The W83194BR-39B is a Clock Synthesizer which provides all clocks required for high-speed RISC or
CISC microprocessor such as Intel Pentium II or Pentium III. W83194BR-39B provides 64 CPU/PCI
frequencies which are selectable with smooth transitions by hardware or software. W83194BR-39B
also provides 13 SDRAM clocks controlled by the none-delay buffer_in pin.
The W83194BR-39B provides step-less frequency programming by controlling the VCO freq. and the
programmable PCI clock output divisor ratio. A watch dog timer is quipped and when time out, the
RESET# pin will output 4ms pulse signal.
The W83194BR-39B accepts a 14.318 MHz reference crystal as its input. Spread spectrum built in at
±0.5% or ±0.25% to reduce EMI. Programmable stopping individual clock outputs and frequency
selection through I2C interface. The device meets the Pentium power-up stabilization, which requires
CPU and PCI clocks be stable within 2 ms after power-up. Using dual function pin for the slots(ISA,
PCI, CPU, DIMM) is not recommend.
IN - Input
OUT - Output
I/O - Bi-directional Pin
# - Active Low
Publication Release Date: June 2000
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Page 3
& - Internal 120KΩ pull-down
Latched Input. *Mode0=1, Pin 2 is REF0; *Mode0=0,
PCICLK0^/FS3&
* - Internal 120kΩ pull-up
4.1 Crystal I/O
SYMBOL PIN I/O FUNCTION
Xin 4 IN Crystal input with internal loading capacitors and
Xout 5 OUT Crystal output at 14.318MHz nominally.
4.2 CPU, SDRAM, PCI, IOAPIC Clock Outputs
SYMBOL PIN I/O FUNCTION
CPUCLK_F 44 OUT Free running CPU clock. Not affected by PD#
CPUCLK1 43 OUT Low skew (< 250ps) clock outputs for host
RESET# 41 OD RESET# (open drain, 4ms low active pulse when
IOAPIC 47 OUT High drive buffered output of the crystal, and is
SDRAM [ 0:12] 17,18,20,21,28
,29,31,32,34,
35,37,38,40
PCICLK_F/
*MODE0
PCICLK [1:3]^
PCICLK 4
BUFFER IN 15 IN Inputs to fanout for SDRAM outputs.
7 I/O Free running PCI clock during normal operation.
8 I/O Low skew (< 250ps) PCI clock outputs.
10,11,12,13 OUT Low skew (< 250ps) PCI clock outputs.
W83194BR-39B
PRELIMINARY
feedback resistors.
frequencies such as CPU, Chipset and Cache.
Powered by VddL2. Low if PD# is low.
Watch Dog time out)
powered by VddL1.
OUT SDRAM clock outputs. Fanout buffer outputs from
BUFFER IN pin.(Controlled by chipset)
Pin2 is PD#
Latched input for FS3 at initial power up for H/W
selecting the output frequency of CPU and PCI
clocks.
PCICLK 0:3 are double strength pins
PCICLK 4 is not.
Publication Release Date: June 2000
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Page 4
W83194BR-39B
PRELIMINARY
4.3 I2C Control Interface
SYMBOL PIN I/O FUNCTION
SDATA* 23 I/O Serial data of I2C 2-wire control interface
SDCLK* 24 IN Serial clock of I2C 2-wire control interface
4.4 Fixed Frequency Outputs
SYMBOL PIN I/O FUNCTION
REF0^ / PD# 2 I/O 14.318MHz reference clock. This REF output is the
stronger buffer for ISA bus loads.(pin7 *Mode0=1)
Halt all clocks at logic 0 level, when input low (pin7
*Mode0=0)
REF1 / FS2* 46 I/O 14.318MHz reference clock.
Latched input for FS2 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
24MHz / FS1* 25 I/O 24MHz output clock.
Latched input for FS1 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
48MHz / FS0* 26 I/O 48MHz output for USB during normal operation.
Latched input for FS0 at initial power up for H/W
selecting the output frequency of CPU, SDRAM and
PCI clocks.
4.5 Power Pins
SYMBOL PIN FUNCTION
Vddq1 1 Power supply for Ref [0:1] crystal and core logic.
VddL1 48 Power supply for IOAPIC output, either 2.5V or 3.3V.
VddL2 42 Power supply for CPUCLK[0:3], either 2.5V or 3.3V.
Vddq2 6, 14 Power supply for PCICLK_F, PCICLK[0:4], 3.3V.
Vddq3 19, 30, 36 Power supply for SDRAM[0:12], and CPU PLL core,
nominal 3.3V.
Vddq4 27 Power for 24 & 48MHz output buffers and fixed PLL
The clock generator is a slave I2C component which can be read back the data stored in the latches
for verification. All proceeding bytes must be sent to change one of the control bytes. The 2-wire
control interface allows each clock output individually enabled or disabled. On power up, the
W83194BR-39Binitializes with default register settings. Use of the 2-wire control interface is then
optional.
The SDATA signal only changes when the SDCLK signal is low, and is stable when SDCLK is high
during normal data transfer. There are only two exceptions. One is a high-to-low transition on
SDATA while SDCLK is high used to indicate the beginning of a data transfer cycle. The other is a
low-to-high transition on SDATA while SDCLK is high used to indicate the end of a data transfer
cycle. Data is always sent as complete 8-bit bytes followed by an acknowledge generated.
Byte writing starts with a “start” condition followed by 7-bit slave address and a write command bit
[1101 0010], command code checking [0000 0000], and byte count checking. After successful
reception of each byte, an “acknowledge“ (low) on the SDATA wire will be generated by the clock
chip. Controller can start to write to internal I2C registers after the string of data. The sequence
order is as follows:
Bytes sequence order for I2C controller :
Clock Address
A(6:0) & R/W
Set R/W to 1 when ?ead back”, the data sequence is as follows :
Clock Address
A(6:0) & R/W
Ack
Ack
8 bits dummy
Command code
Byte 0Ack
Ack
8 bits dummy
Byte count
Byte 1
Ack
Ack
Byte0,1,2...
until Stop
Byte2, 3, 4...
until Stop
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W83194BR-39B
PRELIMINARY
7.2 SERIAL CONTROL REGISTERS
The Pin column lists the affected pin number and the @PowerUp column gives the default state at
true power up. "Command Code" byte and "Byte Count" byte must be sent following the
acknowledge of the Address Byte. Although the data (bits) in these two bytes are considered "don't
care", they must be sent and will be acknowledge. After that, the sequence described below
(Register 0, Register 1, Register 2, ....) will be valid and acknowledged.
7.2.1 Register 0: CPU Frequency Select Register (default = 0)
Bit @PowerUp
7 0 - SSEL5 (for frequency table selection by software via I2C)
6 0 - SSEL4 (for frequency table selection by software via I2C)
5 0 - SSEL3 (for frequency table selection by software via I2C)
4 0 - SSEL2 (for frequency table selection by software via I2C)
3 0 - SSEL1 (for frequency table selection by software via I2C)
2 0 - SSEL0 (for frequency table selection by software via I2C)
1 0 - 0 = Selection by hardware
7.2.7 Register 6~11: M/N step-less mode control registers
7.2.12 Register 11: Winbond Chip ID Register (Read Only)
Bit @PowerUp Pin
7 0 - Winbond Chip ID
6 1 - Winbond Chip ID
5 1 - Winbond Chip ID
4 0 - Winbond Chip ID
3 0 - Winbond Chip ID
2 0 - Winbond Chip ID
1 1 - Winbond Chip ID
0 0 - Winbond Chip ID
Description
7.2.13 Register 12: Winbond Chip ID Register (Read Only)
Bit @PowerUp Pin
7
6
5
4
3
0 - Winbond Chip ID
1 - Winbond Chip ID
0 - Winbond Chip ID
1 - Winbond Chip ID
0 - Winbond Version ID
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Description
Publication Release Date: June 2000
Page 12
W83194BR-39B
PRELIMINARY
2
1
0
0 - Winbond Version ID
0 - Winbond Version ID
1 - Winbond Version ID
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W83194BR-39B
PRELIMINARY
8.0 SPECIFICATIONS
8.1 ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in this table may cause permanent damage to the device.
Precautions should be taken to avoid application of any voltage higher than the maximum rated
voltages to this circuit. Subjection to maximum conditions for extended periods may affect reliability.
Unused inputs must always be tied to an appropriate logic voltage level (Ground or Vdd).
Symbol Parameter Rating
Voltage on any pin with respect to GND - 0.5 V to + 7.0 V
Storage Temperature
Ambient Temperature
Operating Temperature
- 65°C to + 150°C
- 55°C to + 125°C
0°C to + 70°C
Vdd , VIN
T
STG
TB
TA
8.2 AC CHARACTERISTICS
Vdd = Vddq3 = 3.3V ± 5 %, Vddq2 = VddL1=VddL2 = 2.375V~2.9V , TA = 0°C to +70°C
Parameter Symbol Min Typ
Output Duty Cycle
CPU/SDRAM to PCI Offset
Skew (CPU-CPU), (PCIPCI), (SDRAM-SDRAM)
CPU/SDRAM
Cycle to Cycle Jitter
CPU/SDRAM
Absolute Jitter
Jitter Spectrum 20 dB
Bandwidth from Center
Output Rise (0.4V ~ 2.0V)
& Fall (2.0V ~0.4V) Time
Overshoot/Undershoot
Beyond Power Rails
Ring Back Exclusion VRBE0.7 2.1 V Ring Back must not enter this
t
OFF
t
SKEW
t
CCJ
tJA
BWJ500 KHz
t
TLH
t
THL
Vover0.7 1.5 V
45 50 55 % Measured at 1.5V
1 2.6 4 ns 15 pF Load Measured at 1.5V
250 ps 15 pF Load Measured at 1.5V
±250 ps
500 ps
0.4 1.6 ns 15 pF Load on CPU and PCI
Max Units
Test Conditions
outputs
22 Ω at source of 8 inch PCB
run to 15 pF load
range.
Publication Release Date: June 2000
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W83194BR-39B
PRELIMINARY
8.3 DC CHARACTERISTICS
Vdd = Vddq3 = 3.3V ± 5 %, Vddq2 = VddL1=VddL2 = 2.375V~2.9V , TA = 0°C to +70°C
Parameter Symbol Min Typ Max Units
Input Low Voltage
Input High Voltage
Input Low Current
Input High Current
Output Low Voltage
I
= 4 mA
OL
Output High Voltage
IOH = 4mA
Tri-State leakage Current
Dynamic Supply Current
for Vdd + Vddq3
Dynamic Supply Current
for Vddq2 + Vddq2b
CPU Stop Current
for Vdd + Vddq3
CPU Stop Current
for Vddq2 + Vddq2b
VIL
VIH
IIL
IIH
VOL
VOH
Ioz 10
I
dd3
I
dd2
I
CPUS3
I
CPUS2
0.8
2.0
-66
5
0.4
2.4
mA CPU = 66.6 MHz
mA Same as above
mA Same as above
mA Same as above
Vdc
Vdc
µA
µA
Vdc
Vdc
µA
Test Conditions
All outputs
All outputs using 3.3V power
PCI = 33.3 Mhz with load
PCI Stop Current
for Vdd + Vddq3
I
PD3
mA
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8.4 BUFFER CHARACTERISTICS
8.4.1 TYPE 1 BUFFER FOR CPU CLOCK
W83194BR-39B
PRELIMINARY
Parameter Symbol Min Typ Max Units
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max I
Rise/Fall Time Min
Between 0.4 V and 2.0 V
Rise/Fall Time Max
Between 0.4 V and 2.0 V
I
OH(min)
I
OH(max)
I
OL(min)
OL(max)
T
RF(min)
T
RF(max)
-27 mA Vout = 1.0 V
-27 mA Vout = 2.0V
mA Vout = 1.2 V
27 mA Vout = 0.3 V
0.4 ns 10pF Load
1.6 ns 20pF Load
8.4.2 TYPE 2 BUFFER FOR IOAPIC
Parameter Symbol Min Typ Max Units
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max I
Rise/Fall Time Min
Between 0.7 V and 1.7 V
Rise/Fall Time Max
Between 0.7 V and 1.7 V
I
OH(min)
I
OH(max)
I
OL(min)
OL(max)
T
RF(min)
T
RF(max)
mA Vout = 1.4 V
-29 mA Vout = 2.7 V
mA Vout = 1.0 V
28 mA Vout = 0.2 V
0.4 ns 10pF Load
1.8 ns 20pF Load
Test Conditions
Test Conditions
Publication Release Date: June 2000
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Page 16
8.4.3 TYPE 3 BUFFER FOR REF1, 24MHZ, 48MHZ
W83194BR-39B
PRELIMINARY
Parameter Symbol Min Typ Max Units
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max I
Rise/Fall Time Min
Between 0.8 V and 2.0 V
Rise/Fall Time Max
I
OH(min)
I
OH(max)
I
OL(min)
OL(max)
T
RF(min)
T
RF(max)
-29 mA Vout = 1.0 V
-23 mA Vout = 3.135V
29 mA Vout = 1.95 V
mA Vout = 0.4 V
1.0 ns 10pF Load
4.0 ns 20pF Load
Between 0.8 V and 2.0 V
8.4.4 TYPE 4 BUFFER FOR SDRAM (0:12)
Parameter Symbol Min Typ Max Units
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max I
Rise/Fall Time Min
Between 0.8 V and 2.0 V
Rise/Fall Time Max
Between 0.8 V and 2.0 V
I
OH(min)
I
OH(max)
I
OL(min)
OL(max)
T
RF(min)
T
RF(max)
mA Vout = 1.65 V
-46 mA Vout = 3.135 V
mA Vout = 1.65 V
53 mA Vout = 0.4 V
0.5 ns 20pF Load
1.3 ns 30pF Load
Test Conditions
Test Conditions
8.4.5 TYPE 5 BUFFER FOR PCICLK(0:4,F)
Parameter Symbol Min Typ Max Units
Pull-Up Current Min
Pull-Up Current Max
Pull-Down Current Min
Pull-Down Current Max I
Rise/Fall Time Min
Between 0.8 V and 2.0 V
Rise/Fall Time Max
Between 0.8 V and 2.0 V
I
OH(min)
I
OH(max)
I
OL(min)
OL(max)
T
RF(min)
T
RF(max)
-33 mA Vout = 1.0 V
-33 mA Vout = 3.135 V
30 mA Vout = 1.95 V
38 mA Vout = 0.4 V
0.5 ns 15pF Load
2.0 ns 30pF Load
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Test Conditions
Publication Release Date: June 2000
Page 17
W83194BR-39B
PRELIMINARY
9.0 OPERATION OF DUAL FUCTION PINS
Pins 2, 7, 8, 25, and 26 are dual function pins and are used for selecting different functions in this
device (see Pin description). During power up, these pins are in input mode (see Fig1), therefore,
and are considered input select pins. When Vdd reaches 2.5V, the logic level that is present on these
pins is latched into their appropriate internal registers. Once the correct information is properly
latched, these pins will change into output pins and will be pulled low by default. At the end of the
power up timer (within 3 ms) outputs starts to toggle at the specified frequency.
Each of these pins has a large pull-up resistor ( 250 kΩ @3.3V ) inside. The default state will be logic
1, but the internal pull-up resistor may be too large when long traces or heavy load appear on these
dual function pins. Under these conditions, an external 10 kΩ resistor is recommended to be
connected to Vdd if logic 1 is expected. Otherwise, there should be direct connection to ground if a
logic 0 is desired. The 10 kΩ resistor should be placed before the serious terminating resistor. Note
that these logic will only be latched at initial power on.
If optional EMI reducing capacitor are needed, they should be placed as close to the series
terminating resistor as possible and after the series terminating resistor. These capacitors have
typical values ranging from 4.7pF to 22pF.
Publication Release Date: June 2000
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Page 18
W83194BR-39B
PRELIMINARY
Vdd
Device
Pin
Programming Header
Vdd Pad
10k
Device
Pin
10k
10kΩΩ
GroundGround
Ω
Series
Terminating
Resistor
Ground Pad
Series
Terminating
Resistor
Clock
Trace
EMI
Reducing
Cap
Optional
Clock
Trace
EMI
Reducing
Cap
Optional
Ground
Publication Release Date: June 2000
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Page 19
10.0 ORDERING INFORMATION
Part Number Package Type Production Flow
W83194BR-39B
PRELIMINARY
W83194BR-39B 48 PIN SSOP
Commercial, 0°C to +70°C
11.0 HOW TO READ THE TOP MARKING
1st line: Winbond logo and the type number: W83194BR-39B
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 814 G B B
814: packages made in '98, week 14
G: assembly house ID; A means ASE, S means SPIL, G means GR
B: Winbond internal use code
W83194BR-39B
28051234
814GBA
A: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to
their respective owners.
- 19 - Revision 0.46
Publication Release Date: June 2000
Page 20
12.0 PACKAGE DRAWING AND DIMENSIONS
W83194BR-39B
PRELIMINARY
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: 886-35-770066
FAX: 886-35-789467
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: 852-27516023-7
FAX: 852-27552064
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Please note that all data and specifications are subject to change without notice. All the
trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal
injury. Winbond customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Winbond for any damages resulting
from such improper use or sale.
Publication Release Date: June 2000
- 20 - Revision 0.46
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