Datasheet X006 Datasheet (ST)

Features

■ I

■ V

■ I

Description

= 0.8 A

T(RMS)

DRM/VRRM

= 200 µA

GT

X006

0.8 A sensitive gate SCRs

A

= 600 V

G

K

Thanks to highly sensitive triggering levels, the
X006 SCR series is suitable for all applications
where the available gate current is limited, such
as ground fault circuit interrupters, overvoltage
crowbar protection in low power supplies,
capacitive ignition circuits, etc.

Available in though-hole or surface-mount
packages, these devices are optimized in forward
voltage drop and inrush current capabilities, for
reduced power losses and high reliability in harsh
environments.

K

G

A

TO-92

(X00602A)

A

G

A

K

SOT-223

(X00602N)

April 2008 Rev 5 1/9

www.st.com

9

Characteristics X006

1 Characteristics

Table 1. Absolute ratings (limiting values)

Symbol Parameter Value Unit

I

T(RMS)

RMS on-state current (180 °Conduction angle)

SOT-223 T

TO-92 T

TO-92 T

IT

I

TSM

dI/dt

I

P

G(AV)

T

Table 2. Electrical characteristics

Average on-state current (180 °Conduction angle)

(AV)

Non repetitive surge peak on-state current

²

I

tI²t Value for fusing tp = 10 ms Tj = 25 °C 0.4 A

Critical rate of rise of on-state current
I

= 2 x IGT , tr ≤ 100 ns

G

Peak gate current tp = 20 µs Tj = 125 °C 1 A

GM

SOT-223 T

= 8.3 ms

t

p

= 10 ms 9

t

p

F = 60 Hz T

Average gate power dissipation Tj = 125 °C 0.1 W

Storage junction temperature range

stg

T

Operating junction temperature range

j

= 85 °C

l

= 100 °C

tab

= 85 °C

l

= 100 °C

tab

0.8 A

0.5 A

10

T

= 25 °C

j

= 125 °C 50 A/µs

j

- 40 to + 150

- 40 to + 125

Symbol Test Conditions Value Unit

A

°C

2

S

I

GT

V

GT

V

GD

V

RGIRG

I

H

I

L

dV/dt V

V

TM

V

t0

R

d

I

DRM

I

RRM

MIN. 15

µA

VD = 12 V, RL = 140 Ω

MAX. 200

MAX. 0.8 V

VD = V

DRM, RL

= 3.3 kΩ , RGK = 1 kΩ Tj = 125 °C MIN. 0.2 V

= 10 µA MIN. 5 V

IT = 50 mA, RGK = 1 kΩ MAX. 5 mA

IG = 1 mA, RGK = 1 kΩ MAX. 6 mA

= 67% V

D

DRM, RGK

= 1 kΩ Tj = 125 °C MIN. 25 V/µs

ITM = 1 A, tp = 380 µs Tj = 25 °C MAX. 1.35 V

Threshold voltage Tj = 125 °C MAX. 0.85 V

Dynamic resistance Tj = 125 °C MAX. 245 mΩ

T

= 25 °C MAX. 1

V

DRM

= V

RRM , RGK

= 1 kΩ

j

Tj = 125 °C MAX. 100

µA

2/9

X006 Characteristics

Table 3. Thermal resistances

Symbol Parameter Value Unit

TO-92 150

R

th(j-a)

R

th(j-l)

R

th(j-t)

Figure 1. Maximum average power

Junction to ambient (DC)

S = 5 cm

2

SOT-223 60

Junction to lead (DC) TO-92 70

Junction to tab (DC) SOT-223 30

Figure 2. Average and DC on-state current

dissipation versus average on-state

versus case temperature (TO-92)

current

P(W)

0.6

α = 180°

0.5

0.4

0.3

0.2

0.1

I (A)

0.0

0.0 0.1 0.2 0.3 0.4 0.5 0.6

T(AV)

360°

α

Figure 3. Average and D.C. on-state current

versus ambient temperature (epoxy

I (A)

T(AV)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125

D.C.

= 180°

α

T (°C)

l

TO-92

Figure 4. Average and DC on-state current

versus case temperature (SOT-223)
printed circuit board FR4, copper
thickness = 35 µm, S

= 0.5 cm2)

CU

(TO-92)

°C/W

I (A)

T(AV)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125

α

= 180°

D.C.

T (°C)

amb

TO-92

S = 0.5 cm

CU

I (A)

T(AV)

1.0

2

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125

D.C.

= 180°

α

T (°C)

tab

3/9

SOT-223

Characteristics X006

Figure 5. Average and DC on-state current

versus ambient temperature (epoxy
PCB FR4, copper
thickness = 35 µm, S

= 5 cm2)

CU

(SOT-223)

I (A)

T(AV)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0 25 50 75 100 125

α

= 180°

D.C.

T (°C)

amb

SOT-223

S = 0.5 cm

CU

2

Figure 7. Relative variation of thermal

impedance junction to ambient
versus pulse duration (PCB FR4,
copper thickness = 35 µm, S

2

cm

) (SOT-223)

Z/R

th(j-a) th(j-a)

1.00

SOT-223

2

S = 0.5 cm

CU

0.10

t (s)

0.01

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

p

CU

= 0.5

Figure 9. Relative variation of gate trigger

current, holding current and
latching current versus junction
temperature (typical values)

I,I,I[T] /

GT H L j

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130

I ,I ,I [T =25°C]

GT H L j

T (°C)

j

IH& I

L

I

GT

Figure 6. Relative variation of thermal

impedance junction to ambient

versus pulse duration (PCB FR4,

copper thickness = 35 µm, S

2

) (TO-92)

cm

Z/R

th(j-a) th(j-a)

1.00

0.10

0.01

TO-92

2

S = 0.5 cm

CU

t (s)

p

1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03

CU

Figure 8. Thermal resistance junction to

ambient versus copper surface

under tab (PCB FR4, copper

thickness = 35 µm) (SOT-223)

R (°C/W)

th(j-a)

130

120

110

100

90

80

70

60

50

40

30

20

10

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

S(cm²)

Figure 10. Relative variation of holding

current versus gate-cathode

resistance (typical values)

I [R ] / I [ =1k ]

HGK HΩRGK

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02

R(k)GKΩ

= 0.5

4/9

X006 Characteristics

Figure 11. Relative variation of dV/dt immunity

versus gate-cathode resistance
(typical values)

dV/dt[R ] / dV/dt[ =1k ]

100.0

10.0

1.0

0.1

1.0E-01 1.0E+00 1.0E+01

GK

GK

ΩR

R(k)GKΩ

V = 0.67 xV

D DRM

Figure 13. Surge peak on-state current versus

number of cycles

I (A)

TSM

10

9

8

7

6

5

4

3

2

1

0

1 10 100 1000

Repetitive

T =25°C

C

Non repetitive
T initial=25°C

j

Number of cycles

t =10ms

p

One cycle

Figure 12. Relative variation of dV/dt immunity

versus gate-cathode capacitance

(typical values)

dV/dt[C ] / dV/dt[ =1k ]GKΩR

100

10

1

1 10

GK

C (nF)

GK

V = 0.67 xV

D DRM

R = 1k

GK

Ω

Figure 14. Non repetitive surge peak on-state

current for a sinusoidal pulse with

width t

value of I

TSM

22

I (A), I t (A s)

1.E+02

1.E+01

1.E+00

1.E-01

0.01 0.10 1.00 10.00

< 10ms, and corresponding

P

2

t

T initial = 25°C

j

I

TSM

2

I t

t (ms)

p

Figure 15. On-state characteristics (maximum values)

I (A)

TM

10.00

1.00

0.10

0.01

T max.:

j

V =0.85V

t0

Ω

R =245m

d

Tj=125°C

T=25°C

j

V (V)

TM

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

5/9

Ordering information scheme X006

2 Ordering information scheme

Figure 16. Ordering information scheme

Sensitive SCR series

Current

006 = 0.8 A

Sensitivity

02 = 200 µA

Voltage

M = 600 V

Package

A = TO-92 (A"Blank")
N = SOT-223 (N"No Blank”)

Packing mode

1AA2 = Bulk
2AL2 = Ammopack
5AL2 = Tape & reel (TO-92)
5BA4 = Tape & reel (SOT-223)

X 006 02 M Z 1AA2

Blank

6/9

X006 Package information

3 Package information

● Epoxy meets UL94, V0

®

In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.

Table 4. TO-92 (plastic) dimensions

Dimensions

A

B

C

F

Table 5. SOT-223 dimensions

A

A1

e1

D

B1

E

H

1243

e

DE

V

B

Ref.

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 1.35 0.053

a

B 4.70 0.185

C 2.54 0.100

D 4.40 0.173

E 12.70 0.500

F 3.70 0.146

a 0.50 0.019

Dimensions

Ref.

c

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 1.80 0.071

A1 0.02 0.10 0.001 0.004

B 0.60 0.70 0.85 0.024 0.027 0.033

B1 2.90 3.00 3.15 0.114 0.118 0.124

c 0.24 0.26 0.35 0.009 0.010 0.014

(1)

6.30 6.50 6.70 0.248 0.256 0.264

D

e2.3 0.090

e1 4.6 0.181

(1)

3.30 3.50 3.70 0.130 0.138 0.146

E

H 6.70 7.00 7.30 0.264 0.276 0.287

V10° max

1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)

7/9

Ordering information X006

Figure 17. SOT-223 footprint (dimensions in mm)t

3.25

1.32

7.805.16

1.32

2.30 0.95

4 Ordering information

Table 6. Ordering information

Order code Marking Package Weight Base qty Delivery mode

X00602MA 1AA2

X00602MA 2AL2 2000 Ammopack

X0602 MA TO-92 0.2 g

X00602MA 5AL2 2000

X00602MN5BA4 X06 2M SOT-223 0.12 g 1000

5 Revision history

Table 7. Document revision history

Date Revision Changes

Jan-2002 3 Last update.

08-Aug-2006 4 SOT-223 package added.

1-Apr-2008 5

2500 Bulk

Tape and reel

Reformatted to current standards. Device X00605 removed.
Updated dimensions in Ta b l e 5 .

8/9

X006

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