• Dual 2.7V to 5.5V supply (separate digital and analogue
supplies)
• DNL ±±0.4 LSB, INL ±±1.5 LSB
• Low power consumption:
- 5.5mW, slow mode −− 5V supply
- 3.3mW, slow mode −− 3V supply
• TMS320, (Q)SPI, and Microwire compatible serial
interface
• Programmable settling time of 4µµs or 12µµs typical
APPLICATIONS
• Battery powered test instruments
• Digital offset and gain adjustment
• Battery operated/remote industrial controls
• Machine and motion control devices
• Wireless telephone and communication systems
• Speech synthesis
• Arbitrary waveform generation
ORDERING INFORMATION
DEVICE TEMP. RANGE PACKAGE
WM2614CDT 0° to 70°C 16-pin TSSOP
WM2614IDT -40° to 85 °C 16-pin TSSOP
DESCRIPTION
The WM2614 is a quadruple 12-bit voltage output, resistor string,
digital-to-analogue converter. Each DAC can be individually
powered down under software control. A hardware controlled mode
is provided that powers down all DACs. Power down reduces
current consumption to 10nA.
The device has been designed to interface efficiently to industry
standard microprocessors and DSPs, including the TMS320
family. The WM2614 is programmed with a 16-bit serial word
comprising of a DAC address, individual DAC control bits and a
12-bit value.
The WM2614 has provision for two supplies: one supply for the
serial interface (DVDD, DGND) and one for the DACs, reference
buffers and output buffers (AVDD, AGND). This enables a typical
application where the device can be controlled via a
microprocessor operating on a 3V supply, with the DACs operating
on a 5V supply. Alternatively, the supplies can be tied together in a
single supply application.
Excellent performance is delivered with a typical DNL of 0.4 LSBs.
The settling time of the DAC is programmable to allow the designer
to optimize speed versus power dissipation. The output stage is
buffered by a x2 gain near rail-to-rail amplifier, which features a
Class AB output stage. DACs A and B can have a different
reference voltage to DACs C and D.
The device is available in a 16-pin TSSOP package.
Commercial temperature (0° to 70°C) and Industrial
temperature (-40° to 85°C) variants are supported.
NPDDigital inputPower down. Powers down all DACs overriding their individual power down settings
and all output stages. This pin is active low.
NLDACDigital inputLoad DAC. Digital input active low. NLDAC must be taken low to update the DAC
latch from the holding latches.
DINDigital inputSerial data input.
SCLKDigital inputSerial clock input.
NCSDigital inputChip select. This pin is active low.
FSDigital inputFrame synchronisation for serial output data.
DGNDGroundDigital ground.
AGNDGroundAnalogue ground.
REFINCDAnalogue inputVoltage reference input for DACs C and D.
OUTDAnalogue outputDAC D output.
OUTCAnalogue outputDAC C output.
OUTBAnalogue outputDAC B output.
OUTAAnalogue outputDAC A output.
REFINABAnalogue inputVoltage reference input for DACs A and B.
AVDDSupplyAnalogue supply.
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or
beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical
Characteristics at the test conditions specified
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to
damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this
device.
CONDITIONMINMAX
Supply voltages, DVDD to DGND, AVDD to AGND
Supply voltage differences, AVDD to DVDD
Digital input voltage
Reference input voltage
Operating temperature range, T
Storage temperature
Lead temperature 1.6mm (1/16 inch) soldering for 10 seconds
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
A
WM2614CDT
WM2614IDT
-2.8V2.8V
-0.3VDVDD + 0.3V
-0.3VAVDD + 0.3V
0°C
-40°C
-65°C150°C
7V
70°C
85°C
260°C
2
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ProductionData Rev 1.0WM2614
RECOMMENDED OPERATING CONDITIONS
PARAMETERSYMBOLTEST CONDITIONSMINTYPMAXUNIT
Supply voltage
High-level digital input voltage
Low-level digital input voltage
Reference voltage to REFINAB,
REFINCD
Load resistance
Load capacitance
Serial clock rate
Operating free-air temperature
Note: Reference voltages greater than AVDD/2 will cause output saturation for large DAC codes.
AVDD, DVDD2.75.5V
V
f
V
V
REF
R
C
SCLK
T
IH
IL
L
L
A
DVDD = 2.7V to 5.5V2V
DVDD = 2.7V to 5.5V0.8V
See NoteAVDD - 1.5V
210kΩ
100pF
20MHz
WM2614CDT070°C
WM2614IDT-4085°C
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
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WM2614Production Data Rev 1.0
ELECTRICAL CHARACTERISTICS
Test Conditions:
RL = 10kΩ, CL = 100pF. AVDD = DVDD = 5V ±± 10%, V
recommended operating free-air temperature range (unless noted otherwise).
High level input current
Low level input current
Input capacitance
I
IH
I
IL
C
I
Input voltage = DVDD1µA
Input voltage = 0V-1µA
3pF
Notes:
1.Integral non-linearity (INL) is the maximum deviation of the output from the line between zero and full scale (excluding the effects
of zero code and full scale errors).
2.Differential non-linearity (DNL) is the difference between the measured and ideal 1LSB amplitude change of any adjacent two
codes. A guarantee of monotonicity means the output voltage changes in the same direction (or remains constant) as a change in
digital input code.
3.Zero code error is the voltage output when the DAC input code is zero.
4.Gain error is the deviation from the ideal full scale output excluding the effects of zero code error.
5.Power supply rejection ratio is measured by varying AVDD from 4.5V to 5.5V and measuring the proportion of this signal imposed
on the zero code error and the gain error.
6.Zero code error and Gain error temperature coefficients are normalised to V
REF
.
7.Output load regulation is the difference between the output voltage at full scale with a 10kΩ load and 2kΩ load. It is expressed as a
percentage of the full scale output voltage with a 10kΩ load.
8.IDD is measured while continuously writing code 2048 to the DAC. For VIH < DVDD - 0.7V and VIL > 0.7V supply current will increase.
9.Typical supply current in power down mode is 10nA. Production test limits are wider for speed of test.
10.Slew rate results are for the lower value of the rising and falling edge slew rates.
11.Settling time is the time taken for the signal to settle to within 0.5LSB of the final measured value for both rising and falling edges.
Limits are ensured by design and characterisation, but are not production tested.
12.SNR, SNRD, THD and SPFDR are measured on a synthesised sinewave at frequency f
generated with a sampling frequency fs.
OUT
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
5
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WM2614Production Data Rev 1.0
SERIAL INTERFACE
t
WLtWH
SCLK
DIN
12345 1516
t
SUDtHD
t
SUCSFS
D0D1D12D13D14D15
NCS
t
WHFS
t
SUFSCLK
t
SUC16FS
FS
Figure 1 Timing Diagram
Test Conditions:
RL = 10kΩ, CL = 100pF. AVDD = DVDD = 5V ±± 10%, V
= 2.048V and AVDD = DVDD = 3V ±± 10%, V
REF
= 1.024V over recommended
REF
operating free-air temperature range (unless noted otherwise).
SYMBOLTEST CONDITIONSMINTYPMAXUNIT
t
SUCSFS
t
SUFSCLK
t
SUC16FS
Setup time NCS low before negative FS edge.
Setup time FS low before first negative SCLK edge.
Setup time, sixteenth negative SCLK edge after FS low
on which D0 is sampled before rising edge of FS.
10ns
8ns
10ns
Setup time, sixteenth positive SCLK edge (first positive
after D0 sampled) before NCS rising edge.
t
SUC16CS
If FS is used instead of the sixteenth positive edge to
update the DAC, then the setup time is between the FS
10ns
25ns
25ns
8ns
5ns
20ns
t
WHCLK
t
WLCLK
t
SUDCLK
t
HDCLK
t
WHFS
rising edge and the NCS rising edge.
Pulse duration, SCLK high.
Pulse duration, SCLK low.
Setup time, data ready before SCLK falling edge.
Hold time, data held valid after SCLK falling edge.
Pulse duration, FS high.
t
SUC16CS
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
6
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ProductionData Rev 1.0WM2614
INL - LSB
OUTPUT VOLTAGE - V
OUTPUT VOLTAGE - V
OUTPUT VOLTAGE - V
= 1V, Input Code
OUTPUT VOLTAGE - V
TYPICAL PERFORMANCE GRAPHS
3
5V = VDD, V
2
1
0
-1
-2
-3
05121024153620482559307135834095
Figure 2 Integral Non-Linearity
= 2.048V, Speed = Fast mode, Load = 10k/100pF
REF
DIGITAL CODE
0.4
AVDD = DVDD = 3V, V
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
012345678910
= 1V, Input Code = 0
REF
ISINK - mA
Slow Fast
0.4
AVDD = DVDD = 5V, V
0.35
0.3
0.25
0.2
0.15
0.1
0.05
0
012345678910
= 2V, Input Code = 0
REF
ISINK - mA
Figure Sink 3 Current AVDD = DVDD = 3VFigure 4 Sink Current AVDD = DVDD = 5V
2.06
AVDD = DVDD = 3V, V
2.055
2.05
2.045
REF
4.1
4.095
4.09
4.085
4.08
AVDD =DVDD = 5V, V
= 2V, Input Code = 4095
REF
Slow Fast
2.04
2.035
012345678910
ISOURCE - mA
Slow Fast
4.075
4.07
012345678910
ISOURCE - mA
Slow Fast
Figure 5 Source Current AVDD = DVDD = 3VFigure 6 Source Current AVDD = DVDD = 5V
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
7
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WM2614Production Data Rev 1.0
DEVICE DESCRIPTION
GENERAL FUNCTION
The device uses a resistor string network buffered with an op amp to convert 12-bit digital data to
analogue voltage levels (see Block Diagram). The output voltage is determined by the reference input
voltage and the input code according to the following relationship:
Output voltage =
INPUTOUTPUT
111111111111
::
100000000001
100000000000
011111111111
::
000000000001
0000000000000V
Table 1 Binary Code Table (0V to 2V
CODE
()
REF
V2
4096
()
V2 REF
()
V2 REF
()
V2
()
V2 REF
()
V2 REF
Output), Gain = 2
REFIN
2048
4096
4095
4096
2049
4096
2047
4096
1
4096
REFREF
=
V
POWER ON RESET
An internal power-on-reset circuit resets the DAC register to all 0s on power-up.
BUFFER AMPLIFIER
The output buffer has a near rail-to-rail output with short circuit protection and can reliably drive a 2kΩ load
with a 100pF load capacitance.
EXTERNAL REFERENCE
The reference voltage input is buffered which makes the DAC input resistance independent of code. The
REFIN pin has an input resistance of 10MΩ and an input capacitance of typically 5pF. The reference
voltage determines the DAC full-scale output.
HARDWARE CONFIGURATION OPTIONS
The device has two configuration options that are controlled by device pins.
DEVICE POWER DOWN
The device can be powered-down by pulling pin NPD (Pin 2) high. This powers down all DACs overriding
their individual power down settings. This will reduce power consumption to typically 10nA. When the
power down function is released the device reverts to the DAC code set prior to power down.
SIMULTANEOUS DAC UPDATE
The NLDAC pin (Pin 3) can be held high to prevent serial word writes from updating the DAC latches. By
writing new values to multiple DACs then pulling NLDAC low, all new DAC codes are loaded into the DAC
latches simultaneously.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
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ProductionData Rev 1.0WM2614
1
SERIAL INTERFACE
Explanation of data transfer:
First, the device has to be enabled with NCS set to low. Then, a falling edge of FS starts shifting the data
bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK. After 16 bits have
been transferred, the next rising edge on SCLK or FS causes the content of the shift register to be moved
to the DAC holding latch. If NLDAC is low, the DAC latch will also updated immediately.
The serial interface of the device can be used in two basic modes:
• four wire (with chip select)
• three wire (without chip select)
Using chip select (four wire mode), it is possible to have more than one device connected to the serial port
of the data source (DSP or microcontroller). If there is no need to have more than one device on the serial
bus, then NCS can be tied low.
SERIAL CLOCK AND UPDATE RATE
Figure 1 shows the device timing. The maximum serial rate is:
f
max = MHz20
SCLK
The digital update rate is limited to an 800ns period, or 1.25MHz frequency. However, the DAC settling
time to 12 bits limits the update rate for large input step transitions.
+
=
tt
minWCLminWCH
SOFTWARE CONFIGURATION OPTIONS
The 16 bits of data can be transferred with the sequence shown in Table 2. D11-D0 contains the 12-bit
data word. D15-D12 hold the programmable options.
D15 D14 D13 D12 D11 D10 D9D8D7D6D5D4D3D2D1D0
A1A0 PWR SPDNew DAC value (12 bits)
Table 2 Register Map
DAC ADDRESSING
A particular DAC (A, B, C, D) within the device is selected by A1 and A0 within the input word.
A1A0DAC ADDRESS
00DAC A
01DAC B
10DAC C
11DAC D
PROGRAMMABLE SETTLING TIME
Settling time is a software selectable 12µs or 4µs, typical to within ±0.5LSB of final value. This is
controlled by the value of D12 and associated DAC address. A ONE defines a settling time of 4µs, a
ZERO defines a settling time of 12µs for that DAC.
PROGRAMMABLE POWER DOWN
The power down function is controlled by D13. A ZERO configures that DAC as active, a ONE configures
that DAC into power down mode. When the power down function is released the device reverts to the
DAC code set prior to power down.
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
9
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WM2614Production Data Rev 1.0
PACKAGE DIMENSIONS
DM013.ADT: 16 PIN TSSOP (5.0 x 4.4 x 1.0 mm)
b
A2
A1
A
e
916
E1E
GAUGE
D
81
0.05
C
-C-
SEATING PLANE
PLANE
θθ
0.25
c
L
Dimensions
Symbols
(mm)
MINNOMMAX
A
A
1
A
2
b
c
D
e
E
E
1
L
θθ
REF:
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS.
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM.
D. MEETS JEDEC.95 MO-153, VARIATION = AB. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
----------1.20
0.05-----0.15
0.801.001.05
0.19-----0.30
0.09-----0.20
4.905.005.10
0.65 BSC
6.4 BSC
4.304.404.50
0.450.600.75
o
0
-----8
o
JEDEC.95, MO-153
WOLFSON MICROELECTRONICS LTDProduction Data Rev 1.0 June 1999
10
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