Datasheet WM2616ID, WM2616CD Datasheet (Wolfson)

Page 1
WM2616
DNL - LSB
12-bit Serial Input Voltage Output DAC
Production Data June 1999, Rev1.0
FEATURES
• 12-bit voltage output DAC
• Single supply from 2.7V to 5.5V
• DNL ±±0.5 LSB, INL ±±1.9 LSB
• Very low power consumption (3V supply):
- 900µµW, slow mode
- 2.1mW, fast mode
• TMS320, (Q)SPI, and Microwire compatible serial
interface
• Programmable settling time of 4µµs or 12µµs typical
• High impedance reference input buffer
APPLICATIONS
• Battery powered test instruments
• Digital offset and gain adjustment
• Battery operated/remote industrial controls
• Machine and motion control devices
• Wireless telephone and communication systems
• Speech synthesis
• Arbitrary waveform generation
ORDERING INFORMATION
DEVICE TEMP. RANGE PACKAGE
WM2616CD 0° to 70°C 8-pin SOIC
WM2616ID -40° to 85°C 8-pin SOIC
DESCRIPTION
The WM2616 is a 12-bit voltage output, resistor string digital-to­analogue converter that can be powered down under software control. Power down reduces current consumption to 10nA.
The device has been designed to interface efficiently to industry standard microprocessors and DSPs, including the TMS320 family. The WM2616 is programmed with a 16-bit serial word comprising 4 control bits and 12 data bits.
Excellent performance is delivered with a typical DNL of 0.5LSBs. The settling time of the DAC is programmable to allow the designer to optimize speed versus power dissipation. The output stage is buffered by a x2 gain rail-to-rail amplifier, which features a Class AB output stage.
The device is available in an 8-pin SOIC package. Commercial temperature (0° to 70°C) and Industrial temperature (-40° to 85°C) variants are supported.
BLOCK DIAGRAM TYPICAL PERFORMANCE
VDD
(8)
1
AVDD = DVDD = 5V, V
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1 0 512 1024 1536 2048 2559 3071 3583 4095
= 2.048V, Speed = Fast mode, Load = 10k/100pF
REF
DIGITAL CODE
REFIN(6)
DIN (1)
SCLK (2)
NCS (3)
FS (4)
16-BIT SHIFT
REGISTER
AND
CONTROL
LOGIC
POWER-ON
RESET
(5)
AGND
REFERENCE
INPUT BUFFER
X1
12-BIT
data
DAC
LATCH
2-BIT
CONTROL
LATCH
POWERDOWN/
SPEED
CONTROL
DAC OUTPUT BUFFER
X2
WM2616
(7) OUT
WOLFSON MICROELECTRONICS LTD
Lutton Court, Bernard Terrace, Edinburgh, EH8 9NX, UK Tel: +44 (0) 131 667 9386 Fax: +44 (0) 131 667 5176 Email: [email protected] http://www.wolfson.co.uk
Production Data Datasheets contain final
specifications current on publication date.
Supply of products conforms to Wolfson
Microelectronics’ Terms and conditions.
2616 master.doc June 17, 1999 14:13
1999 Wolfson Microelectronics Ltd.
Page 2
WM2616 Production Data Rev 1.0 PIN CONFIGURATION
DIN
SCLK
NCS
FS
1 2 3 4
VDD
8
OUT
7
REFIN
6
AGND
5
PIN DESCRIPTION
PIN NO NAME TYPE DESCRIPTION
1 2 3 4 5 6 7 8
DIN Digital input Serial data input.
SCLK Digital input Serial clock input.
NCS Digital input Chip select. This pin is active low.
FS Digital input Frame synchronisation for serial input data. AGND Supply Analogue ground. REFIN Analogue input Voltage reference input.
OUT Analogue output DAC analogue output VDD Supply Positive power supply.
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device.
CONDITION MIN MAX
Supply voltage, VDD to AGND Digital input voltage Reference input voltage Operating temperature range, T
Storage temperature Lead temperature 1.6mm (1/16 inch) soldering for 10 seconds
A
WM2616CD WM2616ID
-0.3V VDD + 0.3V
-0.3V VDD + 0.3V 0°C
-40°C
-65°C 150°C
7V
70°C 85°C
260°C
RECOMMENDED OPERATING CONDITIONS
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
Supply voltage High-level digital input voltage
Low-level digital input voltage Reference voltage to REFIN Load resistance Load capacitance
Serial clock rate Operating free-air temperature
Note: Reference input voltages greater then VDD/2 will cause saturation for large DAC codes.
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
VDD 2.7 5.5 V
V
f
V V
REF
R C
SCLK
T
IH
IL
L
L
A
VDD = 2.7V to 5.5V 2 V VDD = 2.7V to 5.5V 0.8 V
See Note
2 10 kΩ
WM2616CD 0 70 °C
WM2616ID -40 85 °C
VDD - 1.5 V
100 pF
20 MHz
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Production Data Rev 1.0 WM2616
ELECTRICAL CHARACTERISTICS
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V temperature range (unless noted otherwise).
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Static DAC Specifications
Resolution Integral non-linearity Differential non-linearity Zero code error Gain error D.c. power supply rejection ratio Zero code error temperature coefficient Gain error temperature coefficient
DAC Output Specifications
Output voltage range Output load regulation
Power Supplies
Active supply current
Power down supply current
Dynamic DAC Specifications
Slew rate
Settling time
Glitch energy Signal to noise ratio
Signal to noise and distortion ratio
Total harmonic distortion
Spurious free dynamic range
= 2.048V and VDD = 3V ±± 10%, V
REF
= 1.024V over recommended operating free-air
REF
12 bits
INL See Note 1
DNL See Note 2
±±1.9 ±±4 ±±0.5 ±±1
ZCE See Note 3 2
GE See Note 4 0.1
±±10
±±0.6
LSB LSB
mV
% FSR
d.c. PSRR See Note 5 0.5 mV/V
See Note 6 10 ppm/°C See Note 6 10 ppm/°C
0 VDD - 0.1 V
2kΩ to 10kΩ load
0.1 0.25 %
See Note 7
I
DD
No load, V
IH
VDD = 5V,
V
= 2.048V Slow
REF
VDD = 5V,
V
= 2.048V Fast
REF
VDD = 3V,
V
= 1.024V Slow
REF
VDD = 3V,
V
= 1.024V Fast
REF
= VDD, V
IL
= 0V
0.4 0.6 mA
0.9 1.35 mA
0.3 0.45 mA
0.7 1.1 mA
See Note 8
No load,
0.01 10 µA
all digital inputs 0V or VDD
See Note 9
DAC code 128 to 4095,
10%-90%
Slow
Fast
0.5
2.5
0.9
3.6
V/µs V/µs
See Note 10
DAC code 128 to 4095
Slow
Fast
12.0
4.0
µs µs
See Note 11
Code 2047 to 2048 10 nV-s
SNR fs = 400ksps, f
= 1kHz,
OUT
66 74 dB
BW = 20kHz
See Note 12
SNRD fs = 400ksps, f
= 1kHz,
OUT
54 66 dB
BW = 20kHz
See Note 12
THD fs = 400ksps, f
= 1kHz,
OUT
-68 -56 dB
BW = 20kHz
See Note 12
SPFDR fs = 400ksps, f
= 1kHz,
OUT
56 70 dB
BW = 20kHz
See Note 12
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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WM2616 Production Data Rev 1.0
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V temperature range (unless noted otherwise).
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Reference
Reference input resistance Reference input capacitance Reference feedthrough
Reference input bandwidth
Digital Inputs
High level input current Low level input current Input capacitance
Notes:
1. Integral non-linearity (INL) is the maximum deviation of the output from the line between zero and full scale (excluding the effects of zero code and full scale errors).
2. Differential non-linearity (DNL) is the difference between the measured and ideal 1LSB amplitude change of any adjacent two codes. A guarantee of monotonicity means the output voltage changes in the same direction (or remains constant) as a change in digital input code.
3. Zero code error is the voltage output when the DAC input code is zero.
4. Gain error is the deviation from the ideal full scale output excluding the effects of zero code error.
5. Power supply rejection ratio is measured by varying VDD from 4.5V to 5.5V and measuring the proportion of this signal imposed on the zero code error and the gain error.
6. Zero code error and Gain error temperature coefficients are normalised to full scale voltage.
7. Output load regulation is the difference between the output voltage at full scale with a 10kΩ load and 2kΩ load. It is expressed as a percentage of the full scale output voltage with a 10kΩ load.
8. IDD is measured while continuously writing code 2048 to the DAC. For VIH < VDD - 0.7V and VIL > 0.7V supply current will increase.
9. Typical supply current in power down mode is 10nA. Production test limits are wider for speed of test.
10. Slew rate results are for the lower value of the rising and falling edge slew rates
11. Settling time is the time taken for the signal to settle to within 0.5LSB of the final measured value for both rising and falling edges. Limits are ensured by design and characterisation, but are not production tested.
12. SNR, SNRD, THD and SPFDR are measured on a synthesised sinewave at frequency f
= 2.048V and VDD = 3V ±± 10%, V
REF
R
REFIN
C
REFIN
V
= 1VPP at 1kHz
REF
+ 1.024V dc, DAC code 0
V
= 0.2VPP + 1.024V dc
REF
DAC code 2048
Slow
Fast
I
IH
I
IL
C
I
Input voltage = VDD 1 µA
Input voltage = 0V -1 µA
= 1.024V over recommended operating free-air
REF
10 MΩ
5 pF
-75 dB
0.5
1.3
3 pF
generated with a sampling frequency fs
OUT
MHz MHz
.
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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Production Data Rev 1.0 WM2616
SERIAL INTERFACE
t
t
WL
WH
SCLK
DIN
1 2 3 4 5 15 16
t
SUDtHD
t
SUCSFS
D0D1D12D13D14D15
t
SUC16CS
NCS
t
WHFS
t
SUFS
t
SUC16FS
FS
Figure 1 Timing Diagram
Test Conditions:
RL = 10kΩ, CL = 100pF. VDD = 5V ±± 10%, V
= 2.048V and VDD = 3V ±± 10%, V
REF
= 1.024V over recommended operating free-air
REF
temperature range (unless noted otherwise).
SYMBOL TEST CONDITIONS MIN TYP MAX UNIT
t
SUCSFS
t
SUFS
t
SUC16FS
Setup time NCS low before negative FS edge. Setup time FS low before first negative SCLK edge. Setup time, sixteenth negative SCLK edge after FS low
on which D0 is sampled before rising edge of FS.
10 ns
8 ns
10 ns
Setup time, sixteenth positive SCLK edge (first positive after D0 sampled) before NCS rising edge. If FS is used
t
SUC16CS
instead of the sixteenth positive edge to update the DAC,
10 ns then the setup time is between the FS rising edge and the NCS rising edge.
t t
t
t
WHFS
WH
WL
SUD
t
HD
Pulse duration, SCLK high. Pulse duration, SCLK low. Setup time, data ready before SCLK falling edge. Hold time, data held valid after SCLK falling edge. Pulse duration, FS high.
25 ns
25 ns
8 ns 5 ns
20 ns
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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WM2616 Production Data Rev 1.0
INL - LSB
OUTPUT VOLTAGE - V
OUTPUT VOLTAGE - V
OUTPUT VOLTAGE - V
OUTPUT VOLTAGE - V
TYPICAL PERFORMANCE GRAPHS
3
AVDD = DVDD = 5V, VREF = 2.048V, Speed = Fast mode, Load = 10k/100pF
2
1
0
-1
-2
-3 0 512 1024 1536 2048 2559 3071 3583 4095
Figure 2 Integral Non-Linearity
DIGITAL CODE
0.4
VDD = 3V, V
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
0 1 2 3 4 5 6 7 8 9 10
= 1V, Input Code = 0
REF
ISINK - mA
Slow Fast
0.4
VDD = 5V, V
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
0 1 2 3 4 5 6 7 8 9 10
= 2V, Input Code = 0
REF
ISINK - mA
Figure 3 Sink Current VDD = 3V Figure 4 Sink Current VDD = 5V
2.06
2.055
2.05
2.045
2.04
VDD = 3V, V
= 1V, Input Code = 4095
REF
4.095
4.09
4.085
4.08
4.1
VDD = 5V, V
= 2V, Input Code = 4095
REF
Slow Fast
2.035
2.03
2.025 0 1 2 3 4 5 6 7 8 9 10
ISOURCE - mA
Slow Fast
4.075
4.07
4.065 0 1 2 3 4 5 6 7 8 9 10
ISOURCE - mA
Slow Fast
Figure 5 Source Current VDD = 3V Figure 6 Source Current VDD = 5V
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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Production Data Rev 1.0 WM2616
1
DEVICE DESCRIPTION
GENERAL FUNCTION
The device uses a resistor string network buffered with an op amp to convert 12-bit digital data to analogue voltage levels (see Block Diagram). The output voltage is determined by the reference input voltage and the input code according to the following relationship:
Output voltage =
INPUT OUTPUT
1111 1111 1111
: :
1000 0000 0001
1000 0000 0000
0111 1111 1111
: :
0000 0000 0001
0000 0000 0000 0V
Table 1 Binary Code Table (0V to 2V
CODE
( )
V2 REFIN
4096
( )
REF
V2
( )
V2 REF
2048
( )
V2 =
4096
( )
REF
V2
( )
V2 REF
Output), Gain = 2
REFIN
4095 4096
2049 4096
REFREF V
2047 4096
1
4096
POWER ON RESET
An internal power-on-reset circuit resets the DAC register to all 0s on power-up.
BUFFER AMPLIFIER
The output buffer has a near rail-to-rail output with short circuit protection and can reliably drive a 2kΩ load with a 100pF load capacitance.
EXTERNAL REFERENCE
The reference voltage input is buffered which makes the DAC input resistance independent of code. The REFIN pin has an input resistance of 10MΩ and an input capacitance of typically 5pF. The reference voltage determines the DAC full-scale output.
SERIAL INTERFACE
Explanation of data transfer: First, the device has to be enabled with NCS set to low. Then, a falling edge of FS starts shifting the
data bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK. After 16 bits have been transferred, the next rising edge on SCLK or FS causes the content of the shift register to be moved to the DAC latch which updates the voltage output to the new level.
The serial interface of the device can be used in two basic modes:
• four wire (with chip select)
• three wire (without chip select)
Using chip select (four wire mode), it is possible to have more than one device connected to the serial port of the data source (DSP or microcontroller). If there is no need to have more than one device on the serial bus, then NCS can be tied low.
SERIAL CLOCK AND UPDATE RATE
Figure 1 shows the device timing. The maximum serial rate is: f
max = MHz20
SCLK
The digital update rate is limited to an 800ns period, or 1.25MHz frequency. However, the DAC settling time to 12 bits limits the update rate for large input step transitions.
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
+
=
tt
minWCLminWCH
7
Page 8
WM2616 Production Data Rev 1.0
SOFTWARE CONFIGURATION OPTIONS
The 16 bits of data can be transferred with the sequence shown in Table 2. D11-D0 contains the 12-bit data word. D14-D13 hold the programmable options.
D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
x SPD PWR x New DAC value (12 bits)
Table 2 Register Map
PROGRAMMABLE SETTLING TIME
Settling time is a software selectable 12µs or 4µs typical, to within ±0.5LSB of final value. This is controlled by the value of D14. A ONE defines a settling time of 4µs, a ZERO defines a settling time of 12µs.
PROGRAMMABLE POWER DOWN
The power down function is controlled by D13. A ZERO configures the device as active, or fully powered up, a ONE configures the device into power down mode. When the power down function is released the device reverts to the DAC code set prior to power down.
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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Production Data Rev 1.0 WM2616
PACKAGE DIMENSIONS
D: 8 PIN SOIC 3.9mm Wide Body
e
D
A1
A
B
58
41
E H
-C-
h x 45
α
DM009.B
L
o
Symbols
0.10 (0.004)
Dimensions
(mm)
SEATING PLANE
Dimensions
(Inches)
MIN MAX MIN MAX A A
1
B C D e E h H L
αα
REF:
NOTES: A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES). B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE. C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN). D. MEETS JEDEC.95 MS-012, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
1.35 1.75 0.0532 0.0688
0.10 0.25 0.0040 0.0098
0.33 0.51 0.0130 0.0200
0.19 0.25 0.0075 0.0098
4.80 5.00 0.1890 0.1968
1.27 BSC 0.050 BSC
3.80 4.00 0.1497 0.1574
0.25 0.50 0.0099 0.0196
5.80 6.20 0.2284 0.2440
0.40 1.27 0.0160 0.0500
o
0
o
8
o
0
o
8
JEDEC.95, MS-012
C
WOLFSON MICROELECTRONICS LTD Production Data Rev 1.0 June 1999
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