
WS128K64V-XG4WX
128Kx64 3.3V SRAM MODULE
ADVANCED*
FEATURES
■ Access Times of 15, 17, 20, 25ns
■ Packaging
•116 lead, 40mm square, Hermetic CQFP (Package 504)
■ Organized as 128Kx64, User Configurable as 256Kx32,
512Kx16 or 1Mx8.
■ Commercial, Industrial and Military Temperature Ranges
■ 3 Volt Power Supply
■ Low Power CMOS
FIG. 1 PIN CONFIGURATION FOR WF128K64V-XG4WX
TOP VIEW
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O2I/O1I/O0VCCWE2CS2NC
1514131211
16
3
17
4
18
5
19
6
20
7
21
22
8
23
9
24
10
25
11
26
12
27
13
28
14
29
15
30
31
16
32
17
33
18
34
19
35
20
36
21
37
22
38
23
39
40
24
41
25
42
26
43
27
44
28
4546474849505152535455565758596061626364656667686970717273
A0A1A2A3A4WE1CS1NC
987654321
10
CS8WE8A5A6A7A8A9NC
116
115
114
113
112
111
110
109
CS7WE7VCCI/O63I/O62I/O
108
107
106
105
104
102
101
100
61
103
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
■ 2V Data Retention Devices Available (Low Power Version)
■ TTL Compatible Inputs and Outputs
■ Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
■ Weight
WF128K64V-XG4WX - 20 grams typical
* This data sheet describes a product that may or may not be under
development and is subject to change or cancellation without notice.
Note: Programming information available upon request.
BLOCK DIAGRAM
A
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
0-16
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
WE
1
128K x 8
8
I/O
0-7
1
OE
WE
CS
1
2
128K x 8
8
I/O
8-15
CS
2
2
PIN DESCRIPTION
I/O0-63 Data Inputs/Outputs
A0-16 Address Inputs
WE1-8 Write Enables
CS1-8 Chip Selects
OE Output Enable
VCC Power Supply
GND Ground
NC Not Connected
WE
CS
x
......
8
I/O...
WE
8
128K x 8
8
I/O
56-63
8
CS
x
8
September 1998
I/O29I/O30I/O
3
3
31
CC
NCNCNC
CS
V
WE
NC
16A15
A
4
WE
4
CS
OE
5WE5
CS
A14A13A12A11A
6
6
10
NC
CS
WE
CC
V
I/O32I/O33I/O
1
34
White Microelectronics • Phoenix, AZ • (602) 437-1520

Parameter Symbol Min Max Unit
Operating Temperature T
Storage Temperature T
Signal Voltage Relative to GND V
Junction Temperature T
Supply Voltage V
A -55 +125 °C
STG -65 +150 °C
G -0.5 4.6 V
J 150 °C
CC -0.5 4.6 V
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Max Unit
Supply Voltage V
Input High Voltage V
Input Low Voltage V
Operating Temp. (Mil.) T
CC 3.0 3.6 V
IH 2.2 VCC + 0.3 V
IL -0.3 +0.8 V
A -55 +125 °C
DC CHARACTERISTICS
(VCC = 3.3V ± 0.3V, TA = -55°C to +125°C)
WS128K64V-XG4WX
TRUTH TABLEABSOLUTE MAXIMUM RATINGS
CS OE WE Mode Data I/O Power
H X X Standby High Z Standby
L L H Read Data Out Active
L X L Write Data In Active
L H H Out Disable High Z Active
CAPACITANCE
A = +25°C)
(T
Parameter
OE capacitance COE
WE capacitance CWE
CS capacitance CCS
Data I/O capacitance CI/O
Address input capacitance C
This parameter is guaranteed by design but not tested.
Symbol
ADVIN
Conditions Max Unit
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
VIN = 0 V, f = 1.0 MHz
V
I/O
= 0 V, f = 1.0 MHz
= 0 V, f = 1.0 MHz
100 pF
20 pF
20 pF
20 pF
100 pF
Parameter Sym Conditions Units
Min Max
Input Leakage Current ILI VIN = GND to VCC 10 µA
Output Leakage Current ILO CS = VIH, OE = VIH, VOUT = GND to VCC 10 µA
Operating Supply Current ICC CS = VIL, OE = VIH, f = 5MHz, Vcc = 3.6 1 A
Standby Current ISB CS = VIH, OE = VIH, f = 5MHz, Vcc = 3.6 64 mA
Output Low Voltage VOL IOL = 8mA 0.4 V
Output High Voltage V
NOTE: DC test conditions: V
IH = VCC -0.3V, VIL = 0.3V
FIG. 2
AC TEST CIRCUIT
Current Source
OH IOH = -4.0mA 2.4 V
AC TEST CONDITIONS
I
OL
Parameter Typ Unit
Input Pulse Levels VIL = 0, VIH = 2.5 V
Input Rise and Fall 5 ns
Input and Output Reference Level 1.5 V
D.U.T.
C = 50 pf
eff
Current Source
I
OH
V ≈ 1.5V
Z
(Bipolar Supply)
Output Timing Reference Level 1.5 V
NOTES:
V
Z is programmable from -2V to +7V.
OL & IOH programmable from 0 to 16mA.
I
Tester Impedance Z
V
Z is typically the midpoint of VOH and VOL.
OL & IOH
are adjusted to simulate a typical resistive load circuit.
I
ATE tester includes jig capacitance.
0 = 75 Ω.
White Microelectronics • Phoenix, AZ • (602) 437-1520
2

WS128K64V-XG4WX
AC CHARACTERISTICS
(VCC = 3.3V ± 0.3V, TA = -55°C To +125°C)
Parameter Symbol -15 -17 -20 -25 Units
Read Cycle Min Max Min Max Min Max
Read Cycle Time tRC 15 17 20 25 ns
Address Access Time tAA 15 17 20 25 ns
Output Hold from Address Change tOH 00 00ns
Chip Select Access Time tACS 15 17 20 25 ns
Output Enable to Output Valid tOE 10 10 12 15 ns
Chip Select to Output in Low Z tCLZ
Output Enable to Output in Low Z tOLZ
Chip Disable to Output in High Z tCHZ
Output Disable to Output in High Z t
1. This parameter is guaranteed by design but not tested.
Parameter Symbol -15 -17 -20 -25 Units
Write Cycle Min Max Min Max Min Max Min Max
Write Cycle Time tWC 15 17 20 25 ns
Chip Select to End of Write tCW 14 14 15 20 ns
Address Valid to End of Write tAW 14 14 15 20 ns
Data Valid to End of Write tDW 10 10 12 15 ns
Write Pulse Width tWP 14 14 15 20 ns
Address Setup Time tAS 0 000ns
Address Hold Time tAH 0 000ns
Output Active from End of Write tOW
Write Enable to Output in High Z tWHZ
Data Hold Time t
1. This parameter is guaranteed by design but not tested.
1
33 33ns
1
00 00ns
OHZ
1
1
10 10 12 12 ns
10 10 12 12 ns
AC CHARACTERISTICS
(V
CC
= 3.3V ± 0.3V, TA = -55°C To +125°C)
1
3 333ns
1
DH 0 000ns
10 10 12 15 ns
3
White Microelectronics • Phoenix, AZ • (602) 437-1520

FIG. 3
TIMING WAVEFORM - READ CYCLE
t
ADDRESS
t
DATA I/O
RC
t
AA
OH
WS128K64V-XG4WX
t
t
t
t
ACS
CLZ
RC
AA
t
CHZ
t
OE
t
OLZ
DATA VALID
t
OHZ
ADDRESS
CS
OE
DATA VALIDPREVIOUS DATA VALID
DATA I/O
HIGH IMPEDANCE
READ CYCLE 1 (CS = OE = V
FIG. 4
WRITE CYCLE - WE CONTROLLED
ADDRESS
CS
WE
DATA I/O
FIG. 5
WRITE CYCLE - CS CONTROLLED
ADDRESS
CS
, WE = VIH)
IL
t
WC
t
AW
t
CW
t
AS
WRITE CYCLE 1, WE CONTROLLED
t
WHZ
t
WP
t
WC
WS32K32-XHX
t
t
AS
AW
t
CW
t
DW
DATA VALID
READ CYCLE 2 (WE = V
t
AH
t
OW
t
DH
t
AH
)
IH
White Microelectronics • Phoenix, AZ • (602) 437-1520
WE
DATA I/O
t
WP
WRITE CYCLE 2, CS CONTROLLED
4
t
DW
DATA VALID
t
DH

WS128K64V-XG4WX
PACKAGE 504: 116 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G4W)
39.6 (1.56) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
Pin 1
12.7 (0.500)
± 0.5 (0.020)
4 PLACES
5.1 (0.200)
± 0.25 (0.010)
4 PLACES
4 PLACES
0.38 (0.015)
± 0.08 (0.003)
68 PLACES
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
1.27 (0.050)
REF
38 (1.50) REF
5.1 (0.200) MAX
1.27 (0.050)
± 0.1 (0.005)
0.25 (0.010)
± 0.05 (0.002)
W S 128K64 V - XXX G4W X
DEVICE GRADE:
M= Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to + 70°C
PACKAGE TYPE:
G4W = 116 Lead 40mm Ceramic Quad Flat Pack, CQFP (Package 504)
ACCESS TIME (ns)
Low Voltage Supply 3.3V
± 10%
ORGANIZATION, 128K x 64
User configurable as 256K x 32, 512K x 16 and 1M x 8
SRAM
WHITE MICROELECTRONICS
5
White Microelectronics • Phoenix, AZ • (602) 437-1520