70 0.248 0.256 0.264
E
H
1243
D
e 2.3 0.090
e1 4.6 0.181
(1)
3.30 3.50 3.70 0.130 0.138 0.146
e
E
H 6.70 7.00 7.30 0.264 0.276 0.287
V 10° max
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)

Figure 14. SOT-223 footprint

3.25
1.32
5.16
7.80
1.32
2.30 0.95
Doc ID 7480 Rev 4 7/11
Page 8
Package information X02

Table 8. SMBflat-3L dimensions

Dimensions
A
c
D
L 2x
e
b 2x
L2 2x
L1
E
E1
L
L1
L2
b4

Figure 15. SMBflat-3L footprint dimensions

0.51
(0.020)
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 0.35 0.65 0.014 0.026
b4 1.95 2.20 0.07 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.40 0.016
L2 0.60 0.024
e 1.60 0.063
5.84
(0.230)
2.07
(0.082)
0.51
(0.020)
1.20
(0.047)
millimeters
(inches)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
8/11 Doc ID 7480 Rev 4
Page 9
X02 Package information

Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)

5.84
3.42
3.25
2.92
0.61
1.47
0.51
1.32
0.46
1.50
SMBF3L
SMBF3L
SOT-223
1.19
1.32
1.30
1.20
1.08
1.19
2.07
SOT-223
SOT-223
2.30
0.85
0.95
1.10
1.35
1.20
1.08
SMBF3L
SOT-223
1.95
2.07
2.22
7.80
Solder resist
Solder lands
Solder paste
Connector line
Doc ID 7480 Rev 4 9/11
Page 10
Ordering information X02

4 Ordering information

Table 9. Ordering information

Order code Marking Package Weight Base qty Delivery mode
X0202MA 1BA2 X0202 MA TO-92 0.2 g 2500 Bulk
X0202MA 2BL2 X0202 MA TO-92 0.2 g 2000 Ammopack
X0202MN5BA4 X2M SOT-223 0.12 g 1000 Tape and reel
X0202NA 1BA2 X0202 NA TO-92 0.2 g 2500 Bulk
X0202NA 2BL2 X0202 NA TO-92 0.2 g 2000 Ammopack
X0202NN5BA4 X2N SOT-223 0.12 g 1000 Tape and reel
X0205MA 1BA2 X0205 MA TO-92 0.2 g 2500 Bulk
X0205MA 2BL2 X0205 MA TO-92 0.2 g 2000 Ammopack
X0205NA 1BA2 X0205 NA TO-92 0.2 g 2500 Bulk
X0202NUF X2N SMBflat-3L 46.914 mg 5000 Tape and reel

5 Revision history

Table 10. Document revision history

Date Revision Changes
Sep-2000 3 Previous issue
14-Jan-2011 4 Added SMBflat-3L package and ECOPACK statement.
10/11 Doc ID 7480 Rev 4
Page 11
X02
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Doc ID 7480 Rev 4 11/11
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