• TMS320, (Q)SPI, and Microwire compatible serial
interface
• Programmable settling time of 4µµs or 12µµs typical
• High impedance reference input buffer
APPLICATIONS
• Battery powered test instruments
• Digital offset and gain adjustment
• Battery operated/remote industrial controls
• Machine and motion control devices
• Wireless telephone and communication systems
• Speech synthesis
• Arbitrary waveform generation
ORDERING INFORMATION
DEVICETEMP. RANGEPACKAGE
WM2616CD0° to 70°C8-pin SOIC
WM2616ID-40° to 85°C8-pin SOIC
DESCRIPTION
The WM2616 is a 12-bit voltage output, resistor string digital-toanalogue converter that can be powered down under software
control. Power down reduces current consumption to 10nA.
The device has been designed to interface efficiently to industry
standard microprocessors and DSPs, including the TMS320
family. The WM2616 is programmed with a 16-bit serial word
comprising 4 control bits and 12 data bits.
Excellent performance is delivered with a typical DNL of 0.5LSBs.
The settling time of the DAC is programmable to allow the designer
to optimize speed versus power dissipation. The output stage is
buffered by a x2 gain rail-to-rail amplifier, which features a Class
AB output stage.
The device is available in an 8-pin SOIC package. Commercial
temperature (0° to 70°C) and Industrial temperature (-40° to 85°C)
variants are supported.
NCSDigital inputChip select. This pin is active low.
FSDigital inputFrame synchronisation for serial input data.
AGNDSupplyAnalogue ground.
REFINAnalogue inputVoltage reference input.
OUTAnalogue outputDAC analogue output
VDDSupplyPositive power supply.
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or
beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to
damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this
device.
CONDITIONMINMAX
Supply voltage, VDD to AGND
Digital input voltage
Reference input voltage
Operating temperature range, T
Storage temperature
Lead temperature 1.6mm (1/16 inch) soldering for 10 seconds
A
WM2616CD
WM2616ID
-0.3VVDD + 0.3V
-0.3VVDD + 0.3V
0°C
-40°C
-65°C150°C
7V
70°C
85°C
260°C
RECOMMENDED OPERATING CONDITIONS
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNIT
Supply voltage
High-level digital input voltage
Low-level digital input voltage
Reference voltage to REFIN
Load resistance
Load capacitance
Serial clock rate
Operating free-air temperature
Note: Reference input voltages greater then VDD/2 will cause saturation for large DAC codes.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
VDD2.75.5V
V
f
V
V
REF
R
C
SCLK
T
IH
IL
L
L
A
VDD = 2.7V to 5.5V2V
VDD = 2.7V to 5.5V0.8V
See Note
210kΩ
WM2616CD070°C
WM2616ID-4085°C
VDD - 1.5V
100pF
20MHz
Page 3
Production Data Rev 1.0WM2616
ELECTRICAL CHARACTERISTICS
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V
temperature range (unless noted otherwise).
Resolution
Integral non-linearity
Differential non-linearity
Zero code error
Gain error
D.c. power supply rejection ratio
Zero code error temperature coefficient
Gain error temperature coefficient
DAC Output Specifications
Output voltage range
Output load regulation
Power Supplies
Active supply current
Power down supply current
Dynamic DAC Specifications
Slew rate
Settling time
Glitch energy
Signal to noise ratio
Signal to noise and distortion ratio
Total harmonic distortion
Spurious free dynamic range
= 2.048V and VDD = 3V ±± 10%, V
REF
= 1.024V over recommended operating free-air
REF
12bits
INLSee Note 1
DNLSee Note 2
±±1.9±±4
±±0.5±±1
ZCESee Note 32
GESee Note 40.1
±±10
±±0.6
LSB
LSB
mV
% FSR
d.c. PSRRSee Note 50.5mV/V
See Note 610ppm/°C
See Note 610ppm/°C
0VDD - 0.1V
2kΩ to 10kΩ load
0.10.25%
See Note 7
I
DD
No load, V
IH
VDD = 5V,
V
= 2.048V Slow
REF
VDD = 5V,
V
= 2.048V Fast
REF
VDD = 3V,
V
= 1.024V Slow
REF
VDD = 3V,
V
= 1.024V Fast
REF
= VDD, V
IL
= 0V
0.40.6mA
0.91.35mA
0.30.45mA
0.71.1mA
See Note 8
No load,
0.0110µA
all digital inputs 0V or VDD
See Note 9
DAC code 128 to 4095,
10%-90%
Slow
Fast
0.5
2.5
0.9
3.6
V/µs
V/µs
See Note 10
DAC code 128 to 4095
Slow
Fast
12.0
4.0
µs
µs
See Note 11
Code 2047 to 204810nV-s
SNRfs = 400ksps, f
= 1kHz,
OUT
6674dB
BW = 20kHz
See Note 12
SNRDfs = 400ksps, f
= 1kHz,
OUT
5466dB
BW = 20kHz
See Note 12
THDfs = 400ksps, f
= 1kHz,
OUT
-68-56dB
BW = 20kHz
See Note 12
SPFDRfs = 400ksps, f
= 1kHz,
OUT
5670dB
BW = 20kHz
See Note 12
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
3
Page 4
WM2616Production Data Rev 1.0
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V
temperature range (unless noted otherwise).
High level input current
Low level input current
Input capacitance
Notes:
1. Integral non-linearity (INL) is the maximum deviation of the output from the line between zero and full scale (excluding the effects of zero
code and full scale errors).
2. Differential non-linearity (DNL) is the difference between the measured and ideal 1LSB amplitude change of any adjacent two codes. A
guarantee of monotonicity means the output voltage changes in the same direction (or remains constant) as a change in digital input code.
3. Zero code error is the voltage output when the DAC input code is zero.
4. Gain error is the deviation from the ideal full scale output excluding the effects of zero code error.
5. Power supply rejection ratio is measured by varying VDD from 4.5V to 5.5V and measuring the proportion of this signal imposed on the
zero code error and the gain error.
6. Zero code error and Gain error temperature coefficients are normalised to full scale voltage.
7. Output load regulation is the difference between the output voltage at full scale with a 10kΩ load and 2kΩ load. It is expressed as a
percentage of the full scale output voltage with a 10kΩ load.
8. IDD is measured while continuously writing code 2048 to the DAC. For VIH < VDD - 0.7V and VIL > 0.7V supply current will increase.
9. Typical supply current in power down mode is 10nA. Production test limits are wider for speed of test.
10. Slew rate results are for the lower value of the rising and falling edge slew rates
11. Settling time is the time taken for the signal to settle to within 0.5LSB of the final measured value for both rising and falling edges. Limits
are ensured by design and characterisation, but are not production tested.
12. SNR, SNRD, THD and SPFDR are measured on a synthesised sinewave at frequency f
= 2.048V and VDD = 3V ±± 10%, V
REF
R
REFIN
C
REFIN
V
= 1VPP at 1kHz
REF
+ 1.024V dc, DAC code 0
V
= 0.2VPP + 1.024V dc
REF
DAC code 2048
Slow
Fast
I
IH
I
IL
C
I
Input voltage = VDD1µA
Input voltage = 0V-1µA
= 1.024V over recommended operating free-air
REF
10MΩ
5pF
-75dB
0.5
1.3
3pF
generated with a sampling frequency fs
OUT
MHz
MHz
.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
Page 5
Production Data Rev 1.0WM2616
SERIAL INTERFACE
t
t
WL
WH
SCLK
DIN
12345 1516
t
SUDtHD
t
SUCSFS
D0D1D12D13D14D15
t
SUC16CS
NCS
t
WHFS
t
SUFS
t
SUC16FS
FS
Figure 1 Timing Diagram
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V
= 2.048V and VDD = 3V ±± 10%, V
REF
= 1.024V over recommended operating free-air
REF
temperature range (unless noted otherwise).
SYMBOLTEST CONDITIONSMINTYPMAXUNIT
t
SUCSFS
t
SUFS
t
SUC16FS
Setup time NCS low before negative FS edge.
Setup time FS low before first negative SCLK edge.
Setup time, sixteenth negative SCLK edge after FS low
on which D0 is sampled before rising edge of FS.
10ns
8ns
10ns
Setup time, sixteenth positive SCLK edge (first positive
after D0 sampled) before NCS rising edge. If FS is used
t
SUC16CS
instead of the sixteenth positive edge to update the DAC,
10ns
then the setup time is between the FS rising edge and
the NCS rising edge.
t
t
t
t
WHFS
WH
WL
SUD
t
HD
Pulse duration, SCLK high.
Pulse duration, SCLK low.
Setup time, data ready before SCLK falling edge.
Hold time, data held valid after SCLK falling edge.
Pulse duration, FS high.
25ns
25ns
8ns
5ns
20ns
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
Figure 3 Sink Current VDD = 3VFigure 4 Sink Current VDD = 5V
2.06
2.055
2.05
2.045
2.04
VDD = 3V, V
= 1V, Input Code = 4095
REF
4.095
4.09
4.085
4.08
4.1
VDD = 5V, V
= 2V, Input Code = 4095
REF
Slow Fast
2.035
2.03
2.025
012345678910
ISOURCE - mA
Slow Fast
4.075
4.07
4.065
012345678910
ISOURCE - mA
Slow Fast
Figure 5 Source Current VDD = 3VFigure 6 Source Current VDD = 5V
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
Page 7
Production Data Rev 1.0WM2616
1
DEVICE DESCRIPTION
GENERAL FUNCTION
The device uses a resistor string network buffered with an op amp to convert 12-bit digital data to
analogue voltage levels (see Block Diagram). The output voltage is determined by the reference input
voltage and the input code according to the following relationship:
Output voltage =
INPUTOUTPUT
111111111111
::
100000000001
100000000000
011111111111
::
000000000001
0000000000000V
Table 1 Binary Code Table (0V to 2V
CODE
()
V2 REFIN
4096
()
REF
V2
()
V2 REF
2048
()
V2=
4096
()
REF
V2
()
V2 REF
Output), Gain = 2
REFIN
4095
4096
2049
4096
REFREFV
2047
4096
1
4096
POWER ON RESET
An internal power-on-reset circuit resets the DAC register to all 0s on power-up.
BUFFER AMPLIFIER
The output buffer has a near rail-to-rail output with short circuit protection and can reliably drive a 2kΩ
load with a 100pF load capacitance.
EXTERNAL REFERENCE
The reference voltage input is buffered which makes the DAC input resistance independent of code.
The REFIN pin has an input resistance of 10MΩ and an input capacitance of typically 5pF. The
reference voltage determines the DAC full-scale output.
SERIAL INTERFACE
Explanation of data transfer:
First, the device has to be enabled with NCS set to low. Then, a falling edge of FS starts shifting the
data bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK. After 16 bits
have been transferred, the next rising edge on SCLK or FS causes the content of the shift register to be
moved to the DAC latch which updates the voltage output to the new level.
The serial interface of the device can be used in two basic modes:
• four wire (with chip select)
• three wire (without chip select)
Using chip select (four wire mode), it is possible to have more than one device connected to the serial
port of the data source (DSP or microcontroller). If there is no need to have more than one device on the
serial bus, then NCS can be tied low.
SERIAL CLOCK AND UPDATE RATE
Figure 1 shows the device timing. The maximum serial rate is:
f
max = MHz20
SCLK
The digital update rate is limited to an 800ns period, or 1.25MHz frequency. However, the DAC settling
time to 12 bits limits the update rate for large input step transitions.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
+
=
tt
minWCLminWCH
7
Page 8
WM2616Production Data Rev 1.0
SOFTWARE CONFIGURATION OPTIONS
The 16 bits of data can be transferred with the sequence shown in Table 2. D11-D0 contains the 12-bit
data word. D14-D13 hold the programmable options.
D15 D14 D13 D12 D11 D10D9D8D7D6D5D4D3D2D1D0
xSPD PWRxNew DAC value (12 bits)
Table 2 Register Map
PROGRAMMABLE SETTLING TIME
Settling time is a software selectable 12µs or 4µs typical, to within ±0.5LSB of final value. This is
controlled by the value of D14. A ONE defines a settling time of 4µs, a ZERO defines a settling time of
12µs.
PROGRAMMABLE POWER DOWN
The power down function is controlled by D13. A ZERO configures the device as active, or fully
powered up, a ONE configures the device into power down mode. When the power down function is
released the device reverts to the DAC code set prior to power down.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
Page 9
Production Data Rev 1.0WM2616
PACKAGE DIMENSIONS
D: 8 PIN SOIC 3.9mm Wide Body
e
D
A1
A
B
58
41
EH
-C-
h x 45
α
DM009.B
L
o
Symbols
0.10 (0.004)
Dimensions
(mm)
SEATING PLANE
Dimensions
(Inches)
MINMAXMINMAX
A
A
1
B
C
D
e
E
h
H
L
αα
REF:
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
1.351.750.05320.0688
0.100.250.00400.0098
0.330.510.01300.0200
0.190.250.00750.0098
4.805.000.18900.1968
1.27 BSC0.050 BSC
3.804.000.14970.1574
0.250.500.00990.0196
5.806.200.22840.2440
0.401.270.01600.0500
o
0
o
8
o
0
o
8
JEDEC.95, MS-012
C
WOLFSON MICROELECTRONICS LTDProduction DataRev 1.0 June 1999
9
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